[{"license":"https://creativecommons.org/licenses/by-nc-sa/3.0/","publication":"Musik – Digitalisierung – Bildung","language":[{"iso":"ger"}],"ddc":["780"],"year":"2024","title":"Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse","date_created":"2024-04-23T12:56:15Z","publisher":"kopaed","status":"public","editor":[{"full_name":"Neuhaus, Daniela","last_name":"Neuhaus","first_name":"Daniela"},{"last_name":"Keden","full_name":"Keden, Helmke Jan","first_name":"Helmke Jan"}],"type":"book_chapter","department":[{"_id":"131"},{"_id":"540"}],"user_id":"99991","_id":"53624","page":"77-96","citation":{"chicago":"Neuhausen, Timo, and Michael Ahlers. “Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse.” In <i>Musik – Digitalisierung – Bildung</i>, edited by Daniela Neuhaus and Helmke Jan Keden, 77–96. München: kopaed, 2024.","ieee":"T. Neuhausen and M. Ahlers, “Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse,” in <i>Musik – Digitalisierung – Bildung</i>, D. Neuhaus and H. J. Keden, Eds. München: kopaed, 2024, pp. 77–96.","ama":"Neuhausen T, Ahlers M. Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse. In: Neuhaus D, Keden HJ, eds. <i>Musik – Digitalisierung – Bildung</i>. kopaed; 2024:77-96.","bibtex":"@inbook{Neuhausen_Ahlers_2024, place={München}, title={Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse}, booktitle={Musik – Digitalisierung – Bildung}, publisher={kopaed}, author={Neuhausen, Timo and Ahlers, Michael}, editor={Neuhaus, Daniela and Keden, Helmke Jan}, year={2024}, pages={77–96} }","mla":"Neuhausen, Timo, and Michael Ahlers. “Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse.” <i>Musik – Digitalisierung – Bildung</i>, edited by Daniela Neuhaus and Helmke Jan Keden, kopaed, 2024, pp. 77–96.","short":"T. Neuhausen, M. Ahlers, in: D. Neuhaus, H.J. Keden (Eds.), Musik – Digitalisierung – Bildung, kopaed, München, 2024, pp. 77–96.","apa":"Neuhausen, T., &#38; Ahlers, M. (2024). Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse. In D. Neuhaus &#38; H. J. Keden (Eds.), <i>Musik – Digitalisierung – Bildung</i> (pp. 77–96). kopaed."},"place":"München","publication_identifier":{"unknown":["978-3-96848-728-1"]},"publication_status":"published","main_file_link":[{"open_access":"1","url":"https://www.pedocs.de/volltexte/2024/31459/pdf/Neuhaus_Keden_2024_Musik_Digitalisierung_Bildung.pdf"}],"author":[{"first_name":"Timo","id":"99991","full_name":"Neuhausen, Timo","orcid":"0000-0002-8262-767X","last_name":"Neuhausen"},{"first_name":"Michael","full_name":"Ahlers, Michael","last_name":"Ahlers"}],"oa":"1","date_updated":"2025-02-06T10:49:26Z"},{"department":[{"_id":"151"}],"user_id":"210","_id":"9979","language":[{"iso":"eng"}],"keyword":["Kontaktmodellierung","Rauigkeit"],"type":"dissertation","status":"public","date_created":"2019-05-27T09:43:14Z","author":[{"full_name":"Neuhaus, Jan","last_name":"Neuhaus","first_name":"Jan"}],"date_updated":"2023-09-15T12:26:35Z","publisher":"Shaker","title":"Multiskalen-Kontaktmodellierung unter Berücksichtigung der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts","citation":{"mla":"Neuhaus, Jan. <i>Multiskalen-Kontaktmodellierung Unter Berücksichtigung Der Rauigkeit Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts</i>. Shaker, 2017.","short":"J. Neuhaus, Multiskalen-Kontaktmodellierung Unter Berücksichtigung Der Rauigkeit Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts, Shaker, 2017.","bibtex":"@book{Neuhaus_2017, title={Multiskalen-Kontaktmodellierung unter Berücksichtigung der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts}, publisher={Shaker}, author={Neuhaus, Jan}, year={2017} }","apa":"Neuhaus, J. (2017). <i>Multiskalen-Kontaktmodellierung unter Berücksichtigung der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts</i>. Shaker.","ieee":"J. Neuhaus, <i>Multiskalen-Kontaktmodellierung unter Berücksichtigung der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts</i>. Shaker, 2017.","chicago":"Neuhaus, Jan. <i>Multiskalen-Kontaktmodellierung Unter Berücksichtigung Der Rauigkeit Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts</i>. Shaker, 2017.","ama":"Neuhaus J. <i>Multiskalen-Kontaktmodellierung Unter Berücksichtigung Der Rauigkeit Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts</i>. Shaker; 2017."},"year":"2017"},{"abstract":[{"text":"The contact between viscoelastic materials e.g. elastomers and a rough surface leads to a special friction characteristic, which differs greatly in its properties comparing to other materials like metals. In practice, this friction combination occurs for example in the tire-road contact, or in the use of rubber gaskets. Due to the frictional forces a system is significantly influenced in its vibrational properties. The friction force is composed of two main components adhesion and hysteresis. The adhesion results from molecular bounds between the contact partners, while the deformation of the viscoelastic material by the roughness of the counter body leads to power loss. This internal friction results in an additional frictional force, which is described by the hysteresis. To simulate the frictional behaviour of elastomers on rough surfaces and thus to determine the energy dissipation in contact, it is necessary to develop a mechanical model which considers the roughness of the contact partners, as well as dynamic effects and the dependence on normal pressure and sliding speed. The viscoelastic material behaviour must also be considered. The contact between two rough surfaces is modelled as a rough rigid layer contacting a rough elas- tic layer. The elastic layer is modelled by point masses connected by Maxwell-elements. This allows the viscoelastic properties of the elastomer to be considered. The behaviour of whole system can be described by equations of motion with integrated constraints. The degrees of freedom of the model depends on the varying contact conditions. A point mass not in contact has two degrees of freedom. A point mass in contact moving along the roughness path can be described by only one degree of freedom. For each Maxwell-Element also an inner coordinate and thus a further degree of freedom is needed. Because of varying contact conditions dur- ing the simulation, the simulation interrupts in case the contact conditions change. Then the equations of motions are adapted with respect to the contact constraints. As a result of the simulation one obtain the energy dissipation and thus the friction char- acteristic during the friction process. It is possible to use these results in three dimensional point-contact elements in order to model contact surfaces on lager length scales.","lang":"eng"}],"status":"public","publication":"Proceedings of ICoEV 2015 International Conference on Engineering Vibration","type":"conference","keyword":["Contact Mechanics","Viscoelastic Material","Adhesive Friction","Hysteresis Friction","Energy Dissipation","Vibration"],"language":[{"iso":"eng"}],"_id":"9952","department":[{"_id":"151"}],"user_id":"55222","year":"2015","page":"1109-1117","citation":{"mla":"Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–17.","bibtex":"@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte, Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }","short":"F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International Conference on Engineering Vibration, 2015, pp. 1109–1117.","apa":"Schulte, F., Neuhaus, J., &#38; Sextro, W. (2015). A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i> (pp. 1109–1117).","ama":"Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In: <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>. ; 2015:1109-1117.","ieee":"F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties,” in <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp. 1109–1117.","chicago":"Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>, 1109–17, 2015."},"quality_controlled":"1","title":"A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties","date_updated":"2019-09-16T10:47:53Z","author":[{"first_name":"Frank","full_name":"Schulte, Frank","last_name":"Schulte"},{"first_name":"Jan","full_name":"Neuhaus, Jan","last_name":"Neuhaus"},{"last_name":"Sextro","full_name":"Sextro, Walter","id":"21220","first_name":"Walter"}],"date_created":"2019-05-27T08:37:22Z"},{"quality_controlled":"1","year":"2014","citation":{"ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014. <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>.","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.","mla":"Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">10.1109/ECTC.2014.6897500</a>.","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the bond quality of copper wire bonds using a friction model approach. In <i>Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555). <a href=\"https://doi.org/10.1109/ECTC.2014.6897500\">https://doi.org/10.1109/ECTC.2014.6897500</a>"},"page":"1549-1555","date_updated":"2019-09-16T10:57:58Z","date_created":"2019-05-20T12:11:44Z","author":[{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"first_name":"Jan","last_name":"Neuhaus","full_name":"Neuhaus, Jan"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"last_name":"Sextro","id":"21220","full_name":"Sextro, Walter","first_name":"Walter"}],"title":"Improving the bond quality of copper wire bonds using a friction model approach","doi":"10.1109/ECTC.2014.6897500","type":"conference","publication":"Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th","abstract":[{"text":"In order to increase mechanical strength, heat dissipation and ampacity and to decrease failure through fatigue fracture, wedge copper wire bonding is being introduced as a standard interconnection method for mass production. To achieve the same process stability when using copper wire instead of aluminum wire a profound understanding of the bonding process is needed. Due to the higher hardness of copper compared to aluminum wire it is more difficult to approach the surfaces of wire and substrate to a level where van der Waals forces are able to arise between atoms. Also, enough friction energy referred to the total contact area has to be generated to activate the surfaces. Therefore, a friction model is used to simulate the joining process. This model calculates the resulting energy of partial areas in the contact surface and provides information about the adhesion process of each area. The focus here is on the arising of micro joints in the contact area depending on the location in the contact and time. To validate the model, different touchdown forces are used to vary the initial contact areas of wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built up to identify the known phases of pre-deforming, cleaning, adhering and diffusing for the real bonding process to map with the model. Test substrates as DBC and copper plate are used to show the different formations of a wedge bond connection due to hardness and reaction propensity. The experiments were done by using 500 $\\mu$m copper wire and a standard V-groove tool.","lang":"eng"}],"status":"public","_id":"9868","user_id":"55222","department":[{"_id":"151"}],"keyword":["adhesion","circuit reliability","deformation","diffusion","fatigue cracks","friction","interconnections","lead bonding","van der Waals forces","Cu","adhering process","adhesion process","ampacity improvement","bond quality improvement","cleaning process","diffusing process","fatigue fracture failure","friction energy","friction model","heat dissipation","mechanical strength","piezoelectric triaxial force sensor","predeforming process","size 500 mum","total contact area","van der Waals forces","wedge copper wire bonding","Bonding","Copper","Finite element analysis","Force","Friction","Substrates","Wires"],"language":[{"iso":"eng"}]},{"date_created":"2019-05-20T13:23:02Z","author":[{"full_name":"Neuhaus, Jan","last_name":"Neuhaus","first_name":"Jan"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"}],"publisher":"ScienTech Publisher","date_updated":"2019-09-16T10:59:46Z","title":"Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements","quality_controlled":"1","citation":{"ama":"Neuhaus J, Sextro W. Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements. In: Liu GR, Guan ZW, eds. <i>Proceedings of the 5th International Conference on Computational Methods</i>. ScienTech Publisher; 2014.","ieee":"J. Neuhaus and W. Sextro, “Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements,” in <i>Proceedings of the 5th International Conference on Computational Methods</i>, 2014.","chicago":"Neuhaus, Jan, and Walter Sextro. “Thermo-Mechanical Model for Wheel Rail Contact Using Coupled Point Contact Elements.” In <i>Proceedings of the 5th International Conference on Computational Methods</i>, edited by G.R. Liu and Z.W. Guan. ScienTech Publisher, 2014.","bibtex":"@inproceedings{Neuhaus_Sextro_2014, title={Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements}, booktitle={Proceedings of the 5th International Conference on Computational Methods}, publisher={ScienTech Publisher}, author={Neuhaus, Jan and Sextro, Walter}, editor={Liu, G.R. and Guan, Z.W.Editors}, year={2014} }","mla":"Neuhaus, Jan, and Walter Sextro. “Thermo-Mechanical Model for Wheel Rail Contact Using Coupled Point Contact Elements.” <i>Proceedings of the 5th International Conference on Computational Methods</i>, edited by G.R. Liu and Z.W. Guan, ScienTech Publisher, 2014.","short":"J. Neuhaus, W. Sextro, in: G.R. Liu, Z.W. Guan (Eds.), Proceedings of the 5th International Conference on Computational Methods, ScienTech Publisher, 2014.","apa":"Neuhaus, J., &#38; Sextro, W. (2014). Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements. In G. R. Liu &#38; Z. W. Guan (Eds.), <i>Proceedings of the 5th International Conference on Computational Methods</i>. ScienTech Publisher."},"year":"2014","user_id":"55222","department":[{"_id":"151"}],"_id":"9887","language":[{"iso":"eng"}],"keyword":["Rolling Contact","Discrete Elements","Contact Stiffness","Temperature"],"type":"conference","publication":"Proceedings of the 5th International Conference on Computational Methods","status":"public","abstract":[{"text":"A model to calculate the locally resolved tangential contact forces of the wheel rail contact with respect to contact kinematics, material and surface properties as well as temperature is introduced. The elasticity of wheel and rail is modeled as an elastic layer consisting of point contact elements connected by springs to each other and to the wheel. Each element has two degrees of freedom in tangential directions. The resulting total stiffness matrix is reduced to calculate only the position of the elements in contact. Friction forces as well as contact stiffnesses are incorporated by a nonlinear force-displacement characteristic, which originates from a detailed contact model. The contact elements are transported through the contact zone in discrete time steps. After each time step an equilibrium is calculated. For all elements, their temperature and its influence on local friction are regarded by calculating friction power and temperature each time step.","lang":"eng"}],"editor":[{"last_name":"Liu","full_name":"Liu, G.R.","first_name":"G.R."},{"first_name":"Z.W.","full_name":"Guan, Z.W.","last_name":"Guan"}]},{"user_id":"55222","department":[{"_id":"151"}],"_id":"9797","language":[{"iso":"eng"}],"keyword":["Wire bonding","friction modeling","wire bond quality","contact element modeling"],"type":"conference","publication":"IMAPS 2013, 46th International Symposium on Microelectronics","status":"public","abstract":[{"text":"A model approach for wedge/wedge bonding copper wire is presented. The connection between wire and substrate is based on a variety of physical effects, but the dominant one is the friction based welding while applying ultrasound. Consequently, a friction model was used to investigate the welding process. This model is built up universal and can be used to describe the formation of micro welds in the time variant contact area between wire and substrate. Aim of the model is to identify the interactions between touchdown, bond normal force, ultrasonic power and bonding time. To do so, the contact area is discretized into partial areas where a Point Contact Model is applied. Based on this approach it is possible to simulate micro and macro slip inside the contact area between wire and substrate. The work done by friction force is a main criterion to define occurring micro joints which influence the subsequent welding.","lang":"eng"}],"author":[{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"first_name":"Jan","last_name":"Neuhaus","full_name":"Neuhaus, Jan"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"full_name":"Sextro, Walter","id":"21220","last_name":"Sextro","first_name":"Walter"}],"date_created":"2019-05-13T13:55:36Z","date_updated":"2022-01-06T07:04:20Z","doi":"10.4071/isom-2013-TA67","title":"A friction based approach for modeling wire bonding","citation":{"ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA; 2013. doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013.","short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.","mla":"Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>.","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>"},"place":"Orlando (Florida), USA","year":"2013"}]