@inproceedings{48301, author = {{Glockner, Max and Habernal, Ivan and Gurevych, Iryna}}, booktitle = {{Findings of the Association for Computational Linguistics: EMNLP 2020}}, publisher = {{Association for Computational Linguistics}}, title = {{{Why do you think that? Exploring Faithful Sentence-Level Rationales Without Supervision}}}, doi = {{10.18653/v1/2020.findings-emnlp.97}}, year = {{2020}}, } @inproceedings{29940, abstract = {{A full-bridge modular multilevel converter (MMC) is compared to a half-bridge-based MMC for high-current low-voltage DC-applications such as electrolysis, arc welding or datacenters with DC-power distribution. Usually, modular multilevel converters are used in high-voltage DC-applications (HVDC) in the multiple kV-range, but to meet the needs of a high-current demand at low output voltage levels, the modular converter concept requires adaptations. In the proposed concept, the MMC is used to step-down the three-phase medium-voltage of 10 kV. Therefore, each module is extended by an LLC resonant converter to adapt to the specific electrolyzers DC-voltage range of 142-220V and to provide galvanic isolation. The proposed MMC converter with full-bridge modules uses half the number of modules compared to a half-bridge-based MMC while reducing the voltage ripple by 78% and capacitor losses by 64% by rearranging the same components to ensure identical costs and volume. For additional reliability, a new robust algorithm for balancing conduction losses during the bypass phase is presented.}}, author = {{Unruh, Roland and Schafmeister, Frank and Fröhleke, Norbert and Böcker, Joachim}}, booktitle = {{PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management}}, isbn = {{978-3-8007-5245-4}}, keywords = {{Cascaded H-Bridge, Solid-State Transformer, Capacitor voltage ripple, Zero sequence voltage, Full-Bridge}}, location = {{Germany}}, publisher = {{VDE}}, title = {{{1-MW Full-Bridge MMC for High-Current Low-Voltage (100V-400V) DC-Applications}}}, year = {{2020}}, } @article{48366, abstract = {{The proportion of freshmen enrolled in dual study programmes has steadily increased in recent years. From the perspective of potential students, these programmes are highly attractive because they combine types of learning that used to be largely separate at an institutional level: vocational and academic learning. In training-integrated dual study programmes, different institutional contexts, governance regimes, teaching styles and learning environments make bridging these two worlds of learning a challenge for both educators and learners. However, these programmes also allow leeway for didactic innovation, through the cooperation of different types of educational institutions and through new ways of using available didactic methods, and for establishing a new relationship between higher education (HE) and vocational education and training (VET). This paper positions training-integrated dual study programmes as an object of design-based research (DBR). By developing and using an extended model for the pedagogic development of HEIs, “pädagogische Hochschulentwicklung” (Brahm, Jenert, & Euler, 2016a, p. 19; Euler, 2013, p. 360), the paper systematically identifies generic educational problems in these hybrids. Based on a literature review, this paper classifies and explains the design challenges at the level of the learning environment, the study programme and the organisation. The challenges revolve mainly around the cooperation and integration of HE and VET. The paper concludes with an outlook on future DBR projects designing dual studies.}}, author = {{Mordhorst, Lisa and Gössling, Bernd}}, issn = {{2511-0667}}, journal = {{EDeR. Educational Design Research}}, keywords = {{Dual study programmes, Design challenges, Pedagogic development of HEIs, Literature review, Study programme development, DBR cycle}}, number = {{1}}, publisher = {{Staats- und Universitatsbibliothek Hamburg Carl von Ossietzky}}, title = {{{Dual Study Programmes as a Design Challenge: Identifying Areas for Improvement as a Starting Point for Interventions}}}, doi = {{10.15460/eder.4.1.1482}}, volume = {{4}}, year = {{2020}}, } @inproceedings{30001, abstract = {{Heat dissipation is a limiting factor in the performance of many power electronic components. Especially in the TO-263-7 package, which is used for several SiC-MOSFETs, the heat transfer must take place through the cross section of the printed circuit board (PCB) to the heatsink at the bottom side. Most commonly, thermal vias are used to form this path in a perpendicular direction through all PCB-layers. In a given soft- and hard switched example applications with the use of C3M0065090J SiC-MOSFETs, this conventional approach limited the component’s maximum heat dissipation to approx. 13 W. A recent alternative approach are massive copper blocks (”pedestals”) being integrated in PCBs and reaching from their top- to the bottom-side in relevant footprint areas under SMD-housed power semiconductors. Pedestals allowing to increase the heat dissipation in the given case to even 36 W. This step is achieved due to the clearly superior heat spreading capability of that massive thermal connection between SiC-MOSFET and heatsink. For the hard switched example application the number of switch-elements can be halved to one, by using the pedestal instead of thermal vias. Independently of optimizing the heat transfer path, the up-front avoidance of losses helps to stay within existing heat dissipation limits, of course. The dominant conduction losses of the mentioned soft-switched example application could be halved by changing to SiC-MOSFET types with significant lowered RDSon. By using pedestals and changing to SiC-MOSFETs with lowered RDSon, the number of switch-elements can also be halved for the soft switched application.}}, author = {{Strothmann, Benjamin and Piepenbrock, Till and Schafmeister, Frank and Böcker, Joachim}}, booktitle = {{PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management}}, pages = {{1--7}}, title = {{{Heat dissipation strategies for silicon carbide power SMDs and their use in different applications}}}, year = {{2020}}, } @article{21369, abstract = {{Successful design of human-in-the-loop control sys- tems requires appropriate models for human decision makers. Whilst most paradigms adopted in the control systems literature hide the (limited) decision capability of humans, in behavioral economics individual decision making and optimization processes are well-known to be affected by perceptual and behavioral biases. Our goal is to enrich control engineering with some insights from behavioral economics research through exposing such biases in control-relevant settings. This paper addresses the following two key questions: 1) How do behavioral biases affect decision making? 2) What is the role played by feedback in human-in-the-loop control systems? Our experimental framework shows how individuals behave when faced with the task of piloting an UAV under risk and uncertainty, paralleling a real-world decision-making scenario. Our findings support the notion of humans in Cyberphysical Systems underlying behavioral biases regardless of – or even because of – receiving immediate outcome feedback. We observe substantial shares of drone controllers to act inefficiently through either flying excessively (overconfident) or overly conservatively (underconfident). Furthermore, we observe human-controllers to self-servingly misinterpret random sequences through being subject to a “hot hand fallacy”. We advise control engineers to mind the human component in order not to compromise technological accomplishments through human issues.}}, author = {{Protte, Marius and Fahr, René and Quevedo, Daniel E.}}, journal = {{IEEE Control Systems Magazine}}, number = {{6}}, pages = {{57 -- 76}}, publisher = {{IEEE}}, title = {{{Behavioral Economics for Human-in-the-loop Control Systems Design: Overconfidence and the hot hand fallacy}}}, doi = {{10.1109/MCS.2020.3019723}}, volume = {{40}}, year = {{2020}}, } @inbook{36286, author = {{Schneider, Julia Christina}}, booktitle = {{Transient Bodies in Anglophone Literature and Culture}}, editor = {{Schäfer-Althaus, Sarah and Strauß, Sara}}, pages = {{47--68}}, title = {{{Birth Without a Woman: Mary Shelley's Frankenstein in the Context of Eighteenth-Century Ideas on Birth, Motherhood and Midwifery}}}, year = {{2020}}, } @inbook{48496, author = {{Corall, Niklas}}, booktitle = {{Nietzsche und die Reformation}}, publisher = {{De Gruyter}}, title = {{{Reformation und Regierungskunst: Wahrheit als Grundlage normalisierender Macht bei Nietzsche und Foucault}}}, doi = {{10.1515/9783110587005-019}}, year = {{2020}}, } @inproceedings{45384, author = {{Dröse, Jennifer}}, booktitle = {{Beiträge zum Mathematikunterricht 2020 }}, editor = {{Siller, H.-S. and Weigel, W. and Wöler, J. F.}}, pages = {{233--236}}, publisher = {{WTM}}, title = {{{Verstehensgrundlagen diagnostizieren - Welche Wissenselemente fokussieren Lehrkräfte?}}}, year = {{2020}}, } @inbook{45386, author = {{Dröse, Jennifer and Eisen, V. and Prediger, Susanne and Altieri, M. and Schellenbach, M. and Menning, R.}}, booktitle = {{Mathematik lehren 223}}, pages = {{38--40}}, title = {{{Textaufgaben lesen lernen – eine digital gestützte Einheit mit App }}}, year = {{2020}}, } @article{37831, abstract = {{ Zusammenfassung. Die vorliegende Studie befasst sich mit der Übersetzung und Validierung des englischsprachigen Sport Emotion Questionnaire (SEQ; Jones et al., 2005 ), der vorwettbewerblichen Emotionen von Sporttreibenden misst. In einer ersten Teilstudie wurde mittels einer Hin-Rück-Übersetzung und des Bilingual-Retest-Verfahrens ( n = 32) eine deutsche Version des SEQ (SEQ-d) erzeugt. In Studie 2 (Tennisspieler/innen, n = 116) zeigte sich jedoch eine vom Original abweichende Faktorstruktur, woraufhin der SEQ-d als dreidimensionale Kurzskala entwickelt wurde. Diese wurde in Studie 3 (Läufern/innen, n = 271) validiert. Die Kurzskala besitzt einen akzeptablen Fit (CFI = .950, RMSEA = .069, SRMR = .063) und eine interne Konsistenz von α = .84 (negative Emotionen), α = .86 (positive Emotionen), α = .87 (Anspannung). Durch Korrelationen mit anderen Emotionsmerkmalen konnte die konvergente Validität bestätigt werden. Die Kriteriumsvalidität wurde anhand wettkampf- und personenbezogener Zusatzparameter untersucht (bspw. Alter, Wettkampferfahrung…). Mit der deutschsprachigen Version des SEQ liegt ein ökonomisches und validiertes Messinstrument zur Erfassung vorwettbewerblicher Emotionen vor. }}, author = {{Wetzel, Änne and Weigelt, Matthias and Klingsieck, Katrin Birte}}, issn = {{0012-1924}}, journal = {{Diagnostica}}, keywords = {{Clinical Psychology}}, number = {{4}}, pages = {{246--257}}, publisher = {{Hogrefe Publishing Group}}, title = {{{Übersetzung und Validierung einer deutschsprachigen Version des Sport Emotion Questionnaire (SEQ)}}}, doi = {{10.1026/0012-1924/a000255}}, volume = {{66}}, year = {{2020}}, }