---
_id: '9960'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a common technology for connecting electrodes of
electronic components like power modules. Nowadays, bond connections are often
made of copper instead of aluminum due to its thermal and mechanical assets. One
of the main cost factors in the wire bonding process is the acquisition cost of
consumables such as bonding tools. For copper wire bonding tool lifetime is much
lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge
bonding tools that was validated by observing wear patterns with a scanning electron
microscope. The wear coefficient is determined in long-term bonding tests. The
application of Fleischer´s wear approach incorporating frictional power to a finite
element simulation of the bonding processes is used to shift element nodes depending
on the rising frictional power for finite element modeling. The presented simulation
method can be used to take tool wear into consideration for creating tools with
increased lifetime. This enables the production of reliable bond connections using
heavy as well as thin wire of any material. The paper discusses the predominant
influences of wear on the main tool functions and their changes over tool life.
Furthermore, the influence of the tool groove angle on the tool wear was investigated.
One of the main results is that the wear is largest during the last phase of each
bonding process, when the contact area between tool and wire is largest.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge
Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.'
apa: Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &
Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE
CPMT Symposium Japan, 2016.
bibtex: '@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016,
title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT
Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock,
Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann,
Michael}, year={2016} }'
chicago: Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro,
Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge
Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
ieee: P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,”
in IEEE CPMT Symposium Japan, 2016, 2016.
mla: Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.”
IEEE CPMT Symposium Japan, 2016, 2016.
short: 'P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann,
in: IEEE CPMT Symposium Japan, 2016, 2016.'
date_created: 2019-05-27T09:07:19Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE CPMT Symposium Japan, 2016
quality_controlled: '1'
status: public
title: Micro Wear Modeling in Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9961'
abstract:
- lang: eng
text: Redundancy is a common approach to improve system reliability, availability
and safety in technical systems. It is achieved by adding functionally equivalent
elements that enable the system to remain operational even though one or more
of those elements fail. This paper begins with an overview on the various terminologies
and methods for redundancy concepts that can be modeled sufficiently using established
reliability analysis methods. However, these approaches yield very complex system
models, which limits their applicability. In current research, Bayesian Networks
(BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used
for reliability analysis because of their benefits in modeling complex systems
and in representing multi-state variables. However, these approaches lack appropriate
methods to model all commonly used redundancy concepts. To overcome this limitation,
three different modeling approaches based on BNs and DBNs are described in this
paper. Addressing those approaches, the benefits and limitations of BNs and DBNs
for modeling reliability of redundant technical systems are discussed and evaluated.
author:
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks. In: Proceedings of the Third European Conference of
the Prognostics and Health Management Society 2016. ; 2016.'
apa: Kaul, T., Meyer, T., & Sextro, W. (2016). Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks. In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016.
bibtex: '@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third
European Conference of the Prognostics and Health Management Society 2016}, author={Kaul,
Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }'
chicago: Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks.” In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016, 2016.
ieee: T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical
Systems with Bayesian Networks,” in Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.
mla: Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks.” Proceedings of the Third European Conference of the
Prognostics and Health Management Society 2016, 2016.
short: 'T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.'
date_created: 2019-05-27T09:10:07Z
date_updated: 2019-09-30T08:05:55Z
department:
- _id: '151'
language:
- iso: eng
publication: Proceedings of the Third European Conference of the Prognostics and Health
Management Society 2016
quality_controlled: '1'
status: public
title: Modeling of Complex Redundancy in Technical Systems with Bayesian Networks
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9963'
abstract:
- lang: eng
text: Tire-wheel assembly is the only connection between road and vehicle. Contacting
directly with road within postcard size of contact area, it is mounted and guided
by the suspension system. Therefore kinematics and compliances of suspension system
greatly influence the frictional coupling of tire tread elements and road surface
asperities by affecting pressure and sliding velocity distribution in the contact
zone. This study emphasizes the development of a numerical methodology for frictional
rolling contact analysis with focus on interaction of suspension system dynamics
and tire-road contact using ADAMS. For this purpose a comprehensive flexible multibody
system of the multi-link rear suspension is established, where both flexible and
rigid bodies are modeled to allow large displacements with included elastic effects.
To meet accuracy requirements for the high frequency applications, such as road
excitations, the amplitude- and frequency-dependency of rubber-metal bushings
is included. Furthermore the proposed flexible viscoelastic suspension model is
enhanced by a Flexible Ring Tire Model (FTire), which describes a 3D tire dynamic
response and covers any road excitations by tread submodel connected to road surface
model. Concerning the verification and validation procedure numerous experiments
are carried out to confirm the validity and the accuracy of both the developed
submodels and the entire model. The devised approach makes it possible to investigate
the influence of suspension system design on dynamical rolling contact and to
evaluate tire tread wear. Therefore it can be a useful tool to predict frictional
power distribution within the contact area under more realistic conditions.
author:
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Sebastian
full_name: Schulze, Sebastian
last_name: Schulze
citation:
ama: 'Kohl S, Sextro W, Schulze S. Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis using ADAMS. In: The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016. Cyberjaya, Malaysia, 2016; 2016:1-12.'
apa: Kohl, S., Sextro, W., & Schulze, S. (2016). Aspects of Flexible Viscoelastic
Suspension Modeling for Frictional Rolling Contact Analysis using ADAMS. In The
2nd International Conference on Automotive Innovation and Green Energy Vehicle
(AiGEV 2016), Cyberjaya, Malaysia, 2016. (pp. 1–12). Cyberjaya, Malaysia,
2016.
bibtex: '@inproceedings{Kohl_Sextro_Schulze_2016, place={Cyberjaya, Malaysia, 2016},
title={Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS}, booktitle={The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016.}, author={Kohl, Sergej and Sextro, Walter and Schulze, Sebastian}, year={2016},
pages={1–12} }'
chicago: Kohl, Sergej, Walter Sextro, and Sebastian Schulze. “Aspects of Flexible
Viscoelastic Suspension Modeling for Frictional Rolling Contact Analysis Using
ADAMS.” In The 2nd International Conference on Automotive Innovation and Green
Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016., 1–12. Cyberjaya,
Malaysia, 2016, 2016.
ieee: S. Kohl, W. Sextro, and S. Schulze, “Aspects of Flexible Viscoelastic Suspension
Modeling for Frictional Rolling Contact Analysis using ADAMS,” in The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
mla: Kohl, Sergej, et al. “Aspects of Flexible Viscoelastic Suspension Modeling
for Frictional Rolling Contact Analysis Using ADAMS.” The 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya,
Malaysia, 2016., 2016, pp. 1–12.
short: 'S. Kohl, W. Sextro, S. Schulze, in: The 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV 2016), Cyberjaya, Malaysia,
2016., Cyberjaya, Malaysia, 2016, 2016, pp. 1–12.'
date_created: 2019-05-27T09:13:14Z
date_updated: 2019-05-27T09:13:54Z
department:
- _id: '151'
keyword:
- Kinematics and compliances
- flexible viscoelastic suspension model
- frictional rolling contact analysis
- frictional power distribution.
language:
- iso: eng
page: 1-12
place: Cyberjaya, Malaysia, 2016
publication: The 2nd International Conference on Automotive Innovation and Green Energy
Vehicle (AiGEV 2016), Cyberjaya, Malaysia, 2016.
status: public
title: Aspects of Flexible Viscoelastic Suspension Modeling for Frictional Rolling
Contact Analysis using ADAMS
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9964'
abstract:
- lang: eng
text: This paper presents a benchmark data set for condition monitoring of rolling
bearings in combination with an extensive description of the corresponding bearing
damage, the data set generation by experiments and results of datadriven classifications
used as a diagnostic method. The diagnostic method uses the motor current signal
of an electromechanical drive system for bearing diagnostic. The advantage of
this approach in general is that no additional sensors are required, as current
measurements can be performed in existing frequency inverters. This will help
to reduce the cost of future condition monitoring systems. A particular novelty
of the present approach is the monitoring of damage in external bearings which
are installed in the drive system but outside the electric motor. Nevertheless,
the motor current signal is used as input for the detection of the damage. Moreover,
a wide distribution of bearing damage is considered for the benchmark data set.
The results of the classifications show that the motor current signal can be used
to identify and classify bearing damage within the drive system. However, the
classification accuracy is still low compared to classifications based on vibration
signals. Further, dependency on properties of those bearing damage that were used
for the generation of training data are observed, because training with data of
artificially generated and real bearing damages lead to different accuracies.
Altogether a verified and systematically generated data set is presented and published
online for further research
author:
- first_name: Christian
full_name: Lessmeier, Christian
last_name: Lessmeier
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Detmar
full_name: Zimmer, Detmar
last_name: Zimmer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Lessmeier C, Kimotho JK, Zimmer D, Sextro W. Condition Monitoring of Bearing
Damage in Electromechanical Drive Systems by Using Motor Current Signals of Electric
Motors: A Benchmark Data Set for Data-Driven Classification. In: European Conference
of the Prognostics and Health Management Society. ; 2016.'
apa: 'Lessmeier, C., Kimotho, J. K., Zimmer, D., & Sextro, W. (2016). Condition
Monitoring of Bearing Damage in Electromechanical Drive Systems by Using Motor
Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven Classification.
In European Conference of the Prognostics and Health Management Society.'
bibtex: '@inproceedings{Lessmeier_Kimotho_Zimmer_Sextro_2016, title={Condition Monitoring
of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals
of Electric Motors: A Benchmark Data Set for Data-Driven Classification}, booktitle={European
Conference of the Prognostics and Health Management Society}, author={Lessmeier,
Christian and Kimotho, James Kuria and Zimmer, Detmar and Sextro, Walter}, year={2016}
}'
chicago: 'Lessmeier, Christian, James Kuria Kimotho, Detmar Zimmer, and Walter Sextro.
“Condition Monitoring of Bearing Damage in Electromechanical Drive Systems by
Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven
Classification.” In European Conference of the Prognostics and Health Management
Society, 2016.'
ieee: 'C. Lessmeier, J. K. Kimotho, D. Zimmer, and W. Sextro, “Condition Monitoring
of Bearing Damage in Electromechanical Drive Systems by Using Motor Current Signals
of Electric Motors: A Benchmark Data Set for Data-Driven Classification,” in European
Conference of the Prognostics and Health Management Society, 2016.'
mla: 'Lessmeier, Christian, et al. “Condition Monitoring of Bearing Damage in Electromechanical
Drive Systems by Using Motor Current Signals of Electric Motors: A Benchmark Data
Set for Data-Driven Classification.” European Conference of the Prognostics
and Health Management Society, 2016.'
short: 'C. Lessmeier, J.K. Kimotho, D. Zimmer, W. Sextro, in: European Conference
of the Prognostics and Health Management Society, 2016.'
date_created: 2019-05-27T09:14:22Z
date_updated: 2019-09-16T10:35:40Z
department:
- _id: '151'
language:
- iso: eng
publication: European Conference of the Prognostics and Health Management Society
quality_controlled: '1'
status: public
title: 'Condition Monitoring of Bearing Damage in Electromechanical Drive Systems
by Using Motor Current Signals of Electric Motors: A Benchmark Data Set for Data-Driven
Classification'
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9967'
abstract:
- lang: eng
text: Multibody models of mechatronic systems are usually interdisciplinary and
are continuously gaining complexity, due to a growing demand for comprehensive
models of systems including effects of electro mechanics, elastic bodies, contacts
and friction. To be capable of simulating large models with subassemblies and
contact between bodies, reduction techniques are required, which need certain
experience in the choice of parameters. This publication discusses different possibilities
for the modal description of structures in flexible multibody models with application
to an Adaptive Frontlighting System in ADAMS. It will be shown that mode count,
assembling of structures before and after modal reduction and influence of damping
parameters of particular structures and subassemblies affect the behavior of the
entire system. A common reduction technique for flexible structures in multibody
models is the component mode synthesis, which uses a certain number of modes for
description of the modal behavior of a structure. The influence of the mode count
will be shown by means of different modal descriptions of one structure that contributes
to a comprehensive model. Another study will prove that modal data of subassemblies
and assemblies of modal reduced single structures lead to different models. The
definition of damping parameters depends on the number of structures that have
been added to an assembly before modal reduction and on the number of modal reduced
structures. The comparison of subassemblies and the entire model to experimental
data will highlight the accuracy, computational overhead, complexity of models
and modeling efficiency of the comprehensive model for the frontlighting system.
author:
- first_name: Sebastian
full_name: Schulze, Sebastian
last_name: Schulze
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Sergej
full_name: Kohl, Sergej
last_name: Kohl
citation:
ama: 'Schulze S, Sextro W, Kohl S. Using Adequate Reduced Models for Flexible Multibody
Systems of Automotive Mechatronic Systems. In: 2nd International Conference
on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016. ;
2016:1-11.'
apa: Schulze, S., Sextro, W., & Kohl, S. (2016). Using Adequate Reduced Models
for Flexible Multibody Systems of Automotive Mechatronic Systems. In 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia
2016 (pp. 1–11).
bibtex: '@inproceedings{Schulze_Sextro_Kohl_2016, title={Using Adequate Reduced
Models for Flexible Multibody Systems of Automotive Mechatronic Systems}, booktitle={2nd
International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV)
Malaysia 2016}, author={Schulze, Sebastian and Sextro, Walter and Kohl, Sergej},
year={2016}, pages={1–11} }'
chicago: Schulze, Sebastian, Walter Sextro, and Sergej Kohl. “Using Adequate Reduced
Models for Flexible Multibody Systems of Automotive Mechatronic Systems.” In 2nd
International Conference on Automotive Innovation and Green Energy Vehicle (AiGEV)
Malaysia 2016, 1–11, 2016.
ieee: S. Schulze, W. Sextro, and S. Kohl, “Using Adequate Reduced Models for Flexible
Multibody Systems of Automotive Mechatronic Systems,” in 2nd International
Conference on Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia
2016, 2016, pp. 1–11.
mla: Schulze, Sebastian, et al. “Using Adequate Reduced Models for Flexible Multibody
Systems of Automotive Mechatronic Systems.” 2nd International Conference on
Automotive Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016,
pp. 1–11.
short: 'S. Schulze, W. Sextro, S. Kohl, in: 2nd International Conference on Automotive
Innovation and Green Energy Vehicle (AiGEV) Malaysia 2016, 2016, pp. 1–11.'
date_created: 2019-05-27T09:19:20Z
date_updated: 2019-05-27T09:19:49Z
department:
- _id: '151'
keyword:
- model reduction
- modal description
- flexible multibody systems
language:
- iso: eng
page: 1-11
publication: 2nd International Conference on Automotive Innovation and Green Energy
Vehicle (AiGEV) Malaysia 2016
status: public
title: Using Adequate Reduced Models for Flexible Multibody Systems of Automotive
Mechatronic Systems
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '3934'
abstract:
- lang: eng
text: Typical optical integrated circuits combine elements, like straight and curved
waveguides, or cavities, the simulation and design of which is well established
through numerical eigenproblem-solvers. It remains to predict the interaction
of these modes. We address this task by a ”Hybrid” variant (HCMT) of Coupled Mode
Theory. Using methods from finite-element numerics, the optical properties of
a circuit are approximated by superpositions of eigen-solutions for its constituents,
leading to quantitative, low-dimensional, and interpretable models in the frequency
domain. Spectral scans are complemented by the direct computation of supermode
properties (spectral positions and linewidths, coupling-induced phase shifts).
This contribution outlines the theoretical background, and discusses briefly limitations
and implementational details, with the help of an example of a 2-D coupled-resonator-optical-waveguide
configuration.
author:
- first_name: Manfred
full_name: Hammer, Manfred
id: '48077'
last_name: Hammer
orcid: 0000-0002-6331-9348
citation:
ama: 'Hammer M. Wave interaction in photonic integrated circuits: Hybrid analytical
/ numerical coupled mode modeling. In: Broquin J-E, Nunzi Conti G, eds. Integrated
Optics: Devices, Materials, and Technologies XX. SPIE; 2016:975018-975018-8.
doi:10.1117/12.2214331'
apa: 'Hammer, M. (2016). Wave interaction in photonic integrated circuits: Hybrid
analytical / numerical coupled mode modeling. In J.-E. Broquin & G. Nunzi
Conti (Eds.), Integrated Optics: Devices, Materials, and Technologies XX
(pp. 975018-975018–8). San Francisco, USA: SPIE. https://doi.org/10.1117/12.2214331'
bibtex: '@inproceedings{Hammer_2016, title={Wave interaction in photonic integrated
circuits: Hybrid analytical / numerical coupled mode modeling}, DOI={10.1117/12.2214331},
number={9750}, booktitle={Integrated Optics: Devices, Materials, and Technologies
XX}, publisher={SPIE}, author={Hammer, Manfred}, editor={Broquin, Jean-Emmanuel
and Nunzi Conti, GualtieroEditors}, year={2016}, pages={975018-975018–8} }'
chicago: 'Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid
Analytical / Numerical Coupled Mode Modeling.” In Integrated Optics: Devices,
Materials, and Technologies XX, edited by Jean-Emmanuel Broquin and Gualtiero
Nunzi Conti, 975018-975018–8. SPIE, 2016. https://doi.org/10.1117/12.2214331.'
ieee: 'M. Hammer, “Wave interaction in photonic integrated circuits: Hybrid analytical
/ numerical coupled mode modeling,” in Integrated Optics: Devices, Materials,
and Technologies XX, San Francisco, USA, 2016, no. 9750, pp. 975018-975018–8.'
mla: 'Hammer, Manfred. “Wave Interaction in Photonic Integrated Circuits: Hybrid
Analytical / Numerical Coupled Mode Modeling.” Integrated Optics: Devices,
Materials, and Technologies XX, edited by Jean-Emmanuel Broquin and Gualtiero
Nunzi Conti, no. 9750, SPIE, 2016, pp. 975018-975018–8, doi:10.1117/12.2214331.'
short: 'M. Hammer, in: J.-E. Broquin, G. Nunzi Conti (Eds.), Integrated Optics:
Devices, Materials, and Technologies XX, SPIE, 2016, pp. 975018-975018–8.'
conference:
location: San Francisco, USA
name: Photonics West 2016/OPTO 2016
date_created: 2018-08-20T09:25:13Z
date_updated: 2022-01-06T06:59:56Z
department:
- _id: '61'
doi: 10.1117/12.2214331
editor:
- first_name: Jean-Emmanuel
full_name: Broquin, Jean-Emmanuel
last_name: Broquin
- first_name: Gualtiero
full_name: Nunzi Conti, Gualtiero
last_name: Nunzi Conti
issue: '9750'
keyword:
- tet_topic_waveguide
- tet_topic_numerics
language:
- iso: eng
page: '975018-975018-8 '
publication: 'Integrated Optics: Devices, Materials, and Technologies XX'
publication_status: published
publisher: SPIE
status: public
title: 'Wave interaction in photonic integrated circuits: Hybrid analytical / numerical
coupled mode modeling'
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '3956'
abstract:
- lang: eng
text: "In this article we present an integration technique for low-voltage DNTT-based
TFTs for flexible electronic applications.\r\nTherefore, a high-k nanocomposite
combining the flexibility of its polymericmatrix and the high permittivity\r\nof
the incorporated inorganic material was used as gate dielectric layer. The influence
of a conventional\r\nphotolithography process upon the dielectric layer is analyzed
regarding electrical instabilities in the device characteristics.\r\nThe impact
of an implemented sacrificial layer to reduce chemical stress to the insulating
film during\r\nphotolithography is evaluated. Furthermore, first inverter circuits
were integrated and electrically characterized.\r\nAdditionally, the implementation
of this sacrificial layer can be used for future complementary circuit design."
article_type: original
author:
- first_name: Thorsten
full_name: Meyers, Thorsten
last_name: Meyers
- first_name: Fábio F.
full_name: Vidor, Fábio F.
last_name: Vidor
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
- first_name: Ulrich
full_name: Hilleringmann, Ulrich
last_name: Hilleringmann
citation:
ama: Meyers T, Vidor FF, Brassat K, Lindner J, Hilleringmann U. Low-voltage DNTT-based
thin-film transistors and inverters for flexible electronics. Microelectronic
Engineering. 2016;174:35-39. doi:10.1016/j.mee.2016.12.018
apa: Meyers, T., Vidor, F. F., Brassat, K., Lindner, J., & Hilleringmann, U.
(2016). Low-voltage DNTT-based thin-film transistors and inverters for flexible
electronics. Microelectronic Engineering, 174, 35–39. https://doi.org/10.1016/j.mee.2016.12.018
bibtex: '@article{Meyers_Vidor_Brassat_Lindner_Hilleringmann_2016, title={Low-voltage
DNTT-based thin-film transistors and inverters for flexible electronics}, volume={174},
DOI={10.1016/j.mee.2016.12.018},
journal={Microelectronic Engineering}, publisher={Elsevier BV}, author={Meyers,
Thorsten and Vidor, Fábio F. and Brassat, Katharina and Lindner, Jörg and Hilleringmann,
Ulrich}, year={2016}, pages={35–39} }'
chicago: 'Meyers, Thorsten, Fábio F. Vidor, Katharina Brassat, Jörg Lindner, and
Ulrich Hilleringmann. “Low-Voltage DNTT-Based Thin-Film Transistors and Inverters
for Flexible Electronics.” Microelectronic Engineering 174 (2016): 35–39.
https://doi.org/10.1016/j.mee.2016.12.018.'
ieee: T. Meyers, F. F. Vidor, K. Brassat, J. Lindner, and U. Hilleringmann, “Low-voltage
DNTT-based thin-film transistors and inverters for flexible electronics,” Microelectronic
Engineering, vol. 174, pp. 35–39, 2016.
mla: Meyers, Thorsten, et al. “Low-Voltage DNTT-Based Thin-Film Transistors and
Inverters for Flexible Electronics.” Microelectronic Engineering, vol.
174, Elsevier BV, 2016, pp. 35–39, doi:10.1016/j.mee.2016.12.018.
short: T. Meyers, F.F. Vidor, K. Brassat, J. Lindner, U. Hilleringmann, Microelectronic
Engineering 174 (2016) 35–39.
date_created: 2018-08-20T13:33:05Z
date_updated: 2022-01-06T07:00:00Z
ddc:
- '530'
department:
- _id: '286'
- _id: '15'
doi: 10.1016/j.mee.2016.12.018
file:
- access_level: closed
content_type: application/pdf
creator: hclaudia
date_created: 2018-08-20T13:35:02Z
date_updated: 2018-08-20T13:35:02Z
file_id: '3957'
file_name: Now-voltage DNTT-based thin-film transistors and inverters for flexible
electronics.pdf
file_size: 758984
relation: main_file
success: 1
file_date_updated: 2018-08-20T13:35:02Z
has_accepted_license: '1'
intvolume: ' 174'
language:
- iso: eng
page: 35-39
publication: Microelectronic Engineering
publication_identifier:
issn:
- 0167-9317
publication_status: published
publisher: Elsevier BV
status: public
title: Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics
type: journal_article
user_id: '55706'
volume: 174
year: '2016'
...
---
_id: '4004'
author:
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Arne
full_name: Rüdiger, Arne
last_name: Rüdiger
- first_name: Julius
full_name: Bürger, Julius
id: '46952'
last_name: Bürger
- first_name: W.
full_name: Bremser, W.
last_name: Bremser
- first_name: Oliver
full_name: Strube, Oliver
last_name: Strube
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: 'Brassat K, Rüdiger A, Bürger J, Bremser W, Strube O, Lindner J. Enzyme mediated
autodeposition of protein particles on nanosphere lithographically nanostructured
surfaces . In: ; 2016.'
apa: Brassat, K., Rüdiger, A., Bürger, J., Bremser, W., Strube, O., & Lindner,
J. (2016). Enzyme mediated autodeposition of protein particles on nanosphere lithographically
nanostructured surfaces . Presented at the E-MRS Fall Meeting 2016, Warsaw (Poland).
bibtex: '@inproceedings{Brassat_Rüdiger_Bürger_Bremser_Strube_Lindner_2016, title={Enzyme
mediated autodeposition of protein particles on nanosphere lithographically nanostructured
surfaces }, author={Brassat, Katharina and Rüdiger, Arne and Bürger, Julius and
Bremser, W. and Strube, Oliver and Lindner, Jörg}, year={2016} }'
chicago: Brassat, Katharina, Arne Rüdiger, Julius Bürger, W. Bremser, Oliver Strube,
and Jörg Lindner. “Enzyme Mediated Autodeposition of Protein Particles on Nanosphere
Lithographically Nanostructured Surfaces ,” 2016.
ieee: K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, and J. Lindner,
“Enzyme mediated autodeposition of protein particles on nanosphere lithographically
nanostructured surfaces ,” presented at the E-MRS Fall Meeting 2016, Warsaw (Poland),
2016.
mla: Brassat, Katharina, et al. Enzyme Mediated Autodeposition of Protein Particles
on Nanosphere Lithographically Nanostructured Surfaces . 2016.
short: 'K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, J. Lindner, in:
2016.'
conference:
end_date: 2016-09-22
location: Warsaw (Poland)
name: E-MRS Fall Meeting 2016
start_date: 2016-09-19
date_created: 2018-08-21T12:19:28Z
date_updated: 2022-01-06T07:00:06Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
status: public
title: 'Enzyme mediated autodeposition of protein particles on nanosphere lithographically
nanostructured surfaces '
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4005'
author:
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Julius
full_name: Bürger, Julius
id: '46952'
last_name: Bürger
- first_name: 'Melanie '
full_name: 'Reinecke, Melanie '
last_name: Reinecke
- first_name: Dennis
full_name: Briese, Dennis
last_name: Briese
- first_name: K.
full_name: Duschik, K.
last_name: Duschik
- first_name: Mirko
full_name: Schaper, Mirko
last_name: Schaper
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: 'Brassat K, Bürger J, Reinecke M, et al. Arrangement of perovskitic semiconductor
nanoparticles using soft lithography . In: ; 2016.'
apa: Brassat, K., Bürger, J., Reinecke, M., Briese, D., Duschik, K., Schaper, M.,
& Lindner, J. (2016). Arrangement of perovskitic semiconductor nanoparticles
using soft lithography . Presented at the E-MRS Fall Meeting 2016, Warsaw (Poland).
bibtex: '@inproceedings{Brassat_Bürger_Reinecke_Briese_Duschik_Schaper_Lindner_2016,
title={Arrangement of perovskitic semiconductor nanoparticles using soft lithography
}, author={Brassat, Katharina and Bürger, Julius and Reinecke, Melanie and Briese,
Dennis and Duschik, K. and Schaper, Mirko and Lindner, Jörg}, year={2016} }'
chicago: Brassat, Katharina, Julius Bürger, Melanie Reinecke, Dennis Briese, K.
Duschik, Mirko Schaper, and Jörg Lindner. “Arrangement of Perovskitic Semiconductor
Nanoparticles Using Soft Lithography ,” 2016.
ieee: K. Brassat et al., “Arrangement of perovskitic semiconductor nanoparticles
using soft lithography ,” presented at the E-MRS Fall Meeting 2016, Warsaw (Poland),
2016.
mla: Brassat, Katharina, et al. Arrangement of Perovskitic Semiconductor Nanoparticles
Using Soft Lithography . 2016.
short: 'K. Brassat, J. Bürger, M. Reinecke, D. Briese, K. Duschik, M. Schaper, J.
Lindner, in: 2016.'
conference:
end_date: 2016-09-22
location: Warsaw (Poland)
name: E-MRS Fall Meeting 2016
start_date: 2016-09-19
date_created: 2018-08-21T12:21:43Z
date_updated: 2022-01-06T07:00:06Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
status: public
title: 'Arrangement of perovskitic semiconductor nanoparticles using soft lithography '
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4006'
author:
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Arne
full_name: Rüdiger, Arne
last_name: Rüdiger
- first_name: Julius
full_name: Bürger, Julius
id: '46952'
last_name: Bürger
- first_name: 'W. '
full_name: 'Bremser, W. '
last_name: Bremser
- first_name: O.
full_name: Strube, O.
last_name: Strube
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: 'Brassat K, Rüdiger A, Bürger J, Bremser W, Strube O, Lindner J. Site-selective
protein immobilization on regular antidot patterns fabricated by nanosphere lithography
. In: ; 2016.'
apa: Brassat, K., Rüdiger, A., Bürger, J., Bremser, W., Strube, O., & Lindner,
J. (2016). Site-selective protein immobilization on regular antidot patterns fabricated
by nanosphere lithography . Presented at the E-MRS Fall Meeting 2016, Warsaw (Poland).
bibtex: '@inproceedings{Brassat_Rüdiger_Bürger_Bremser_Strube_Lindner_2016, title={Site-selective
protein immobilization on regular antidot patterns fabricated by nanosphere lithography
}, author={Brassat, Katharina and Rüdiger, Arne and Bürger, Julius and Bremser,
W. and Strube, O. and Lindner, Jörg}, year={2016} }'
chicago: Brassat, Katharina, Arne Rüdiger, Julius Bürger, W. Bremser, O. Strube,
and Jörg Lindner. “Site-Selective Protein Immobilization on Regular Antidot Patterns
Fabricated by Nanosphere Lithography ,” 2016.
ieee: K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, and J. Lindner,
“Site-selective protein immobilization on regular antidot patterns fabricated
by nanosphere lithography ,” presented at the E-MRS Fall Meeting 2016, Warsaw
(Poland), 2016.
mla: Brassat, Katharina, et al. Site-Selective Protein Immobilization on Regular
Antidot Patterns Fabricated by Nanosphere Lithography . 2016.
short: 'K. Brassat, A. Rüdiger, J. Bürger, W. Bremser, O. Strube, J. Lindner, in:
2016.'
conference:
end_date: 2016-09-22
location: Warsaw (Poland)
name: E-MRS Fall Meeting 2016
start_date: 2016-09-19
date_created: 2018-08-21T12:23:38Z
date_updated: 2022-01-06T07:00:06Z
department:
- _id: '286'
- _id: '15'
status: public
title: 'Site-selective protein immobilization on regular antidot patterns fabricated
by nanosphere lithography '
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4007'
author:
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Daniel
full_name: Kool, Daniel
id: '44586'
last_name: Kool
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: 'Brassat K, Kool D, Lindner J. Hierarchically ordered nanopore structures formed
by combined nanosphere and block copolymer lithography . In: ; 2016.'
apa: Brassat, K., Kool, D., & Lindner, J. (2016). Hierarchically ordered nanopore
structures formed by combined nanosphere and block copolymer lithography . Presented
at the E-MRS Fall Meeting 2016, Warsaw (Poland).
bibtex: '@inproceedings{Brassat_Kool_Lindner_2016, title={Hierarchically ordered
nanopore structures formed by combined nanosphere and block copolymer lithography
}, author={Brassat, Katharina and Kool, Daniel and Lindner, Jörg}, year={2016}
}'
chicago: Brassat, Katharina, Daniel Kool, and Jörg Lindner. “Hierarchically Ordered
Nanopore Structures Formed by Combined Nanosphere and Block Copolymer Lithography
,” 2016.
ieee: K. Brassat, D. Kool, and J. Lindner, “Hierarchically ordered nanopore structures
formed by combined nanosphere and block copolymer lithography ,” presented at
the E-MRS Fall Meeting 2016, Warsaw (Poland), 2016.
mla: Brassat, Katharina, et al. Hierarchically Ordered Nanopore Structures Formed
by Combined Nanosphere and Block Copolymer Lithography . 2016.
short: 'K. Brassat, D. Kool, J. Lindner, in: 2016.'
conference:
end_date: 2016-09-22
location: Warsaw (Poland)
name: E-MRS Fall Meeting 2016
start_date: 2016-09-19
date_created: 2018-08-21T12:25:04Z
date_updated: 2022-01-06T07:00:06Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
status: public
title: 'Hierarchically ordered nanopore structures formed by combined nanosphere and
block copolymer lithography '
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4008'
author:
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: 'Brassat K, Lindner J. Sub-20 nm surface patterning by block copolymer lithography
. In: ; 2016.'
apa: Brassat, K., & Lindner, J. (2016). Sub-20 nm surface patterning by block
copolymer lithography . Presented at the Europhotonics Spring School 2016, Porquerolles
(France).
bibtex: '@inproceedings{Brassat_Lindner_2016, title={Sub-20 nm surface patterning
by block copolymer lithography }, author={Brassat, Katharina and Lindner, Jörg},
year={2016} }'
chicago: Brassat, Katharina, and Jörg Lindner. “Sub-20 Nm Surface Patterning by
Block Copolymer Lithography ,” 2016.
ieee: K. Brassat and J. Lindner, “Sub-20 nm surface patterning by block copolymer
lithography ,” presented at the Europhotonics Spring School 2016, Porquerolles
(France), 2016.
mla: Brassat, Katharina, and Jörg Lindner. Sub-20 Nm Surface Patterning by Block
Copolymer Lithography . 2016.
short: 'K. Brassat, J. Lindner, in: 2016.'
conference:
end_date: 2016-04-01
location: Porquerolles (France)
name: Europhotonics Spring School 2016
start_date: 2016-03-30
date_created: 2018-08-21T12:26:13Z
date_updated: 2022-01-06T07:00:06Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
status: public
title: 'Sub-20 nm surface patterning by block copolymer lithography '
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4009'
author:
- first_name: Christoph
full_name: Brodehl, Christoph
id: '30380'
last_name: Brodehl
- first_name: Siegmund
full_name: Greulich-Weber, Siegmund
last_name: Greulich-Weber
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: Brodehl C, Greulich-Weber S, Lindner J. Fabricating metasurface-based optical
devices with a low-cost technique. 2016.
apa: Brodehl, C., Greulich-Weber, S., & Lindner, J. (2016). Fabricating metasurface-based
optical devices with a low-cost technique. Presented at the E-MRS Spring Meeting
2016, Lille (France).
bibtex: '@article{Brodehl_Greulich-Weber_Lindner_2016, series={contributed talk
DD 12.3}, title={Fabricating metasurface-based optical devices with a low-cost
technique}, author={Brodehl, Christoph and Greulich-Weber, Siegmund and Lindner,
Jörg}, year={2016}, collection={contributed talk DD 12.3} }'
chicago: Brodehl, Christoph, Siegmund Greulich-Weber, and Jörg Lindner. “Fabricating
Metasurface-Based Optical Devices with a Low-Cost Technique.” Contributed Talk
DD 12.3, 2016.
ieee: C. Brodehl, S. Greulich-Weber, and J. Lindner, “Fabricating metasurface-based
optical devices with a low-cost technique.” 2016.
mla: Brodehl, Christoph, et al. Fabricating Metasurface-Based Optical Devices
with a Low-Cost Technique. 2016.
short: C. Brodehl, S. Greulich-Weber, J. Lindner, (2016).
conference:
end_date: 2016-05-06
location: Lille (France)
name: E-MRS Spring Meeting 2016
start_date: 2016-05-02
date_created: 2018-08-21T12:30:03Z
date_updated: 2022-01-06T07:00:06Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
series_title: contributed talk DD 12.3
status: public
title: Fabricating metasurface-based optical devices with a low-cost technique
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4010'
author:
- first_name: R.A.
full_name: Puglisi, R.A.
last_name: Puglisi
- first_name: 'C. '
full_name: 'Bongiorno, C. '
last_name: Bongiorno
- first_name: Katharina
full_name: Brassat, Katharina
id: '11305'
last_name: Brassat
- first_name: Christina
full_name: Garozzo, Christina
last_name: Garozzo
- first_name: 'A. '
full_name: 'La Magna, A. '
last_name: La Magna
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: 'Puglisi RA, Bongiorno C, Brassat K, Garozzo C, La Magna A, Lindner J. High-resolution
TEM and STEM-EELS studies of colloidal Au nanoparticles self-assembled in nanometric
SiO2 nanopore arrays fabricated by block-copolymer lithography . In: ; 2016.'
apa: Puglisi, R. A., Bongiorno, C., Brassat, K., Garozzo, C., La Magna, A., &
Lindner, J. (2016). High-resolution TEM and STEM-EELS studies of colloidal Au
nanoparticles self-assembled in nanometric SiO2 nanopore arrays fabricated by
block-copolymer lithography . Presented at the E-MRS Fall Meeting 2016, Warsaw
(Poland).
bibtex: '@inproceedings{Puglisi_Bongiorno_Brassat_Garozzo_La Magna_Lindner_2016,
title={High-resolution TEM and STEM-EELS studies of colloidal Au nanoparticles
self-assembled in nanometric SiO2 nanopore arrays fabricated by block-copolymer
lithography }, author={Puglisi, R.A. and Bongiorno, C. and Brassat, Katharina
and Garozzo, Christina and La Magna, A. and Lindner, Jörg}, year={2016} }'
chicago: Puglisi, R.A., C. Bongiorno, Katharina Brassat, Christina Garozzo, A. La
Magna, and Jörg Lindner. “High-Resolution TEM and STEM-EELS Studies of Colloidal
Au Nanoparticles Self-Assembled in Nanometric SiO2 Nanopore Arrays Fabricated
by Block-Copolymer Lithography ,” 2016.
ieee: R. A. Puglisi, C. Bongiorno, K. Brassat, C. Garozzo, A. La Magna, and J. Lindner,
“High-resolution TEM and STEM-EELS studies of colloidal Au nanoparticles self-assembled
in nanometric SiO2 nanopore arrays fabricated by block-copolymer lithography ,”
presented at the E-MRS Fall Meeting 2016, Warsaw (Poland), 2016.
mla: Puglisi, R. A., et al. High-Resolution TEM and STEM-EELS Studies of Colloidal
Au Nanoparticles Self-Assembled in Nanometric SiO2 Nanopore Arrays Fabricated
by Block-Copolymer Lithography . 2016.
short: 'R.A. Puglisi, C. Bongiorno, K. Brassat, C. Garozzo, A. La Magna, J. Lindner,
in: 2016.'
conference:
end_date: 2016-09-22
location: Warsaw (Poland)
name: E-MRS Fall Meeting 2016
start_date: 2016-09-19
date_created: 2018-08-21T12:32:13Z
date_updated: 2022-01-06T07:00:07Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
status: public
title: 'High-resolution TEM and STEM-EELS studies of colloidal Au nanoparticles self-assembled
in nanometric SiO2 nanopore arrays fabricated by block-copolymer lithography '
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4011'
author:
- first_name: Thomas
full_name: Riedl, Thomas
id: '36950'
last_name: Riedl
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: Riedl T, Lindner J. Automated SEM image analysis of the opening size distribution
of nanosphere lithography masks and their origins . 2016.
apa: Riedl, T., & Lindner, J. (2016). Automated SEM image analysis of the opening
size distribution of nanosphere lithography masks and their origins . Presented
at the E-MRS Fall Meeting 2016, Warsaw (Poland).
bibtex: '@article{Riedl_Lindner_2016, series={contributed talk E.13.5}, title={Automated
SEM image analysis of the opening size distribution of nanosphere lithography
masks and their origins }, author={Riedl, Thomas and Lindner, Jörg}, year={2016},
collection={contributed talk E.13.5} }'
chicago: Riedl, Thomas, and Jörg Lindner. “Automated SEM Image Analysis of the Opening
Size Distribution of Nanosphere Lithography Masks and Their Origins .” Contributed
Talk E.13.5, 2016.
ieee: T. Riedl and J. Lindner, “Automated SEM image analysis of the opening size
distribution of nanosphere lithography masks and their origins .” 2016.
mla: Riedl, Thomas, and Jörg Lindner. Automated SEM Image Analysis of the Opening
Size Distribution of Nanosphere Lithography Masks and Their Origins . 2016.
short: T. Riedl, J. Lindner, (2016).
conference:
end_date: 2016-09-22
location: Warsaw (Poland)
name: E-MRS Fall Meeting 2016
start_date: 2016-09-19
date_created: 2018-08-21T12:33:59Z
date_updated: 2022-01-06T07:00:07Z
department:
- _id: '286'
language:
- iso: eng
series_title: contributed talk E.13.5
status: public
title: 'Automated SEM image analysis of the opening size distribution of nanosphere
lithography masks and their origins '
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4012'
author:
- first_name: Thomas
full_name: Riedl, Thomas
id: '36950'
last_name: Riedl
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: Riedl T, Lindner J. Theoretical analysis of strain and misfit dislocation stability
in axial-heteroepitaxial GaAs/InAs nanopillars. 2016.
apa: Riedl, T., & Lindner, J. (2016). Theoretical analysis of strain and misfit
dislocation stability in axial-heteroepitaxial GaAs/InAs nanopillars. Presented
at the DPG Spring Meeting 2016, Regensburg (Germany).
bibtex: '@article{Riedl_Lindner_2016, series={contributed talk DS 36.7}, title={Theoretical
analysis of strain and misfit dislocation stability in axial-heteroepitaxial GaAs/InAs
nanopillars}, author={Riedl, Thomas and Lindner, Jörg}, year={2016}, collection={contributed
talk DS 36.7} }'
chicago: Riedl, Thomas, and Jörg Lindner. “Theoretical Analysis of Strain and Misfit
Dislocation Stability in Axial-Heteroepitaxial GaAs/InAs Nanopillars.” Contributed
Talk DS 36.7, 2016.
ieee: T. Riedl and J. Lindner, “Theoretical analysis of strain and misfit dislocation
stability in axial-heteroepitaxial GaAs/InAs nanopillars.” 2016.
mla: Riedl, Thomas, and Jörg Lindner. Theoretical Analysis of Strain and Misfit
Dislocation Stability in Axial-Heteroepitaxial GaAs/InAs Nanopillars. 2016.
short: T. Riedl, J. Lindner, (2016).
conference:
end_date: 2016-03-11
location: Regensburg (Germany)
name: DPG Spring Meeting 2016
start_date: 2016-03-06
date_created: 2018-08-21T12:35:39Z
date_updated: 2022-01-06T07:00:07Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
series_title: contributed talk DS 36.7
status: public
title: Theoretical analysis of strain and misfit dislocation stability in axial-heteroepitaxial
GaAs/InAs nanopillars
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4013'
author:
- first_name: Thomas
full_name: Riedl, Thomas
id: '36950'
last_name: Riedl
- first_name: R.M.
full_name: Kemper, R.M.
last_name: Kemper
- first_name: Donald
full_name: As, Donald
last_name: As
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
citation:
ama: Riedl T, Kemper RM, As D, Lindner J. Stability of misfit dislocations in axial-heteroepitaxial
3CSiC/c-GaN nanopillars and nanomesas. 2016.
apa: Riedl, T., Kemper, R. M., As, D., & Lindner, J. (2016). Stability of misfit
dislocations in axial-heteroepitaxial 3CSiC/c-GaN nanopillars and nanomesas. Presented
at the DPG Spring Meeting 2016, Regensburg.
bibtex: '@article{Riedl_Kemper_As_Lindner_2016, series={poster DS 53.3}, title={Stability
of misfit dislocations in axial-heteroepitaxial 3CSiC/c-GaN nanopillars and nanomesas},
author={Riedl, Thomas and Kemper, R.M. and As, Donald and Lindner, Jörg}, year={2016},
collection={poster DS 53.3} }'
chicago: Riedl, Thomas, R.M. Kemper, Donald As, and Jörg Lindner. “Stability of
Misfit Dislocations in Axial-Heteroepitaxial 3CSiC/c-GaN Nanopillars and Nanomesas.”
Poster DS 53.3, 2016.
ieee: T. Riedl, R. M. Kemper, D. As, and J. Lindner, “Stability of misfit dislocations
in axial-heteroepitaxial 3CSiC/c-GaN nanopillars and nanomesas.” 2016.
mla: Riedl, Thomas, et al. Stability of Misfit Dislocations in Axial-Heteroepitaxial
3CSiC/c-GaN Nanopillars and Nanomesas. 2016.
short: T. Riedl, R.M. Kemper, D. As, J. Lindner, (2016).
conference:
end_date: 2016-03-11
location: Regensburg
name: DPG Spring Meeting 2016
start_date: 2016-03-06
date_created: 2018-08-21T12:40:44Z
date_updated: 2022-01-06T07:00:07Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
series_title: poster DS 53.3
status: public
title: Stability of misfit dislocations in axial-heteroepitaxial 3CSiC/c-GaN nanopillars
and nanomesas
type: conference
user_id: '55706'
year: '2016'
...
---
_id: '4014'
author:
- first_name: T.
full_name: Rieger, T.
last_name: Rieger
- first_name: Thomas
full_name: Riedl, Thomas
id: '36950'
last_name: Riedl
- first_name: Jörg
full_name: Lindner, Jörg
id: '20797'
last_name: Lindner
- first_name: A.
full_name: Pawlis, A.
last_name: Pawlis
citation:
ama: Rieger T, Riedl T, Lindner J, Pawlis A. Enhancement of the critical thickness
of CdSe/ZnSe quantum wells via the strain compensation technique. 2016.
apa: Rieger, T., Riedl, T., Lindner, J., & Pawlis, A. (2016). Enhancement of
the critical thickness of CdSe/ZnSe quantum wells via the strain compensation
technique. Presented at the 19th International Conference on Molecular Beam Epitaxy,
Montpellier (France).
bibtex: '@article{Rieger_Riedl_Lindner_Pawlis_2016, series={poster Mo-P-8}, title={Enhancement
of the critical thickness of CdSe/ZnSe quantum wells via the strain compensation
technique}, author={Rieger, T. and Riedl, Thomas and Lindner, Jörg and Pawlis,
A.}, year={2016}, collection={poster Mo-P-8} }'
chicago: Rieger, T., Thomas Riedl, Jörg Lindner, and A. Pawlis. “Enhancement of
the Critical Thickness of CdSe/ZnSe Quantum Wells via the Strain Compensation
Technique.” Poster Mo-P-8, 2016.
ieee: T. Rieger, T. Riedl, J. Lindner, and A. Pawlis, “Enhancement of the critical
thickness of CdSe/ZnSe quantum wells via the strain compensation technique.” 2016.
mla: Rieger, T., et al. Enhancement of the Critical Thickness of CdSe/ZnSe Quantum
Wells via the Strain Compensation Technique. 2016.
short: T. Rieger, T. Riedl, J. Lindner, A. Pawlis, (2016).
conference:
end_date: 2016-09-09
location: Montpellier (France)
name: 19th International Conference on Molecular Beam Epitaxy
start_date: 2016-09-05
date_created: 2018-08-21T12:42:48Z
date_updated: 2022-01-06T07:00:07Z
department:
- _id: '286'
- _id: '15'
language:
- iso: eng
series_title: poster Mo-P-8
status: public
title: Enhancement of the critical thickness of CdSe/ZnSe quantum wells via the strain
compensation technique
type: conference
user_id: '55706'
year: '2016'
...