[{"type":"conference","department":[{"_id":"59"}],"date_created":"2023-01-24T10:08:41Z","publication":"2021 IEEE AFRICON","citation":{"chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Influence of Electrode Metallization on Thin-Film Transistor Performance.” In <i>2021 IEEE AFRICON</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">https://doi.org/10.1109/africon51333.2021.9570953</a>.","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE AFRICON, IEEE, 2021.","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Influence of electrode metallization on thin-film transistor performance,” 2021, doi: <a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>.","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Influence of electrode metallization on thin-film transistor performance. <i>2021 IEEE AFRICON</i>. <a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">https://doi.org/10.1109/africon51333.2021.9570953</a>","bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Influence of electrode metallization on thin-film transistor performance}, DOI={<a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>}, booktitle={2021 IEEE AFRICON}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Influence of electrode metallization on thin-film transistor performance. In: <i>2021 IEEE AFRICON</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>","mla":"Reker, Julia, et al. “Influence of Electrode Metallization on Thin-Film Transistor Performance.” <i>2021 IEEE AFRICON</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570953\">10.1109/africon51333.2021.9570953</a>."},"user_id":"20179","doi":"10.1109/africon51333.2021.9570953","_id":"39384","language":[{"iso":"eng"}],"publisher":"IEEE","publication_status":"published","date_updated":"2023-03-22T10:23:56Z","title":"Influence of electrode metallization on thin-film transistor performance","status":"public","year":"2021","author":[{"full_name":"Reker, Julia","first_name":"Julia","last_name":"Reker"},{"full_name":"Meyers, Thorsten","last_name":"Meyers","first_name":"Thorsten"},{"full_name":"Vidor, Fabio F.","last_name":"Vidor","first_name":"Fabio F."},{"last_name":"Joubert","first_name":"Trudi-Heleen","full_name":"Joubert, Trudi-Heleen"},{"id":"20179","last_name":"Hilleringmann","first_name":"Ulrich","full_name":"Hilleringmann, Ulrich"}]},{"date_created":"2023-01-24T10:12:47Z","type":"conference","department":[{"_id":"59"}],"publication":"2021 22nd IEEE International Conference on Industrial Technology (ICIT)","citation":{"mla":"Sander, Tom, et al. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>.","bibtex":"@inproceedings{Sander_Lange_Hilleringmann_Geneis_Hedayat_Kuhn_Gockel_2021, title={Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction}, DOI={<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>}, booktitle={2021 22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Sander, Tom and Lange, Sven and Hilleringmann, Ulrich and Geneis, Volker and Hedayat, Christian and Kuhn, Harald and Gockel, Franz-Barthold}, year={2021} }","ama":"Sander T, Lange S, Hilleringmann U, et al. Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. In: <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>","ieee":"T. Sander <i>et al.</i>, “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction,” 2021, doi: <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">10.1109/icit46573.2021.9453646</a>.","apa":"Sander, T., Lange, S., Hilleringmann, U., Geneis, V., Hedayat, C., Kuhn, H., &#38; Gockel, F.-B. (2021). Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction. <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">https://doi.org/10.1109/icit46573.2021.9453646</a>","short":"T. Sander, S. Lange, U. Hilleringmann, V. Geneis, C. Hedayat, H. Kuhn, F.-B. Gockel, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.","chicago":"Sander, Tom, Sven Lange, Ulrich Hilleringmann, Volker Geneis, Christian Hedayat, Harald Kuhn, and Franz-Barthold Gockel. “Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction.” In <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/icit46573.2021.9453646\">https://doi.org/10.1109/icit46573.2021.9453646</a>."},"_id":"39392","language":[{"iso":"eng"}],"publisher":"IEEE","user_id":"20179","doi":"10.1109/icit46573.2021.9453646","title":"Detection of Defects on Irregular Structured Surfaces by Image Processing Methods for Feature Extraction","year":"2021","status":"public","author":[{"full_name":"Sander, Tom","last_name":"Sander","first_name":"Tom"},{"full_name":"Lange, Sven","first_name":"Sven","last_name":"Lange"},{"id":"20179","first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"},{"full_name":"Geneis, Volker","last_name":"Geneis","first_name":"Volker"},{"full_name":"Hedayat, Christian","first_name":"Christian","last_name":"Hedayat"},{"full_name":"Kuhn, Harald","last_name":"Kuhn","first_name":"Harald"},{"full_name":"Gockel, Franz-Barthold","last_name":"Gockel","first_name":"Franz-Barthold"}],"publication_status":"published","date_updated":"2023-03-22T10:31:28Z"},{"type":"conference","department":[{"_id":"59"}],"date_created":"2023-01-24T10:12:18Z","publication":"2021 22nd IEEE International Conference on Industrial Technology (ICIT)","citation":{"bibtex":"@inproceedings{Lange_Schroder_Hedayat_Kuhn_Hilleringmann_2021, title={Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses}, DOI={<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>}, booktitle={2021 22nd IEEE International Conference on Industrial Technology (ICIT)}, publisher={IEEE}, author={Lange, Sven and Schroder, Dominik and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2021} }","ama":"Lange S, Schroder D, Hedayat C, Kuhn H, Hilleringmann U. Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. In: <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>","short":"S. Lange, D. Schroder, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2021 22nd IEEE International Conference on Industrial Technology (ICIT), IEEE, 2021.","chicago":"Lange, Sven, Dominik Schroder, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” In <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">https://doi.org/10.1109/icit46573.2021.9453609</a>.","ieee":"S. Lange, D. Schroder, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses,” 2021, doi: <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>.","apa":"Lange, S., Schroder, D., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2021). Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses. <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>. <a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">https://doi.org/10.1109/icit46573.2021.9453609</a>","mla":"Lange, Sven, et al. “Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses.” <i>2021 22nd IEEE International Conference on Industrial Technology (ICIT)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/icit46573.2021.9453609\">10.1109/icit46573.2021.9453609</a>."},"user_id":"20179","doi":"10.1109/icit46573.2021.9453609","publisher":"IEEE","_id":"39390","language":[{"iso":"eng"}],"publication_status":"published","date_updated":"2023-03-22T10:30:58Z","title":"Development of Methods for Coil-Based Localization by Magnetic Fields of Miniaturized Sensor Platforms in Bioprocesses","year":"2021","status":"public","author":[{"first_name":"Sven","last_name":"Lange","full_name":"Lange, Sven"},{"full_name":"Schroder, Dominik","first_name":"Dominik","last_name":"Schroder"},{"full_name":"Hedayat, Christian","first_name":"Christian","last_name":"Hedayat"},{"full_name":"Kuhn, Harald","last_name":"Kuhn","first_name":"Harald"},{"id":"20179","last_name":"Hilleringmann","first_name":"Ulrich","full_name":"Hilleringmann, Ulrich"}]},{"publication_status":"published","date_updated":"2023-03-22T10:30:19Z","publication_identifier":{"isbn":["9780128189009"]},"author":[{"id":"20179","last_name":"Hilleringmann","first_name":"Ulrich","full_name":"Hilleringmann, Ulrich"}],"status":"public","year":"2021","title":"ZnO nanoparticle films as active layer for thin film transistors","user_id":"20179","doi":"10.1016/b978-0-12-818900-9.00013-9","language":[{"iso":"eng"}],"_id":"39394","publisher":"Elsevier","citation":{"ama":"Hilleringmann U. ZnO nanoparticle films as active layer for thin film transistors. In: <i>Nanostructured Zinc Oxide</i>. Elsevier; 2021. doi:<a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">10.1016/b978-0-12-818900-9.00013-9</a>","bibtex":"@inbook{Hilleringmann_2021, title={ZnO nanoparticle films as active layer for thin film transistors}, DOI={<a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">10.1016/b978-0-12-818900-9.00013-9</a>}, booktitle={Nanostructured Zinc Oxide}, publisher={Elsevier}, author={Hilleringmann, Ulrich}, year={2021} }","mla":"Hilleringmann, Ulrich. “ZnO Nanoparticle Films as Active Layer for Thin Film Transistors.” <i>Nanostructured Zinc Oxide</i>, Elsevier, 2021, doi:<a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">10.1016/b978-0-12-818900-9.00013-9</a>.","short":"U. Hilleringmann, in: Nanostructured Zinc Oxide, Elsevier, 2021.","chicago":"Hilleringmann, Ulrich. “ZnO Nanoparticle Films as Active Layer for Thin Film Transistors.” In <i>Nanostructured Zinc Oxide</i>. Elsevier, 2021. <a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">https://doi.org/10.1016/b978-0-12-818900-9.00013-9</a>.","apa":"Hilleringmann, U. (2021). ZnO nanoparticle films as active layer for thin film transistors. In <i>Nanostructured Zinc Oxide</i>. Elsevier. <a href=\"https://doi.org/10.1016/b978-0-12-818900-9.00013-9\">https://doi.org/10.1016/b978-0-12-818900-9.00013-9</a>","ieee":"U. Hilleringmann, “ZnO nanoparticle films as active layer for thin film transistors,” in <i>Nanostructured Zinc Oxide</i>, Elsevier, 2021."},"publication":"Nanostructured Zinc Oxide","department":[{"_id":"59"}],"type":"book_chapter","date_created":"2023-01-24T10:13:10Z"},{"citation":{"bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Complementary Inverter Circuits on Flexible Substrates}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Complementary Inverter Circuits on Flexible Substrates. In: <i>2021 Smart Systems Integration (SSI)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Complementary Inverter Circuits on Flexible Substrates.” In <i>2021 Smart Systems Integration (SSI)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>.","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Complementary Inverter Circuits on Flexible Substrates,” 2021, doi: <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>.","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Complementary Inverter Circuits on Flexible Substrates. <i>2021 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>","mla":"Reker, Julia, et al. “Complementary Inverter Circuits on Flexible Substrates.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>."},"publication":"2021 Smart Systems Integration (SSI)","department":[{"_id":"59"}],"type":"conference","date_created":"2023-01-24T10:13:47Z","publication_status":"published","date_updated":"2023-03-22T10:30:04Z","author":[{"last_name":"Reker","first_name":"Julia","full_name":"Reker, Julia"},{"full_name":"Meyers, Thorsten","last_name":"Meyers","first_name":"Thorsten"},{"last_name":"Vidor","first_name":"Fabio F.","full_name":"Vidor, Fabio F."},{"first_name":"Trudi-Heleen","last_name":"Joubert","full_name":"Joubert, Trudi-Heleen"},{"id":"20179","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"title":"Complementary Inverter Circuits on Flexible Substrates","status":"public","year":"2021","user_id":"20179","doi":"10.1109/ssi52265.2021.9466966","_id":"39396","publisher":"IEEE","language":[{"iso":"eng"}]},{"citation":{"mla":"Reker, Julia, et al. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>.","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. In: <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>","bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics}, DOI={<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>}, booktitle={2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">https://doi.org/10.1109/fleps51544.2021.9469764</a>","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics,” 2021, doi: <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>.","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” In <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">https://doi.org/10.1109/fleps51544.2021.9469764</a>.","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE, 2021."},"publication":"2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","date_created":"2023-01-24T10:11:30Z","department":[{"_id":"59"}],"type":"conference","author":[{"last_name":"Reker","first_name":"Julia","full_name":"Reker, Julia"},{"first_name":"Thorsten","last_name":"Meyers","full_name":"Meyers, Thorsten"},{"last_name":"Vidor","first_name":"Fabio F.","full_name":"Vidor, Fabio F."},{"full_name":"Joubert, Trudi-Heleen","last_name":"Joubert","first_name":"Trudi-Heleen"},{"id":"20179","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"year":"2021","status":"public","title":"Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics","date_updated":"2023-03-23T13:24:52Z","publication_status":"published","publisher":"IEEE","_id":"39388","language":[{"iso":"eng"}],"doi":"10.1109/fleps51544.2021.9469764","user_id":"20179"},{"citation":{"ieee":"I. R. Kaufmann, O. Zerey, T. Meyers, J. Reker, F. Vidor, and U. Hilleringmann, “A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application,” <i>Nanomaterials</i>, vol. 11, no. 5, Art. no. 1188, 2021, doi: <a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>.","mla":"Kaufmann, Ivan Rodrigo, et al. “A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application.” <i>Nanomaterials</i>, vol. 11, no. 5, 1188, MDPI AG, 2021, doi:<a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>.","apa":"Kaufmann, I. R., Zerey, O., Meyers, T., Reker, J., Vidor, F., &#38; Hilleringmann, U. (2021). A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application. <i>Nanomaterials</i>, <i>11</i>(5), Article 1188. <a href=\"https://doi.org/10.3390/nano11051188\">https://doi.org/10.3390/nano11051188</a>","bibtex":"@article{Kaufmann_Zerey_Meyers_Reker_Vidor_Hilleringmann_2021, title={A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application}, volume={11}, DOI={<a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>}, number={51188}, journal={Nanomaterials}, publisher={MDPI AG}, author={Kaufmann, Ivan Rodrigo and Zerey, Onur and Meyers, Thorsten and Reker, Julia and Vidor, Fábio and Hilleringmann, Ulrich}, year={2021} }","chicago":"Kaufmann, Ivan Rodrigo, Onur Zerey, Thorsten Meyers, Julia Reker, Fábio Vidor, and Ulrich Hilleringmann. “A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application.” <i>Nanomaterials</i> 11, no. 5 (2021). <a href=\"https://doi.org/10.3390/nano11051188\">https://doi.org/10.3390/nano11051188</a>.","ama":"Kaufmann IR, Zerey O, Meyers T, Reker J, Vidor F, Hilleringmann U. A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application. <i>Nanomaterials</i>. 2021;11(5). doi:<a href=\"https://doi.org/10.3390/nano11051188\">10.3390/nano11051188</a>","short":"I.R. Kaufmann, O. Zerey, T. Meyers, J. Reker, F. Vidor, U. Hilleringmann, Nanomaterials 11 (2021)."},"user_id":"20179","volume":11,"_id":"39383","publisher":"MDPI AG","status":"public","type":"journal_article","keyword":["General Materials Science","General Chemical Engineering"],"department":[{"_id":"59"}],"date_created":"2023-01-24T10:08:10Z","abstract":[{"text":"<jats:p>Zinc oxide nanoparticles (ZnO NP) used for the channel region in inverted coplanar setup in Thin Film Transistors (TFT) were the focus of this study. The regions between the source electrode and the ZnO NP and the drain electrode were under investigation as they produce a Schottky barrier in metal-semiconductor interfaces. A more general Thermionic emission theory must be evaluated: one that considers both metal/semiconductor interfaces (MSM structures). Aluminum, gold, and nickel were used as metallization layers for source and drain electrodes. An organic-inorganic nanocomposite was used as a gate dielectric. The TFTs transfer and output characteristics curves were extracted, and a numerical computational program was used for fitting the data; hence information about Schottky Barrier Height (SBH) and ideality factors for each TFT could be estimated. The nickel metallization appears with the lowest SBH among the metals investigated. For this metal and for higher drain-to-source voltages, the SBH tended to converge to some value around 0.3 eV. The developed fitting method showed good fitting accuracy even when the metallization produced different SBH in each metal-semiconductor interface, as was the case for gold metallization. The Schottky effect is also present and was studied when the drain-to-source voltages and/or the gate voltage were increased.</jats:p>","lang":"eng"}],"issue":"5","publication":"Nanomaterials","doi":"10.3390/nano11051188","article_number":"1188","language":[{"iso":"eng"}],"publication_status":"published","date_updated":"2023-03-22T10:27:25Z","intvolume":"        11","title":"A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application","year":"2021","author":[{"first_name":"Ivan Rodrigo","last_name":"Kaufmann","full_name":"Kaufmann, Ivan Rodrigo"},{"full_name":"Zerey, Onur","first_name":"Onur","last_name":"Zerey"},{"full_name":"Meyers, Thorsten","last_name":"Meyers","first_name":"Thorsten"},{"full_name":"Reker, Julia","last_name":"Reker","first_name":"Julia"},{"full_name":"Vidor, Fábio","last_name":"Vidor","first_name":"Fábio"},{"id":"20179","full_name":"Hilleringmann, Ulrich","first_name":"Ulrich","last_name":"Hilleringmann"}],"publication_identifier":{"issn":["2079-4991"]}},{"publication":"2021 Smart Systems Integration (SSI)","citation":{"mla":"Reker, Julia, et al. “Complementary Inverter Circuits on Flexible Substrates.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>.","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Complementary Inverter Circuits on Flexible Substrates. In: <i>2021 Smart Systems Integration (SSI)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>","bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Complementary Inverter Circuits on Flexible Substrates}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Complementary Inverter Circuits on Flexible Substrates. <i>2021 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Complementary Inverter Circuits on Flexible Substrates,” 2021, doi: <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">10.1109/ssi52265.2021.9466966</a>.","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Complementary Inverter Circuits on Flexible Substrates.” In <i>2021 Smart Systems Integration (SSI)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466966\">https://doi.org/10.1109/ssi52265.2021.9466966</a>.","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021."},"type":"conference","department":[{"_id":"59"}],"date_created":"2023-01-24T10:13:36Z","date_updated":"2023-03-22T10:26:21Z","publication_status":"published","status":"public","year":"2021","title":"Complementary Inverter Circuits on Flexible Substrates","author":[{"first_name":"Julia","last_name":"Reker","full_name":"Reker, Julia"},{"full_name":"Meyers, Thorsten","first_name":"Thorsten","last_name":"Meyers"},{"last_name":"Vidor","first_name":"Fabio F.","full_name":"Vidor, Fabio F."},{"last_name":"Joubert","first_name":"Trudi-Heleen","full_name":"Joubert, Trudi-Heleen"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich","id":"20179"}],"doi":"10.1109/ssi52265.2021.9466966","user_id":"20179","_id":"39395","publisher":"IEEE","language":[{"iso":"eng"}]},{"publication":"2021 IEEE AFRICON","citation":{"mla":"Andrews, George, et al. “The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting.” <i>2021 IEEE AFRICON</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>.","ama":"Andrews G, Hilleringmann U, Joubert T-H. The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting. In: <i>2021 IEEE AFRICON</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>","bibtex":"@inproceedings{Andrews_Hilleringmann_Joubert_2021, title={The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting}, DOI={<a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>}, booktitle={2021 IEEE AFRICON}, publisher={IEEE}, author={Andrews, George and Hilleringmann, Ulrich and Joubert, Trudi-Heleen}, year={2021} }","apa":"Andrews, G., Hilleringmann, U., &#38; Joubert, T.-H. (2021). The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting. <i>2021 IEEE AFRICON</i>. <a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">https://doi.org/10.1109/africon51333.2021.9570870</a>","ieee":"G. Andrews, U. Hilleringmann, and T.-H. Joubert, “The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting,” 2021, doi: <a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>.","chicago":"Andrews, George, Ulrich Hilleringmann, and Trudi-Heleen Joubert. “The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting.” In <i>2021 IEEE AFRICON</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">https://doi.org/10.1109/africon51333.2021.9570870</a>.","short":"G. Andrews, U. Hilleringmann, T.-H. Joubert, in: 2021 IEEE AFRICON, IEEE, 2021."},"type":"conference","department":[{"_id":"34"},{"_id":"59"}],"date_created":"2023-01-24T10:09:06Z","publication_status":"published","date_updated":"2023-03-23T13:29:55Z","status":"public","title":"The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting","year":"2021","author":[{"full_name":"Andrews, George","last_name":"Andrews","first_name":"George"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich","id":"20179"},{"last_name":"Joubert","first_name":"Trudi-Heleen","full_name":"Joubert, Trudi-Heleen"}],"user_id":"20179","doi":"10.1109/africon51333.2021.9570870","_id":"39385","language":[{"iso":"eng"}],"publisher":"IEEE"},{"date_updated":"2023-03-23T13:28:01Z","publication_status":"published","year":"2021","title":"The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting","status":"public","author":[{"full_name":"Andrews, George","first_name":"George","last_name":"Andrews"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179"},{"first_name":"Trudi-Heleen","last_name":"Joubert","full_name":"Joubert, Trudi-Heleen"}],"doi":"10.1109/africon51333.2021.9570870","user_id":"20179","_id":"39386","publisher":"IEEE","language":[{"iso":"eng"}],"publication":"2021 IEEE AFRICON","citation":{"short":"G. Andrews, U. Hilleringmann, T.-H. Joubert, in: 2021 IEEE AFRICON, IEEE, 2021.","chicago":"Andrews, George, Ulrich Hilleringmann, and Trudi-Heleen Joubert. “The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting.” In <i>2021 IEEE AFRICON</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">https://doi.org/10.1109/africon51333.2021.9570870</a>.","apa":"Andrews, G., Hilleringmann, U., &#38; Joubert, T.-H. (2021). The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting. <i>2021 IEEE AFRICON</i>. <a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">https://doi.org/10.1109/africon51333.2021.9570870</a>","ieee":"G. Andrews, U. Hilleringmann, and T.-H. Joubert, “The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting,” 2021, doi: <a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>.","ama":"Andrews G, Hilleringmann U, Joubert T-H. The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting. In: <i>2021 IEEE AFRICON</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>","bibtex":"@inproceedings{Andrews_Hilleringmann_Joubert_2021, title={The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting}, DOI={<a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>}, booktitle={2021 IEEE AFRICON}, publisher={IEEE}, author={Andrews, George and Hilleringmann, Ulrich and Joubert, Trudi-Heleen}, year={2021} }","mla":"Andrews, George, et al. “The Viability of a Non-Flow Capacitive Biosensing Microsystem for Whole Cell Counting.” <i>2021 IEEE AFRICON</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570870\">10.1109/africon51333.2021.9570870</a>."},"type":"conference","department":[{"_id":"34"},{"_id":"59"}],"date_created":"2023-01-24T10:11:05Z"},{"user_id":"8282","doi":"10.1109/ssi52265.2021.9466956","publisher":"IEEE","_id":"59780","language":[{"iso":"eng"}],"publication_status":"published","date_updated":"2026-02-24T19:14:58Z","author":[{"id":"8282","first_name":"Dmitry","last_name":"Petrov","full_name":"Petrov, Dmitry"},{"first_name":"Kim-Florian","last_name":"Taron","full_name":"Taron, Kim-Florian"},{"id":"20179","full_name":"Hilleringmann, Ulrich","first_name":"Ulrich","last_name":"Hilleringmann"},{"full_name":"Joubert, Trudi-Heleen","first_name":"Trudi-Heleen","last_name":"Joubert"}],"status":"public","year":"2021","title":"Low-cost Sensor System for on-the-field Water Quality Analysis","department":[{"_id":"59"},{"_id":"977"}],"type":"conference","date_created":"2025-05-03T07:58:46Z","citation":{"ieee":"D. Petrov, K.-F. Taron, U. Hilleringmann, and T.-H. Joubert, “Low-cost Sensor System for on-the-field Water Quality Analysis,” 2021, doi: <a href=\"https://doi.org/10.1109/ssi52265.2021.9466956\">10.1109/ssi52265.2021.9466956</a>.","apa":"Petrov, D., Taron, K.-F., Hilleringmann, U., &#38; Joubert, T.-H. (2021). Low-cost Sensor System for on-the-field Water Quality Analysis. <i>2021 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466956\">https://doi.org/10.1109/ssi52265.2021.9466956</a>","short":"D. Petrov, K.-F. Taron, U. Hilleringmann, T.-H. Joubert, in: 2021 Smart Systems Integration (SSI), IEEE, 2021.","chicago":"Petrov, Dmitry, Kim-Florian Taron, Ulrich Hilleringmann, and Trudi-Heleen Joubert. “Low-Cost Sensor System for on-the-Field Water Quality Analysis.” In <i>2021 Smart Systems Integration (SSI)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9466956\">https://doi.org/10.1109/ssi52265.2021.9466956</a>.","mla":"Petrov, Dmitry, et al. “Low-Cost Sensor System for on-the-Field Water Quality Analysis.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466956\">10.1109/ssi52265.2021.9466956</a>.","bibtex":"@inproceedings{Petrov_Taron_Hilleringmann_Joubert_2021, title={Low-cost Sensor System for on-the-field Water Quality Analysis}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9466956\">10.1109/ssi52265.2021.9466956</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Petrov, Dmitry and Taron, Kim-Florian and Hilleringmann, Ulrich and Joubert, Trudi-Heleen}, year={2021} }","ama":"Petrov D, Taron K-F, Hilleringmann U, Joubert T-H. Low-cost Sensor System for on-the-field Water Quality Analysis. In: <i>2021 Smart Systems Integration (SSI)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9466956\">10.1109/ssi52265.2021.9466956</a>"},"publication":"2021 Smart Systems Integration (SSI)"},{"language":[{"iso":"eng"}],"_id":"59777","publisher":"IEEE","doi":"10.1109/africon51333.2021.9570970","user_id":"8282","year":"2021","status":"public","title":"Local Power Control using Wireless Sensor System for Microgrids in Africa","author":[{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179"},{"first_name":"Dmitry","last_name":"Petrov","full_name":"Petrov, Dmitry","id":"8282"},{"full_name":"Mwammenywa, Ibrahim","last_name":"Mwammenywa","first_name":"Ibrahim"},{"full_name":"Kagarura, Geoffrey Mark","first_name":"Geoffrey Mark","last_name":"Kagarura","id":"88623"}],"date_updated":"2026-02-24T19:10:35Z","publication_status":"published","date_created":"2025-05-02T16:10:01Z","type":"conference","department":[{"_id":"59"},{"_id":"977"}],"publication":"2021 IEEE AFRICON","citation":{"bibtex":"@inproceedings{Hilleringmann_Petrov_Mwammenywa_Kagarura_2021, title={Local Power Control using Wireless Sensor System for Microgrids in Africa}, DOI={<a href=\"https://doi.org/10.1109/africon51333.2021.9570970\">10.1109/africon51333.2021.9570970</a>}, booktitle={2021 IEEE AFRICON}, publisher={IEEE}, author={Hilleringmann, Ulrich and Petrov, Dmitry and Mwammenywa, Ibrahim and Kagarura, Geoffrey Mark}, year={2021} }","ama":"Hilleringmann U, Petrov D, Mwammenywa I, Kagarura GM. Local Power Control using Wireless Sensor System for Microgrids in Africa. In: <i>2021 IEEE AFRICON</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570970\">10.1109/africon51333.2021.9570970</a>","mla":"Hilleringmann, Ulrich, et al. “Local Power Control Using Wireless Sensor System for Microgrids in Africa.” <i>2021 IEEE AFRICON</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/africon51333.2021.9570970\">10.1109/africon51333.2021.9570970</a>.","short":"U. Hilleringmann, D. Petrov, I. Mwammenywa, G.M. Kagarura, in: 2021 IEEE AFRICON, IEEE, 2021.","chicago":"Hilleringmann, Ulrich, Dmitry Petrov, Ibrahim Mwammenywa, and Geoffrey Mark Kagarura. “Local Power Control Using Wireless Sensor System for Microgrids in Africa.” In <i>2021 IEEE AFRICON</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/africon51333.2021.9570970\">https://doi.org/10.1109/africon51333.2021.9570970</a>.","ieee":"U. Hilleringmann, D. Petrov, I. Mwammenywa, and G. M. Kagarura, “Local Power Control using Wireless Sensor System for Microgrids in Africa,” 2021, doi: <a href=\"https://doi.org/10.1109/africon51333.2021.9570970\">10.1109/africon51333.2021.9570970</a>.","apa":"Hilleringmann, U., Petrov, D., Mwammenywa, I., &#38; Kagarura, G. M. (2021). Local Power Control using Wireless Sensor System for Microgrids in Africa. <i>2021 IEEE AFRICON</i>. <a href=\"https://doi.org/10.1109/africon51333.2021.9570970\">https://doi.org/10.1109/africon51333.2021.9570970</a>"}},{"date_created":"2023-01-24T10:14:17Z","department":[{"_id":"59"},{"_id":"977"}],"type":"conference","citation":{"mla":"Petrov, Dmitry, et al. “Microcontroller Firmware Design for Industrial Wireless Sensors.” <i>2021 Smart Systems Integration (SSI)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9467010\">10.1109/ssi52265.2021.9467010</a>.","ama":"Petrov D, Kroschewski K, Hilleringmann U. Microcontroller Firmware Design for Industrial Wireless Sensors. In: <i>2021 Smart Systems Integration (SSI)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/ssi52265.2021.9467010\">10.1109/ssi52265.2021.9467010</a>","bibtex":"@inproceedings{Petrov_Kroschewski_Hilleringmann_2021, title={Microcontroller Firmware Design for Industrial Wireless Sensors}, DOI={<a href=\"https://doi.org/10.1109/ssi52265.2021.9467010\">10.1109/ssi52265.2021.9467010</a>}, booktitle={2021 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Petrov, Dmitry and Kroschewski, Konstantin and Hilleringmann, Ulrich}, year={2021} }","apa":"Petrov, D., Kroschewski, K., &#38; Hilleringmann, U. (2021). Microcontroller Firmware Design for Industrial Wireless Sensors. <i>2021 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi52265.2021.9467010\">https://doi.org/10.1109/ssi52265.2021.9467010</a>","ieee":"D. Petrov, K. Kroschewski, and U. Hilleringmann, “Microcontroller Firmware Design for Industrial Wireless Sensors,” 2021, doi: <a href=\"https://doi.org/10.1109/ssi52265.2021.9467010\">10.1109/ssi52265.2021.9467010</a>.","chicago":"Petrov, Dmitry, Konstantin Kroschewski, and Ulrich Hilleringmann. “Microcontroller Firmware Design for Industrial Wireless Sensors.” In <i>2021 Smart Systems Integration (SSI)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/ssi52265.2021.9467010\">https://doi.org/10.1109/ssi52265.2021.9467010</a>.","short":"D. Petrov, K. Kroschewski, U. Hilleringmann, in: 2021 Smart Systems Integration (SSI), IEEE, 2021."},"publication":"2021 Smart Systems Integration (SSI)","language":[{"iso":"eng"}],"_id":"39397","publisher":"IEEE","user_id":"8282","doi":"10.1109/ssi52265.2021.9467010","author":[{"full_name":"Petrov, Dmitry","last_name":"Petrov","first_name":"Dmitry","id":"8282"},{"full_name":"Kroschewski, Konstantin","last_name":"Kroschewski","first_name":"Konstantin"},{"id":"20179","last_name":"Hilleringmann","first_name":"Ulrich","full_name":"Hilleringmann, Ulrich"}],"year":"2021","title":"Microcontroller Firmware Design for Industrial Wireless Sensors","status":"public","publication_status":"published","date_updated":"2026-02-24T19:11:22Z"},{"language":[{"iso":"eng"}],"doi":"10.25046/aj060529","author":[{"id":"8282","full_name":"Petrov, Dmitry","first_name":"Dmitry","last_name":"Petrov"},{"id":"20179","full_name":"Hilleringmann, Ulrich","first_name":"Ulrich","last_name":"Hilleringmann"}],"publication_identifier":{"issn":["2415-6698","2415-6698"]},"title":"Low-Power Primary Cell with Water-Based Electrolyte for Powering of Wireless Sensors","year":"2021","intvolume":"         6","date_updated":"2026-02-24T19:15:34Z","publication_status":"published","date_created":"2025-05-03T07:55:42Z","department":[{"_id":"59"},{"_id":"977"}],"type":"journal_article","issue":"5","publication":"Advances in Science, Technology and Engineering Systems Journal","_id":"59779","publisher":"ASTES Journal","page":"267-272","volume":6,"user_id":"8282","status":"public","citation":{"short":"D. Petrov, U. Hilleringmann, Advances in Science, Technology and Engineering Systems Journal 6 (2021) 267–272.","ama":"Petrov D, Hilleringmann U. Low-Power Primary Cell with Water-Based Electrolyte for Powering of Wireless Sensors. <i>Advances in Science, Technology and Engineering Systems Journal</i>. 2021;6(5):267-272. doi:<a href=\"https://doi.org/10.25046/aj060529\">10.25046/aj060529</a>","chicago":"Petrov, Dmitry, and Ulrich Hilleringmann. “Low-Power Primary Cell with Water-Based Electrolyte for Powering of Wireless Sensors.” <i>Advances in Science, Technology and Engineering Systems Journal</i> 6, no. 5 (2021): 267–72. <a href=\"https://doi.org/10.25046/aj060529\">https://doi.org/10.25046/aj060529</a>.","bibtex":"@article{Petrov_Hilleringmann_2021, title={Low-Power Primary Cell with Water-Based Electrolyte for Powering of Wireless Sensors}, volume={6}, DOI={<a href=\"https://doi.org/10.25046/aj060529\">10.25046/aj060529</a>}, number={5}, journal={Advances in Science, Technology and Engineering Systems Journal}, publisher={ASTES Journal}, author={Petrov, Dmitry and Hilleringmann, Ulrich}, year={2021}, pages={267–272} }","apa":"Petrov, D., &#38; Hilleringmann, U. (2021). Low-Power Primary Cell with Water-Based Electrolyte for Powering of Wireless Sensors. <i>Advances in Science, Technology and Engineering Systems Journal</i>, <i>6</i>(5), 267–272. <a href=\"https://doi.org/10.25046/aj060529\">https://doi.org/10.25046/aj060529</a>","mla":"Petrov, Dmitry, and Ulrich Hilleringmann. “Low-Power Primary Cell with Water-Based Electrolyte for Powering of Wireless Sensors.” <i>Advances in Science, Technology and Engineering Systems Journal</i>, vol. 6, no. 5, ASTES Journal, 2021, pp. 267–72, doi:<a href=\"https://doi.org/10.25046/aj060529\">10.25046/aj060529</a>.","ieee":"D. Petrov and U. Hilleringmann, “Low-Power Primary Cell with Water-Based Electrolyte for Powering of Wireless Sensors,” <i>Advances in Science, Technology and Engineering Systems Journal</i>, vol. 6, no. 5, pp. 267–272, 2021, doi: <a href=\"https://doi.org/10.25046/aj060529\">10.25046/aj060529</a>."}},{"date_updated":"2026-02-24T19:17:43Z","publication_status":"published","title":"Low-Cost NB-IoT Microgrid Power Quality Monitoring System","year":"2021","status":"public","author":[{"id":"8282","first_name":"Dmitry","last_name":"Petrov","full_name":"Petrov, Dmitry"},{"last_name":"Kroschewski","first_name":"Konstantin","full_name":"Kroschewski, Konstantin"},{"full_name":"Mwammenywa, Ibrahim","first_name":"Ibrahim","last_name":"Mwammenywa"},{"id":"88623","full_name":"Kagarura, Geoffrey Mark","first_name":"Geoffrey Mark","last_name":"Kagarura"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich","id":"20179"}],"doi":"10.1109/sensors47087.2021.9639641","user_id":"8282","publisher":"IEEE","_id":"59774","language":[{"iso":"eng"}],"publication":"2021 IEEE Sensors","citation":{"mla":"Petrov, Dmitry, et al. “Low-Cost NB-IoT Microgrid Power Quality Monitoring System.” <i>2021 IEEE Sensors</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/sensors47087.2021.9639641\">10.1109/sensors47087.2021.9639641</a>.","apa":"Petrov, D., Kroschewski, K., Mwammenywa, I., Kagarura, G. M., &#38; Hilleringmann, U. (2021). Low-Cost NB-IoT Microgrid Power Quality Monitoring System. <i>2021 IEEE Sensors</i>. <a href=\"https://doi.org/10.1109/sensors47087.2021.9639641\">https://doi.org/10.1109/sensors47087.2021.9639641</a>","ieee":"D. Petrov, K. Kroschewski, I. Mwammenywa, G. M. Kagarura, and U. Hilleringmann, “Low-Cost NB-IoT Microgrid Power Quality Monitoring System,” 2021, doi: <a href=\"https://doi.org/10.1109/sensors47087.2021.9639641\">10.1109/sensors47087.2021.9639641</a>.","ama":"Petrov D, Kroschewski K, Mwammenywa I, Kagarura GM, Hilleringmann U. Low-Cost NB-IoT Microgrid Power Quality Monitoring System. In: <i>2021 IEEE Sensors</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/sensors47087.2021.9639641\">10.1109/sensors47087.2021.9639641</a>","short":"D. Petrov, K. Kroschewski, I. Mwammenywa, G.M. Kagarura, U. Hilleringmann, in: 2021 IEEE Sensors, IEEE, 2021.","chicago":"Petrov, Dmitry, Konstantin Kroschewski, Ibrahim Mwammenywa, Geoffrey Mark Kagarura, and Ulrich Hilleringmann. “Low-Cost NB-IoT Microgrid Power Quality Monitoring System.” In <i>2021 IEEE Sensors</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/sensors47087.2021.9639641\">https://doi.org/10.1109/sensors47087.2021.9639641</a>.","bibtex":"@inproceedings{Petrov_Kroschewski_Mwammenywa_Kagarura_Hilleringmann_2021, title={Low-Cost NB-IoT Microgrid Power Quality Monitoring System}, DOI={<a href=\"https://doi.org/10.1109/sensors47087.2021.9639641\">10.1109/sensors47087.2021.9639641</a>}, booktitle={2021 IEEE Sensors}, publisher={IEEE}, author={Petrov, Dmitry and Kroschewski, Konstantin and Mwammenywa, Ibrahim and Kagarura, Geoffrey Mark and Hilleringmann, Ulrich}, year={2021} }"},"type":"conference","department":[{"_id":"59"},{"_id":"977"}],"date_created":"2025-05-02T16:01:20Z"},{"keyword":["Near-Field Scanner","Near-Field to Far-Field Transformation","Directivity","Surface Equivalence Theorem","Huygens’ Box"],"type":"conference","department":[{"_id":"59"},{"_id":"485"}],"date_created":"2021-03-18T13:43:53Z","related_material":{"record":[{"status":"public","relation":"original","id":"21541"}]},"abstract":[{"text":"In this publication, the near-field to far-field transformation using the self-built near-field scanner NFS3000 is examined with regard to its geometry. This device allows to measure electric and magnetic fields in small distances to the DUT (Device under Test) with high geometric precision and high sensitivity. Leading to a fast examination of EMC (Electromagnetic Compatibility) problems, because the electromagnetic properties are better understandable and therefore easier to solve than e.g. measurements in a far-field chamber. In addition, it is possible to extrapolate the near-fields into the far-field and to determine the radiation pattern of antennas and emitting objects. For this purpose, this paper deals with the basis of this transformation, the so-called surface equivalence theorem. This principle is then adapted to the measurement of near-field scanners and implemented accordingly. Due to the non-ideal design of the near-field scanner, the effects on a far-field transformation are finally presented and discussed.","lang":"eng"}],"publication":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","doi":"10.1109/emceurope48519.2020.9245697","main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9245697"}],"language":[{"iso":"eng"}],"date_updated":"2022-01-06T06:55:03Z","publication_status":"published","year":"2020","title":"Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000","author":[{"id":"38240","full_name":"Lange, Sven","last_name":"Lange","first_name":"Sven"},{"full_name":"Schroder, Dominik","first_name":"Dominik","last_name":"Schroder"},{"last_name":"Hedayat","first_name":"Christian","full_name":"Hedayat, Christian"},{"first_name":"Christian","last_name":"Hangmann","full_name":"Hangmann, Christian"},{"full_name":"Otto, Thomas","first_name":"Thomas","last_name":"Otto"},{"full_name":"Hilleringmann, Ulrich","first_name":"Ulrich","last_name":"Hilleringmann"}],"publication_identifier":{"issn":["2325-0364 "],"isbn":["978-1-7281-5580-7"],"eisbn":["978-1-7281-5579-1"]},"project":[{"name":"Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"citation":{"ieee":"S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, and U. Hilleringmann, “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000,” in <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>, Rome, Italy , 2020.","apa":"Lange, S., Schroder, D., Hedayat, C., Hangmann, C., Otto, T., &#38; Hilleringmann, U. (2020). Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000. In <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. Rome, Italy : IEEE. <a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">https://doi.org/10.1109/emceurope48519.2020.9245697</a>","chicago":"Lange, Sven, Dominik Schroder, Christian Hedayat, Christian Hangmann, Thomas Otto, and Ulrich Hilleringmann. “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.” In <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. IEEE, 2020. <a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">https://doi.org/10.1109/emceurope48519.2020.9245697</a>.","short":"S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.","mla":"Lange, Sven, et al. “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.” <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>.","bibtex":"@inproceedings{Lange_Schroder_Hedayat_Hangmann_Otto_Hilleringmann_2020, title={Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000}, DOI={<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>}, booktitle={2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE}, publisher={IEEE}, author={Lange, Sven and Schroder, Dominik and Hedayat, Christian and Hangmann, Christian and Otto, Thomas and Hilleringmann, Ulrich}, year={2020} }","ama":"Lange S, Schroder D, Hedayat C, Hangmann C, Otto T, Hilleringmann U. Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000. In: <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. IEEE; 2020. doi:<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>"},"user_id":"38240","_id":"21541","publisher":"IEEE","status":"public","conference":{"end_date":"2020-09-25","location":"Rome, Italy ","start_date":"2020-09-23","name":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE"}},{"_id":"39404","language":[{"iso":"eng"}],"publisher":"IEEE","user_id":"20179","doi":"10.1109/emceurope48519.2020.9245697","year":"2020","title":"Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000","status":"public","author":[{"full_name":"Lange, Sven","last_name":"Lange","first_name":"Sven"},{"full_name":"Schroder, Dominik","first_name":"Dominik","last_name":"Schroder"},{"full_name":"Hedayat, Christian","first_name":"Christian","last_name":"Hedayat"},{"full_name":"Hangmann, Christian","last_name":"Hangmann","first_name":"Christian"},{"last_name":"Otto","first_name":"Thomas","full_name":"Otto, Thomas"},{"id":"20179","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich"}],"publication_status":"published","date_updated":"2023-03-21T10:00:58Z","date_created":"2023-01-24T10:21:48Z","type":"conference","department":[{"_id":"59"}],"publication":"2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE","citation":{"ieee":"S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, and U. Hilleringmann, “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000,” 2020, doi: <a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>.","apa":"Lange, S., Schroder, D., Hedayat, C., Hangmann, C., Otto, T., &#38; Hilleringmann, U. (2020). Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000. <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. <a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">https://doi.org/10.1109/emceurope48519.2020.9245697</a>","chicago":"Lange, Sven, Dominik Schroder, Christian Hedayat, Christian Hangmann, Thomas Otto, and Ulrich Hilleringmann. “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.” In <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. IEEE, 2020. <a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">https://doi.org/10.1109/emceurope48519.2020.9245697</a>.","short":"S. Lange, D. Schroder, C. Hedayat, C. Hangmann, T. Otto, U. Hilleringmann, in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, IEEE, 2020.","mla":"Lange, Sven, et al. “Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000.” <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>.","bibtex":"@inproceedings{Lange_Schroder_Hedayat_Hangmann_Otto_Hilleringmann_2020, title={Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000}, DOI={<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>}, booktitle={2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE}, publisher={IEEE}, author={Lange, Sven and Schroder, Dominik and Hedayat, Christian and Hangmann, Christian and Otto, Thomas and Hilleringmann, Ulrich}, year={2020} }","ama":"Lange S, Schroder D, Hedayat C, Hangmann C, Otto T, Hilleringmann U. Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000. In: <i>2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE</i>. IEEE; 2020. doi:<a href=\"https://doi.org/10.1109/emceurope48519.2020.9245697\">10.1109/emceurope48519.2020.9245697</a>"}},{"citation":{"bibtex":"@inproceedings{Hilleringmann_2020, title={27th European Solid-State Device Research Conference}, DOI={<a href=\"https://doi.org/10.1109/essderc.1997\">10.1109/essderc.1997</a>}, publisher={IEEE}, author={Hilleringmann, Ulrich}, year={2020} }","ama":"Hilleringmann U. 27th European Solid-State Device Research Conference. In: IEEE; 2020. doi:<a href=\"https://doi.org/10.1109/essderc.1997\">10.1109/essderc.1997</a>","mla":"Hilleringmann, Ulrich. <i>27th European Solid-State Device Research Conference</i>. 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(2020). <i>27th European Solid-State Device Research Conference</i>. <a href=\"https://doi.org/10.1109/essderc.1997\">https://doi.org/10.1109/essderc.1997</a>"},"department":[{"_id":"59"}],"type":"conference","date_created":"2023-01-25T09:17:41Z","publication_status":"published","date_updated":"2023-03-21T10:15:54Z","author":[{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179"}],"publication_identifier":{"isbn":["2863322214"]},"status":"public","title":"27th European Solid-State Device Research Conference","year":"2020","user_id":"20179","doi":"10.1109/essderc.1997","language":[{"iso":"eng"}],"_id":"39897","publisher":"IEEE"},{"status":"public","title":"Designing Mixed-Signal PLLs regarding Multiple Requirements taking Non-Ideal Effects into Account","year":"2020","author":[{"first_name":"Christian","last_name":"Hangmann","full_name":"Hangmann, Christian"},{"last_name":"Hedayat","first_name":"Christian","full_name":"Hedayat, Christian"},{"id":"20179","first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"}],"date_updated":"2023-03-22T10:17:42Z","publication_status":"published","language":[{"iso":"eng"}],"_id":"39413","publisher":"IEEE","doi":"10.1109/newcas44328.2019.8961261","user_id":"20179","publication":"2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)","citation":{"chicago":"Hangmann, Christian, Christian Hedayat, and Ulrich Hilleringmann. “Designing Mixed-Signal PLLs Regarding Multiple Requirements Taking Non-Ideal Effects into Account.” In <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>. 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Designing Mixed-Signal PLLs regarding Multiple Requirements taking Non-Ideal Effects into Account. In: <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>. IEEE; 2020. doi:<a href=\"https://doi.org/10.1109/newcas44328.2019.8961261\">10.1109/newcas44328.2019.8961261</a>","bibtex":"@inproceedings{Hangmann_Hedayat_Hilleringmann_2020, title={Designing Mixed-Signal PLLs regarding Multiple Requirements taking Non-Ideal Effects into Account}, DOI={<a href=\"https://doi.org/10.1109/newcas44328.2019.8961261\">10.1109/newcas44328.2019.8961261</a>}, booktitle={2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)}, publisher={IEEE}, author={Hangmann, Christian and Hedayat, Christian and Hilleringmann, Ulrich}, year={2020} }","mla":"Hangmann, Christian, et al. “Designing Mixed-Signal PLLs Regarding Multiple Requirements Taking Non-Ideal Effects into Account.” <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/newcas44328.2019.8961261\">10.1109/newcas44328.2019.8961261</a>."},"date_created":"2023-01-24T10:29:16Z","type":"conference","department":[{"_id":"59"}]},{"language":[{"iso":"eng"}],"_id":"39410","publisher":"IEEE","user_id":"20179","doi":"10.1109/newcas44328.2019.8961227","author":[{"last_name":"Lange","first_name":"Sven","full_name":"Lange, Sven"},{"first_name":"Dominik","last_name":"Schroder","full_name":"Schroder, Dominik"},{"full_name":"Hedayat, Christian","last_name":"Hedayat","first_name":"Christian"},{"full_name":"Otto, Thomas","last_name":"Otto","first_name":"Thomas"},{"first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich","id":"20179"}],"year":"2020","title":"Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics","status":"public","publication_status":"published","date_updated":"2023-03-23T08:11:10Z","date_created":"2023-01-24T10:28:20Z","department":[{"_id":"59"}],"type":"conference","citation":{"bibtex":"@inproceedings{Lange_Schroder_Hedayat_Otto_Hilleringmann_2020, title={Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics}, DOI={<a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">10.1109/newcas44328.2019.8961227</a>}, booktitle={2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)}, publisher={IEEE}, author={Lange, Sven and Schroder, Dominik and Hedayat, Christian and Otto, Thomas and Hilleringmann, Ulrich}, year={2020} }","ama":"Lange S, Schroder D, Hedayat C, Otto T, Hilleringmann U. Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics. In: <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>. IEEE; 2020. doi:<a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">10.1109/newcas44328.2019.8961227</a>","mla":"Lange, Sven, et al. “Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics.” <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">10.1109/newcas44328.2019.8961227</a>.","chicago":"Lange, Sven, Dominik Schroder, Christian Hedayat, Thomas Otto, and Ulrich Hilleringmann. “Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics.” In <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>. IEEE, 2020. <a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">https://doi.org/10.1109/newcas44328.2019.8961227</a>.","short":"S. Lange, D. Schroder, C. Hedayat, T. Otto, U. Hilleringmann, in: 2019 17th IEEE International New Circuits and Systems Conference (NEWCAS), IEEE, 2020.","ieee":"S. Lange, D. Schroder, C. Hedayat, T. Otto, and U. Hilleringmann, “Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics,” 2020, doi: <a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">10.1109/newcas44328.2019.8961227</a>.","apa":"Lange, S., Schroder, D., Hedayat, C., Otto, T., &#38; Hilleringmann, U. (2020). Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics. <i>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</i>. <a href=\"https://doi.org/10.1109/newcas44328.2019.8961227\">https://doi.org/10.1109/newcas44328.2019.8961227</a>"},"publication":"2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)"}]