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To this end, we present DIRA a Deep reinforcement learning based Iterative Resource\r\nAllocation algorithm, which is scalable and control-aware. Our algorithm is tailored towards\r\nlarge-scale problems where control and scheduling need to act jointly to optimize performance.\r\nDIRA can be used to schedule general time-domain optimization based controllers. In the present\r\nwork, we focus on control designs based on suitably adapted linear quadratic regulators. We\r\napply our algorithm to networked systems with correlated fading communication channels. Our\r\nsimulations show that DIRA scales well to large scheduling problems."}],"main_file_link":[{"url":"https://arxiv.org/abs/1905.05992","open_access":"1"}],"language":[{"iso":"eng"}],"title":"Deep reinforcement learning for scheduling in large-scale networked control systems","year":"2019","author":[{"id":"52265","full_name":"Redder, Adrian","first_name":"Adrian","orcid":"https://orcid.org/0000-0001-7391-4688","last_name":"Redder"},{"full_name":"Ramaswamy, Arunselvan","last_name":"Ramaswamy","first_name":"Arunselvan","orcid":"https://orcid.org/ 0000-0001-7547-8111","id":"66937"},{"first_name":"Daniel","last_name":"Quevedo","full_name":"Quevedo, Daniel"}],"date_updated":"2022-01-06T06:51:36Z","publication_status":"published","oa":"1","file_date_updated":"2019-09-23T16:21:16Z","citation":{"ama":"Redder A, Ramaswamy A, Quevedo D. Deep reinforcement learning for scheduling in large-scale networked control systems. 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Gift Purchases as Catalysts for Strengthening Customer–Brand Relationships. <i>Journal of Marketing</i>. 2019.","bibtex":"@article{Eggert_Steinhoff_Witte_2019, title={Gift Purchases as Catalysts for Strengthening Customer–Brand Relationships}, journal={Journal of Marketing}, author={Eggert, Andreas and Steinhoff, Lena and Witte, Carina}, year={2019} }","mla":"Eggert, Andreas, et al. “Gift Purchases as Catalysts for Strengthening Customer–Brand Relationships.” <i>Journal of Marketing</i>, 2019.","chicago":"Eggert, Andreas, Lena Steinhoff, and Carina Witte. “Gift Purchases as Catalysts for Strengthening Customer–Brand Relationships.” <i>Journal of Marketing</i>, 2019.","short":"A. Eggert, L. Steinhoff, C. Witte, Journal of Marketing (2019).","apa":"Eggert, A., Steinhoff, L., &#38; Witte, C. (2019). Gift Purchases as Catalysts for Strengthening Customer–Brand Relationships. <i>Journal of Marketing</i>.","ieee":"A. Eggert, L. Steinhoff, and C. Witte, “Gift Purchases as Catalysts for Strengthening Customer–Brand Relationships,” <i>Journal of Marketing</i>, 2019."},"language":[{"iso":"eng"}],"_id":"13457","user_id":"57352","year":"2019","title":"Gift Purchases as Catalysts for Strengthening Customer–Brand Relationships","status":"public","author":[{"full_name":"Eggert, Andreas","first_name":"Andreas","last_name":"Eggert"},{"full_name":"Steinhoff, Lena","last_name":"Steinhoff","first_name":"Lena"},{"last_name":"Witte","first_name":"Carina","full_name":"Witte, Carina"}],"date_updated":"2022-01-06T06:51:36Z"},{"date_created":"2019-05-27T10:31:35Z","keyword":["Abschlussbericht zum Spitzenclusterprojekt InCuB"],"type":"book","department":[{"_id":"151"}],"citation":{"short":"W. Sextro, M. Brökelmann, Intelligente Herstellung Zuverlässiger Kupferbondverbindungen, Springer Verlag, 2019.","chicago":"Sextro, Walter, and Michael Brökelmann. <i>Intelligente Herstellung Zuverlässiger Kupferbondverbindungen</i>. Vol. VIII. 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Vol. VIII, Springer Verlag, 2019, doi:<a href=\"https://doi.org/10.1007/978-3-662-55146-2\">10.1007/978-3-662-55146-2</a>."},"abstract":[{"text":"Dieses Buch beschreibt basierend auf dem gleichnamigen Innovationsprojekt im Spitzencluster it’s OWL die Entwicklung intelligenter Verfahren und Systeme, um auch unter variablen Produktionsbedingungen eine zuverlässige Massenfertigung von Kupferbondverbindungen sicherzustellen.Dabei wird der gesamte Prozess der Ultraschall-Verbindungsbildung modelliert. Dies beinhaltet u. a. ein Reibmodell mit gekoppeltem Anbindungsmodell, den Ultraschall-Erweichungseffekt und den Verschleiß des Bondwerkzeugs. Zudem wird das Konzept einer selbstoptimierenden Bondmaschine vorgestellt, welche Prozessparameter in Abhängigkeit von Störgrößen wie Verschleiß anpasst.Das Ultraschallbonden mit Aluminiumdraht ist ein etabliertes Fertigungsverfahren zur Kontaktierung von Leistungshalbleitern. Zukünftige Leistungshalbleiterchips erfordern jedoch einen Technologiewechsel zu Kupferdraht. Die Prozessparameter unterscheiden sich dabei deutlich von den bekannten Aluminiumprozessen, ihre Wechselwirkungen sind weitestgehend unbekannt.","lang":"ger"}],"page":"67","publisher":"Springer Verlag","_id":"10002","language":[{"iso":"eng"}],"doi":"10.1007/978-3-662-55146-2","user_id":"55222","volume":"VIII","title":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","status":"public","year":"2019","author":[{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"},{"last_name":"Brökelmann","first_name":"Michael","full_name":"Brökelmann, Michael"}],"date_updated":"2022-01-06T06:50:22Z"},{"type":"journal_article","department":[{"_id":"77"}],"date_created":"2019-05-28T06:32:57Z","issue":"1","publication":"Formal Asp. Comput.","citation":{"ieee":"M. Fränzle, D. Kapur, H. Wehrheim, and N. Zhan, “Editorial,” <i>Formal Asp. 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Badger and Kristin Yvonne Rozier, vol. 11460, Springer, 2019, pp. 263–79, doi:<a href=\"https://doi.org/10.1007/978-3-030-20652-9\\_18\">10.1007/978-3-030-20652-9\\_18</a>.","bibtex":"@inproceedings{König_Wehrheim_2019, series={Lecture Notes in Computer Science}, title={Data Independence for Software Transactional Memory}, volume={11460}, DOI={<a href=\"https://doi.org/10.1007/978-3-030-20652-9\\_18\">10.1007/978-3-030-20652-9\\_18</a>}, booktitle={{NASA} Formal Methods - 11th International Symposium, {NFM} 2019, Houston, TX, USA, May 7-9, 2019, Proceedings}, publisher={Springer}, author={König, Jürgen and Wehrheim, Heike}, editor={M. Badger, Julia and Yvonne Rozier, KristinEditors}, year={2019}, pages={263–279}, collection={Lecture Notes in Computer Science} }","ama":"König J, Wehrheim H. Data Independence for Software Transactional Memory. In: M. 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