[{"citation":{"chicago":"Gerick, Julia, Birgit Eickelmann, Gesa Ramm, and Jennifer Akue-Dovi. “Wissenschaftliche Begleitung des Projekts ‚Lernen mit digitalen Medien‘ und Evaluationsergebnisse aus Projektphase II.” In <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>, 170:13–32. Berlin: Cornelsen Verlag, 2019.","short":"J. Gerick, B. Eickelmann, G. Ramm, J. Akue-Dovi, in: Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch, Cornelsen Verlag, Berlin, 2019, pp. 13–32.","ieee":"J. Gerick, B. Eickelmann, G. Ramm, and J. Akue-Dovi, “Wissenschaftliche Begleitung des Projekts ‚Lernen mit digitalen Medien‘ und Evaluationsergebnisse aus Projektphase II,” in <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>, vol. 170, Berlin: Cornelsen Verlag, 2019, pp. 13–32.","apa":"Gerick, J., Eickelmann, B., Ramm, G., &#38; Akue-Dovi, J. (2019). Wissenschaftliche Begleitung des Projekts ‚Lernen mit digitalen Medien‘ und Evaluationsergebnisse aus Projektphase II. In <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i> (Vol. 170, pp. 13–32). Cornelsen Verlag.","bibtex":"@inbook{Gerick_Eickelmann_Ramm_Akue-Dovi_2019, place={Berlin}, title={Wissenschaftliche Begleitung des Projekts ‚Lernen mit digitalen Medien‘ und Evaluationsergebnisse aus Projektphase II}, volume={170}, booktitle={Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch}, publisher={Cornelsen Verlag}, author={Gerick, Julia and Eickelmann, Birgit and Ramm, Gesa and Akue-Dovi, Jennifer}, year={2019}, pages={13–32} }","ama":"Gerick J, Eickelmann B, Ramm G, Akue-Dovi J. Wissenschaftliche Begleitung des Projekts ‚Lernen mit digitalen Medien‘ und Evaluationsergebnisse aus Projektphase II. In: <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>. Vol 170. Cornelsen Verlag; 2019:13-32.","mla":"Gerick, Julia, et al. “Wissenschaftliche Begleitung des Projekts ‚Lernen mit digitalen Medien‘ und Evaluationsergebnisse aus Projektphase II.” <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>, vol. 170, Cornelsen Verlag, 2019, pp. 13–32."},"publication":"Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch","date_created":"2021-12-13T16:22:31Z","place":"Berlin","department":[{"_id":"462"}],"type":"book_chapter","author":[{"last_name":"Gerick","first_name":"Julia","full_name":"Gerick, Julia"},{"id":"40387","full_name":"Eickelmann, Birgit","last_name":"Eickelmann","first_name":"Birgit"},{"full_name":"Ramm, Gesa","first_name":"Gesa","last_name":"Ramm"},{"first_name":"Jennifer","last_name":"Akue-Dovi","full_name":"Akue-Dovi, Jennifer"}],"status":"public","title":"Wissenschaftliche Begleitung des Projekts ‚Lernen mit digitalen Medien‘ und Evaluationsergebnisse aus Projektphase II","year":"2019","intvolume":"       170","date_updated":"2022-01-06T06:58:20Z","_id":"28753","language":[{"iso":"ger"}],"publisher":"Cornelsen Verlag","page":"13-32","volume":170,"user_id":"50923"},{"department":[{"_id":"462"}],"type":"book_chapter","date_created":"2021-12-13T16:24:47Z","place":"Berlin","citation":{"bibtex":"@inbook{Ramm_Gerick_Eickelmann_2019, place={Berlin}, title={Das Projekt ‚Lernen mit digitalen Medien‘}, volume={170}, booktitle={Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch}, publisher={Cornelsen Verlag}, author={Ramm, Gesa and Gerick, Julia and Eickelmann, Birgit}, editor={Gerick, Julia and Ramm, Gesa and Eickelmann, Birgit}, year={2019}, pages={6–17} }","short":"G. Ramm, J. Gerick, B. Eickelmann, in: J. Gerick, G. Ramm, B. Eickelmann (Eds.), Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch, Cornelsen Verlag, Berlin, 2019, pp. 6–17.","ama":"Ramm G, Gerick J, Eickelmann B. Das Projekt ‚Lernen mit digitalen Medien‘. In: Gerick J, Ramm G, Eickelmann B, eds. <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>. Vol 170. Cornelsen Verlag; 2019:6-17.","chicago":"Ramm, Gesa, Julia Gerick, and Birgit Eickelmann. “Das Projekt ‚Lernen mit digitalen Medien‘.” In <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>, edited by Julia Gerick, Gesa Ramm, and Birgit Eickelmann, 170:6–17. Berlin: Cornelsen Verlag, 2019.","ieee":"G. Ramm, J. Gerick, and B. Eickelmann, “Das Projekt ‚Lernen mit digitalen Medien‘,” in <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>, vol. 170, J. Gerick, G. Ramm, and B. Eickelmann, Eds. Berlin: Cornelsen Verlag, 2019, pp. 6–17.","apa":"Ramm, G., Gerick, J., &#38; Eickelmann, B. (2019). Das Projekt ‚Lernen mit digitalen Medien‘. In J. Gerick, G. Ramm, &#38; B. Eickelmann (Eds.), <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i> (Vol. 170, pp. 6–17). Cornelsen Verlag.","mla":"Ramm, Gesa, et al. “Das Projekt ‚Lernen mit digitalen Medien‘.” <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>, edited by Julia Gerick et al., vol. 170, Cornelsen Verlag, 2019, pp. 6–17."},"publication":"Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch","volume":170,"editor":[{"last_name":"Gerick","first_name":"Julia","full_name":"Gerick, Julia"},{"first_name":"Gesa","last_name":"Ramm","full_name":"Ramm, Gesa"},{"full_name":"Eickelmann, Birgit","first_name":"Birgit","last_name":"Eickelmann"}],"user_id":"50923","_id":"28754","publisher":"Cornelsen Verlag","language":[{"iso":"ger"}],"page":"6-17","intvolume":"       170","date_updated":"2022-01-06T06:58:20Z","author":[{"full_name":"Ramm, Gesa","first_name":"Gesa","last_name":"Ramm"},{"last_name":"Gerick","first_name":"Julia","full_name":"Gerick, Julia"},{"id":"40387","last_name":"Eickelmann","first_name":"Birgit","full_name":"Eickelmann, Birgit"}],"title":"Das Projekt ‚Lernen mit digitalen Medien‘","status":"public","year":"2019"},{"title":"Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch","year":"2019","status":"public","date_updated":"2022-01-06T06:58:20Z","intvolume":"       170","_id":"28755","publisher":"Cornelsen Verlag","language":[{"iso":"ger"}],"user_id":"50923","volume":170,"editor":[{"first_name":"Julia","last_name":"Gerick","full_name":"Gerick, Julia"},{"first_name":"Gesa","last_name":"Ramm","full_name":"Ramm, Gesa"},{"id":"40387","full_name":"Eickelmann, Birgit","first_name":"Birgit","last_name":"Eickelmann"}],"citation":{"bibtex":"@book{Gerick_Ramm_Eickelmann_2019, place={Berlin}, title={Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch}, volume={170}, publisher={Cornelsen Verlag}, year={2019} }","short":"J. Gerick, G. Ramm, B. Eickelmann, eds., Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch, Cornelsen Verlag, Berlin, 2019.","ama":"Gerick J, Ramm G, Eickelmann B, eds. <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>. Vol 170. Cornelsen Verlag; 2019.","chicago":"Gerick, Julia, Gesa Ramm, and Birgit Eickelmann, eds. <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>. Vol. 170. Berlin: Cornelsen Verlag, 2019.","ieee":"J. Gerick, G. Ramm, and B. Eickelmann, Eds., <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>, vol. 170. Berlin: Cornelsen Verlag, 2019.","mla":"Gerick, Julia, et al., editors. <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i>. Cornelsen Verlag, 2019.","apa":"Gerick, J., Ramm, G., &#38; Eickelmann, B. (Eds.). (2019). <i>Praxis des digitalen Lehrens und Lernens. Befunde und Erfahrungen. Schulmanagement-Handbuch</i> (Vol. 170). Cornelsen Verlag."},"date_created":"2021-12-13T16:26:11Z","place":"Berlin","type":"book_editor","department":[{"_id":"462"}]},{"editor":[{"last_name":"Knauder","first_name":"Hannelore","full_name":"Knauder, Hannelore"},{"full_name":"Reisinger, Christa-Monika","first_name":"Christa-Monika","last_name":"Reisinger"}],"user_id":"50923","language":[{"iso":"ger"}],"_id":"28756","publisher":"Waxmann","page":"143-156","date_updated":"2022-01-06T06:58:20Z","author":[{"full_name":"Drossel, Kerstin","last_name":"Drossel","first_name":"Kerstin","id":"48921"},{"first_name":"Birgit","last_name":"Eickelmann","full_name":"Eickelmann, Birgit","id":"40387"}],"year":"2019","title":"Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven","status":"public","department":[{"_id":"462"}],"type":"book_chapter","place":"Münster","date_created":"2021-12-13T16:29:22Z","citation":{"bibtex":"@inbook{Drossel_Eickelmann_2019, place={Münster}, title={Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven}, booktitle={Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis}, publisher={Waxmann}, author={Drossel, Kerstin and Eickelmann, Birgit}, editor={Knauder, Hannelore and Reisinger, Christa-Monika}, year={2019}, pages={143–156} }","ama":"Drossel K, Eickelmann B. Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven. In: Knauder H, Reisinger C-M, eds. <i>Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis</i>. Waxmann; 2019:143-156.","mla":"Drossel, Kerstin, and Birgit Eickelmann. “Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven.” <i>Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis</i>, edited by Hannelore Knauder and Christa-Monika Reisinger, Waxmann, 2019, pp. 143–56.","chicago":"Drossel, Kerstin, and Birgit Eickelmann. “Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven.” In <i>Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis</i>, edited by Hannelore Knauder and Christa-Monika Reisinger, 143–56. Münster: Waxmann, 2019.","short":"K. Drossel, B. Eickelmann, in: H. Knauder, C.-M. Reisinger (Eds.), Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis, Waxmann, Münster, 2019, pp. 143–156.","ieee":"K. Drossel and B. Eickelmann, “Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven,” in <i>Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis</i>, H. Knauder and C.-M. Reisinger, Eds. Münster: Waxmann, 2019, pp. 143–156.","apa":"Drossel, K., &#38; Eickelmann, B. (2019). Potenziale der Tabletnutzung im Unterricht zur individuellen Förderung – Analysen und Forschungsperspektiven. In H. Knauder &#38; C.-M. Reisinger (Eds.), <i>Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis</i> (pp. 143–156). Waxmann."},"publication":"Individuelle Förderung im Unterricht. Empirische Befunde und Hinweise für die Praxis"},{"citation":{"bibtex":"@inbook{Eickelmann_2019, place={Singapore}, title={Measuring secondary school students’ competence in computational thinking in ICILS 2018 – challenges, concepts, and potential implications for school systems around the world}, booktitle={Computational Thinking Education}, publisher={Springer}, author={Eickelmann, Birgit}, editor={Kong, Siu-Cheun and Abelson, Harold}, year={2019}, pages={53–64} }","chicago":"Eickelmann, Birgit. “Measuring Secondary School Students’ Competence in Computational Thinking in ICILS 2018 – Challenges, Concepts, and Potential Implications for School Systems around the World.” In <i>Computational Thinking Education</i>, edited by Siu-Cheun Kong and Harold Abelson, 53–64. Singapore: Springer, 2019.","short":"B. Eickelmann, in: S.-C. Kong, H. Abelson (Eds.), Computational Thinking Education, Springer, Singapore, 2019, pp. 53–64.","ama":"Eickelmann B. Measuring secondary school students’ competence in computational thinking in ICILS 2018 – challenges, concepts, and potential implications for school systems around the world. In: Kong S-C, Abelson H, eds. <i>Computational Thinking Education</i>. Springer; 2019:53-64.","ieee":"B. Eickelmann, “Measuring secondary school students’ competence in computational thinking in ICILS 2018 – challenges, concepts, and potential implications for school systems around the world,” in <i>Computational Thinking Education</i>, S.-C. Kong and H. Abelson, Eds. Singapore: Springer, 2019, pp. 53–64.","apa":"Eickelmann, B. (2019). Measuring secondary school students’ competence in computational thinking in ICILS 2018 – challenges, concepts, and potential implications for school systems around the world. In S.-C. Kong &#38; H. Abelson (Eds.), <i>Computational Thinking Education</i> (pp. 53–64). Springer.","mla":"Eickelmann, Birgit. “Measuring Secondary School Students’ Competence in Computational Thinking in ICILS 2018 – Challenges, Concepts, and Potential Implications for School Systems around the World.” <i>Computational Thinking Education</i>, edited by Siu-Cheun Kong and Harold Abelson, Springer, 2019, pp. 53–64."},"publication":"Computational Thinking Education","department":[{"_id":"462"}],"type":"book_chapter","place":"Singapore","date_created":"2021-12-13T16:33:31Z","date_updated":"2022-01-06T06:58:20Z","author":[{"id":"40387","full_name":"Eickelmann, Birgit","last_name":"Eickelmann","first_name":"Birgit"}],"status":"public","title":"Measuring secondary school students’ competence in computational thinking in ICILS 2018 – challenges, concepts, and potential implications for school systems around the world","year":"2019","editor":[{"full_name":"Kong, Siu-Cheun","last_name":"Kong","first_name":"Siu-Cheun"},{"last_name":"Abelson","first_name":"Harold","full_name":"Abelson, Harold"}],"user_id":"50923","publisher":"Springer","_id":"28759","language":[{"iso":"eng"}],"page":"53-64"},{"date_updated":"2022-01-06T06:58:20Z","author":[{"full_name":"Voogt, Joke","last_name":"Voogt","first_name":"Joke"},{"full_name":"Knezek, Geral","first_name":"Geral","last_name":"Knezek"},{"last_name":"Christensen","first_name":"Rhonda","full_name":"Christensen, Rhonda"},{"first_name":"Jo","last_name":"Tondeur","full_name":"Tondeur, Jo"},{"first_name":"Dirk","last_name":"Ifenthaler","full_name":"Ifenthaler, Dirk"},{"last_name":"Eickelmann","first_name":"Birgit","full_name":"Eickelmann, Birgit","id":"40387"}],"corporate_editor":["Association for the Advancement of Computing in Education (AACE)"],"title":"Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View","status":"public","year":"2019","user_id":"50923","language":[{"iso":"eng"}],"_id":"28760","page":"918-920","citation":{"apa":"Voogt, J., Knezek, G., Christensen, R., Tondeur, J., Ifenthaler, D., &#38; Eickelmann, B. (2019). Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View. In Association for the Advancement of Computing in Education (AACE) (Ed.), <i>Proceedings of EdMedia + Innovate Learning 2019</i> (pp. 918–920).","ieee":"J. Voogt, G. Knezek, R. Christensen, J. Tondeur, D. Ifenthaler, and B. Eickelmann, “Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View,” in <i>Proceedings of EdMedia + Innovate Learning 2019</i>, 2019, pp. 918–920.","chicago":"Voogt, Joke, Geral Knezek, Rhonda Christensen, Jo Tondeur, Dirk Ifenthaler, and Birgit Eickelmann. “Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View.” In <i>Proceedings of EdMedia + Innovate Learning 2019</i>, edited by Association for the Advancement of Computing in Education (AACE), 918–20. Waynesville, NC, 2019.","short":"J. Voogt, G. Knezek, R. Christensen, J. Tondeur, D. Ifenthaler, B. Eickelmann, in: Association for the Advancement of Computing in Education (AACE) (Ed.), Proceedings of EdMedia + Innovate Learning 2019, Waynesville, NC, 2019, pp. 918–920.","mla":"Voogt, Joke, et al. “Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View.” <i>Proceedings of EdMedia + Innovate Learning 2019</i>, edited by Association for the Advancement of Computing in Education (AACE), 2019, pp. 918–20.","ama":"Voogt J, Knezek G, Christensen R, Tondeur J, Ifenthaler D, Eickelmann B. Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View. In: Association for the Advancement of Computing in Education (AACE), ed. <i>Proceedings of EdMedia + Innovate Learning 2019</i>. ; 2019:918-920.","bibtex":"@inproceedings{Voogt_Knezek_Christensen_Tondeur_Ifenthaler_Eickelmann_2019, place={Waynesville, NC}, title={Core Themes in the Second International Handbook of Information Technology in Primary and Secondary Education: A Bird’s Eye View}, booktitle={Proceedings of EdMedia + Innovate Learning 2019}, author={Voogt, Joke and Knezek, Geral and Christensen, Rhonda and Tondeur, Jo and Ifenthaler, Dirk and Eickelmann, Birgit}, editor={Association for the Advancement of Computing in Education (AACE)}, year={2019}, pages={918–920} }"},"publication":"Proceedings of EdMedia + Innovate Learning 2019","department":[{"_id":"462"}],"type":"conference","date_created":"2021-12-13T16:37:12Z","place":"Waynesville, NC"},{"publication":"b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland","citation":{"chicago":"Fugmann, Martin, Birgit Eickelmann, and Dirk Neubauer. “‘Digitalisierung meets Schule’ - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?” <i>b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland</i> 2 (2019): 39–40.","short":"M. Fugmann, B. Eickelmann, D. Neubauer, b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland 2 (2019) 39–40.","ama":"Fugmann M, Eickelmann B, Neubauer D. “Digitalisierung meets Schule” - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung? <i>b:sl Beruf: Schulleitung Das Fachmagazin für Schulleitungen in Deutschland</i>. 2019;2:39-40.","bibtex":"@article{Fugmann_Eickelmann_Neubauer_2019, title={“Digitalisierung meets Schule” - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?}, volume={2}, journal={b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland}, publisher={Berlin: ASD Allgemeiner Schulleitungsverband}, author={Fugmann, Martin and Eickelmann, Birgit and Neubauer, Dirk}, year={2019}, pages={39–40} }","apa":"Fugmann, M., Eickelmann, B., &#38; Neubauer, D. (2019). “Digitalisierung meets Schule” - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung? <i>b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland</i>, <i>2</i>, 39–40.","mla":"Fugmann, Martin, et al. “‘Digitalisierung meets Schule’ - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?” <i>b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland</i>, vol. 2, Berlin: ASD Allgemeiner Schulleitungsverband, 2019, pp. 39–40.","ieee":"M. Fugmann, B. Eickelmann, and D. Neubauer, “‘Digitalisierung meets Schule’ - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?,” <i>b:sl. Beruf: Schulleitung. Das Fachmagazin für Schulleitungen in Deutschland</i>, vol. 2, pp. 39–40, 2019."},"date_created":"2021-12-13T17:00:21Z","type":"journal_article","department":[{"_id":"462"}],"status":"public","title":"'Digitalisierung meets Schule' - Welchen Stellenwert haben pädagogische Führungskräfte in Zeiten der Digitalisierung?","year":"2019","author":[{"first_name":"Martin","last_name":"Fugmann","full_name":"Fugmann, Martin"},{"id":"40387","full_name":"Eickelmann, Birgit","first_name":"Birgit","last_name":"Eickelmann"},{"full_name":"Neubauer, Dirk","last_name":"Neubauer","first_name":"Dirk"}],"date_updated":"2022-01-06T06:58:20Z","intvolume":"         2","page":"39-40","publisher":"Berlin: ASD Allgemeiner Schulleitungsverband","_id":"28761","language":[{"iso":"ger"}],"user_id":"50923","volume":2},{"publication":"Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)","department":[{"_id":"462"}],"type":"book_chapter","date_created":"2021-12-13T17:03:41Z","intvolume":"        23","publication_status":"published","date_updated":"2022-01-06T06:58:20Z","publication_identifier":{"isbn":["9783658262303","9783658262310"]},"author":[{"full_name":"Gerick, Julia","last_name":"Gerick","first_name":"Julia"},{"id":"40387","first_name":"Birgit","last_name":"Eickelmann","full_name":"Eickelmann, Birgit"}],"title":"Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen","year":"2019","doi":"10.1007/978-3-658-26231-0_25","language":[{"iso":"ger"}],"citation":{"ieee":"J. Gerick and B. Eickelmann, “Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen,” in <i>Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)</i>, vol. 23, C. Donie, F. Foerster, M. Obermayr, A. Deckwerth, G. Kammermeyer, G. Lenske, M. Leuchter, and A. Wildemann, Eds. Wiesbaden: VS Verlag, 2019, pp. 200–205.","apa":"Gerick, J., &#38; Eickelmann, B. (2019). Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen. In C. Donie, F. Foerster, M. Obermayr, A. Deckwerth, G. Kammermeyer, G. Lenske, M. Leuchter, &#38; A. Wildemann (Eds.), <i>Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)</i> (Vol. 23, pp. 200–205). VS Verlag. <a href=\"https://doi.org/10.1007/978-3-658-26231-0_25\">https://doi.org/10.1007/978-3-658-26231-0_25</a>","short":"J. Gerick, B. Eickelmann, in: C. Donie, F. Foerster, M. Obermayr, A. Deckwerth, G. Kammermeyer, G. Lenske, M. Leuchter, A. Wildemann (Eds.), Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung), VS Verlag, Wiesbaden, 2019, pp. 200–205.","chicago":"Gerick, Julia, and Birgit Eickelmann. “Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen.” In <i>Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)</i>, edited by Christian Donie, Frank Foerster, Marlene Obermayr, Anne Deckwerth, Gisela Kammermeyer, Gerlinde Lenske, Miriam Leuchter, and Anja Wildemann, 23:200–205. Wiesbaden: VS Verlag, 2019. <a href=\"https://doi.org/10.1007/978-3-658-26231-0_25\">https://doi.org/10.1007/978-3-658-26231-0_25</a>.","mla":"Gerick, Julia, and Birgit Eickelmann. “Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen.” <i>Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)</i>, edited by Christian Donie et al., vol. 23, VS Verlag, 2019, pp. 200–05, doi:<a href=\"https://doi.org/10.1007/978-3-658-26231-0_25\">10.1007/978-3-658-26231-0_25</a>.","bibtex":"@inbook{Gerick_Eickelmann_2019, place={Wiesbaden}, title={Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen}, volume={23}, DOI={<a href=\"https://doi.org/10.1007/978-3-658-26231-0_25\">10.1007/978-3-658-26231-0_25</a>}, booktitle={Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)}, publisher={VS Verlag}, author={Gerick, Julia and Eickelmann, Birgit}, editor={Donie, Christian and Foerster, Frank and Obermayr, Marlene and Deckwerth, Anne and Kammermeyer, Gisela and Lenske, Gerlinde and Leuchter, Miriam and Wildemann, Anja}, year={2019}, pages={200–205} }","ama":"Gerick J, Eickelmann B. Möglichkeiten des Transfers schulischer Innovationen im Kontext des Lernens mit digitalen Medien an Grundschulen. In: Donie C, Foerster F, Obermayr M, et al., eds. <i>Grundschulpädagogik zwischen Wissenschaft und Transfer (Jahrbuch Grundschulforschung)</i>. Vol 23. VS Verlag; 2019:200-205. doi:<a href=\"https://doi.org/10.1007/978-3-658-26231-0_25\">10.1007/978-3-658-26231-0_25</a>"},"place":"Wiesbaden","status":"public","volume":23,"editor":[{"full_name":"Donie, Christian","first_name":"Christian","last_name":"Donie"},{"last_name":"Foerster","first_name":"Frank","full_name":"Foerster, Frank"},{"full_name":"Obermayr, Marlene","first_name":"Marlene","last_name":"Obermayr"},{"last_name":"Deckwerth","first_name":"Anne","full_name":"Deckwerth, Anne"},{"first_name":"Gisela","last_name":"Kammermeyer","full_name":"Kammermeyer, Gisela"},{"first_name":"Gerlinde","last_name":"Lenske","full_name":"Lenske, Gerlinde"},{"full_name":"Leuchter, Miriam","last_name":"Leuchter","first_name":"Miriam"},{"first_name":"Anja","last_name":"Wildemann","full_name":"Wildemann, Anja"}],"user_id":"50923","_id":"28764","publisher":"VS Verlag","page":"200-205"},{"type":"conference","department":[{"_id":"58"}],"date_created":"2021-09-09T12:26:07Z","place":"London, England","related_material":{"link":[{"relation":"confirmation","url":"https://www.wwrf.ch/files/content%20wwrf/meetings/past%20events/wwrf43/presentations%20wwrf43/Metaracom%20Project.pdf"}]},"abstract":[{"lang":"eng","text":"We overview the 3-year Meteracom project which\r\nwill provide traceability to the SI for THz communication\r\nmeasurement parameters. The key objectives are to develop new\r\nmetrological methods to characterize the measurement systems,\r\nsystem components and propagation channels. The final\r\nobjective is to develop metrology for functionality and signal\r\nintegrity of THz communication systems; particularly device\r\ndiscovery and beam tracking, determination of physical layer\r\nparameters for digital transmission and real-time performance\r\nevaluation."}],"publication":"Proc. 43-nd Meeting of the Wireless World Research Forum (WWRF)\",","citation":{"ama":"Humphreys D, Berekovic M, Kallfass I, et al. An overview of the Meteracom Project. In: <i>Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\",</i>. ; 2019.","bibtex":"@inproceedings{Humphreys_Berekovic_Kallfass_Scheytt_Kuerner_Jukan_Schneider_Kleine-Ostmann_Koch_Thomae_2019, place={London, England}, title={An overview of the Meteracom Project}, booktitle={Proc. 43-nd Meeting of the Wireless World Research Forum (WWRF)\",}, author={Humphreys, David and Berekovic, Mladen and Kallfass, Ingmar and Scheytt, Christoph and Kuerner, Thomas and Jukan, Admela and Schneider, Thomas and Kleine-Ostmann, Thomas and Koch, Martin and Thomae, Reiner}, year={2019} }","mla":"Humphreys, David, et al. “An Overview of the Meteracom Project.” <i>Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\",</i> 2019.","short":"D. Humphreys, M. Berekovic, I. Kallfass, C. Scheytt, T. Kuerner, A. Jukan, T. Schneider, T. Kleine-Ostmann, M. Koch, R. Thomae, in: Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\", London, England, 2019.","chicago":"Humphreys, David, Mladen Berekovic, Ingmar Kallfass, Christoph Scheytt, Thomas Kuerner, Admela Jukan, Thomas Schneider, Thomas Kleine-Ostmann, Martin Koch, and Reiner Thomae. “An Overview of the Meteracom Project.” In <i>Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\",</i>. London, England, 2019.","apa":"Humphreys, D., Berekovic, M., Kallfass, I., Scheytt, C., Kuerner, T., Jukan, A., Schneider, T., Kleine-Ostmann, T., Koch, M., &#38; Thomae, R. (2019). An overview of the Meteracom Project. <i>Proc. 43-Nd Meeting of the Wireless World Research Forum (WWRF)\",</i>.","ieee":"D. Humphreys <i>et al.</i>, “An overview of the Meteracom Project,” 2019."},"user_id":"15931","_id":"24053","language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:56:06Z","status":"public","title":"An overview of the Meteracom Project","year":"2019","author":[{"last_name":"Humphreys","first_name":"David","full_name":"Humphreys, David"},{"last_name":"Berekovic","first_name":"Mladen","full_name":"Berekovic, Mladen"},{"first_name":"Ingmar","last_name":"Kallfass","full_name":"Kallfass, Ingmar"},{"id":"37144","last_name":"Scheytt","first_name":"Christoph","full_name":"Scheytt, Christoph"},{"full_name":"Kuerner, Thomas","first_name":"Thomas","last_name":"Kuerner"},{"full_name":"Jukan, Admela","last_name":"Jukan","first_name":"Admela"},{"full_name":"Schneider, Thomas","last_name":"Schneider","first_name":"Thomas"},{"full_name":"Kleine-Ostmann, Thomas","last_name":"Kleine-Ostmann","first_name":"Thomas"},{"full_name":"Koch, Martin","last_name":"Koch","first_name":"Martin"},{"full_name":"Thomae, Reiner","last_name":"Thomae","first_name":"Reiner"}]},{"user_id":"15931","doi":"10.1109/PATMOS.2019.8862170","_id":"24058","language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:56:06Z","title":"RISC-V Extensions for Bit Manipulation Instructions","year":"2019","status":"public","author":[{"full_name":"Koppelmann, Bastian","last_name":"Koppelmann","first_name":"Bastian","id":"25260"},{"id":"5603","full_name":"Adelt, Peer","last_name":"Adelt","first_name":"Peer"},{"id":"16243","full_name":"Müller, Wolfgang","first_name":"Wolfgang","last_name":"Müller"},{"first_name":"Christoph","last_name":"Scheytt","full_name":"Scheytt, Christoph","id":"37144"}],"conference":{"end_date":"2019.07.03","start_date":"2019.07.01"},"type":"conference","department":[{"_id":"58"}],"date_created":"2021-09-09T12:26:14Z","place":"Rhodos, Griechenland","abstract":[{"lang":"eng","text":"Embedded systems require a high energy efficiency in combination with an optimized performance. As such, Bit Manipulation Instructions (BMIs) were introduced for x86 and ARMv8 to improve the runtime efficiency and power dissipation of the compiled software for various applications. Though the RISC-V platform is meanwhile widely accepted for embedded systems application, its instruction set architecture (ISA) currently still supports only two basic BMIs.We introduce ten advanced BMIs for the RISC-V ISA and implemented them on Berkeley's Rocket CPU [1], which we synthesized for the Artix-7 FPGA and the TSMC 65nm cell library. Our RISC-V BMI definitions are based on an analysis and combination of existing x86 and ARMv8 BMIs. Our Rocket CPU hardware extensions show that RISC-V BMI extensions have no negative impact on the critical path of the execution pipeline. Our software evaluations show that we can, for example, expect a significant impact for time and power consuming cryptographic applications."}],"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/8862170"}]},"publication":"29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)","citation":{"short":"B. Koppelmann, P. Adelt, W. Müller, C. Scheytt, in: 29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), Rhodos, Griechenland, 2019.","chicago":"Koppelmann, Bastian, Peer Adelt, Wolfgang Müller, and Christoph Scheytt. “RISC-V Extensions for Bit Manipulation Instructions.” In <i>29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)</i>. Rhodos, Griechenland, 2019. <a href=\"https://doi.org/10.1109/PATMOS.2019.8862170\">https://doi.org/10.1109/PATMOS.2019.8862170</a>.","ieee":"B. Koppelmann, P. Adelt, W. Müller, and C. Scheytt, “RISC-V Extensions for Bit Manipulation Instructions,” 2019, doi: <a href=\"https://doi.org/10.1109/PATMOS.2019.8862170\">10.1109/PATMOS.2019.8862170</a>.","apa":"Koppelmann, B., Adelt, P., Müller, W., &#38; Scheytt, C. (2019). RISC-V Extensions for Bit Manipulation Instructions. <i>29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)</i>. <a href=\"https://doi.org/10.1109/PATMOS.2019.8862170\">https://doi.org/10.1109/PATMOS.2019.8862170</a>","bibtex":"@inproceedings{Koppelmann_Adelt_Müller_Scheytt_2019, place={Rhodos, Griechenland}, title={RISC-V Extensions for Bit Manipulation Instructions}, DOI={<a href=\"https://doi.org/10.1109/PATMOS.2019.8862170\">10.1109/PATMOS.2019.8862170</a>}, booktitle={29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)}, author={Koppelmann, Bastian and Adelt, Peer and Müller, Wolfgang and Scheytt, Christoph}, year={2019} }","ama":"Koppelmann B, Adelt P, Müller W, Scheytt C. RISC-V Extensions for Bit Manipulation Instructions. In: <i>29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)</i>. ; 2019. doi:<a href=\"https://doi.org/10.1109/PATMOS.2019.8862170\">10.1109/PATMOS.2019.8862170</a>","mla":"Koppelmann, Bastian, et al. “RISC-V Extensions for Bit Manipulation Instructions.” <i>29th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)</i>, 2019, doi:<a href=\"https://doi.org/10.1109/PATMOS.2019.8862170\">10.1109/PATMOS.2019.8862170</a>."}},{"department":[{"_id":"58"}],"type":"conference","date_created":"2021-09-09T12:26:16Z","place":"Kaiserslautern, DE","related_material":{"link":[{"relation":"confirmation","url":"https://www.vde-verlag.de/proceedings-de/454945007.html"}]},"abstract":[{"lang":"ger","text":"In diesem Artikel stellen wir eine Methode zur nicht-invasiven dynamischen Speicher- und IO-Analyse mit QEMU für sicherheitskritische eingebettete Software für die RISC-V Befehlssatzarchitektur vor. Die Implementierung basiert auf einer Erweiterung des Tiny Code Generator (TCG) des quelloffenen CPU-Emulators QEMU um die dynamische Identifikation von Zugriffen auf Datenspeicher sowie auf an die CPU angeschlossene IO-Geräte. Wir demonstrieren die Funktionalität der Methode anhand eines Versuchsaufbaus, bei dem eine Schließsystemkontrolle mittels serieller UART-Schnittstelle an einen RISC-V-Prozessor angebunden ist. Dieses Szenario zeigt, dass ein unberechtigter Zugriff auf die UART-Schnittstelle frühzeitig aufgedeckt und ein Angriff auf eine Zugangskontrolle somit endeckt werden kann. "}],"citation":{"mla":"Adelt, Peer, et al. “Analyse Sicherheitskritischer Software Für RISC-V Prozessoren.” <i>MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019)</i>, 2019.","ama":"Adelt P, Koppelmann B, Müller W, Scheytt C. Analyse sicherheitskritischer Software für RISC-V Prozessoren. In: <i>MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019)</i>. ; 2019.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Scheytt_2019, place={Kaiserslautern, DE}, title={Analyse sicherheitskritischer Software für RISC-V Prozessoren}, booktitle={MBMV 2019-22.Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2019)}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Scheytt, Christoph}, year={2019} }","apa":"Adelt, P., Koppelmann, B., Müller, W., &#38; Scheytt, C. (2019). Analyse sicherheitskritischer Software für RISC-V Prozessoren. <i>MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019)</i>.","ieee":"P. Adelt, B. Koppelmann, W. Müller, and C. Scheytt, “Analyse sicherheitskritischer Software für RISC-V Prozessoren,” 2019.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, and Christoph Scheytt. “Analyse Sicherheitskritischer Software Für RISC-V Prozessoren.” In <i>MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019)</i>. Kaiserslautern, DE, 2019.","short":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, in: MBMV 2019-22.Workshop Methoden Und Beschreibungssprachen Zur Modellierung Und Verifikation von Schaltungen Und Systemen (MBMV 2019), Kaiserslautern, DE, 2019."},"publication":"MBMV 2019-22.Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2019)","user_id":"15931","language":[{"iso":"eng"}],"_id":"24060","date_updated":"2022-01-06T06:56:06Z","publication_identifier":{"isbn":["978-3-8007-4945-4"]},"author":[{"full_name":"Adelt, Peer","first_name":"Peer","last_name":"Adelt","id":"5603"},{"full_name":"Koppelmann, Bastian","first_name":"Bastian","last_name":"Koppelmann","id":"25260"},{"id":"16243","first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang"},{"id":"37144","first_name":"Christoph","last_name":"Scheytt","full_name":"Scheytt, Christoph"}],"conference":{"end_date":"2019.04.08","start_date":"2019.04.08"},"status":"public","title":"Analyse sicherheitskritischer Software für RISC-V Prozessoren","year":"2019"},{"status":"public","year":"2019","title":"QEMU for Dynamic Memory Analysis of Security Sensitive Software","author":[{"full_name":"Adelt, Peer","first_name":"Peer","last_name":"Adelt","id":"5603"},{"full_name":"Koppelmann, Bastian","last_name":"Koppelmann","first_name":"Bastian","id":"25260"},{"id":"16243","first_name":"Wolfgang","last_name":"Müller","full_name":"Müller, Wolfgang"},{"id":"37144","full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt"},{"full_name":"Driessen, Benedikt","last_name":"Driessen","first_name":"Benedikt"}],"date_updated":"2022-01-06T06:56:06Z","page":"32-34","language":[{"iso":"eng"}],"_id":"24061","user_id":"15931","publication":" 2nd International Workshop on Embedded Software for Industrial IoT in conjunction with DATE 2019","citation":{"ieee":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, and B. Driessen, “QEMU for Dynamic Memory Analysis of Security Sensitive Software,” in <i> 2nd International Workshop on Embedded Software for Industrial IoT in conjunction with DATE 2019</i>, 2019, pp. 32–34.","apa":"Adelt, P., Koppelmann, B., Müller, W., Scheytt, C., &#38; Driessen, B. (2019). QEMU for Dynamic Memory Analysis of Security Sensitive Software. <i> 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019</i>, 32–34.","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, Christoph Scheytt, and Benedikt Driessen. “QEMU for Dynamic Memory Analysis of Security Sensitive Software.” In <i> 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019</i>, 32–34. Florence, Italy, 2019.","short":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, B. Driessen, in:  2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019, Florence, Italy, 2019, pp. 32–34.","mla":"Adelt, Peer, et al. “QEMU for Dynamic Memory Analysis of Security Sensitive Software.” <i> 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019</i>, 2019, pp. 32–34.","bibtex":"@inproceedings{Adelt_Koppelmann_Müller_Scheytt_Driessen_2019, place={Florence, Italy}, title={QEMU for Dynamic Memory Analysis of Security Sensitive Software}, booktitle={ 2nd International Workshop on Embedded Software for Industrial IoT in conjunction with DATE 2019}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Scheytt, Christoph and Driessen, Benedikt}, year={2019}, pages={32–34} }","ama":"Adelt P, Koppelmann B, Müller W, Scheytt C, Driessen B. QEMU for Dynamic Memory Analysis of Security Sensitive Software. In: <i> 2nd International Workshop on Embedded Software for Industrial IoT in Conjunction with DATE 2019</i>. ; 2019:32-34."},"related_material":{"link":[{"relation":"confirmation","url":"https://www.researchgate.net/publication/334258953_QEMU_for_Dynamic_Memory_Analysis_of_Security_Sensitive_Software"}]},"place":"Florence, Italy","date_created":"2021-09-09T12:26:18Z","type":"conference","department":[{"_id":"58"}]},{"date_updated":"2022-01-06T06:56:06Z","title":"QEMU Support for RISC-V: Current State and Future Releases","year":"2019","status":"public","author":[{"last_name":"Adelt","first_name":"Peer","full_name":"Adelt, Peer","id":"5603"},{"full_name":"Koppelmann, Bastian","last_name":"Koppelmann","first_name":"Bastian","id":"25260"},{"id":"16243","last_name":"Müller","first_name":"Wolfgang","full_name":"Müller, Wolfgang"},{"full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt","id":"37144"}],"user_id":"15931","volume":"(Presentation)","language":[{"iso":"eng"}],"_id":"24063","related_material":{"link":[{"url":"https://www.edacentrum.de/veranstaltungen/risc-v/2019/programm","relation":"confirmation"}]},"abstract":[{"text":"It its current Version 3.1.0 QEMU supports RISC-V RV32GC and RV64GC software emulation in user and full system mode. We will first give an overview of the current state of the QEMU RISC-V implementation. Thereafter, we will present the DecodeTree tool, which will be available with the next QEMU release. DecodeTree is a code generator included in QEMU that can generate the program logic for extracting and decoding opcodes and operands from a formal instruction list of the target architecture. This enables the structured implementation of just-in-time compilations to guarantee that the QEMU implementation meets the ISA specification. As such, we completely replaced the existing RISC-V RV32GC and RV64GC implementations by DecodeTree generations in the next official QEMU release, which is expected in spring 2019. We will demonstrate the DecodeTree applications by the example of RISC-V ISA subset configurations.","lang":"eng"}],"publication":"2nd International Workshop on RISC-V Research Activities","citation":{"short":"P. Adelt, B. Koppelmann, W. Müller, C. Scheytt, 2nd International Workshop on RISC-V Research Activities (Presentation) (2019).","chicago":"Adelt, Peer, Bastian Koppelmann, Wolfgang Müller, and Christoph Scheytt. “QEMU Support for RISC-V: Current State and Future Releases.” <i>2nd International Workshop on RISC-V Research Activities</i> (Presentation) (2019).","ieee":"P. Adelt, B. Koppelmann, W. Müller, and C. Scheytt, “QEMU Support for RISC-V: Current State and Future Releases,” <i>2nd International Workshop on RISC-V Research Activities</i>, vol. (Presentation), 2019.","apa":"Adelt, P., Koppelmann, B., Müller, W., &#38; Scheytt, C. (2019). QEMU Support for RISC-V: Current State and Future Releases. <i>2nd International Workshop on RISC-V Research Activities</i>, <i>(Presentation)</i>.","bibtex":"@article{Adelt_Koppelmann_Müller_Scheytt_2019, title={QEMU Support for RISC-V: Current State and Future Releases}, volume={(Presentation)}, journal={2nd International Workshop on RISC-V Research Activities}, author={Adelt, Peer and Koppelmann, Bastian and Müller, Wolfgang and Scheytt, Christoph}, year={2019} }","ama":"Adelt P, Koppelmann B, Müller W, Scheytt C. QEMU Support for RISC-V: Current State and Future Releases. <i>2nd International Workshop on RISC-V Research Activities</i>. 2019;(Presentation).","mla":"Adelt, Peer, et al. “QEMU Support for RISC-V: Current State and Future Releases.” <i>2nd International Workshop on RISC-V Research Activities</i>, vol. (Presentation), 2019."},"type":"journal_article","department":[{"_id":"58"}],"date_created":"2021-09-09T12:26:20Z"},{"doi":"10.1007/978-3-030-05861-6_44","user_id":"48411","language":[{"iso":"eng"}],"_id":"24097","date_updated":"2022-01-06T06:56:06Z","publication_status":"published","year":"2019","title":"Alloy Design for Biomedical Applications in Additive Manufacturing","status":"public","publication_identifier":{"issn":["2367-1181","2367-1696"]},"author":[{"first_name":"Kay-Peter","last_name":"Hoyer","full_name":"Hoyer, Kay-Peter","id":"48411"},{"id":"43720","last_name":"Schaper","first_name":"Mirko","full_name":"Schaper, Mirko"}],"type":"book_chapter","department":[{"_id":"9"},{"_id":"158"}],"place":"Cham","date_created":"2021-09-10T06:47:45Z","publication":"TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings","citation":{"ama":"Hoyer K-P, Schaper M. Alloy Design for Biomedical Applications in Additive Manufacturing. In: <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>. ; 2019. doi:<a href=\"https://doi.org/10.1007/978-3-030-05861-6_44\">10.1007/978-3-030-05861-6_44</a>","bibtex":"@inbook{Hoyer_Schaper_2019, place={Cham}, title={Alloy Design for Biomedical Applications in Additive Manufacturing}, DOI={<a href=\"https://doi.org/10.1007/978-3-030-05861-6_44\">10.1007/978-3-030-05861-6_44</a>}, booktitle={TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings}, author={Hoyer, Kay-Peter and Schaper, Mirko}, year={2019} }","mla":"Hoyer, Kay-Peter, and Mirko Schaper. “Alloy Design for Biomedical Applications in Additive Manufacturing.” <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>, 2019, doi:<a href=\"https://doi.org/10.1007/978-3-030-05861-6_44\">10.1007/978-3-030-05861-6_44</a>.","short":"K.-P. Hoyer, M. Schaper, in: TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings, Cham, 2019.","chicago":"Hoyer, Kay-Peter, and Mirko Schaper. “Alloy Design for Biomedical Applications in Additive Manufacturing.” In <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>. Cham, 2019. <a href=\"https://doi.org/10.1007/978-3-030-05861-6_44\">https://doi.org/10.1007/978-3-030-05861-6_44</a>.","apa":"Hoyer, K.-P., &#38; Schaper, M. (2019). Alloy Design for Biomedical Applications in Additive Manufacturing. In <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>. <a href=\"https://doi.org/10.1007/978-3-030-05861-6_44\">https://doi.org/10.1007/978-3-030-05861-6_44</a>","ieee":"K.-P. Hoyer and M. Schaper, “Alloy Design for Biomedical Applications in Additive Manufacturing,” in <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>, Cham, 2019."}},{"_id":"24098","language":[{"iso":"eng"}],"doi":"10.1007/978-3-030-05861-6_45","user_id":"48411","year":"2019","status":"public","title":"Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry","author":[{"full_name":"Tasche, Lennart","last_name":"Tasche","first_name":"Lennart"},{"id":"48411","full_name":"Hoyer, Kay-Peter","first_name":"Kay-Peter","last_name":"Hoyer"},{"last_name":"Zhuravlev","first_name":"Evgeny","full_name":"Zhuravlev, Evgeny"},{"full_name":"Grundmeier, Guido","first_name":"Guido","last_name":"Grundmeier","id":"194"},{"full_name":"Schaper, Mirko","first_name":"Mirko","last_name":"Schaper","id":"43720"},{"full_name":"Keßler, Olaf","last_name":"Keßler","first_name":"Olaf"}],"publication_identifier":{"issn":["2367-1181","2367-1696"]},"date_updated":"2022-01-06T06:56:06Z","publication_status":"published","place":"Cham","date_created":"2021-09-10T06:49:15Z","type":"book_chapter","department":[{"_id":"9"},{"_id":"158"}],"publication":"TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings","citation":{"short":"L. Tasche, K.-P. Hoyer, E. Zhuravlev, G. Grundmeier, M. Schaper, O. Keßler, in: TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings, Cham, 2019.","chicago":"Tasche, Lennart, Kay-Peter Hoyer, Evgeny Zhuravlev, Guido Grundmeier, Mirko Schaper, and Olaf Keßler. “Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry.” In <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>. Cham, 2019. <a href=\"https://doi.org/10.1007/978-3-030-05861-6_45\">https://doi.org/10.1007/978-3-030-05861-6_45</a>.","apa":"Tasche, L., Hoyer, K.-P., Zhuravlev, E., Grundmeier, G., Schaper, M., &#38; Keßler, O. (2019). Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry. In <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>. <a href=\"https://doi.org/10.1007/978-3-030-05861-6_45\">https://doi.org/10.1007/978-3-030-05861-6_45</a>","ieee":"L. Tasche, K.-P. Hoyer, E. Zhuravlev, G. Grundmeier, M. Schaper, and O. Keßler, “Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry,” in <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>, Cham, 2019.","ama":"Tasche L, Hoyer K-P, Zhuravlev E, Grundmeier G, Schaper M, Keßler O. Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry. In: <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>. ; 2019. doi:<a href=\"https://doi.org/10.1007/978-3-030-05861-6_45\">10.1007/978-3-030-05861-6_45</a>","bibtex":"@inbook{Tasche_Hoyer_Zhuravlev_Grundmeier_Schaper_Keßler_2019, place={Cham}, title={Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry}, DOI={<a href=\"https://doi.org/10.1007/978-3-030-05861-6_45\">10.1007/978-3-030-05861-6_45</a>}, booktitle={TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings}, author={Tasche, Lennart and Hoyer, Kay-Peter and Zhuravlev, Evgeny and Grundmeier, Guido and Schaper, Mirko and Keßler, Olaf}, year={2019} }","mla":"Tasche, Lennart, et al. “Surface Inoculation of Aluminium Powders for Additive Manufacturing Guided by Differential Fast Scanning Calorimetry.” <i>TMS 2019 148th Annual Meeting &#38; Exhibition Supplemental Proceedings</i>, 2019, doi:<a href=\"https://doi.org/10.1007/978-3-030-05861-6_45\">10.1007/978-3-030-05861-6_45</a>."}},{"citation":{"apa":"Eiber, M., &#38; Deutscher Verband für Materialforschung und -prüfung e.V. (Eds.). (2019). <i>Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, </i>.","ieee":"M. Eiber and Deutscher Verband für Materialforschung und -prüfung e.V., Eds., <i>Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, </i>. Berlin, 2019.","short":"M. Eiber, Deutscher Verband für Materialforschung und -prüfung e.V., eds., Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, , Berlin, 2019.","chicago":"Eiber, Marion, and Deutscher Verband für Materialforschung und -prüfung e.V., eds. <i>Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, </i>. Berlin, 2019.","mla":"Eiber, Marion, and Deutscher Verband für Materialforschung und -prüfung e.V., editors. <i>Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, </i>. 2019.","ama":"Eiber M, Deutscher Verband für Materialforschung und -prüfung e.V., eds. <i>Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, </i>.; 2019.","bibtex":"@book{Eiber_Deutscher Verband für Materialforschung und -prüfung e.V._2019, place={Berlin}, title={Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, }, year={2019} }"},"type":"conference_editor","department":[{"_id":"9"},{"_id":"158"}],"date_created":"2021-09-10T07:05:44Z","place":"Berlin","date_updated":"2022-01-06T06:56:07Z","status":"public","title":"Einfluss von Eigenspannungen und Oberflächenrauheit additiv gefertigter Komponenten aus 316L auf die Beschichtbarkeit und Ermüdungsfestigkeit, ","year":"2019","corporate_editor":["Deutscher Verband für Materialforschung und -prüfung e.V."],"publication_identifier":{"issn":["2509-8772"]},"conference":{"end_date":"07.11.2019","location":"Berlin","start_date":"06.11.2019","name":"4. Tagung des DVM-Arbeitskreises Additiv gefertigte Bauteile und Strukturen"},"user_id":"48411","editor":[{"first_name":"Marion","last_name":"Eiber","full_name":"Eiber, Marion"}],"_id":"24102","language":[{"iso":"ger"}]},{"conference":{"end_date":"29.05.2019","location":"Yokohama","start_date":"26.05.2019","name":"\tInternational Thermal Spray Conference and Exposition (ITSC 2019): New Waves of Thermal Spray Technology for Sustainable Growth"},"publication_identifier":{"isbn":["9781510888005"]},"status":"public","year":"2019","title":"Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L","date_updated":"2022-01-06T06:56:07Z","_id":"24103","language":[{"iso":"eng"}],"publisher":"ASM International","editor":[{"full_name":"Azarmi, Fardad ","first_name":"Fardad ","last_name":"Azarmi"}],"user_id":"48411","citation":{"short":"F. Azarmi, ed., Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L, ASM International, Yokohama, 2019.","chicago":"Azarmi, Fardad , ed. <i>Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L</i>. Yokohama: ASM International, 2019.","apa":"Azarmi, F. (Ed.). (2019). <i>Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L</i>. ASM International.","ieee":"F. Azarmi, Ed., <i>Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L</i>. Yokohama: ASM International, 2019.","ama":"Azarmi F, ed. <i>Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L</i>. ASM International; 2019.","bibtex":"@book{Azarmi_2019, place={Yokohama}, title={Adhesion of HVOF sprayed WC-Co coatings on additively processed 316L}, publisher={ASM International}, year={2019} }","mla":"Azarmi, Fardad, editor. <i>Adhesion of HVOF Sprayed WC-Co Coatings on Additively Processed 316L</i>. ASM International, 2019."},"place":"Yokohama","date_created":"2021-09-10T07:12:58Z","department":[{"_id":"9"},{"_id":"158"}],"type":"conference_editor"},{"publication_status":"published","date_updated":"2022-01-06T06:56:07Z","publication_identifier":{"issn":["1738-494X","1976-3824"]},"author":[{"last_name":"Inguva","first_name":"Venkatesh","full_name":"Inguva, Venkatesh"},{"full_name":"Graceffa, Rita","first_name":"Rita","last_name":"Graceffa"},{"full_name":"Schulz, Joachim","first_name":"Joachim","last_name":"Schulz"},{"first_name":"Osman","last_name":"Bilsel","full_name":"Bilsel, Osman"},{"full_name":"Perot, Blair J.","first_name":"Blair J.","last_name":"Perot"}],"year":"2019","title":"Creating round focused micro-jets from rectangular nozzles","status":"public","user_id":"75069","doi":"10.1007/s12206-019-0824-x","_id":"24122","language":[{"iso":"eng"}],"page":"4281-4289","citation":{"bibtex":"@article{Inguva_Graceffa_Schulz_Bilsel_Perot_2019, title={Creating round focused micro-jets from rectangular nozzles}, DOI={<a href=\"https://doi.org/10.1007/s12206-019-0824-x\">10.1007/s12206-019-0824-x</a>}, journal={Journal of Mechanical Science and Technology}, author={Inguva, Venkatesh and Graceffa, Rita and Schulz, Joachim and Bilsel, Osman and Perot, Blair J.}, year={2019}, pages={4281–4289} }","ama":"Inguva V, Graceffa R, Schulz J, Bilsel O, Perot BJ. Creating round focused micro-jets from rectangular nozzles. <i>Journal of Mechanical Science and Technology</i>. Published online 2019:4281-4289. doi:<a href=\"https://doi.org/10.1007/s12206-019-0824-x\">10.1007/s12206-019-0824-x</a>","mla":"Inguva, Venkatesh, et al. “Creating Round Focused Micro-Jets from Rectangular Nozzles.” <i>Journal of Mechanical Science and Technology</i>, 2019, pp. 4281–89, doi:<a href=\"https://doi.org/10.1007/s12206-019-0824-x\">10.1007/s12206-019-0824-x</a>.","chicago":"Inguva, Venkatesh, Rita Graceffa, Joachim Schulz, Osman Bilsel, and Blair J. Perot. “Creating Round Focused Micro-Jets from Rectangular Nozzles.” <i>Journal of Mechanical Science and Technology</i>, 2019, 4281–89. <a href=\"https://doi.org/10.1007/s12206-019-0824-x\">https://doi.org/10.1007/s12206-019-0824-x</a>.","short":"V. Inguva, R. Graceffa, J. Schulz, O. Bilsel, B.J. Perot, Journal of Mechanical Science and Technology (2019) 4281–4289.","ieee":"V. Inguva, R. Graceffa, J. Schulz, O. Bilsel, and B. J. Perot, “Creating round focused micro-jets from rectangular nozzles,” <i>Journal of Mechanical Science and Technology</i>, pp. 4281–4289, 2019, doi: <a href=\"https://doi.org/10.1007/s12206-019-0824-x\">10.1007/s12206-019-0824-x</a>.","apa":"Inguva, V., Graceffa, R., Schulz, J., Bilsel, O., &#38; Perot, B. J. (2019). Creating round focused micro-jets from rectangular nozzles. <i>Journal of Mechanical Science and Technology</i>, 4281–4289. <a href=\"https://doi.org/10.1007/s12206-019-0824-x\">https://doi.org/10.1007/s12206-019-0824-x</a>"},"publication":"Journal of Mechanical Science and Technology","type":"journal_article","date_created":"2021-09-10T07:54:38Z"},{"type":"conference","date_created":"2021-09-10T09:50:53Z","publication":"Science and Information Conference","citation":{"apa":"König, J., Malberg, S., Martens, M., Niehaus, S., Krohn-Grimberghe, A., &#38; Ramaswamy, A. (2019). Multi-stage reinforcement learning for object detection. <i>Science and Information Conference</i>, 178–191.","ieee":"J. König, S. Malberg, M. Martens, S. Niehaus, A. Krohn-Grimberghe, and A. Ramaswamy, “Multi-stage reinforcement learning for object detection,” in <i>Science and Information Conference</i>, 2019, pp. 178–191.","chicago":"König, Jonas, Simon Malberg, Martin Martens, Sebastian Niehaus, Artus Krohn-Grimberghe, and Arunselvan Ramaswamy. “Multi-Stage Reinforcement Learning for Object Detection.” In <i>Science and Information Conference</i>, 178–91, 2019.","short":"J. König, S. Malberg, M. Martens, S. Niehaus, A. Krohn-Grimberghe, A. Ramaswamy, in: Science and Information Conference, 2019, pp. 178–191.","mla":"König, Jonas, et al. “Multi-Stage Reinforcement Learning for Object Detection.” <i>Science and Information Conference</i>, 2019, pp. 178–91.","ama":"König J, Malberg S, Martens M, Niehaus S, Krohn-Grimberghe A, Ramaswamy A. Multi-stage reinforcement learning for object detection. In: <i>Science and Information Conference</i>. ; 2019:178-191.","bibtex":"@inproceedings{König_Malberg_Martens_Niehaus_Krohn-Grimberghe_Ramaswamy_2019, title={Multi-stage reinforcement learning for object detection}, booktitle={Science and Information Conference}, author={König, Jonas and Malberg, Simon and Martens, Martin and Niehaus, Sebastian and Krohn-Grimberghe, Artus and Ramaswamy, Arunselvan}, year={2019}, pages={178–191} }"},"user_id":"66937","page":"178-191","_id":"24141","language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:56:08Z","title":"Multi-stage reinforcement learning for object detection","year":"2019","status":"public","author":[{"first_name":"Jonas","last_name":"König","full_name":"König, Jonas"},{"last_name":"Malberg","first_name":"Simon","full_name":"Malberg, Simon"},{"first_name":"Martin","last_name":"Martens","full_name":"Martens, Martin"},{"full_name":"Niehaus, Sebastian","last_name":"Niehaus","first_name":"Sebastian"},{"full_name":"Krohn-Grimberghe, Artus","last_name":"Krohn-Grimberghe","first_name":"Artus"},{"id":"66937","orcid":"https://orcid.org/ 0000-0001-7547-8111","last_name":"Ramaswamy","first_name":"Arunselvan","full_name":"Ramaswamy, Arunselvan"}]},{"citation":{"bibtex":"@article{Knoke_Kronberg_Glushenkov_Kenig_2019, title={On the design of heat exchanger equipment for novel-type isobaric expansion engines}, volume={167}, DOI={<a href=\"https://doi.org/10.1016/j.applthermaleng.2019.114382\">10.1016/j.applthermaleng.2019.114382</a>}, number={5}, journal={Applied Thermal Engineering}, author={Knoke, Torben and Kronberg, Alexander and Glushenkov, Maxim and Kenig, Eugeny}, year={2019}, pages={114382} }","short":"T. Knoke, A. Kronberg, M. Glushenkov, E. Kenig, Applied Thermal Engineering 167 (2019) 114382.","ama":"Knoke T, Kronberg A, Glushenkov M, Kenig E. On the design of heat exchanger equipment for novel-type isobaric expansion engines. <i>Applied Thermal Engineering</i>. 2019;167(5):114382. doi:<a href=\"https://doi.org/10.1016/j.applthermaleng.2019.114382\">10.1016/j.applthermaleng.2019.114382</a>","chicago":"Knoke, Torben, Alexander Kronberg, Maxim Glushenkov, and Eugeny Kenig. “On the Design of Heat Exchanger Equipment for Novel-Type Isobaric Expansion Engines.” <i>Applied Thermal Engineering</i> 167, no. 5 (2019): 114382. <a href=\"https://doi.org/10.1016/j.applthermaleng.2019.114382\">https://doi.org/10.1016/j.applthermaleng.2019.114382</a>.","ieee":"T. Knoke, A. Kronberg, M. Glushenkov, and E. Kenig, “On the design of heat exchanger equipment for novel-type isobaric expansion engines,” <i>Applied Thermal Engineering</i>, vol. 167, no. 5, p. 114382, 2019, doi: <a href=\"https://doi.org/10.1016/j.applthermaleng.2019.114382\">10.1016/j.applthermaleng.2019.114382</a>.","apa":"Knoke, T., Kronberg, A., Glushenkov, M., &#38; Kenig, E. (2019). On the design of heat exchanger equipment for novel-type isobaric expansion engines. <i>Applied Thermal Engineering</i>, <i>167</i>(5), 114382. <a href=\"https://doi.org/10.1016/j.applthermaleng.2019.114382\">https://doi.org/10.1016/j.applthermaleng.2019.114382</a>","mla":"Knoke, Torben, et al. “On the Design of Heat Exchanger Equipment for Novel-Type Isobaric Expansion Engines.” <i>Applied Thermal Engineering</i>, vol. 167, no. 5, 2019, p. 114382, doi:<a href=\"https://doi.org/10.1016/j.applthermaleng.2019.114382\">10.1016/j.applthermaleng.2019.114382</a>."},"issue":"5","publication":"Applied Thermal Engineering","department":[{"_id":"9"},{"_id":"145"}],"type":"journal_article","date_created":"2021-09-13T12:00:44Z","intvolume":"       167","publication_status":"published","date_updated":"2022-01-06T06:56:13Z","publication_identifier":{"issn":["1359-4311"]},"author":[{"full_name":"Knoke, Torben","last_name":"Knoke","first_name":"Torben"},{"first_name":"Alexander","last_name":"Kronberg","full_name":"Kronberg, Alexander"},{"first_name":"Maxim","last_name":"Glushenkov","full_name":"Glushenkov, Maxim"},{"id":"665","full_name":"Kenig, Eugeny","last_name":"Kenig","first_name":"Eugeny"}],"status":"public","title":"On the design of heat exchanger equipment for novel-type isobaric expansion engines","year":"2019","volume":167,"user_id":"22006","doi":"10.1016/j.applthermaleng.2019.114382","language":[{"iso":"eng"}],"_id":"24272","page":"114382"}]