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Schulmanagement-Handbuch}, publisher={Cornelsen Verlag}, author={Ramm, Gesa and Gerick, Julia and Eickelmann, Birgit}, editor={Gerick, Julia and Ramm, Gesa and Eickelmann, Birgit}, year={2019}, pages={6–17} }","mla":"Ramm, Gesa, et al. “Das Projekt ‚Lernen mit digitalen Medien‘.” Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch, edited by Julia Gerick et al., vol. 170, Cornelsen Verlag, 2019, pp. 6–17."},"type":"book_chapter","page":"6-17","language":[{"iso":"ger"}]},{"publisher":"Cornelsen Verlag","department":[{"_id":"462"}],"status":"public","date_created":"2021-12-13T16:26:11Z","editor":[{"full_name":"Gerick, Julia","first_name":"Julia","last_name":"Gerick"},{"last_name":"Ramm","full_name":"Ramm, Gesa","first_name":"Gesa"},{"last_name":"Eickelmann","id":"40387","first_name":"Birgit","full_name":"Eickelmann, Birgit"}],"volume":170,"place":"Berlin","user_id":"50923","title":"Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. 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Reisinger (Eds.), Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis (pp. 143–156). Waxmann.","chicago":"Drossel, Kerstin, and Birgit Eickelmann. “Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven.” In Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis, edited by Hannelore Knauder and Christa-Monika Reisinger, 143–56. Münster: Waxmann, 2019.","bibtex":"@inbook{Drossel_Eickelmann_2019, place={Münster}, title={Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven}, booktitle={Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis}, publisher={Waxmann}, author={Drossel, Kerstin and Eickelmann, Birgit}, editor={Knauder, Hannelore and Reisinger, Christa-Monika}, year={2019}, pages={143–156} }","mla":"Drossel, Kerstin, and Birgit Eickelmann. “Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven.” Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis, edited by Hannelore Knauder and Christa-Monika Reisinger, Waxmann, 2019, pp. 143–56.","short":"K. Drossel, B. Eickelmann, in: H. Knauder, C.-M. Reisinger (Eds.), Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis, Waxmann, Münster, 2019, pp. 143–156.","ieee":"K. Drossel and B. Eickelmann, “Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven,” in Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis, H. 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In Association for the Advancement of Computing in Education (AACE) (Ed.), Proceedings of EdMedia + Innovate Learning 2019 (pp. 918–920).","chicago":"Voogt, Joke, Geral Knezek, Rhonda Christensen, Jo Tondeur, Dirk Ifenthaler, and Birgit Eickelmann. “Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View.” In Proceedings of EdMedia + Innovate Learning 2019, edited by Association for the Advancement of Computing in Education (AACE), 918–20. 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Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland","title":"'Digitalisierung meets Schule' - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?","user_id":"50923","year":"2019","type":"journal_article","citation":{"short":"M. Fugmann, B. Eickelmann, D. Neubauer, b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland 2 (2019) 39–40.","ieee":"M. Fugmann, B. Eickelmann, and D. Neubauer, “‘Digitalisierung meets Schule’ - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?,” b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland, vol. 2, pp. 39–40, 2019.","apa":"Fugmann, M., Eickelmann, B., & Neubauer, D. (2019). “Digitalisierung meets Schule” - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung? b:sl. Beruf: Schulleitung. 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Das Fachmagazin für Schulleitungen in Deutschland, vol. 2, Berlin: ASD Allgemeiner Schulleitungsverband, 2019, pp. 39–40.","bibtex":"@article{Fugmann_Eickelmann_Neubauer_2019, title={“Digitalisierung meets Schule” - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?}, volume={2}, journal={b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland}, publisher={Berlin: ASD Allgemeiner Schulleitungsverband}, author={Fugmann, Martin and Eickelmann, Birgit and Neubauer, Dirk}, year={2019}, pages={39–40} }"},"page":"39-40","language":[{"iso":"ger"}],"_id":"28761","intvolume":" 2","date_updated":"2022-01-06T06:58:20Z"},{"language":[{"iso":"ger"}],"doi":"10.1007/978-3-658-26231-0_25","date_updated":"2022-01-06T06:58:20Z","editor":[{"first_name":"Christian","full_name":"Donie, Christian","last_name":"Donie"},{"first_name":"Frank","full_name":"Foerster, Frank","last_name":"Foerster"},{"last_name":"Obermayr","first_name":"Marlene","full_name":"Obermayr, Marlene"},{"full_name":"Deckwerth, Anne","first_name":"Anne","last_name":"Deckwerth"},{"full_name":"Kammermeyer, Gisela","first_name":"Gisela","last_name":"Kammermeyer"},{"full_name":"Lenske, Gerlinde","first_name":"Gerlinde","last_name":"Lenske"},{"full_name":"Leuchter, Miriam","first_name":"Miriam","last_name":"Leuchter"},{"full_name":"Wildemann, Anja","first_name":"Anja","last_name":"Wildemann"}],"publication_identifier":{"isbn":["9783658262303","9783658262310"]},"publication_status":"published","department":[{"_id":"462"}],"title":"Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen","place":"Wiesbaden","type":"book_chapter","citation":{"apa":"Gerick, J., & Eickelmann, B. (2019). Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen. In C. Donie, F. Foerster, M. Obermayr, A. Deckwerth, G. Kammermeyer, G. Lenske, M. Leuchter, & A. Wildemann (Eds.), Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung) (Vol. 23, pp. 200–205). VS Verlag. https://doi.org/10.1007/978-3-658-26231-0_25","ama":"Gerick J, Eickelmann B. Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen. In: Donie C, Foerster F, Obermayr M, et al., eds. Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung). Vol 23. VS Verlag; 2019:200-205. doi:10.1007/978-3-658-26231-0_25","chicago":"Gerick, Julia, and Birgit Eickelmann. “Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen.” In Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung), edited by Christian Donie, Frank Foerster, Marlene Obermayr, Anne Deckwerth, Gisela Kammermeyer, Gerlinde Lenske, Miriam Leuchter, and Anja Wildemann, 23:200–205. Wiesbaden: VS Verlag, 2019. https://doi.org/10.1007/978-3-658-26231-0_25.","bibtex":"@inbook{Gerick_Eickelmann_2019, place={Wiesbaden}, title={Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen}, volume={23}, DOI={10.1007/978-3-658-26231-0_25}, booktitle={Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)}, publisher={VS Verlag}, author={Gerick, Julia and Eickelmann, Birgit}, editor={Donie, Christian and Foerster, Frank and Obermayr, Marlene and Deckwerth, Anne and Kammermeyer, Gisela and Lenske, Gerlinde and Leuchter, Miriam and Wildemann, Anja}, year={2019}, pages={200–205} }","mla":"Gerick, Julia, and Birgit Eickelmann. “Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen.” Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung), edited by Christian Donie et al., vol. 23, VS Verlag, 2019, pp. 200–05, doi:10.1007/978-3-658-26231-0_25.","short":"J. Gerick, B. Eickelmann, in: C. Donie, F. Foerster, M. Obermayr, A. Deckwerth, G. Kammermeyer, G. Lenske, M. Leuchter, A. Wildemann (Eds.), Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung), VS Verlag, Wiesbaden, 2019, pp. 200–205.","ieee":"J. Gerick and B. Eickelmann, “Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen,” in Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung), vol. 23, C. Donie, F. Foerster, M. Obermayr, A. Deckwerth, G. Kammermeyer, G. Lenske, M. Leuchter, and A. Wildemann, Eds. Wiesbaden: VS Verlag, 2019, pp. 200–205."},"year":"2019","page":"200-205","intvolume":" 23","_id":"28764","volume":23,"status":"public","date_created":"2021-12-13T17:03:41Z","publisher":"VS Verlag","author":[{"last_name":"Gerick","full_name":"Gerick, Julia","first_name":"Julia"},{"first_name":"Birgit","full_name":"Eickelmann, Birgit","last_name":"Eickelmann","id":"40387"}],"publication":"Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)","user_id":"50923"},{"department":[{"_id":"58"}],"publication":"IEEE MTT-S International Microwave and RF Conference 2019","publisher":"IEEE","author":[{"first_name":"Stephan","full_name":"Kruse, Stephan","last_name":"Kruse","id":"38254"}],"date_created":"2021-09-09T12:26:02Z","status":"public","abstract":[{"text":"This paper presents an area-efficient 19.25 GHz to 77 GHz frequency quadrupler for automotive radar applications. To reduce chip area, the delay lines of each doubler stage have been drastically shrunk by means of meandering, slow wave structures, and capacitive loading. Additional circuit techniques were applied to further reduce chip area. Compared to previously published Gilbert cell frequency multipliers the presented quadrupler achieves the shortest electrical length of the delay lines reported so far allowing for compact, low-cost radar transceivers. The chip was implemented in a IHP 130nm SiGe BiCMOS technology (f T /f max =240/340GHz). It dissipates 91.5mW from a 3.3V supply.","lang":"eng"}],"place":"Bombay, Mumbai, India","title":"An Area Efficient 19.25 GHz to 77 GHz Gilbert Cell Frequency Quadrupler with 55% Shrinked Delay Lines in 130nm SiGe BiCMOS ","user_id":"15931","related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/9118726"}]},"year":"2019","type":"conference","citation":{"short":"S. Kruse, in: IEEE MTT-S International Microwave and RF Conference 2019, IEEE, Bombay, Mumbai, India, 2019.","ieee":"S. Kruse, “An Area Efficient 19.25 GHz to 77 GHz Gilbert Cell Frequency Quadrupler with 55% Shrinked Delay Lines in 130nm SiGe BiCMOS ,” 2019, doi: 10.1109/IMaRC45935.2019.9118726.","chicago":"Kruse, Stephan. “An Area Efficient 19.25 GHz to 77 GHz Gilbert Cell Frequency Quadrupler with 55% Shrinked Delay Lines in 130nm SiGe BiCMOS .” In IEEE MTT-S International Microwave and RF Conference 2019. Bombay, Mumbai, India: IEEE, 2019. https://doi.org/10.1109/IMaRC45935.2019.9118726.","apa":"Kruse, S. (2019). An Area Efficient 19.25 GHz to 77 GHz Gilbert Cell Frequency Quadrupler with 55% Shrinked Delay Lines in 130nm SiGe BiCMOS . IEEE MTT-S International Microwave and RF Conference 2019. https://doi.org/10.1109/IMaRC45935.2019.9118726","ama":"Kruse S. An Area Efficient 19.25 GHz to 77 GHz Gilbert Cell Frequency Quadrupler with 55% Shrinked Delay Lines in 130nm SiGe BiCMOS . In: IEEE MTT-S International Microwave and RF Conference 2019. IEEE; 2019. doi:10.1109/IMaRC45935.2019.9118726","bibtex":"@inproceedings{Kruse_2019, place={Bombay, Mumbai, India}, title={An Area Efficient 19.25 GHz to 77 GHz Gilbert Cell Frequency Quadrupler with 55% Shrinked Delay Lines in 130nm SiGe BiCMOS }, DOI={10.1109/IMaRC45935.2019.9118726}, booktitle={IEEE MTT-S International Microwave and RF Conference 2019}, publisher={IEEE}, author={Kruse, Stephan}, year={2019} }","mla":"Kruse, Stephan. “An Area Efficient 19.25 GHz to 77 GHz Gilbert Cell Frequency Quadrupler with 55% Shrinked Delay Lines in 130nm SiGe BiCMOS .” IEEE MTT-S International Microwave and RF Conference 2019, IEEE, 2019, doi:10.1109/IMaRC45935.2019.9118726."},"language":[{"iso":"eng"}],"conference":{"start_date":"2019.12.13","end_date":"2019.12.15"},"date_updated":"2022-01-06T06:56:06Z","_id":"24048","doi":"10.1109/IMaRC45935.2019.9118726"},{"doi":"10.1109/APMC46564.2019.9038239","conference":{"end_date":"2019.12.13","location":"Singapore ","start_date":"2019.12.10"},"_id":"24049","date_updated":"2022-01-06T06:56:06Z","language":[{"iso":"eng"}],"citation":{"chicago":"Wu, Liang, Maxim Weizel, and Christoph Scheytt. “70 GHz Large-Signal Bandwidth Sampler Using Current-Mode Integrate-and-Hold Circuit in 130 Nm SiGe BiCMOS Technology.” In Asia-Pacific Microwave Conference (APMC), 2019. https://doi.org/10.1109/APMC46564.2019.9038239.","ama":"Wu L, Weizel M, Scheytt C. 70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology. In: Asia-Pacific Microwave Conference (APMC). ; 2019. doi:10.1109/APMC46564.2019.9038239","apa":"Wu, L., Weizel, M., & Scheytt, C. (2019). 70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology. Asia-Pacific Microwave Conference (APMC). https://doi.org/10.1109/APMC46564.2019.9038239","mla":"Wu, Liang, et al. “70 GHz Large-Signal Bandwidth Sampler Using Current-Mode Integrate-and-Hold Circuit in 130 Nm SiGe BiCMOS Technology.” Asia-Pacific Microwave Conference (APMC), 2019, doi:10.1109/APMC46564.2019.9038239.","bibtex":"@inproceedings{Wu_Weizel_Scheytt_2019, title={70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology}, DOI={10.1109/APMC46564.2019.9038239}, booktitle={Asia-Pacific Microwave Conference (APMC)}, author={Wu, Liang and Weizel, Maxim and Scheytt, Christoph}, year={2019} }","short":"L. Wu, M. Weizel, C. Scheytt, in: Asia-Pacific Microwave Conference (APMC), 2019.","ieee":"L. Wu, M. Weizel, and C. Scheytt, “70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology,” Singapore , 2019, doi: 10.1109/APMC46564.2019.9038239."},"type":"conference","year":"2019","user_id":"15931","related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/9038239"}]},"title":"70 GHz Large-signal Bandwidth Sampler Using Current-mode Integrate-and-Hold Circuit in 130 nm SiGe BiCMOS Technology","abstract":[{"text":"This paper presents a broadband sampler IC using a current-mode integrated-and-hold-circuit (IHC) as sampling circuit. The sampler IC exhibits 1dB large-signal bandwidth of 70 GHz and excellent signal integrity on hold-mode. With a sampling rate of 5 GS/s, it achieves effective number of bits (ENOB) of 6 bit at 9.9 GHz input frequency. The chip was fabricated in a 130 nm SiGe BiCMOS technology from IHP.","lang":"eng"}],"date_created":"2021-09-09T12:26:04Z","status":"public","department":[{"_id":"58"}],"publication":"Asia-Pacific Microwave Conference (APMC)","author":[{"first_name":"Liang","full_name":"Wu, Liang","last_name":"Wu","id":"30401"},{"last_name":"Weizel","id":"44271","first_name":"Maxim","orcid":"https://orcid.org/0000-0003-2699-9839","full_name":"Weizel, Maxim"},{"first_name":"Christoph","full_name":"Scheytt, Christoph","last_name":"Scheytt","id":"37144"}]},{"date_updated":"2022-01-06T06:56:06Z","_id":"24052","conference":{"start_date":"2019.11.27","end_date":"2019.11.29"},"doi":"10.1109/ICECS46596.2019.8965046","year":"2019","type":"conference","citation":{"short":"L. Wu, M. Weizel, C. Scheytt, in: 26th IEEE International Conference on Electronics Circuits and Systems (ICECS), Genova, Italy, 2019.","ieee":"L. Wu, M. Weizel, and C. Scheytt, “A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology,” 2019, doi: 10.1109/ICECS46596.2019.8965046.","apa":"Wu, L., Weizel, M., & Scheytt, C. (2019). A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology. 26th IEEE International Conference on Electronics Circuits and Systems (ICECS). https://doi.org/10.1109/ICECS46596.2019.8965046","ama":"Wu L, Weizel M, Scheytt C. A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology. In: 26th IEEE International Conference on Electronics Circuits and Systems (ICECS). ; 2019. doi:10.1109/ICECS46596.2019.8965046","chicago":"Wu, Liang, Maxim Weizel, and Christoph Scheytt. “A 70 GHz Small-Signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 Nm SiGe BiCMOS Technology.” In 26th IEEE International Conference on Electronics Circuits and Systems (ICECS). Genova, Italy, 2019. https://doi.org/10.1109/ICECS46596.2019.8965046.","bibtex":"@inproceedings{Wu_Weizel_Scheytt_2019, place={Genova, Italy}, title={A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology}, DOI={10.1109/ICECS46596.2019.8965046}, booktitle={26th IEEE International Conference on Electronics Circuits and Systems (ICECS)}, author={Wu, Liang and Weizel, Maxim and Scheytt, Christoph}, year={2019} }","mla":"Wu, Liang, et al. “A 70 GHz Small-Signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 Nm SiGe BiCMOS Technology.” 26th IEEE International Conference on Electronics Circuits and Systems (ICECS), 2019, doi:10.1109/ICECS46596.2019.8965046."},"language":[{"iso":"eng"}],"place":"Genova, Italy","abstract":[{"text":"This paper presents a broadband track-and-hold amplifier (THA) based on switched-emitter-follower (SEF) topology. The THA exhibits a record 3dB small-signal bandwidth of 70 GHz. With the high sampling rate of 40 GS/s, it achieves an effective number of bits (ENOB) of 7.5 bit at 1 GHz input frequency and an ENOB of >5 bit up to 15 GHz input frequency. The chip was fabricated in a 130 nm SiGe BiCMOS technology from IHP (SG13G2). It draws 110 mA from a -4 V supply voltage, dissipating 440 mW.","lang":"eng"}],"title":"A 70 GHz Small-signal Bandwidth 40 GS/s Track-and-Hold Amplifier in 130 nm SiGe BiCMOS Technology","related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/8965046"}]},"user_id":"15931","author":[{"last_name":"Wu","id":"30401","first_name":"Liang","full_name":"Wu, Liang"},{"first_name":"Maxim","orcid":"https://orcid.org/0000-0003-2699-9839","full_name":"Weizel, Maxim","last_name":"Weizel","id":"44271"},{"last_name":"Scheytt","id":"37144","first_name":"Christoph","full_name":"Scheytt, Christoph"}],"department":[{"_id":"58"}],"publication":"26th IEEE International Conference on Electronics Circuits and Systems (ICECS)","status":"public","date_created":"2021-09-09T12:26:06Z"},{"place":"London, England","abstract":[{"text":"We overview the 3-year Meteracom project which\r\nwill provide traceability to the SI for THz communication\r\nmeasurement parameters. The key objectives are to develop new\r\nmetrological methods to characterize the measurement systems,\r\nsystem components and propagation channels. The final\r\nobjective is to develop metrology for functionality and signal\r\nintegrity of THz communication systems; particularly device\r\ndiscovery and beam tracking, determination of physical layer\r\nparameters for digital transmission and real-time performance\r\nevaluation.","lang":"eng"}],"title":"An overview of the Meteracom Project","related_material":{"link":[{"url":"https://www.wwrf.ch/files/content%20wwrf/meetings/past%20events/wwrf43/presentations%20wwrf43/Metaracom%20Project.pdf","relation":"confirmation"}]},"user_id":"15931","author":[{"full_name":"Humphreys, David","first_name":"David","last_name":"Humphreys"},{"full_name":"Berekovic, Mladen","first_name":"Mladen","last_name":"Berekovic"},{"last_name":"Kallfass","first_name":"Ingmar","full_name":"Kallfass, Ingmar"},{"last_name":"Scheytt","id":"37144","first_name":"Christoph","full_name":"Scheytt, Christoph"},{"last_name":"Kuerner","first_name":"Thomas","full_name":"Kuerner, Thomas"},{"last_name":"Jukan","full_name":"Jukan, Admela","first_name":"Admela"},{"last_name":"Schneider","full_name":"Schneider, Thomas","first_name":"Thomas"},{"first_name":"Thomas","full_name":"Kleine-Ostmann, Thomas","last_name":"Kleine-Ostmann"},{"first_name":"Martin","full_name":"Koch, Martin","last_name":"Koch"},{"full_name":"Thomae, Reiner","first_name":"Reiner","last_name":"Thomae"}],"department":[{"_id":"58"}],"publication":"Proc. 43-nd Meeting of the Wireless World Research Forum (WWRF)\",","status":"public","date_created":"2021-09-09T12:26:07Z","date_updated":"2022-01-06T06:56:06Z","_id":"24053","type":"conference","year":"2019","citation":{"bibtex":"@inproceedings{Humphreys_Berekovic_Kallfass_Scheytt_Kuerner_Jukan_Schneider_Kleine-Ostmann_Koch_Thomae_2019, place={London, England}, title={An overview of the Meteracom Project}, booktitle={Proc. 43-nd Meeting of the Wireless World Research Forum (WWRF)\",}, author={Humphreys, David and Berekovic, Mladen and Kallfass, Ingmar and Scheytt, Christoph and Kuerner, Thomas and Jukan, Admela and Schneider, Thomas and Kleine-Ostmann, Thomas and Koch, Martin and Thomae, Reiner}, year={2019} }","mla":"Humphreys, David, et al. “An Overview of the Meteracom Project.” Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\", 2019.","apa":"Humphreys, D., Berekovic, M., Kallfass, I., Scheytt, C., Kuerner, T., Jukan, A., Schneider, T., Kleine-Ostmann, T., Koch, M., & Thomae, R. (2019). An overview of the Meteracom Project. Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\",.","ama":"Humphreys D, Berekovic M, Kallfass I, et al. An overview of the Meteracom Project. In: Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\",. ; 2019.","chicago":"Humphreys, David, Mladen Berekovic, Ingmar Kallfass, Christoph Scheytt, Thomas Kuerner, Admela Jukan, Thomas Schneider, Thomas Kleine-Ostmann, Martin Koch, and Reiner Thomae. “An Overview of the Meteracom Project.” In Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\",. London, England, 2019.","ieee":"D. Humphreys et al., “An overview of the Meteracom Project,” 2019.","short":"D. Humphreys, M. Berekovic, I. Kallfass, C. Scheytt, T. Kuerner, A. Jukan, T. Schneider, T. Kleine-Ostmann, M. Koch, R. Thomae, in: Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\", London, England, 2019."},"language":[{"iso":"eng"}]},{"publication":"IEEE International Conference on RFID Technology & Application (RFID-TA) ","department":[{"_id":"58"}],"author":[{"full_name":"Haddadian, Sanaz","first_name":"Sanaz","id":"59648","last_name":"Haddadian"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","id":"37144","last_name":"Scheytt"}],"date_created":"2021-09-09T12:26:13Z","status":"public","abstract":[{"lang":"eng","text":"Targeting the feasible application of microwave RFID systems with MIMO reader technology for tracking small objects in multipath fading conditions, we present a fully integrated Analog Front-End (AFE) designed and fabricated in a standard 65-nm CMOS technology for low power passive RFID tags in the 5.8 GHz ISM band. A differential drive power scavenging unit is dimensioned to provide a 1.2 V rectified voltage resulting in a 1 V regulated voltage for the AFE while supplying a 50 μW load. Transistors with standard threshold voltage (V th ) have been used for implementation. Measurements of the fabricated circuits show a maximum Power Conversion Efficiency (PCE) of 71.8% at -12.5 dBm, and an input quality factor (Q-factor) of approximately 10."}],"place":"Pisa, Italy","related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/8892037","relation":"confirmation"}]},"user_id":"15931","title":"A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader","language":[{"iso":"eng"}],"type":"conference","citation":{"apa":"Haddadian, S., & Scheytt, C. (2019). A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader. IEEE International Conference on RFID Technology & Application (RFID-TA) . https://doi.org/10.1109/RFID-TA.2019.8892037","ama":"Haddadian S, Scheytt C. A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader. In: IEEE International Conference on RFID Technology & Application (RFID-TA) . ; 2019. doi:10.1109/RFID-TA.2019.8892037","chicago":"Haddadian, Sanaz, and Christoph Scheytt. “A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader.” In IEEE International Conference on RFID Technology & Application (RFID-TA) . Pisa, Italy, 2019. https://doi.org/10.1109/RFID-TA.2019.8892037.","bibtex":"@inproceedings{Haddadian_Scheytt_2019, place={Pisa, Italy}, title={A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader}, DOI={10.1109/RFID-TA.2019.8892037}, booktitle={IEEE International Conference on RFID Technology & Application (RFID-TA) }, author={Haddadian, Sanaz and Scheytt, Christoph}, year={2019} }","mla":"Haddadian, Sanaz, and Christoph Scheytt. “A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader.” IEEE International Conference on RFID Technology & Application (RFID-TA) , 2019, doi:10.1109/RFID-TA.2019.8892037.","short":"S. Haddadian, C. Scheytt, in: IEEE International Conference on RFID Technology & Application (RFID-TA) , Pisa, Italy, 2019.","ieee":"S. Haddadian and C. Scheytt, “A 5.8 GHz CMOS Analog Front-End Targeting RF Energy Harvesting for Microwave RFIDs with MIMO Reader,” 2019, doi: 10.1109/RFID-TA.2019.8892037."},"year":"2019","conference":{"end_date":"2019.09.27","start_date":"2019.09.25"},"_id":"24057","date_updated":"2022-01-06T06:56:06Z","doi":"10.1109/RFID-TA.2019.8892037"},{"citation":{"chicago":"Koppelmann, Bastian, Peer Adelt, Wolfgang Müller, and Christoph Scheytt. “RISC-V Extensions for Bit Manipulation Instructions.” In 29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS). Rhodos, Griechenland, 2019. https://doi.org/10.1109/PATMOS.2019.8862170.","apa":"Koppelmann, B., Adelt, P., Müller, W., & Scheytt, C. (2019). RISC-V Extensions for Bit Manipulation Instructions. 29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS). https://doi.org/10.1109/PATMOS.2019.8862170","ama":"Koppelmann B, Adelt P, Müller W, Scheytt C. RISC-V Extensions for Bit Manipulation Instructions. In: 29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS). ; 2019. doi:10.1109/PATMOS.2019.8862170","bibtex":"@inproceedings{Koppelmann_Adelt_Müller_Scheytt_2019, place={Rhodos, Griechenland}, title={RISC-V Extensions for Bit Manipulation Instructions}, DOI={10.1109/PATMOS.2019.8862170}, booktitle={29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)}, author={Koppelmann, Bastian and Adelt, Peer and Müller, Wolfgang and Scheytt, Christoph}, year={2019} }","mla":"Koppelmann, Bastian, et al. “RISC-V Extensions for Bit Manipulation Instructions.” 29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), 2019, doi:10.1109/PATMOS.2019.8862170.","short":"B. Koppelmann, P. Adelt, W. Müller, C. Scheytt, in: 29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), Rhodos, Griechenland, 2019.","ieee":"B. Koppelmann, P. Adelt, W. Müller, and C. Scheytt, “RISC-V Extensions for Bit Manipulation Instructions,” 2019, doi: 10.1109/PATMOS.2019.8862170."},"year":"2019","type":"conference","language":[{"iso":"eng"}],"doi":"10.1109/PATMOS.2019.8862170","conference":{"start_date":"2019.07.01","end_date":"2019.07.03"},"date_updated":"2022-01-06T06:56:06Z","_id":"24058","date_created":"2021-09-09T12:26:14Z","status":"public","publication":"29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)","department":[{"_id":"58"}],"author":[{"full_name":"Koppelmann, Bastian","first_name":"Bastian","id":"25260","last_name":"Koppelmann"},{"first_name":"Peer","full_name":"Adelt, Peer","last_name":"Adelt","id":"5603"},{"full_name":"Müller, Wolfgang","first_name":"Wolfgang","id":"16243","last_name":"Müller"},{"first_name":"Christoph","full_name":"Scheytt, Christoph","last_name":"Scheytt","id":"37144"}],"title":"RISC-V Extensions for Bit Manipulation Instructions","user_id":"15931","related_material":{"link":[{"url":"https://ieeexplore.ieee.org/document/8862170","relation":"confirmation"}]},"abstract":[{"text":"Embedded systems require a high energy efficiency in combination with an optimized performance. As such, Bit Manipulation Instructions (BMIs) were introduced for x86 and ARMv8 to improve the runtime efficiency and power dissipation of the compiled software for various applications. Though the RISC-V platform is meanwhile widely accepted for embedded systems application, its instruction set architecture (ISA) currently still supports only two basic BMIs.We introduce ten advanced BMIs for the RISC-V ISA and implemented them on Berkeley's Rocket CPU [1], which we synthesized for the Artix-7 FPGA and the TSMC 65nm cell library. Our RISC-V BMI definitions are based on an analysis and combination of existing x86 and ARMv8 BMIs. Our Rocket CPU hardware extensions show that RISC-V BMI extensions have no negative impact on the critical path of the execution pipeline. Our software evaluations show that we can, for example, expect a significant impact for time and power consuming cryptographic applications.","lang":"eng"}],"place":"Rhodos, Griechenland"},{"doi":"10.1109/ICC.2019.8761960","conference":{"start_date":"2019.05.20","end_date":"2019.05.24"},"date_updated":"2022-01-06T06:56:06Z","_id":"24059","language":[{"iso":"eng"}],"page":"1-6","type":"conference","citation":{"chicago":"Amjad, Muhammad Sohaib, Claas Tebruegge, Agon Memedi, Stephan Kruse, Christian Kress, Christoph Scheytt, and Falko Dressler. “An IEEE 802.11 Compliant SDR-Based System for Vehicular Visible Light Communications.” In IEEE International Conference on Communications (ICC), 1–6. Shanghai, China: ICC 2019 - 2019 IEEE International Conference on Communications (ICC), 2019. https://doi.org/10.1109/ICC.2019.8761960.","apa":"Amjad, M. S., Tebruegge, C., Memedi, A., Kruse, S., Kress, C., Scheytt, C., & Dressler, F. (2019). An IEEE 802.11 Compliant SDR-Based System for Vehicular Visible Light Communications. IEEE International Conference on Communications (ICC), 1–6. https://doi.org/10.1109/ICC.2019.8761960","ama":"Amjad MS, Tebruegge C, Memedi A, et al. An IEEE 802.11 Compliant SDR-Based System for Vehicular Visible Light Communications. In: IEEE International Conference on Communications (ICC). ICC 2019 - 2019 IEEE International Conference on Communications (ICC); 2019:1-6. doi:10.1109/ICC.2019.8761960","mla":"Amjad, Muhammad Sohaib, et al. “An IEEE 802.11 Compliant SDR-Based System for Vehicular Visible Light Communications.” IEEE International Conference on Communications (ICC), ICC 2019 - 2019 IEEE International Conference on Communications (ICC), 2019, pp. 1–6, doi:10.1109/ICC.2019.8761960.","bibtex":"@inproceedings{Amjad_Tebruegge_Memedi_Kruse_Kress_Scheytt_Dressler_2019, place={Shanghai, China}, title={An IEEE 802.11 Compliant SDR-Based System for Vehicular Visible Light Communications}, DOI={10.1109/ICC.2019.8761960}, booktitle={IEEE International Conference on Communications (ICC)}, publisher={ICC 2019 - 2019 IEEE International Conference on Communications (ICC)}, author={Amjad, Muhammad Sohaib and Tebruegge, Claas and Memedi, Agon and Kruse, Stephan and Kress, Christian and Scheytt, Christoph and Dressler, Falko}, year={2019}, pages={1–6} }","short":"M.S. Amjad, C. Tebruegge, A. Memedi, S. Kruse, C. Kress, C. Scheytt, F. Dressler, in: IEEE International Conference on Communications (ICC), ICC 2019 - 2019 IEEE International Conference on Communications (ICC), Shanghai, China, 2019, pp. 1–6.","ieee":"M. S. Amjad et al., “An IEEE 802.11 Compliant SDR-Based System for Vehicular Visible Light Communications,” in IEEE International Conference on Communications (ICC), 2019, pp. 1–6, doi: 10.1109/ICC.2019.8761960."},"year":"2019","related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/8761960"}]},"user_id":"15931","title":"An IEEE 802.11 Compliant SDR-Based System for Vehicular Visible Light Communications","abstract":[{"text":"We present a complete Visible Light Communication (VLC) system for experimental Vehicular VLC (V-VLC) research activities. Visible light is becoming an important technology complementing existing Radio Frequency (RF) technologies such as Cellular V2X (C-V2X) and Dedicated Short Range Communication (DSRC). In this scope, first works helped introducing new simulation models to explore V-VLC capabilities, technologies, and algorithms. Yet, experimental prototypes are still in an early phase. We aim bridging this gap with our system, which integrates a custom-made driver hardware, commercial vehicle light modules, and an Open Source signal processing implementation in GNU Radio, which explicitly offers rapid prototyping. Our system supports OFDM with a variety of Modulation and Coding Schemes (MCS) and is compliant to IEEE 802.11; this is in line with the upcoming IEEE 802.11 LC standard as well. In an extensive series of experiments, we assessed the communication performance by looking at realistic inter vehicle distances. Our results clearly show that our system supports even higher order MCS with very low error rates over long distances.","lang":"eng"}],"place":"Shanghai, China","date_created":"2021-09-09T12:26:15Z","status":"public","department":[{"_id":"58"}],"publication":"IEEE International Conference on Communications (ICC)","author":[{"last_name":"Amjad","full_name":"Amjad, Muhammad Sohaib","first_name":"Muhammad Sohaib"},{"first_name":"Claas","full_name":"Tebruegge, Claas","last_name":"Tebruegge"},{"first_name":"Agon","full_name":"Memedi, Agon","last_name":"Memedi"},{"last_name":"Kruse","id":"38254","first_name":"Stephan","full_name":"Kruse, Stephan"},{"id":"13256","last_name":"Kress","full_name":"Kress, Christian","first_name":"Christian"},{"first_name":"Christoph","full_name":"Scheytt, Christoph","last_name":"Scheytt","id":"37144"},{"orcid":"0000-0002-1989-1750","full_name":"Dressler, Falko","first_name":"Falko","id":"48097","last_name":"Dressler"}],"publisher":"ICC 2019 - 2019 IEEE International Conference on Communications (ICC)"},{"type":"conference","year":"2019","citation":{"mla":"Adelt, Peer, et al. “Analyse Sicherheitskritischer Software Für RISC-V Prozessoren.” MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019), 2019.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Scheytt_2019, place={Kaiserslautern, DE}, title={Analyse sicherheitskritischer Software für RISC-V Prozessoren}, booktitle={MBMV 2019-22.Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2019)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Scheytt, Christoph}, year={2019} }","apa":"Adelt, P., Koppelmann, B., Müller, W., & Scheytt, C. (2019). Analyse sicherheitskritischer Software für RISC-V Prozessoren. MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019).","ama":"Adelt P, Koppelmann B, Müller W, Scheytt C. Analyse sicherheitskritischer Software für RISC-V Prozessoren. In: MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019). ; 2019.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, and Christoph Scheytt. “Analyse Sicherheitskritischer Software Für RISC-V Prozessoren.” In MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019). Kaiserslautern, DE, 2019.","ieee":"P. Adelt, B. Koppelmann, W. Müller, and C. Scheytt, “Analyse sicherheitskritischer Software für RISC-V Prozessoren,” 2019.","short":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, in: MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019), Kaiserslautern, DE, 2019."},"language":[{"iso":"eng"}],"conference":{"start_date":"2019.04.08","end_date":"2019.04.08"},"_id":"24060","date_updated":"2022-01-06T06:56:06Z","publication":"MBMV 2019-22.Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2019)","department":[{"_id":"58"}],"author":[{"full_name":"Adelt, Peer","first_name":"Peer","id":"5603","last_name":"Adelt"},{"id":"25260","last_name":"Koppelmann","full_name":"Koppelmann, Bastian","first_name":"Bastian"},{"id":"16243","last_name":"Müller","full_name":"Müller, Wolfgang","first_name":"Wolfgang"},{"id":"37144","last_name":"Scheytt","full_name":"Scheytt, Christoph","first_name":"Christoph"}],"publication_identifier":{"isbn":["978-3-8007-4945-4"]},"date_created":"2021-09-09T12:26:16Z","status":"public","abstract":[{"text":"In diesem Artikel stellen wir eine Methode zur nicht-invasiven dynamischen Speicher- und IO-Analyse mit QEMU für sicherheitskritische eingebettete Software für die RISC-V Befehlssatzarchitektur vor. Die Implementierung basiert auf einer Erweiterung des Tiny Code Generator (TCG) des quelloffenen CPU-Emulators QEMU um die dynamische Identifikation von Zugriffen auf Datenspeicher sowie auf an die CPU angeschlossene IO-Geräte. Wir demonstrieren die Funktionalität der Methode anhand eines Versuchsaufbaus, bei dem eine Schließsystemkontrolle mittels serieller UART-Schnittstelle an einen RISC-V-Prozessor angebunden ist. Dieses Szenario zeigt, dass ein unberechtigter Zugriff auf die UART-Schnittstelle frühzeitig aufgedeckt und ein Angriff auf eine Zugangskontrolle somit endeckt werden kann. ","lang":"ger"}],"place":"Kaiserslautern, DE","title":"Analyse sicherheitskritischer Software für RISC-V Prozessoren","related_material":{"link":[{"url":"https://www.vde-verlag.de/proceedings-de/454945007.html","relation":"confirmation"}]},"user_id":"15931"},{"language":[{"iso":"eng"}],"page":"32-34","citation":{"ama":"Adelt P, Koppelmann B, Müller W, Scheytt C, Driessen B. QEMU for Dynamic Memory Analysis of Security Sensitive Software. In: 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019. ; 2019:32-34.","apa":"Adelt, P., Koppelmann, B., Müller, W., Scheytt, C., & Driessen, B. (2019). QEMU for Dynamic Memory Analysis of Security Sensitive Software. 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019, 32–34.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Christoph Scheytt, and Benedikt Driessen. “QEMU for Dynamic Memory Analysis of Security Sensitive Software.” In 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019, 32–34. Florence, Italy, 2019.","mla":"Adelt, Peer, et al. “QEMU for Dynamic Memory Analysis of Security Sensitive Software.” 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019, 2019, pp. 32–34.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Scheytt_Driessen_2019, place={Florence, Italy}, title={QEMU for Dynamic Memory Analysis of Security Sensitive Software}, booktitle={ 2nd International Workshop on Embedded Software for Industrial IoT in conjunction with DATE 2019}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Scheytt, Christoph and Driessen, Benedikt}, year={2019}, pages={32–34} }","short":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, B. Driessen, in: 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019, Florence, Italy, 2019, pp. 32–34.","ieee":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, and B. Driessen, “QEMU for Dynamic Memory Analysis of Security Sensitive Software,” in 2nd International Workshop on Embedded Software for Industrial IoT in conjunction with DATE 2019, 2019, pp. 32–34."},"year":"2019","type":"conference","_id":"24061","date_updated":"2022-01-06T06:56:06Z","date_created":"2021-09-09T12:26:18Z","status":"public","department":[{"_id":"58"}],"publication":" 2nd International Workshop on Embedded Software for Industrial IoT in conjunction with DATE 2019","author":[{"first_name":"Peer","full_name":"Adelt, Peer","last_name":"Adelt","id":"5603"},{"first_name":"Bastian","full_name":"Koppelmann, Bastian","last_name":"Koppelmann","id":"25260"},{"id":"16243","last_name":"Müller","full_name":"Müller, Wolfgang","first_name":"Wolfgang"},{"first_name":"Christoph","full_name":"Scheytt, Christoph","last_name":"Scheytt","id":"37144"},{"last_name":"Driessen","full_name":"Driessen, Benedikt","first_name":"Benedikt"}],"related_material":{"link":[{"url":"https://www.researchgate.net/publication/334258953_QEMU_for_Dynamic_Memory_Analysis_of_Security_Sensitive_Software","relation":"confirmation"}]},"user_id":"15931","title":"QEMU for Dynamic Memory Analysis of Security Sensitive Software","place":"Florence, Italy"},{"title":"QEMU Support for RISC-V: Current State and Future Releases","user_id":"15931","related_material":{"link":[{"relation":"confirmation","url":"https://www.edacentrum.de/veranstaltungen/risc-v/2019/programm"}]},"abstract":[{"lang":"eng","text":"It its current Version 3.1.0 QEMU supports RISC-V RV32GC and RV64GC software emulation in user and full system mode. We will first give an overview of the current state of the QEMU RISC-V implementation. Thereafter, we will present the DecodeTree tool, which will be available with the next QEMU release. DecodeTree is a code generator included in QEMU that can generate the program logic for extracting and decoding opcodes and operands from a formal instruction list of the target architecture. This enables the structured implementation of just-in-time compilations to guarantee that the QEMU implementation meets the ISA specification. As such, we completely replaced the existing RISC-V RV32GC and RV64GC implementations by DecodeTree generations in the next official QEMU release, which is expected in spring 2019. We will demonstrate the DecodeTree applications by the example of RISC-V ISA subset configurations."}],"volume":"(Presentation)","date_created":"2021-09-09T12:26:20Z","status":"public","department":[{"_id":"58"}],"publication":"2nd International Workshop on RISC-V Research Activities","author":[{"last_name":"Adelt","id":"5603","first_name":"Peer","full_name":"Adelt, Peer"},{"full_name":"Koppelmann, Bastian","first_name":"Bastian","id":"25260","last_name":"Koppelmann"},{"first_name":"Wolfgang","full_name":"Müller, Wolfgang","last_name":"Müller","id":"16243"},{"id":"37144","last_name":"Scheytt","full_name":"Scheytt, Christoph","first_name":"Christoph"}],"date_updated":"2022-01-06T06:56:06Z","_id":"24063","citation":{"mla":"Adelt, Peer, et al. “QEMU Support for RISC-V: Current State and Future Releases.” 2nd International Workshop on RISC-V Research Activities, vol. (Presentation), 2019.","bibtex":"@article{Adelt_Koppelmann_Müller_Scheytt_2019, title={QEMU Support for RISC-V: Current State and Future Releases}, volume={(Presentation)}, journal={2nd International Workshop on RISC-V Research Activities}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Scheytt, Christoph}, year={2019} }","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, and Christoph Scheytt. “QEMU Support for RISC-V: Current State and Future Releases.” 2nd International Workshop on RISC-V Research Activities (Presentation) (2019).","ama":"Adelt P, Koppelmann B, Müller W, Scheytt C. QEMU Support for RISC-V: Current State and Future Releases. 2nd International Workshop on RISC-V Research Activities. 2019;(Presentation).","apa":"Adelt, P., Koppelmann, B., Müller, W., & Scheytt, C. (2019). QEMU Support for RISC-V: Current State and Future Releases. 2nd International Workshop on RISC-V Research Activities, (Presentation).","ieee":"P. Adelt, B. Koppelmann, W. Müller, and C. Scheytt, “QEMU Support for RISC-V: Current State and Future Releases,” 2nd International Workshop on RISC-V Research Activities, vol. (Presentation), 2019.","short":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, 2nd International Workshop on RISC-V Research Activities (Presentation) (2019)."},"type":"journal_article","year":"2019","language":[{"iso":"eng"}]},{"author":[{"id":"48411","last_name":"Hoyer","full_name":"Hoyer, Kay-Peter","first_name":"Kay-Peter"},{"last_name":"Schaper","id":"43720","first_name":"Mirko","full_name":"Schaper, Mirko"}],"department":[{"_id":"9"},{"_id":"158"}],"publication":"TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings","publication_identifier":{"issn":["2367-1181","2367-1696"]},"publication_status":"published","status":"public","date_created":"2021-09-10T06:47:45Z","place":"Cham","title":"Alloy Design for Biomedical Applications in Additive Manufacturing","user_id":"48411","year":"2019","citation":{"ieee":"K.-P. Hoyer and M. Schaper, “Alloy Design for Biomedical Applications in Additive Manufacturing,” in TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings, Cham, 2019.","short":"K.-P. Hoyer, M. Schaper, in: TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings, Cham, 2019.","bibtex":"@inbook{Hoyer_Schaper_2019, place={Cham}, title={Alloy Design for Biomedical Applications in Additive Manufacturing}, DOI={10.1007/978-3-030-05861-6_44}, booktitle={TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings}, author={Hoyer, Kay-Peter and Schaper, Mirko}, year={2019} }","mla":"Hoyer, Kay-Peter, and Mirko Schaper. “Alloy Design for Biomedical Applications in Additive Manufacturing.” TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings, 2019, doi:10.1007/978-3-030-05861-6_44.","ama":"Hoyer K-P, Schaper M. Alloy Design for Biomedical Applications in Additive Manufacturing. In: TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. ; 2019. doi:10.1007/978-3-030-05861-6_44","apa":"Hoyer, K.-P., & Schaper, M. (2019). Alloy Design for Biomedical Applications in Additive Manufacturing. In TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. https://doi.org/10.1007/978-3-030-05861-6_44","chicago":"Hoyer, Kay-Peter, and Mirko Schaper. “Alloy Design for Biomedical Applications in Additive Manufacturing.” In TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. Cham, 2019. https://doi.org/10.1007/978-3-030-05861-6_44."},"type":"book_chapter","language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:56:06Z","_id":"24097","doi":"10.1007/978-3-030-05861-6_44"},{"publication":"TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings","department":[{"_id":"9"},{"_id":"158"}],"author":[{"last_name":"Tasche","first_name":"Lennart","full_name":"Tasche, Lennart"},{"last_name":"Hoyer","id":"48411","first_name":"Kay-Peter","full_name":"Hoyer, Kay-Peter"},{"first_name":"Evgeny","full_name":"Zhuravlev, Evgeny","last_name":"Zhuravlev"},{"full_name":"Grundmeier, Guido","first_name":"Guido","id":"194","last_name":"Grundmeier"},{"first_name":"Mirko","full_name":"Schaper, Mirko","last_name":"Schaper","id":"43720"},{"last_name":"Keßler","full_name":"Keßler, Olaf","first_name":"Olaf"}],"date_created":"2021-09-10T06:49:15Z","status":"public","publication_identifier":{"issn":["2367-1181","2367-1696"]},"publication_status":"published","place":"Cham","user_id":"48411","title":"Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry","language":[{"iso":"eng"}],"type":"book_chapter","year":"2019","citation":{"ieee":"L. Tasche, K.-P. Hoyer, E. Zhuravlev, G. Grundmeier, M. Schaper, and O. Keßler, “Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry,” in TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings, Cham, 2019.","short":"L. Tasche, K.-P. Hoyer, E. Zhuravlev, G. Grundmeier, M. Schaper, O. Keßler, in: TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings, Cham, 2019.","mla":"Tasche, Lennart, et al. “Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry.” TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings, 2019, doi:10.1007/978-3-030-05861-6_45.","bibtex":"@inbook{Tasche_Hoyer_Zhuravlev_Grundmeier_Schaper_Keßler_2019, place={Cham}, title={Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry}, DOI={10.1007/978-3-030-05861-6_45}, booktitle={TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings}, author={Tasche, Lennart and Hoyer, Kay-Peter and Zhuravlev, Evgeny and Grundmeier, Guido and Schaper, Mirko and Keßler, Olaf}, year={2019} }","chicago":"Tasche, Lennart, Kay-Peter Hoyer, Evgeny Zhuravlev, Guido Grundmeier, Mirko Schaper, and Olaf Keßler. “Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry.” In TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. Cham, 2019. https://doi.org/10.1007/978-3-030-05861-6_45.","ama":"Tasche L, Hoyer K-P, Zhuravlev E, Grundmeier G, Schaper M, Keßler O. Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry. In: TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. ; 2019. doi:10.1007/978-3-030-05861-6_45","apa":"Tasche, L., Hoyer, K.-P., Zhuravlev, E., Grundmeier, G., Schaper, M., & Keßler, O. (2019). Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry. In TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. https://doi.org/10.1007/978-3-030-05861-6_45"},"_id":"24098","date_updated":"2022-01-06T06:56:06Z","doi":"10.1007/978-3-030-05861-6_45"},{"date_created":"2021-09-10T07:05:44Z","status":"public","publication_identifier":{"issn":["2509-8772"]},"editor":[{"first_name":"Marion","full_name":"Eiber, Marion","last_name":"Eiber"}],"department":[{"_id":"9"},{"_id":"158"}],"user_id":"48411","title":"Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, ","place":"Berlin","language":[{"iso":"ger"}],"citation":{"mla":"Eiber, Marion, and Deutscher Verband für Materialforschung und -prüfung e.V., editors. Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, . 2019.","bibtex":"@book{Eiber_Deutscher Verband für Materialforschung und -prüfung e.V._2019, place={Berlin}, title={Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, }, year={2019} }","chicago":"Eiber, Marion, and Deutscher Verband für Materialforschung und -prüfung e.V., eds. Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, . Berlin, 2019.","ama":"Eiber M, Deutscher Verband für Materialforschung und -prüfung e.V., eds. Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, .; 2019.","apa":"Eiber, M., & Deutscher Verband für Materialforschung und -prüfung e.V. (Eds.). (2019). Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, .","ieee":"M. Eiber and Deutscher Verband für Materialforschung und -prüfung e.V., Eds., Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, . Berlin, 2019.","short":"M. Eiber, Deutscher Verband für Materialforschung und -prüfung e.V., eds., Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, , Berlin, 2019."},"type":"conference_editor","year":"2019","corporate_editor":["Deutscher Verband für Materialforschung und -prüfung e.V."],"conference":{"end_date":"07.11.2019","start_date":"06.11.2019","name":"4. Tagung des DVM-Arbeitskreises Additiv gefertigte Bauteile und Strukturen","location":"Berlin"},"date_updated":"2022-01-06T06:56:07Z","_id":"24102"},{"place":"Yokohama","title":"Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L","user_id":"48411","department":[{"_id":"9"},{"_id":"158"}],"publisher":"ASM International","publication_identifier":{"isbn":["9781510888005"]},"editor":[{"full_name":"Azarmi, Fardad ","first_name":"Fardad ","last_name":"Azarmi"}],"date_created":"2021-09-10T07:12:58Z","status":"public","conference":{"location":"Yokohama","name":"\tInternational Thermal Spray Conference and Exposition (ITSC 2019): New Waves of Thermal Spray Technology for Sustainable Growth","start_date":"26.05.2019","end_date":"29.05.2019"},"date_updated":"2022-01-06T06:56:07Z","_id":"24103","year":"2019","citation":{"short":"F. Azarmi, ed., Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L, ASM International, Yokohama, 2019.","ieee":"F. Azarmi, Ed., Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L. Yokohama: ASM International, 2019.","ama":"Azarmi F, ed. Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L. ASM International; 2019.","apa":"Azarmi, F. (Ed.). (2019). Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L. ASM International.","chicago":"Azarmi, Fardad , ed. Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L. Yokohama: ASM International, 2019.","bibtex":"@book{Azarmi_2019, place={Yokohama}, title={Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L}, publisher={ASM International}, year={2019} }","mla":"Azarmi, Fardad, editor. Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L. ASM International, 2019."},"type":"conference_editor","language":[{"iso":"eng"}]},{"user_id":"75069","title":"Creating round focused micro-jets from rectangular nozzles","publication":"Journal of Mechanical Science and Technology","author":[{"last_name":"Inguva","first_name":"Venkatesh","full_name":"Inguva, Venkatesh"},{"last_name":"Graceffa","full_name":"Graceffa, Rita","first_name":"Rita"},{"first_name":"Joachim","full_name":"Schulz, Joachim","last_name":"Schulz"},{"last_name":"Bilsel","full_name":"Bilsel, Osman","first_name":"Osman"},{"last_name":"Perot","first_name":"Blair J.","full_name":"Perot, Blair J."}],"date_created":"2021-09-10T07:54:38Z","status":"public","publication_status":"published","publication_identifier":{"issn":["1738-494X","1976-3824"]},"_id":"24122","date_updated":"2022-01-06T06:56:07Z","doi":"10.1007/s12206-019-0824-x","language":[{"iso":"eng"}],"page":"4281-4289","year":"2019","citation":{"apa":"Inguva, V., Graceffa, R., Schulz, J., Bilsel, O., & Perot, B. J. (2019). Creating round focused micro-jets from rectangular nozzles. Journal of Mechanical Science and Technology, 4281–4289. https://doi.org/10.1007/s12206-019-0824-x","ama":"Inguva V, Graceffa R, Schulz J, Bilsel O, Perot BJ. Creating round focused micro-jets from rectangular nozzles. Journal of Mechanical Science and Technology. Published online 2019:4281-4289. doi:10.1007/s12206-019-0824-x","chicago":"Inguva, Venkatesh, Rita Graceffa, Joachim Schulz, Osman Bilsel, and Blair J. Perot. “Creating Round Focused Micro-Jets from Rectangular Nozzles.” Journal of Mechanical Science and Technology, 2019, 4281–89. https://doi.org/10.1007/s12206-019-0824-x.","bibtex":"@article{Inguva_Graceffa_Schulz_Bilsel_Perot_2019, title={Creating round focused micro-jets from rectangular nozzles}, DOI={10.1007/s12206-019-0824-x}, journal={Journal of Mechanical Science and Technology}, author={Inguva, Venkatesh and Graceffa, Rita and Schulz, Joachim and Bilsel, Osman and Perot, Blair J.}, year={2019}, pages={4281–4289} }","mla":"Inguva, Venkatesh, et al. “Creating Round Focused Micro-Jets from Rectangular Nozzles.” Journal of Mechanical Science and Technology, 2019, pp. 4281–89, doi:10.1007/s12206-019-0824-x.","short":"V. Inguva, R. Graceffa, J. Schulz, O. Bilsel, B.J. Perot, Journal of Mechanical Science and Technology (2019) 4281–4289.","ieee":"V. Inguva, R. Graceffa, J. Schulz, O. Bilsel, and B. J. Perot, “Creating round focused micro-jets from rectangular nozzles,” Journal of Mechanical Science and Technology, pp. 4281–4289, 2019, doi: 10.1007/s12206-019-0824-x."},"type":"journal_article"},{"date_updated":"2022-01-06T06:56:08Z","_id":"24141","language":[{"iso":"eng"}],"citation":{"ieee":"J. König, S. Malberg, M. Martens, S. Niehaus, A. Krohn-Grimberghe, and A. Ramaswamy, “Multi-stage reinforcement learning for object detection,” in Science and Information Conference, 2019, pp. 178–191.","short":"J. König, S. Malberg, M. Martens, S. Niehaus, A. Krohn-Grimberghe, A. Ramaswamy, in: Science and Information Conference, 2019, pp. 178–191.","bibtex":"@inproceedings{König_Malberg_Martens_Niehaus_Krohn-Grimberghe_Ramaswamy_2019, title={Multi-stage reinforcement learning for object detection}, booktitle={Science and Information Conference}, author={König, Jonas and Malberg, Simon and Martens, Martin and Niehaus, Sebastian and Krohn-Grimberghe, Artus and Ramaswamy, Arunselvan}, year={2019}, pages={178–191} }","mla":"König, Jonas, et al. “Multi-Stage Reinforcement Learning for Object Detection.” Science and Information Conference, 2019, pp. 178–91.","ama":"König J, Malberg S, Martens M, Niehaus S, Krohn-Grimberghe A, Ramaswamy A. Multi-stage reinforcement learning for object detection. In: Science and Information Conference. ; 2019:178-191.","apa":"König, J., Malberg, S., Martens, M., Niehaus, S., Krohn-Grimberghe, A., & Ramaswamy, A. (2019). Multi-stage reinforcement learning for object detection. Science and Information Conference, 178–191.","chicago":"König, Jonas, Simon Malberg, Martin Martens, Sebastian Niehaus, Artus Krohn-Grimberghe, and Arunselvan Ramaswamy. “Multi-Stage Reinforcement Learning for Object Detection.” In Science and Information Conference, 178–91, 2019."},"type":"conference","year":"2019","page":"178-191","user_id":"66937","title":"Multi-stage reinforcement learning for object detection","author":[{"last_name":"König","full_name":"König, Jonas","first_name":"Jonas"},{"full_name":"Malberg, Simon","first_name":"Simon","last_name":"Malberg"},{"last_name":"Martens","first_name":"Martin","full_name":"Martens, Martin"},{"first_name":"Sebastian","full_name":"Niehaus, Sebastian","last_name":"Niehaus"},{"last_name":"Krohn-Grimberghe","full_name":"Krohn-Grimberghe, Artus","first_name":"Artus"},{"first_name":"Arunselvan","full_name":"Ramaswamy, Arunselvan","orcid":"https://orcid.org/ 0000-0001-7547-8111","last_name":"Ramaswamy","id":"66937"}],"publication":"Science and Information Conference","status":"public","date_created":"2021-09-10T09:50:53Z"},{"type":"journal_article","citation":{"ama":"Knoke T, Kronberg A, Glushenkov M, Kenig E. On the design of heat exchanger equipment for novel-type isobaric expansion engines. Applied Thermal Engineering. 2019;167(5):114382. doi:10.1016/j.applthermaleng.2019.114382","apa":"Knoke, T., Kronberg, A., Glushenkov, M., & Kenig, E. (2019). On the design of heat exchanger equipment for novel-type isobaric expansion engines. Applied Thermal Engineering, 167(5), 114382. https://doi.org/10.1016/j.applthermaleng.2019.114382","chicago":"Knoke, Torben, Alexander Kronberg, Maxim Glushenkov, and Eugeny Kenig. “On the Design of Heat Exchanger Equipment for Novel-Type Isobaric Expansion Engines.” Applied Thermal Engineering 167, no. 5 (2019): 114382. https://doi.org/10.1016/j.applthermaleng.2019.114382.","bibtex":"@article{Knoke_Kronberg_Glushenkov_Kenig_2019, title={On the design of heat exchanger equipment for novel-type isobaric expansion engines}, volume={167}, DOI={10.1016/j.applthermaleng.2019.114382}, number={5}, journal={Applied Thermal Engineering}, author={Knoke, Torben and Kronberg, Alexander and Glushenkov, Maxim and Kenig, Eugeny}, year={2019}, pages={114382} }","mla":"Knoke, Torben, et al. “On the Design of Heat Exchanger Equipment for Novel-Type Isobaric Expansion Engines.” Applied Thermal Engineering, vol. 167, no. 5, 2019, p. 114382, doi:10.1016/j.applthermaleng.2019.114382.","short":"T. Knoke, A. Kronberg, M. Glushenkov, E. Kenig, Applied Thermal Engineering 167 (2019) 114382.","ieee":"T. Knoke, A. Kronberg, M. Glushenkov, and E. Kenig, “On the design of heat exchanger equipment for novel-type isobaric expansion engines,” Applied Thermal Engineering, vol. 167, no. 5, p. 114382, 2019, doi: 10.1016/j.applthermaleng.2019.114382."},"year":"2019","page":"114382","language":[{"iso":"eng"}],"_id":"24272","date_updated":"2022-01-06T06:56:13Z","intvolume":" 167","doi":"10.1016/j.applthermaleng.2019.114382","issue":"5","author":[{"full_name":"Knoke, Torben","first_name":"Torben","last_name":"Knoke"},{"last_name":"Kronberg","first_name":"Alexander","full_name":"Kronberg, Alexander"},{"last_name":"Glushenkov","full_name":"Glushenkov, Maxim","first_name":"Maxim"},{"first_name":"Eugeny","full_name":"Kenig, Eugeny","last_name":"Kenig","id":"665"}],"publication":"Applied Thermal Engineering","department":[{"_id":"9"},{"_id":"145"}],"publication_identifier":{"issn":["1359-4311"]},"volume":167,"publication_status":"published","status":"public","date_created":"2021-09-13T12:00:44Z","title":"On the design of heat exchanger equipment for novel-type isobaric expansion engines","user_id":"22006"},{"place":"Chemnitz","title":"Untersuchung des Dosierverhaltens von Carbonfaserrezyklaten für den Einsatz im gleichläufigen Doppel-schneckenextruder","user_id":"30479","publication":"27. Fachtagung Technomer","department":[{"_id":"9"},{"_id":"367"},{"_id":"321"}],"author":[{"first_name":"Hatice","full_name":"Malatyali, Hatice","last_name":"Malatyali","id":"30479"},{"full_name":"Schöppner, Volker","first_name":"Volker","last_name":"Schöppner"}],"date_created":"2021-09-14T07:40:22Z","status":"public","_id":"24319","date_updated":"2022-01-06T06:56:17Z","year":"2019","type":"conference","citation":{"mla":"Malatyali, Hatice, and Volker Schöppner. “Untersuchung Des Dosierverhaltens von Carbonfaserrezyklaten Für Den Einsatz Im Gleichläufigen Doppel-Schneckenextruder.” 27. Fachtagung Technomer, 2019.","bibtex":"@inproceedings{Malatyali_Schöppner_2019, place={Chemnitz}, title={Untersuchung des Dosierverhaltens von Carbonfaserrezyklaten für den Einsatz im gleichläufigen Doppel-schneckenextruder}, booktitle={27. Fachtagung Technomer}, author={Malatyali, Hatice and Schöppner, Volker}, year={2019} }","chicago":"Malatyali, Hatice, and Volker Schöppner. “Untersuchung Des Dosierverhaltens von Carbonfaserrezyklaten Für Den Einsatz Im Gleichläufigen Doppel-Schneckenextruder.” In 27. Fachtagung Technomer. Chemnitz, 2019.","apa":"Malatyali, H., & Schöppner, V. (2019). Untersuchung des Dosierverhaltens von Carbonfaserrezyklaten für den Einsatz im gleichläufigen Doppel-schneckenextruder. 27. Fachtagung Technomer.","ama":"Malatyali H, Schöppner V. Untersuchung des Dosierverhaltens von Carbonfaserrezyklaten für den Einsatz im gleichläufigen Doppel-schneckenextruder. In: 27. Fachtagung Technomer. ; 2019.","ieee":"H. Malatyali and V. Schöppner, “Untersuchung des Dosierverhaltens von Carbonfaserrezyklaten für den Einsatz im gleichläufigen Doppel-schneckenextruder,” 2019.","short":"H. Malatyali, V. Schöppner, in: 27. Fachtagung Technomer, Chemnitz, 2019."},"language":[{"iso":"eng"}]},{"_id":"24322","date_updated":"2022-01-06T06:56:17Z","type":"conference","citation":{"ieee":"H. Malatyali, V. Schöppner, W. Tillmann, and D. Kokalj, “Deveploment of thin film sensors: The influence of layer variation on the measurement quality for inline melt temperature measurements,” 2019.","short":"H. Malatyali, V. Schöppner, W. Tillmann, D. Kokalj, in: SPE ANTEC, 2019.","mla":"Malatyali, Hatice, et al. “Deveploment of Thin Film Sensors: The Influence of Layer Variation on the Measurement Quality for Inline Melt Temperature Measurements.” SPE ANTEC, 2019.","bibtex":"@inproceedings{Malatyali_Schöppner_Tillmann_Kokalj_2019, title={Deveploment of thin film sensors: The influence of layer variation on the measurement quality for inline melt temperature measurements}, booktitle={SPE ANTEC}, author={Malatyali, Hatice and Schöppner, Volker and Tillmann, Wolfgang and Kokalj, David}, year={2019} }","chicago":"Malatyali, Hatice, Volker Schöppner, Wolfgang Tillmann, and David Kokalj. “Deveploment of Thin Film Sensors: The Influence of Layer Variation on the Measurement Quality for Inline Melt Temperature Measurements.” In SPE ANTEC, 2019.","apa":"Malatyali, H., Schöppner, V., Tillmann, W., & Kokalj, D. (2019). Deveploment of thin film sensors: The influence of layer variation on the measurement quality for inline melt temperature measurements. SPE ANTEC.","ama":"Malatyali H, Schöppner V, Tillmann W, Kokalj D. Deveploment of thin film sensors: The influence of layer variation on the measurement quality for inline melt temperature measurements. In: SPE ANTEC. ; 2019."},"year":"2019","language":[{"iso":"eng"}],"title":"Deveploment of thin film sensors: The influence of layer variation on the measurement quality for inline melt temperature measurements","user_id":"30479","publication":"SPE ANTEC","author":[{"id":"30479","last_name":"Malatyali","full_name":"Malatyali, Hatice","first_name":"Hatice"},{"first_name":"Volker","full_name":"Schöppner, Volker","last_name":"Schöppner"},{"full_name":"Tillmann, Wolfgang","first_name":"Wolfgang","last_name":"Tillmann"},{"last_name":"Kokalj","first_name":"David","full_name":"Kokalj, David"}],"date_created":"2021-09-14T07:44:42Z","status":"public"},{"title":"Vibration welding of components with angled areas in the direction of vibration","user_id":"32492","place":"Bratislava","date_created":"2021-09-14T07:50:55Z","status":"public","department":[{"_id":"9"},{"_id":"367"},{"_id":"321"}],"author":[{"full_name":"Vogtschmidt, Sascha","first_name":"Sascha","id":"32492","last_name":"Vogtschmidt"},{"full_name":"Schöppner, Volker","first_name":"Volker","id":"20530","last_name":"Schöppner"}],"conference":{"name":"72nd Assembly of the International Institute of Welding (IIW)","location":"Bratislava"},"date_updated":"2022-01-06T06:56:17Z","_id":"24326","citation":{"mla":"Vogtschmidt, Sascha, and Volker Schöppner. Vibration Welding of Components with Angled Areas in the Direction of Vibration. 2019.","bibtex":"@inproceedings{Vogtschmidt_Schöppner_2019, place={Bratislava}, title={Vibration welding of components with angled areas in the direction of vibration}, author={Vogtschmidt, Sascha and Schöppner, Volker}, year={2019} }","chicago":"Vogtschmidt, Sascha, and Volker Schöppner. “Vibration Welding of Components with Angled Areas in the Direction of Vibration.” Bratislava, 2019.","ama":"Vogtschmidt S, Schöppner V. Vibration welding of components with angled areas in the direction of vibration. In: ; 2019.","apa":"Vogtschmidt, S., & Schöppner, V. (2019). Vibration welding of components with angled areas in the direction of vibration. 72nd Assembly of the International Institute of Welding (IIW), Bratislava.","ieee":"S. Vogtschmidt and V. Schöppner, “Vibration welding of components with angled areas in the direction of vibration,” presented at the 72nd Assembly of the International Institute of Welding (IIW), Bratislava, 2019.","short":"S. Vogtschmidt, V. Schöppner, in: Bratislava, 2019."},"type":"conference","year":"2019","language":[{"iso":"eng"}]},{"publisher":"ILASS (European Conference on Liquid Atomization and Spray Systems)","author":[{"first_name":"M.","full_name":"Bieber, M.","last_name":"Bieber"},{"first_name":"R.","full_name":"Tischendorf, R.","last_name":"Tischendorf"},{"last_name":"Reddemann","first_name":"M.","full_name":"Reddemann, M."},{"last_name":"Schmid","full_name":"Schmid, H.-J.","first_name":"H.-J."},{"full_name":"Kneer, R.","first_name":"R.","last_name":"Kneer"}],"keyword":["FSP","nanoparticle synthesis","in situ measurements"],"file_date_updated":"2021-09-28T08:39:12Z","file":[{"date_created":"2021-09-28T08:39:12Z","file_name":"Influence of precursor concentration on spray and particle.pdf","access_level":"closed","file_id":"25056","creator":"ricardo","file_size":2807339,"relation":"main_file","success":1,"content_type":"application/pdf","date_updated":"2021-09-28T08:39:12Z"}],"publication_status":"published","has_accepted_license":"1","status":"public","date_created":"2021-09-15T10:26:54Z","abstract":[{"text":"Liquid atomization is expected to be a key process in Flame Spray Pyrolysis, as it determines the primary droplet size and velocity distribution, which represent initial conditions for flame shape and temperature field. A well-defined manipulation of atomization may be achieved by variation of nozzle geometry, injection parameter or fluid properties. However, change of fluid properties, e.g. varying solvents or increasing the precursor concentration, also influences the final particle properties. In this work, the influence of precursor concentration on fluid properties, spray and particle formation in Flame Spray Pyrolysis is experimentally investigated. High-speed shadowgraphy and Phase-Doppler measurements are conducted in a semi-closed combustion chamber with a well-defined burner geometry (SpraySyn burner) that is based on a coaxial atomization principle. By adding precursor to the flammable solvent, resulting spray characteristics, flame shape and appearance are changed in color, shape and mean droplet size distribution. Compared to resulting mean droplet sizes of pure solvent mixtures (D32, 22 μm), mean droplet sizes in the center of the precursor flame at 30 mm above the burner are generally smaller (D32, 18 μm). Persisting high share of small droplets in the droplet size distribution are presented, that presumably origin from an accumulation of metal organic precursor at the droplet surface during combustion, that acts as a diffusive barrier for high volatility solvent and thus reduces droplet evaporation. Sufficiently high above the nozzle exit, increasing the precursor concentration does not affect the radial distribution of mean droplet sizes but leads to increased mean particle sizes. More precursor presumably leads to higher concentrations of prime particles in the flame, thus probability of particle collusion and agglomeration. High-speed imaging at nozzle exit revealed random fluctuations of initial jet diameter, paired with jet axis shifting around 1000 Hz. These superposed fluctuations determine the initial conditions for atomization, induce pulsations in the flame and thus initiate the entire chain of the particle synthesis process.","lang":"eng"}],"ddc":["620"],"title":"Influence of precursor concentration on spray and particle formation in flame spray pyrolysis","user_id":"67002","type":"conference","year":"2019","citation":{"chicago":"Bieber, M., R. Tischendorf, M. Reddemann, H.-J. Schmid, and R. Kneer. “Influence of Precursor Concentration on Spray and Particle Formation in Flame Spray Pyrolysis.” ILASS (European Conference on Liquid Atomization and Spray Systems), 2019.","apa":"Bieber, M., Tischendorf, R., Reddemann, M., Schmid, H.-J., & Kneer, R. (2019). Influence of precursor concentration on spray and particle formation in flame spray pyrolysis. ILASS (European Conference on Liquid Atomization and Spray Systems), Paris.","ama":"Bieber M, Tischendorf R, Reddemann M, Schmid H-J, Kneer R. Influence of precursor concentration on spray and particle formation in flame spray pyrolysis. In: ILASS (European Conference on Liquid Atomization and Spray Systems); 2019.","mla":"Bieber, M., et al. Influence of Precursor Concentration on Spray and Particle Formation in Flame Spray Pyrolysis. ILASS (European Conference on Liquid Atomization and Spray Systems), 2019.","bibtex":"@inproceedings{Bieber_Tischendorf_Reddemann_Schmid_Kneer_2019, title={Influence of precursor concentration on spray and particle formation in flame spray pyrolysis}, publisher={ILASS (European Conference on Liquid Atomization and Spray Systems)}, author={Bieber, M. and Tischendorf, R. and Reddemann, M. and Schmid, H.-J. and Kneer, R.}, year={2019} }","short":"M. Bieber, R. Tischendorf, M. Reddemann, H.-J. Schmid, R. Kneer, in: ILASS (European Conference on Liquid Atomization and Spray Systems), 2019.","ieee":"M. Bieber, R. Tischendorf, M. Reddemann, H.-J. Schmid, and R. Kneer, “Influence of precursor concentration on spray and particle formation in flame spray pyrolysis,” presented at the ILASS (European Conference on Liquid Atomization and Spray Systems), Paris, 2019."},"language":[{"iso":"eng"}],"_id":"24502","date_updated":"2022-01-06T06:56:26Z","conference":{"location":"Paris","name":"ILASS (European Conference on Liquid Atomization and Spray Systems)","start_date":"2019-09-02","end_date":"2019-09-04"}},{"place":"Frankfurt","user_id":"29240","title":"FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen","department":[{"_id":"150"},{"_id":"219"},{"_id":"624"}],"author":[{"full_name":"Menge, Dennis","first_name":"Dennis","id":"29240","last_name":"Menge"},{"last_name":"Walter","first_name":"Rolf","full_name":"Walter, Rolf"},{"first_name":"Hans-Joachim","full_name":"Schmid, Hans-Joachim","last_name":"Schmid","id":"464"},{"first_name":"Ulf Paul","full_name":"Breuer, Ulf Paul","last_name":"Breuer"}],"date_created":"2021-09-17T09:31:20Z","status":"public","volume":1338,"_id":"24628","date_updated":"2022-01-06T06:56:31Z","intvolume":" 1338","series_title":"FVA-Heft","language":[{"iso":"ger"}],"page":"77","citation":{"mla":"Menge, Dennis, et al. FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen. 2019.","bibtex":"@book{Menge_Walter_Schmid_Breuer_2019, place={Frankfurt}, series={FVA-Heft}, title={FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen}, volume={1338}, author={Menge, Dennis and Walter, Rolf and Schmid, Hans-Joachim and Breuer, Ulf Paul}, year={2019}, collection={FVA-Heft} }","apa":"Menge, D., Walter, R., Schmid, H.-J., & Breuer, U. P. (2019). FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen (Vol. 1338).","ama":"Menge D, Walter R, Schmid H-J, Breuer UP. FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen. Vol 1338.; 2019.","chicago":"Menge, Dennis, Rolf Walter, Hans-Joachim Schmid, and Ulf Paul Breuer. FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen. Vol. 1338. FVA-Heft. Frankfurt, 2019.","ieee":"D. Menge, R. Walter, H.-J. Schmid, and U. P. Breuer, FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen, vol. 1338. Frankfurt, 2019.","short":"D. Menge, R. Walter, H.-J. Schmid, U.P. Breuer, FVA-Nr. 813 I - Generative Verfahren zur Herstellung von Polymerbauteilen, Frankfurt, 2019."},"type":"report","year":"2019"},{"doi":"10.3390/en12101926","article_number":"1926","date_updated":"2022-01-06T06:56:31Z","_id":"24632","language":[{"iso":"eng"}],"type":"journal_article","citation":{"ieee":"R.-H. Peesel, F. Schlosser, H. Meschede, H. Dunkelberg, and T. Walmsley, “Optimization of Cooling Utility System with Continuous Self-Learning Performance Models,” Energies, Art. no. 1926, 2019, doi: 10.3390/en12101926.","short":"R.-H. Peesel, F. Schlosser, H. Meschede, H. Dunkelberg, T. Walmsley, Energies (2019).","mla":"Peesel, Ron-Hendrik, et al. “Optimization of Cooling Utility System with Continuous Self-Learning Performance Models.” Energies, 1926, 2019, doi:10.3390/en12101926.","bibtex":"@article{Peesel_Schlosser_Meschede_Dunkelberg_Walmsley_2019, title={Optimization of Cooling Utility System with Continuous Self-Learning Performance Models}, DOI={10.3390/en12101926}, number={1926}, journal={Energies}, author={Peesel, Ron-Hendrik and Schlosser, Florian and Meschede, Henning and Dunkelberg, Heiko and Walmsley, Timothy}, year={2019} }","chicago":"Peesel, Ron-Hendrik, Florian Schlosser, Henning Meschede, Heiko Dunkelberg, and Timothy Walmsley. “Optimization of Cooling Utility System with Continuous Self-Learning Performance Models.” Energies, 2019. https://doi.org/10.3390/en12101926.","apa":"Peesel, R.-H., Schlosser, F., Meschede, H., Dunkelberg, H., & Walmsley, T. (2019). Optimization of Cooling Utility System with Continuous Self-Learning Performance Models. Energies, Article 1926. https://doi.org/10.3390/en12101926","ama":"Peesel R-H, Schlosser F, Meschede H, Dunkelberg H, Walmsley T. Optimization of Cooling Utility System with Continuous Self-Learning Performance Models. Energies. Published online 2019. doi:10.3390/en12101926"},"year":"2019","user_id":"88614","title":"Optimization of Cooling Utility System with Continuous Self-Learning Performance Models","abstract":[{"lang":"eng","text":"Prerequisite for an efficient cooling energy system is the knowledge and optimal combination of different operating conditions of individual compression and free cooling chillers. The performance of cooling systems depends on their part-load performance and their condensing temperature, which are often not continuously measured. Recorded energy data remain unused, and manufacturers’ data differ from the real performance. For this purpose, manufacturer and real data are combined and continuously adapted to form part-load chiller models. This study applied a predictive optimization algorithm to calculate the optimal operating conditions of multiple chillers. A sprinkler tank offers the opportunity to store cold-water for later utilization. This potential is used to show the load shifting potential of the cooling system by using a variable electricity price as an input variable to the optimization. The set points from the optimization have been continuously adjusted throughout a dynamic simulation. A case study of a plastic processing company evaluates different scenarios against the status quo. Applying an optimal chiller sequencing and charging strategy of a sprinkler tank leads to electrical energy savings of up to 43%. Purchasing electricity on the EPEX SPOT market leads to additional costs savings of up to 17%. The total energy savings highly depend on the weather conditions and the prediction horizon."}],"extern":"1","date_created":"2021-09-17T09:35:31Z","status":"public","publication_identifier":{"issn":["1996-1073"]},"publication_status":"published","publication":"Energies","author":[{"full_name":"Peesel, Ron-Hendrik","first_name":"Ron-Hendrik","last_name":"Peesel"},{"last_name":"Schlosser","first_name":"Florian","full_name":"Schlosser, Florian"},{"last_name":"Meschede","first_name":"Henning","full_name":"Meschede, Henning"},{"last_name":"Dunkelberg","full_name":"Dunkelberg, Heiko","first_name":"Heiko"},{"last_name":"Walmsley","full_name":"Walmsley, Timothy","first_name":"Timothy"}]},{"author":[{"id":"88614","last_name":"Schlosser","full_name":"Schlosser, Florian","first_name":"Florian"},{"last_name":"Seevers","first_name":"Jan-Peter","full_name":"Seevers, Jan-Peter"},{"last_name":"Peesel","first_name":"Ron-Hendrik","full_name":"Peesel, Ron-Hendrik"},{"first_name":"Timothy Gordon","full_name":"Walmsley, Timothy Gordon","last_name":"Walmsley"}],"publication":"Energy","status":"public","date_created":"2021-09-17T09:37:21Z","publication_identifier":{"issn":["0360-5442"]},"publication_status":"published","extern":"1","user_id":"88614","title":"System efficient integration of standby control and heat pump storage systems in manufacturing processes","language":[{"iso":"eng"}],"type":"journal_article","year":"2019","citation":{"apa":"Schlosser, F., Seevers, J.-P., Peesel, R.-H., & Walmsley, T. G. (2019). System efficient integration of standby control and heat pump storage systems in manufacturing processes. Energy, 395–406. https://doi.org/10.1016/j.energy.2019.05.113","ama":"Schlosser F, Seevers J-P, Peesel R-H, Walmsley TG. System efficient integration of standby control and heat pump storage systems in manufacturing processes. Energy. Published online 2019:395-406. doi:10.1016/j.energy.2019.05.113","chicago":"Schlosser, Florian, Jan-Peter Seevers, Ron-Hendrik Peesel, and Timothy Gordon Walmsley. “System Efficient Integration of Standby Control and Heat Pump Storage Systems in Manufacturing Processes.” Energy, 2019, 395–406. https://doi.org/10.1016/j.energy.2019.05.113.","bibtex":"@article{Schlosser_Seevers_Peesel_Walmsley_2019, title={System efficient integration of standby control and heat pump storage systems in manufacturing processes}, DOI={10.1016/j.energy.2019.05.113}, journal={Energy}, author={Schlosser, Florian and Seevers, Jan-Peter and Peesel, Ron-Hendrik and Walmsley, Timothy Gordon}, year={2019}, pages={395–406} }","mla":"Schlosser, Florian, et al. “System Efficient Integration of Standby Control and Heat Pump Storage Systems in Manufacturing Processes.” Energy, 2019, pp. 395–406, doi:10.1016/j.energy.2019.05.113.","short":"F. Schlosser, J.-P. Seevers, R.-H. Peesel, T.G. Walmsley, Energy (2019) 395–406.","ieee":"F. Schlosser, J.-P. Seevers, R.-H. Peesel, and T. G. Walmsley, “System efficient integration of standby control and heat pump storage systems in manufacturing processes,” Energy, pp. 395–406, 2019, doi: 10.1016/j.energy.2019.05.113."},"page":"395-406","_id":"24633","date_updated":"2022-01-06T06:56:31Z","doi":"10.1016/j.energy.2019.05.113"},{"abstract":[{"text":"For increased total site heat integration, the optimal sizing and robust operation of a heat recovery loop (HRL) are prerequisites for economic efficiency. However, sizing based on one representative time series, not considering the variability of process streams due to their discontinuous operation, often leads to oversizing. The sensitive evaluation of the performance of an HRL by Monte Carlo (MC) simulation requires sufficient historical data and performance models. Stochastic time series are generated by distribution functions of measured data. With these inputs, one can then model and reliably assess the benefits of installing a new HRL. A key element of the HRL is a stratified heat storage tank. Validation tests of a stratified tank (ST) showed sufficient accuracy with acceptable simulation time for the variable layer height (VLH) multi-node (MN) modelling approach. The results of the MC simulation of the HRL system show only minor yield losses in terms of heat recovery rate (HRR) for smaller tanks. 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Yadegari, in: 77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC), Detroit (USA), 2019.","bibtex":"@inproceedings{Schöppner_Bayazian_Yadegari_2019, place={Detroit (USA)}, title={Morphology Development in LLDPE Stretch Films Prepared with Different Cast Film Process Parameters}, booktitle={77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC)}, author={Schöppner, Volker and Bayazian, H. and Yadegari, Ali }, year={2019} }","mla":"Schöppner, Volker, et al. “Morphology Development in LLDPE Stretch Films Prepared with Different Cast Film Process Parameters.” 77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC), 2019.","apa":"Schöppner, V., Bayazian, H., & Yadegari, A. (2019). Morphology Development in LLDPE Stretch Films Prepared with Different Cast Film Process Parameters. 77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC). 77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC), Detroit (USA).","ama":"Schöppner V, Bayazian H, Yadegari A. Morphology Development in LLDPE Stretch Films Prepared with Different Cast Film Process Parameters. In: 77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC). ; 2019.","chicago":"Schöppner, Volker, H. Bayazian, and Ali Yadegari. “Morphology Development in LLDPE Stretch Films Prepared with Different Cast Film Process Parameters.” In 77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC). Detroit (USA), 2019."},"type":"conference","language":[{"iso":"eng"}],"_id":"25736","date_updated":"2022-01-06T06:57:12Z","conference":{"name":"77th Annual Technical Conference of the Society of Plastics Engineers (ANTEC)","location":"Detroit (USA)"}}]