---
_id: '9729'
author:
- first_name: Christina
full_name: Flotmann-Scholz, Christina
id: '8736'
last_name: Flotmann-Scholz
citation:
ama: Flotmann-Scholz C. The Making of English Popular Culture. ed. by John Storey.
Journal for the Study of British Cultures. 2016;23(1):75-78.
apa: Flotmann-Scholz, C. (2016). The Making of English Popular Culture. ed. by John
Storey. Journal for the Study of British Cultures.
bibtex: '@article{Flotmann-Scholz_2016, title={The Making of English Popular Culture.
ed. by John Storey}, volume={23}, number={1}, journal={Journal for the Study of
British Cultures}, author={Flotmann-Scholz, Christina}, year={2016}, pages={75–78}
}'
chicago: Flotmann-Scholz, Christina. “The Making of English Popular Culture. Ed.
by John Storey.” Journal for the Study of British Cultures, 2016.
ieee: C. Flotmann-Scholz, “The Making of English Popular Culture. ed. by John Storey,”
Journal for the Study of British Cultures, vol. 23, no. 1. pp. 75–78, 2016.
mla: Flotmann-Scholz, Christina. “The Making of English Popular Culture. Ed. by
John Storey.” Journal for the Study of British Cultures, vol. 23, no. 1,
2016, pp. 75–78.
short: C. Flotmann-Scholz, Journal for the Study of British Cultures 23 (2016) 75–78.
date_created: 2019-05-13T07:39:21Z
date_updated: 2022-01-06T07:04:19Z
department:
- _id: '36'
- _id: '1'
- _id: '380'
intvolume: ' 23'
issue: '1'
language:
- iso: eng
page: 75-78
publication: Journal for the Study of British Cultures
publication_status: published
status: public
title: The Making of English Popular Culture. ed. by John Storey
type: review
user_id: '32277'
volume: 23
year: '2016'
...
---
_id: '9731'
author:
- first_name: Christina
full_name: Flotmann-Scholz, Christina
id: '8736'
last_name: Flotmann-Scholz
citation:
ama: 'Flotmann-Scholz C. Oedipal Murders and Nostalgic Ressurections: The Victorians
in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl. Literaturwissenschaftliches
Jahrbuch. 2016;57:259-262.'
apa: 'Flotmann-Scholz, C. (2016). Oedipal Murders and Nostalgic Ressurections: The
Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl.
Literaturwissenschaftliches Jahrbuch.'
bibtex: '@article{Flotmann-Scholz_2016, title={Oedipal Murders and Nostalgic Ressurections:
The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria
Grasl}, volume={57}, journal={Literaturwissenschaftliches Jahrbuch}, author={Flotmann-Scholz,
Christina}, year={2016}, pages={259–262} }'
chicago: 'Flotmann-Scholz, Christina. “Oedipal Murders and Nostalgic Ressurections:
The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria
Grasl.” Literaturwissenschaftliches Jahrbuch, 2016.'
ieee: 'C. Flotmann-Scholz, “Oedipal Murders and Nostalgic Ressurections: The Victorians
in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl,” Literaturwissenschaftliches
Jahrbuch, vol. 57. pp. 259–262, 2016.'
mla: 'Flotmann-Scholz, Christina. “Oedipal Murders and Nostalgic Ressurections:
The Victorians in Historical Middlebrow Fiction, 1914-1959. by Caterina Maria
Grasl.” Literaturwissenschaftliches Jahrbuch, vol. 57, 2016, pp. 259–62.'
short: C. Flotmann-Scholz, Literaturwissenschaftliches Jahrbuch 57 (2016) 259–262.
date_created: 2019-05-13T07:42:53Z
date_updated: 2022-01-06T07:04:19Z
department:
- _id: '36'
- _id: '1'
- _id: '380'
intvolume: ' 57'
language:
- iso: eng
page: 259-262
publication: Literaturwissenschaftliches Jahrbuch
publication_status: published
status: public
title: 'Oedipal Murders and Nostalgic Ressurections: The Victorians in Historical
Middlebrow Fiction, 1914-1959. by Caterina Maria Grasl'
type: review
user_id: '32277'
volume: 57
year: '2016'
...
---
_id: '9815'
author:
- first_name: Bardo
full_name: Herzig, Bardo
last_name: Herzig
- first_name: Alexander
full_name: Martin, Alexander
last_name: Martin
- first_name: Tilman-Mathies
full_name: Klar, Tilman-Mathies
id: '35771'
last_name: Klar
citation:
ama: 'Herzig B, Martin A, Klar T-M. Smartphone und Tablet – Medienpädagogische und
technische Grundlagen, Potential für den Deutschunterricht und Beispiele. In:
Knopf J, Abraham U, eds. Deutsch Digital. Band 1 Theorie. Vol 3. Deutschdidaktik
in der Primarstufe. Baltmannsweiler: Schneider Verlag Hohengeren; 2016:69-97.'
apa: 'Herzig, B., Martin, A., & Klar, T.-M. (2016). Smartphone und Tablet –
Medienpädagogische und technische Grundlagen, Potential für den Deutschunterricht
und Beispiele. In J. Knopf & U. Abraham (Eds.), Deutsch Digital. Band 1
Theorie (Vol. 3, pp. 69–97). Baltmannsweiler: Schneider Verlag Hohengeren.'
bibtex: '@inbook{Herzig_Martin_Klar_2016, place={Baltmannsweiler}, series={Deutschdidaktik
in der Primarstufe}, title={Smartphone und Tablet – Medienpädagogische und technische
Grundlagen, Potential für den Deutschunterricht und Beispiele}, volume={3}, booktitle={Deutsch
Digital. Band 1 Theorie}, publisher={Schneider Verlag Hohengeren}, author={Herzig,
Bardo and Martin, Alexander and Klar, Tilman-Mathies}, editor={Knopf, J. and Abraham,
U.Editors}, year={2016}, pages={69–97}, collection={Deutschdidaktik in der Primarstufe}
}'
chicago: 'Herzig, Bardo, Alexander Martin, and Tilman-Mathies Klar. “Smartphone
Und Tablet – Medienpädagogische Und Technische Grundlagen, Potential Für Den Deutschunterricht
Und Beispiele.” In Deutsch Digital. Band 1 Theorie, edited by J. Knopf
and U. Abraham, 3:69–97. Deutschdidaktik in Der Primarstufe. Baltmannsweiler:
Schneider Verlag Hohengeren, 2016.'
ieee: 'B. Herzig, A. Martin, and T.-M. Klar, “Smartphone und Tablet – Medienpädagogische
und technische Grundlagen, Potential für den Deutschunterricht und Beispiele,”
in Deutsch Digital. Band 1 Theorie, vol. 3, J. Knopf and U. Abraham, Eds.
Baltmannsweiler: Schneider Verlag Hohengeren, 2016, pp. 69–97.'
mla: Herzig, Bardo, et al. “Smartphone Und Tablet – Medienpädagogische Und Technische
Grundlagen, Potential Für Den Deutschunterricht Und Beispiele.” Deutsch Digital.
Band 1 Theorie, edited by J. Knopf and U. Abraham, vol. 3, Schneider Verlag
Hohengeren, 2016, pp. 69–97.
short: 'B. Herzig, A. Martin, T.-M. Klar, in: J. Knopf, U. Abraham (Eds.), Deutsch
Digital. Band 1 Theorie, Schneider Verlag Hohengeren, Baltmannsweiler, 2016, pp.
69–97.'
date_created: 2019-05-15T09:03:42Z
date_updated: 2022-01-06T07:04:22Z
editor:
- first_name: J.
full_name: Knopf, J.
last_name: Knopf
- first_name: U.
full_name: Abraham, U.
last_name: Abraham
intvolume: ' 3'
language:
- iso: eng
page: 69-97
place: Baltmannsweiler
publication: Deutsch Digital. Band 1 Theorie
publication_status: published
publisher: Schneider Verlag Hohengeren
series_title: Deutschdidaktik in der Primarstufe
status: public
title: Smartphone und Tablet – Medienpädagogische und technische Grundlagen, Potential
für den Deutschunterricht und Beispiele
type: book_chapter
user_id: '38923'
volume: 3
year: '2016'
...
---
_id: '9835'
author:
- first_name: J.
full_name: Sperling, J.
last_name: Sperling
- first_name: Tim
full_name: Bartley, Tim
id: '49683'
last_name: Bartley
- first_name: G.
full_name: Donati, G.
last_name: Donati
- first_name: M.
full_name: Barbieri, M.
last_name: Barbieri
- first_name: X.-M.
full_name: Jin, X.-M.
last_name: Jin
- first_name: A.
full_name: Datta, A.
last_name: Datta
- first_name: W.
full_name: Vogel, W.
last_name: Vogel
- first_name: I. A.
full_name: Walmsley, I. A.
last_name: Walmsley
citation:
ama: Sperling J, Bartley T, Donati G, et al. Quantum Correlations from the Conditional
Statistics of Incomplete Data. Physical Review Letters. 2016. doi:10.1103/physrevlett.117.083601
apa: Sperling, J., Bartley, T., Donati, G., Barbieri, M., Jin, X.-M., Datta, A.,
… Walmsley, I. A. (2016). Quantum Correlations from the Conditional Statistics
of Incomplete Data. Physical Review Letters. https://doi.org/10.1103/physrevlett.117.083601
bibtex: '@article{Sperling_Bartley_Donati_Barbieri_Jin_Datta_Vogel_Walmsley_2016,
title={Quantum Correlations from the Conditional Statistics of Incomplete Data},
DOI={10.1103/physrevlett.117.083601},
journal={Physical Review Letters}, author={Sperling, J. and Bartley, Tim and Donati,
G. and Barbieri, M. and Jin, X.-M. and Datta, A. and Vogel, W. and Walmsley, I. A.},
year={2016} }'
chicago: Sperling, J., Tim Bartley, G. Donati, M. Barbieri, X.-M. Jin, A. Datta,
W. Vogel, and I. A. Walmsley. “Quantum Correlations from the Conditional Statistics
of Incomplete Data.” Physical Review Letters, 2016. https://doi.org/10.1103/physrevlett.117.083601.
ieee: J. Sperling et al., “Quantum Correlations from the Conditional Statistics
of Incomplete Data,” Physical Review Letters, 2016.
mla: Sperling, J., et al. “Quantum Correlations from the Conditional Statistics
of Incomplete Data.” Physical Review Letters, 2016, doi:10.1103/physrevlett.117.083601.
short: J. Sperling, T. Bartley, G. Donati, M. Barbieri, X.-M. Jin, A. Datta, W.
Vogel, I.A. Walmsley, Physical Review Letters (2016).
date_created: 2019-05-17T14:08:09Z
date_updated: 2020-02-26T14:39:40Z
department:
- _id: '15'
doi: 10.1103/physrevlett.117.083601
language:
- iso: eng
publication: Physical Review Letters
publication_identifier:
issn:
- 0031-9007
- 1079-7114
publication_status: published
status: public
title: Quantum Correlations from the Conditional Statistics of Incomplete Data
type: journal_article
user_id: '49683'
year: '2016'
...
---
_id: '9836'
abstract:
- lang: eng
text: AbstractQuantum mechanics establishes the
ultimate limit to the scaling of the precision on any parameter, by identifying
optimal probe states and measurements. While this paradigm is, at least in principle,
adequate for the metrology of quantum channels involving the estimation of phase
and loss parameters, we show that estimating the loss parameters associated with
a quantum channel and a realistic quantum detector are fundamentally different.
While Fock states are provably optimal for the former, we identify a crossover
in the nature of the optimal probe state for estimating detector imperfections
as a function of the loss parameter using Fisher information as a benchmark. We
provide theoretical results for on-off and homodyne detectors, the most widely
used detectors in quantum photonics technologies, when using Fock states and coherent
states as probes.
author:
- first_name: Marco
full_name: Barbieri, Marco
last_name: Barbieri
- first_name: Animesh
full_name: Datta, Animesh
last_name: Datta
- first_name: Tim
full_name: Bartley, Tim
id: '49683'
last_name: Bartley
- first_name: Xian-Min
full_name: Jin, Xian-Min
last_name: Jin
- first_name: W. Steven
full_name: Kolthammer, W. Steven
last_name: Kolthammer
- first_name: Ian A.
full_name: Walmsley, Ian A.
last_name: Walmsley
citation:
ama: Barbieri M, Datta A, Bartley T, Jin X-M, Kolthammer WS, Walmsley IA. Quantum
enhanced estimation of optical detector efficiencies. Quantum Measurements
and Quantum Metrology. 2016. doi:10.1515/qmetro-2016-0002
apa: Barbieri, M., Datta, A., Bartley, T., Jin, X.-M., Kolthammer, W. S., &
Walmsley, I. A. (2016). Quantum enhanced estimation of optical detector efficiencies.
Quantum Measurements and Quantum Metrology. https://doi.org/10.1515/qmetro-2016-0002
bibtex: '@article{Barbieri_Datta_Bartley_Jin_Kolthammer_Walmsley_2016, title={Quantum
enhanced estimation of optical detector efficiencies}, DOI={10.1515/qmetro-2016-0002},
journal={Quantum Measurements and Quantum Metrology}, author={Barbieri, Marco
and Datta, Animesh and Bartley, Tim and Jin, Xian-Min and Kolthammer, W. Steven
and Walmsley, Ian A.}, year={2016} }'
chicago: Barbieri, Marco, Animesh Datta, Tim Bartley, Xian-Min Jin, W. Steven Kolthammer,
and Ian A. Walmsley. “Quantum Enhanced Estimation of Optical Detector Efficiencies.”
Quantum Measurements and Quantum Metrology, 2016. https://doi.org/10.1515/qmetro-2016-0002.
ieee: M. Barbieri, A. Datta, T. Bartley, X.-M. Jin, W. S. Kolthammer, and I. A.
Walmsley, “Quantum enhanced estimation of optical detector efficiencies,” Quantum
Measurements and Quantum Metrology, 2016.
mla: Barbieri, Marco, et al. “Quantum Enhanced Estimation of Optical Detector Efficiencies.”
Quantum Measurements and Quantum Metrology, 2016, doi:10.1515/qmetro-2016-0002.
short: M. Barbieri, A. Datta, T. Bartley, X.-M. Jin, W.S. Kolthammer, I.A. Walmsley,
Quantum Measurements and Quantum Metrology (2016).
date_created: 2019-05-17T14:08:35Z
date_updated: 2020-02-26T14:38:03Z
department:
- _id: '15'
doi: 10.1515/qmetro-2016-0002
language:
- iso: eng
publication: Quantum Measurements and Quantum Metrology
publication_identifier:
issn:
- 2299-114X
publication_status: published
status: public
title: Quantum enhanced estimation of optical detector efficiencies
type: journal_article
user_id: '49683'
year: '2016'
...
---
_id: '985'
accept: '1'
author:
- first_name: S.
full_name: v. Rossem, S.
last_name: v. Rossem
- first_name: W.
full_name: Tavernier, W.
last_name: Tavernier
- first_name: Manuel
full_name: Peuster, Manuel
id: '13271'
last_name: Peuster
- first_name: D.
full_name: Colle, D.
last_name: Colle
- first_name: M.
full_name: Pickavet, M.
last_name: Pickavet
- first_name: P.
full_name: Demeester, P.
last_name: Demeester
citation:
ama: 'v. Rossem S, Tavernier W, Peuster M, Colle D, Pickavet M, Demeester P. Monitoring
and debugging using an SDK for NFV-powered telecom applications. In: Proc.
IEEE Conference on Network Function Virtualization and Software Defined Network
(NFV-SDN), Demo Track. ; 2016.'
apa: v. Rossem, S., Tavernier, W., Peuster, M., Colle, D., Pickavet, M., & Demeester,
P. (2016). Monitoring and debugging using an SDK for NFV-powered telecom applications.
In Proc. IEEE Conference on Network Function Virtualization and Software Defined
Network (NFV-SDN), Demo Track.
bibtex: '@inproceedings{v. Rossem_Tavernier_Peuster_Colle_Pickavet_Demeester_2016,
title={Monitoring and debugging using an SDK for NFV-powered telecom applications},
booktitle={Proc. IEEE Conference on Network Function Virtualization and Software
Defined Network (NFV-SDN), Demo Track}, author={v. Rossem, S. and Tavernier, W.
and Peuster, Manuel and Colle, D. and Pickavet, M. and Demeester, P.}, year={2016}
}'
chicago: Rossem, S. v., W. Tavernier, Manuel Peuster, D. Colle, M. Pickavet, and
P. Demeester. “Monitoring and Debugging Using an SDK for NFV-Powered Telecom Applications.”
In Proc. IEEE Conference on Network Function Virtualization and Software Defined
Network (NFV-SDN), Demo Track, 2016.
ieee: S. v. Rossem, W. Tavernier, M. Peuster, D. Colle, M. Pickavet, and P. Demeester,
“Monitoring and debugging using an SDK for NFV-powered telecom applications,”
in Proc. IEEE Conference on Network Function Virtualization and Software Defined
Network (NFV-SDN), Demo Track, 2016.
mla: v. Rossem, S., et al. “Monitoring and Debugging Using an SDK for NFV-Powered
Telecom Applications.” Proc. IEEE Conference on Network Function Virtualization
and Software Defined Network (NFV-SDN), Demo Track, 2016.
short: 'S. v. Rossem, W. Tavernier, M. Peuster, D. Colle, M. Pickavet, P. Demeester,
in: Proc. IEEE Conference on Network Function Virtualization and Software Defined
Network (NFV-SDN), Demo Track, 2016.'
date_created: 2017-11-27T10:22:29Z
date_updated: 2019-01-03T13:18:55Z
ddc:
- '004'
department:
- _id: '75'
file:
- access_level: closed
content_type: application/pdf
creator: tabu
date_created: 2017-12-21T12:16:53Z
date_updated: 2017-12-21T12:16:53Z
file_id: '1084'
file_name: 8521284.pdf
file_size: 305293
open_access: 1
relation: main_file
success: 1
file_date_updated: 2017-12-21T12:16:53Z
project:
- _id: '25'
call_identifier: 5G PPP Phase 1
grant_number: '671517'
name: 'SONATA NFV: Agile Service Development and Orchestration in 5G Virtualized
Networks'
publication: Proc. IEEE Conference on Network Function Virtualization and Software
Defined Network (NFV-SDN), Demo Track
status: public
title: Monitoring and debugging using an SDK for NFV-powered telecom applications
type: conference
user_id: '126'
year: '2016'
...
---
_id: '9955'
abstract:
- lang: eng
text: Wire bonding has been an established packaging technology for decades. When
introducing copper as wire material for high power applications, adaptations to
the bonding process and to machines became necessary. Here, challenges occur due
to the stiffer wire material and changing oxide layers on the contact partners.
To achieve sufficient process stability, a clean bond area is required, which
can only be achieved with high shear stresses in the contact partners surfaces.
These necessitate high normal forces to plastically deform the wire and substrate.
To achieve such high stresses in the contact area, the bonding tool needs to be
able to transmit the needed tangential forces to the top side of the wire. The
wire itself performs a shear movement and transmits the force into the contact
area to clean the contaminant and oxide layers and to level the desired bond surfaces.
The main function of the tool is to transmit these forces. If the bond tool can
only transmit low forces in the direction of excitation, the parameter space for
a stable bond process is severely restricted. Here, a modeling approach to estimate
how well different tool shapes meet the demand of transmitting high tangential
forces is presented. The model depends on wire deformation and thus on the ultrasonic
softening effect.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and
Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234'
apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic
Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
year={2016}, pages={2103–2110} }'
chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016.
https://doi.org/10.1109/ECTC.2016.234.
ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.
mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
Bond Tools.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9957'
abstract:
- lang: eng
text: Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter
und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL –
Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden
Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen
herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit,
sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte
Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der
Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in
Form einer modifizierten Bondmaschine. Intelligent production of heavy copper
wire bonds It is the aim of this innovation-project to develop a self-optimization
system for ultrasonic copper wire bonding. It is part of the leading edge cluster
“it’s OWL”. The bonding machine will be able to react autonomously to changing
boundary conditions to ensure constant and reliable bonding results. For this,
the hole bonding process is modeled in great detail and newest self-optimization
techniques are utilized. A prototype-system incorporated in a serial machine is
used for evaluation.
author:
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Florian
full_name: Biermann, Florian
last_name: Biermann
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen.
wt-online. 2016;7/8:512-519.
apa: Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M.,
… Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. Wt-Online,
7/8, 512–519.
bibtex: '@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016,
title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online},
author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff,
Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth,
Karsten}, year={2016}, pages={512–519} }'
chicago: 'Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter
Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen
Intelligent Herstellen.” Wt-Online 7/8 (2016): 512–19.'
ieee: M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,”
wt-online, vol. 7/8, pp. 512–519, 2016.
mla: Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.”
Wt-Online, vol. 7/8, 2016, pp. 512–19.
short: M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F.
Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
date_created: 2019-05-27T08:53:18Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
language:
- iso: eng
page: 512-519
popular_science: '1'
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: wt-online
status: public
title: Kupferbondverbindungen intelligent herstellen
type: journal_article
user_id: '210'
volume: 7/8
year: '2016'
...
---
_id: '9958'
abstract:
- lang: eng
text: The transportation of dry fine powders is an emerging technologic task, as
in biotechnology, pharmaceutical or coatings industry particle sizes of processed
powders are getting smaller and smaller. Fine powders are primarily defined by
the fact that adhesive and cohesive forces outweigh the weight forces. This leads
to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes
it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory
conveyors) for transport. A rather new method for transporting these fine powders
is based on ultrasonic vibrations, which are used to reduce friction and adhesion
between powder and the substrate. One very effective set-up consists of a pipe,
which vibrates harmoniously in axial direction at low frequency combined with
a pulsed radial high frequency vibration. The high frequency vibration accelerates
the particles perpendicular to the surface of the pipe, which in average leads
to lower normal and thereby smaller friction force. With coordinated friction
manipulation the powder acceleration can be varied so that the powder may be greatly
accelerated and only slightly decelerated in each excitation period of the low
frequency axial vibration of the pipe. The amount of powder flow is adjustable
by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile
for comparable high volume and fine dosing using one setup. Within this contribution
an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration
and a piezoelectric actuator for the radial high frequency vibration is described.
An analytical model is shown, that simulates the powder velocity. Finally, simulation
results are validated by experimental data for different driving parameters such
as amplitude of low frequency vibration, pipe material and inclination angle.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Littmann, Walter
last_name: Littmann
citation:
ama: 'Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry
fine powders by coordinated friction manipulation. In: PAMM Proc. Appl. Math.
Mech. 16. Braunschweig; 2016:635-636. doi:10.1002/pamm.201610306'
apa: Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., & Littmann, W. (2016).
Transportation of dry fine powders by coordinated friction manipulation. In PAMM
Proc. Appl. Math. Mech. 16 (pp. 635–636). Braunschweig. https://doi.org/10.1002/pamm.201610306
bibtex: '@inproceedings{Dunst_Sextro_Bornmann_Hemsel_Littmann_2016, place={Braunschweig},
title={Transportation of dry fine powders by coordinated friction manipulation},
DOI={10.1002/pamm.201610306},
booktitle={PAMM Proc. Appl. Math. Mech. 16}, author={Dunst, Paul and Sextro, Walter
and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}, year={2016}, pages={635–636}
}'
chicago: Dunst, Paul, Walter Sextro, Peter Bornmann, Tobias Hemsel, and Walter Littmann.
“Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” In
PAMM Proc. Appl. Math. Mech. 16, 635–36. Braunschweig, 2016. https://doi.org/10.1002/pamm.201610306.
ieee: P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation
of dry fine powders by coordinated friction manipulation,” in PAMM Proc. Appl.
Math. Mech. 16, 2016, pp. 635–636.
mla: Dunst, Paul, et al. “Transportation of Dry Fine Powders by Coordinated Friction
Manipulation.” PAMM Proc. Appl. Math. Mech. 16, 2016, pp. 635–36, doi:10.1002/pamm.201610306.
short: 'P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc.
Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.'
date_created: 2019-05-27T08:57:25Z
date_updated: 2019-05-27T08:59:25Z
department:
- _id: '151'
doi: 10.1002/pamm.201610306
language:
- iso: eng
page: 635-636
place: Braunschweig
publication: PAMM Proc. Appl. Math. Mech. 16
status: public
title: Transportation of dry fine powders by coordinated friction manipulation
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9959'
abstract:
- lang: eng
text: Ultrasonic heavy wire bonding is a commonly used technology to conduct electrical
devices in power electronics. In order to facilitate powerful solutions combined
with an increased efficiency, involving a material change from aluminum to copper
wire as conductor material takes place in recent years. Due to the material related
properties, copper wire bonding requires significant higher bond processing parameters
such as bond force and ultrasonic power compared to aluminum which can lead to
damages or a failure of the bonded component. Therefore, a profound knowledge
of the processes prevailing during wire bonding is essential to optimize the application
of the copper wires and consequently to achieve the demands on quality and reliability.
The behavior of different natural surface oxides of aluminum and copper are assumed
to be one reason for the deviation in the required bond parameters. Accordingly,
the impact of differently pre-treated substrates surfaces on which the bonding
is applied were investigated in this study. First, all conditions investigated
(as-received, oxidefree, AlOx and the CuOx) were characterized by utilizing scanning
electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam microscopy
and atomic force microscopy. In addition, hardness tests were performed as well
as perthometer measurements. Afterwards, a 500 $\mu$ m copper wire was bonded
on the generated surfaces investigated. In consideration of the roughness, shear
test of various bond times and microscopic images were evaluated. Finally, the
results were compared and discussed. Overall, the current study indicates that
an Al-oxide layer is beneficial for welding process in Cu wire bonding. On the
contrary, the Cu-oxide is detrimental and leads to a delayed welding of the joining
parts. Based on the obtained results, it can be expected that due to an ideal
set of Al-oxide layers, lower optimal bond parameters can used to reach high bond
strength with good reliability properties.
author:
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Olexandr
full_name: Grydin, Olexandr
last_name: Grydin
- first_name: Florian
full_name: Hengsbach, Florian
last_name: Hengsbach
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on
the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91'
apa: Eacock, F., Unger, A., Eichwald, P., Grydin, O., Hengsbach, F., Althoff, S.,
… Guth, K. (2016). Effect of different oxide layers on the ultrasonic copper wire
bond process. In IEEE 66th Electronic Components and Technology Conference
(pp. 2111–2118). https://doi.org/10.1109/ECTC.2016.91
bibtex: '@inproceedings{Eacock_Unger_Eichwald_Grydin_Hengsbach_Althoff_Schaper_Guth_2016,
title={Effect of different oxide layers on the ultrasonic copper wire bond process},
DOI={10.1109/ECTC.2016.91},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Eacock,
Florian and Unger, Andreas and Eichwald, Paul and Grydin, Olexandr and Hengsbach,
Florian and Althoff, Simon and Schaper, Mirko and Guth, Karsten}, year={2016},
pages={2111–2118} }'
chicago: Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian
Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different
Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic
Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
ieee: F. Eacock et al., “Effect of different oxide layers on the ultrasonic
copper wire bond process,” in IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 2111–2118.
mla: Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic
Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
short: 'F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M.
Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2111–2118.'
date_created: 2019-05-27T09:00:50Z
date_updated: 2019-09-16T10:38:59Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.91
keyword:
- Ultrasonic copper wire bonding
- Al-oxide
- Cuoxide
- oxide-free
- roughness
- morphology
language:
- iso: eng
page: 2111-2118
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Effect of different oxide layers on the ultrasonic copper wire bond process
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9960'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a common technology for connecting electrodes of
electronic components like power modules. Nowadays, bond connections are often
made of copper instead of aluminum due to its thermal and mechanical assets. One
of the main cost factors in the wire bonding process is the acquisition cost of
consumables such as bonding tools. For copper wire bonding tool lifetime is much
lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge
bonding tools that was validated by observing wear patterns with a scanning electron
microscope. The wear coefficient is determined in long-term bonding tests. The
application of Fleischer´s wear approach incorporating frictional power to a finite
element simulation of the bonding processes is used to shift element nodes depending
on the rising frictional power for finite element modeling. The presented simulation
method can be used to take tool wear into consideration for creating tools with
increased lifetime. This enables the production of reliable bond connections using
heavy as well as thin wire of any material. The paper discusses the predominant
influences of wear on the main tool functions and their changes over tool life.
Furthermore, the influence of the tool groove angle on the tool wear was investigated.
One of the main results is that the wear is largest during the last phase of each
bonding process, when the contact area between tool and wire is largest.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge
Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.'
apa: Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &
Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE
CPMT Symposium Japan, 2016.
bibtex: '@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016,
title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT
Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock,
Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann,
Michael}, year={2016} }'
chicago: Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro,
Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge
Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
ieee: P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,”
in IEEE CPMT Symposium Japan, 2016, 2016.
mla: Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.”
IEEE CPMT Symposium Japan, 2016, 2016.
short: 'P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann,
in: IEEE CPMT Symposium Japan, 2016, 2016.'
date_created: 2019-05-27T09:07:19Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE CPMT Symposium Japan, 2016
quality_controlled: '1'
status: public
title: Micro Wear Modeling in Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9961'
abstract:
- lang: eng
text: Redundancy is a common approach to improve system reliability, availability
and safety in technical systems. It is achieved by adding functionally equivalent
elements that enable the system to remain operational even though one or more
of those elements fail. This paper begins with an overview on the various terminologies
and methods for redundancy concepts that can be modeled sufficiently using established
reliability analysis methods. However, these approaches yield very complex system
models, which limits their applicability. In current research, Bayesian Networks
(BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used
for reliability analysis because of their benefits in modeling complex systems
and in representing multi-state variables. However, these approaches lack appropriate
methods to model all commonly used redundancy concepts. To overcome this limitation,
three different modeling approaches based on BNs and DBNs are described in this
paper. Addressing those approaches, the benefits and limitations of BNs and DBNs
for modeling reliability of redundant technical systems are discussed and evaluated.
author:
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks. In: Proceedings of the Third European Conference of
the Prognostics and Health Management Society 2016. ; 2016.'
apa: Kaul, T., Meyer, T., & Sextro, W. (2016). Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks. In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016.
bibtex: '@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third
European Conference of the Prognostics and Health Management Society 2016}, author={Kaul,
Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }'
chicago: Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks.” In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016, 2016.
ieee: T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical
Systems with Bayesian Networks,” in Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.
mla: Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks.” Proceedings of the Third European Conference of the
Prognostics and Health Management Society 2016, 2016.
short: 'T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.'
date_created: 2019-05-27T09:10:07Z
date_updated: 2019-09-30T08:05:55Z
department:
- _id: '151'
language:
- iso: eng
publication: Proceedings of the Third European Conference of the Prognostics and Health
Management Society 2016
quality_controlled: '1'
status: public
title: Modeling of Complex Redundancy in Technical Systems with Bayesian Networks
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9963'
abstract:
- lang: eng
text: Tire-wheel assembly is the only connection between road and vehicle. Contacting
directly with road within postcard size of contact area, it is mounted and guided
by the suspension system. Therefore kinematics and compliances of suspension system
greatly influence the frictional coupling of tire tread elements and road surface
asperities by affecting pressure and sliding velocity distribution in the contact
zone. This study emphasizes the development of a numerical methodology for frictional
rolling contact analysis with focus on interaction of suspension system dynamics
and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody
system of the multi-link rear suspension is established, where both flexible and
rigid bodies are modeled to allow large displacements with included elastic effects.
To meet accuracy requirements for the high frequency applications, such as road
excitations, the amplitude- and frequency-dependency of rubber-metal bushings
is included. Furthermore the proposed flexible viscoelastic suspension model is
enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic
response and covers any road excitations by tread submodel connected to road surface
model. Concerning the verification and validation procedure numerous experiments
are carried out to confirm the validity and the accuracy of both the developed
submodels and the entire model. The devised approach makes it possible to investigate
the influence of suspension system design on dynamical rolling contact and to
evaluate tire tread wear. Therefore it can be a useful tool to predict frictional
power distribution within the contact area under more realistic conditions.
author:
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Sebastian
full_name: Schulze, Sebastian
last_name: Schulze
citation:
ama: 'Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis using ADAMS. In: The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016. Cyberjaya, Malaysia, 2016; 2016:1-12.'
apa: Kohl, S., Sextro, W., & Schulze, S. (2016). Aspects of Flexible Viscoelastic
Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In The
2nd International Conference on Automotive Innovation and Green Energy Vehicle
(AiGEV 2016), Cyberjaya, Malaysia, 2016. (pp. 1–12). Cyberjaya, Malaysia,
2016.
bibtex: '@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016},
title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016},
pages={1–12} }'
chicago: Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible
Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using
ADAMS.” In The 2nd International Conference on Automotive Innovation and Green
Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 1–12. Cyberjaya,
Malaysia, 2016, 2016.
ieee: S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension
Modeling for Frictional Rolling Contact Analysis using ADAMS,” in The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
mla: Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis Using ADAMS.” The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
short: 'S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.'
date_created: 2019-05-27T09:13:14Z
date_updated: 2019-05-27T09:13:54Z
department:
- _id: '151'
keyword:
- Kinematics and compliances
- flexible viscoelastic suspension model
- frictional rolling contact analysis
- frictional power distribution.
language:
- iso: eng
page: 1-12
place: Cyberjaya, Malaysia, 2016
publication: The 2nd International Conference on Automotive Innovation and Green Energy
Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.
status: public
title: Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9964'
abstract:
- lang: eng
text: This paper presents a benchmark data set for condition monitoring of rolling
bearings in combination with an extensive description of the corresponding bearing
damage, the data set generation by experiments and results of datadriven classifications
used as a diagnostic method. The diagnostic method uses the motor current signal
of an electromechanical drive system for bearing diagnostic. The advantage of
this approach in general is that no additional sensors are required, as current
measurements can be performed in existing frequency inverters. This will help
to reduce the cost of future condition monitoring systems. A particular novelty
of the present approach is the monitoring of damage in external bearings which
are installed in the drive system but outside the electric motor. Nevertheless,
the motor current signal is used as input for the detection of the damage. Moreover,
a wide distribution of bearing damage is considered for the benchmark data set.
The results of the classifications show that the motor current signal can be used
to identify and classify bearing damage within the drive system. However, the
classification accuracy is still low compared to classifications based on vibration
signals. Further, dependency on properties of those bearing damage that were used
for the generation of training data are observed, because training with data of
artificially generated and real bearing damages lead to different accuracies.
Altogether a verified and systematically generated data set is presented and published
online for further research
author:
- first_name: Christian
full_name: Lessmeier, Christian
last_name: Lessmeier
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Detmar
full_name: Zimmer, Detmar
last_name: Zimmer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Lessmeier C, Kimotho JK, Zimmer D, Sextro W. Condition Monitoring of Bearing
Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric
Motors: A Benchmark Data Set for Data-Driven Classification. In: European Conference
of the Prognostics and Health Management Society. ; 2016.'
apa: 'Lessmeier, C., Kimotho, J. K., Zimmer, D., & Sextro, W. (2016). Condition
Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor
Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.
In European Conference of the Prognostics and Health Management Society.'
bibtex: '@inproceedings{Lessmeier_Kimotho_Zimmer_Sextro_2016, title={Condition Monitoring
of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals
of Electric Motors: A Benchmark Data Set for Data-Driven Classification}, booktitle={European
Conference of the Prognostics and Health Management Society}, author={Lessmeier,
Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter}, year={2016}
}'
chicago: 'Lessmeier, Christian, James Kuria Kimotho, Detmar Zimmer, and Walter Sextro.
“Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by
Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven
Classification.” In European Conference of the Prognostics and Health Management
Society, 2016.'
ieee: 'C. Lessmeier, J. K. Kimotho, D. Zimmer, and W. Sextro, “Condition Monitoring
of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals
of Electric Motors: A Benchmark Data Set for Data-Driven Classification,” in European
Conference of the Prognostics and Health Management Society, 2016.'
mla: 'Lessmeier, Christian, et al. “Condition Monitoring of Bearing Damage in Electromechanical
Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data
Set for Data-Driven Classification.” European Conference of the Prognostics
and Health Management Society, 2016.'
short: 'C. Lessmeier, J.K. Kimotho, D. Zimmer, W. Sextro, in: European Conference
of the Prognostics and Health Management Society, 2016.'
date_created: 2019-05-27T09:14:22Z
date_updated: 2019-09-16T10:35:40Z
department:
- _id: '151'
language:
- iso: eng
publication: European Conference of the Prognostics and Health Management Society
quality_controlled: '1'
status: public
title: 'Condition Monitoring of Bearing Damage in Electromechanical Drive Systems
by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven
Classification'
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9967'
abstract:
- lang: eng
text: Multibody models of mechatronic systems are usually interdisciplinary and
are continuously gaining complexity, due to a growing demand for comprehensive
models of systems including effects of electro mechanics, elastic bodies, contacts
and friction. To be capable of simulating large models with subassemblies and
contact between bodies, reduction techniques are required, which need certain
experience in the choice of parameters. This publication discusses different possibilities
for the modal description of structures in flexible multibody models with application
to an Adaptive Frontlighting System in ADAMS. It will be shown that mode count,
assembling of structures before and after modal reduction and influence of damping
parameters of particular structures and subassemblies affect the behavior of the
entire system. A common reduction technique for flexible structures in multibody
models is the component mode synthesis, which uses a certain number of modes for
description of the modal behavior of a structure. The influence of the mode count
will be shown by means of different modal descriptions of one structure that contributes
to a comprehensive model. Another study will prove that modal data of subassemblies
and assemblies of modal reduced single structures lead to different models. The
definition of damping parameters depends on the number of structures that have
been added to an assembly before modal reduction and on the number of modal reduced
structures. The comparison of subassemblies and the entire model to experimental
data will highlight the accuracy, computational overhead, complexity of models
and modeling efficiency of the comprehensive model for the frontlighting system.
author:
- first_name: Sebastian
full_name: Schulze, Sebastian
last_name: Schulze
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
citation:
ama: 'Schulze S, Sextro W, Kohl S. Using Adequate Reduced Models for Flexible Multibody
Systems of Automotive Mechatronic Systems. In: 2nd International Conference
on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016. ;
2016:1-11.'
apa: Schulze, S., Sextro, W., & Kohl, S. (2016). Using Adequate Reduced Models
for Flexible Multibody Systems of Automotive Mechatronic Systems. In 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia
2016 (pp. 1–11).
bibtex: '@inproceedings{Schulze_Sextro_Kohl_2016, title={Using Adequate Reduced
Models for Flexible Multibody Systems of Automotive Mechatronic Systems}, booktitle={2nd
International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV)
Malaysia 2016}, author={Schulze, Sebastian and Sextro, Walter and Kohl, Sergej},
year={2016}, pages={1–11} }'
chicago: Schulze, Sebastian, Walter Sextro, and Sergej Kohl. “Using Adequate Reduced
Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” In 2nd
International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV)
Malaysia 2016, 1–11, 2016.
ieee: S. Schulze, W. Sextro, and S. Kohl, “Using Adequate Reduced Models for Flexible
Multibody Systems of Automotive Mechatronic Systems,” in 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia
2016, 2016, pp. 1–11.
mla: Schulze, Sebastian, et al. “Using Adequate Reduced Models for Flexible Multibody
Systems of Automotive Mechatronic Systems.” 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016,
pp. 1–11.
short: 'S. Schulze, W. Sextro, S. Kohl, in: 2nd International Conference on Automotive
Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.'
date_created: 2019-05-27T09:19:20Z
date_updated: 2019-05-27T09:19:49Z
department:
- _id: '151'
keyword:
- model reduction
- modal description
- flexible multibody systems
language:
- iso: eng
page: 1-11
publication: 2nd International Conference on Automotive Innovation and Green Energy
Vehicle (AiGEV) Malaysia 2016
status: public
title: Using Adequate Reduced Models for Flexible Multibody Systems of Automotive
Mechatronic Systems
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '3934'
abstract:
- lang: eng
text: Typical optical integrated circuits combine elements, like straight and curved
waveguides, or cavities, the simulation and design of which is well established
through numerical eigenproblem-solvers. It remains to predict the interaction
of these modes. We address this task by a ”Hybrid” variant (HCMT) of Coupled Mode
Theory. Using methods from finite-element numerics, the optical properties of
a circuit are approximated by superpositions of eigen-solutions for its constituents,
leading to quantitative, low-dimensional, and interpretable models in the frequency
domain. Spectral scans are complemented by the direct computation of supermode
properties (spectral positions and linewidths, coupling-induced phase shifts).
This contribution outlines the theoretical background, and discusses briefly limitations
and implementational details, with the help of an example of a 2-D coupled-resonator-optical-waveguide
configuration.
author:
- first_name: Manfred
full_name: Hammer, Manfred
id: '48077'
last_name: Hammer
orcid: 0000-0002-6331-9348
citation:
ama: 'Hammer M. Wave interaction in photonic integrated circuits: Hybrid analytical
/ numerical coupled mode modeling. In: Broquin J-E, Nunzi Conti G, eds. Integrated
Optics: Devices, Materials, and Technologies XX. SPIE; 2016:975018-975018-8.
doi:10.1117/12.2214331'
apa: 'Hammer, M. (2016). Wave interaction in photonic integrated circuits: Hybrid
analytical / numerical coupled mode modeling. In J.-E. Broquin & G. Nunzi
Conti (Eds.), Integrated Optics: Devices, Materials, and Technologies XX
(pp. 975018-975018–8). San Francisco, USA: SPIE. https://doi.org/10.1117/12.2214331'
bibtex: '@inproceedings{Hammer_2016, title={Wave interaction in photonic integrated
circuits: Hybrid analytical / numerical coupled mode modeling}, DOI={10.1117/12.2214331},
number={9750}, booktitle={Integrated Optics: Devices, Materials, and Technologies
XX}, publisher={SPIE}, author={Hammer, Manfred}, editor={Broquin, Jean-Emmanuel
and Nunzi Conti, GualtieroEditors}, year={2016}, pages={975018-975018–8} }'
chicago: 'Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid
Analytical / Numerical Coupled Mode Modeling.” In Integrated Optics: Devices,
Materials, and Technologies XX, edited by Jean-Emmanuel Broquin and Gualtiero
Nunzi Conti, 975018-975018–8. SPIE, 2016. https://doi.org/10.1117/12.2214331.'
ieee: 'M. Hammer, “Wave interaction in photonic integrated circuits: Hybrid analytical
/ numerical coupled mode modeling,” in Integrated Optics: Devices, Materials,
and Technologies XX, San Francisco, USA, 2016, no. 9750, pp. 975018-975018–8.'
mla: 'Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid
Analytical / Numerical Coupled Mode Modeling.” Integrated Optics: Devices,
Materials, and Technologies XX, edited by Jean-Emmanuel Broquin and Gualtiero
Nunzi Conti, no. 9750, SPIE, 2016, pp. 975018-975018–8, doi:10.1117/12.2214331.'
short: 'M. Hammer, in: J.-E. Broquin, G. Nunzi Conti (Eds.), Integrated Optics:
Devices, Materials, and Technologies XX, SPIE, 2016, pp. 975018-975018–8.'
conference:
location: San Francisco, USA
name: Photonics West 2016/OPTO 2016
date_created: 2018-08-20T09:25:13Z
date_updated: 2022-01-06T06:59:56Z
department:
- _id: '61'
doi: 10.1117/12.2214331
editor:
- first_name: Jean-Emmanuel
full_name: Broquin, Jean-Emmanuel
last_name: Broquin
- first_name: Gualtiero
full_name: Nunzi Conti, Gualtiero
last_name: Nunzi Conti
issue: '9750'
keyword:
- tet_topic_waveguide
- tet_topic_numerics
language:
- iso: eng
page: '975018-975018-8 '
publication: 'Integrated Optics: Devices, Materials, and Technologies XX'
publication_status: published
publisher: SPIE
status: public
title: 'Wave interaction in photonic integrated circuits: Hybrid analytical / numerical
coupled mode modeling'
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '3956'
abstract:
- lang: eng
text: "In this article we present an integration technique for low-voltage DNTT-based
TFTs for flexible electronic applications.\r\nTherefore, a high-k nanocomposite
combining the flexibility of its polymericmatrix and the high permittivity\r\nof
the incorporated inorganic material was used as gate dielectric layer. The influence
of a conventional\r\nphotolithography process upon the dielectric layer is analyzed
regarding electrical instabilities in the device characteristics.\r\nThe impact
of an implemented sacrificial layer to reduce chemical stress to the insulating
film during\r\nphotolithography is evaluated. Furthermore, first inverter circuits
were integrated and electrically characterized.\r\nAdditionally, the implementation
of this sacrificial layer can be used for future complementary circuit design."
article_type: original
author:
- first_name: Thorsten
full_name: Meyers, Thorsten
last_name: Meyers
- first_name: Fábio F.
full_name: Vidor, Fábio F.
last_name: Vidor
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
citation:
ama: Meyers T, Vidor FF, Brassat K, Lindner J, Hilleringmann U. Low-voltage DNTT-based
thin-film transistors and inverters for flexible electronics. Microelectronic
Engineering. 2016;174:35-39. doi:10.1016/j.mee.2016.12.018
apa: Meyers, T., Vidor, F. F., Brassat, K., Lindner, J., & Hilleringmann, U.
(2016). Low-voltage DNTT-based thin-film transistors and inverters for flexible
electronics. Microelectronic Engineering, 174, 35–39. https://doi.org/10.1016/j.mee.2016.12.018
bibtex: '@article{Meyers_Vidor_Brassat_Lindner_Hilleringmann_2016, title={Low-voltage
DNTT-based thin-film transistors and inverters for flexible electronics}, volume={174},
DOI={10.1016/j.mee.2016.12.018},
journal={Microelectronic Engineering}, publisher={Elsevier BV}, author={Meyers,
Thorsten and Vidor, Fábio F. and Brassat, Katharina and Lindner, Jörg and Hilleringmann,
Ulrich}, year={2016}, pages={35–39} }'
chicago: 'Meyers, Thorsten, Fábio F. Vidor, Katharina Brassat, Jörg Lindner, and
Ulrich Hilleringmann. “Low-Voltage DNTT-Based Thin-Film Transistors and Inverters
for Flexible Electronics.” Microelectronic Engineering 174 (2016): 35–39.
https://doi.org/10.1016/j.mee.2016.12.018.'
ieee: T. Meyers, F. F. Vidor, K. Brassat, J. Lindner, and U. Hilleringmann, “Low-voltage
DNTT-based thin-film transistors and inverters for flexible electronics,” Microelectronic
Engineering, vol. 174, pp. 35–39, 2016.
mla: Meyers, Thorsten, et al. “Low-Voltage DNTT-Based Thin-Film Transistors and
Inverters for Flexible Electronics.” Microelectronic Engineering, vol.
174, Elsevier BV, 2016, pp. 35–39, doi:10.1016/j.mee.2016.12.018.
short: T. Meyers, F.F. Vidor, K. Brassat, J. Lindner, U. Hilleringmann, Microelectronic
Engineering 174 (2016) 35–39.
date_created: 2018-08-20T13:33:05Z
date_updated: 2022-01-06T07:00:00Z
ddc:
- '530'
department:
- _id: '286'
- _id: '15'
doi: 10.1016/j.mee.2016.12.018
file:
- access_level: closed
content_type: application/pdf
creator: hclaudia
date_created: 2018-08-20T13:35:02Z
date_updated: 2018-08-20T13:35:02Z
file_id: '3957'
file_name: Now-voltage DNTT-based thin-film transistors and inverters for flexible
electronics.pdf
file_size: 758984
relation: main_file
success: 1
file_date_updated: 2018-08-20T13:35:02Z
has_accepted_license: '1'
intvolume: ' 174'
language:
- iso: eng
page: 35-39
publication: Microelectronic Engineering
publication_identifier:
issn:
- 0167-9317
publication_status: published
publisher: Elsevier BV
status: public
title: Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics
type: journal_article
user_id: '55706'
volume: 174
year: '2016'
...
---
_id: '4004'
author:
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Arne
full_name: Rüdiger, Arne
last_name: Rüdiger
- first_name: Julius
full_name: Bürger, Julius
id: '46952'
last_name: Bürger
- first_name: W.
full_name: Bremser, W.
last_name: Bremser
- first_name: Oliver
full_name: Strube, Oliver
last_name: Strube
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: 'Brassat K, Rüdiger A, Bürger J, Bremser W, Strube O, Lindner J. Enzyme mediated
autodeposition of protein particles on nanosphere lithographically nanostructured
surfaces . In: ; 2016.'
apa: Brassat, K., Rüdiger, A., Bürger, J., Bremser, W., Strube, O., & Lindner,
J. (2016). Enzyme mediated autodeposition of protein particles on nanosphere lithographically
nanostructured surfaces . Presented at the E-MRS Fall Meeting 2016, Warsaw (Poland).
bibtex: '@inproceedings{Brassat_Rüdiger_Bürger_Bremser_Strube_Lindner_2016, title={Enzyme
mediated autodeposition of protein particles on nanosphere lithographically nanostructured
surfaces }, author={Brassat, Katharina and Rüdiger, Arne and Bürger, Julius and
Bremser, W. and Strube, Oliver and Lindner, Jörg}, year={2016} }'
chicago: Brassat, Katharina, Arne Rüdiger, Julius Bürger, W. Bremser, Oliver Strube,
and Jörg Lindner. “Enzyme Mediated Autodeposition of Protein Particles on Nanosphere
Lithographically Nanostructured Surfaces ,” 2016.
ieee: K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, and J. Lindner,
“Enzyme mediated autodeposition of protein particles on nanosphere lithographically
nanostructured surfaces ,” presented at the E-MRS Fall Meeting 2016, Warsaw (Poland),
2016.
mla: Brassat, Katharina, et al. Enzyme Mediated Autodeposition of Protein Particles
on Nanosphere Lithographically Nanostructured Surfaces . 2016.
short: 'K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, J. Lindner, in:
2016.'
conference:
end_date: 2016-09-22
location: Warsaw (Poland)
name: E-MRS Fall Meeting 2016
start_date: 2016-09-19
date_created: 2018-08-21T12:19:28Z
date_updated: 2022-01-06T07:00:06Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
status: public
title: 'Enzyme mediated autodeposition of protein particles on nanosphere lithographically
nanostructured surfaces '
type: conference
user_id: '55706'
year: '2016'
...