[{"title":"Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding","year":"2022","status":"public","author":[{"first_name":"Claus","last_name":"Scheidemann","full_name":"Scheidemann, Claus","id":"38259"},{"full_name":"Kirsch, Olaf","first_name":"Olaf","last_name":"Kirsch"},{"id":"210","last_name":"Hemsel","first_name":"Tobias","full_name":"Hemsel, Tobias"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"}],"date_updated":"2023-09-22T12:24:18Z","publication_status":"published","language":[{"iso":"eng"}],"_id":"34104","publisher":"IEEE","doi":"10.1109/estc55720.2022.9939478","user_id":"38259","publication":"2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)","citation":{"short":"C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.","chicago":"Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>. IEEE, 2022. <a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">https://doi.org/10.1109/estc55720.2022.9939478</a>.","ieee":"C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: <a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>.","apa":"Scheidemann, C., Kirsch, O., Hemsel, T., &#38; Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>. <a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">https://doi.org/10.1109/estc55720.2022.9939478</a>","bibtex":"@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={<a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>}, booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022} }","ama":"Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>. IEEE; 2022. doi:<a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>","mla":"Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>."},"quality_controlled":"1","abstract":[{"lang":"eng","text":"ue to the constantly growing energy demand of power electronics and the need to reduce the size of electronic components like power modules for e-mobility, new challenges arise for ultrasonic wire bonding: the electrical connection must endure higher thermal and mechanical stress while the connecting partners become more sensitive or require more energy to get bonded. Past investigations have shown already that multi-dimensional ultrasonic bonding and welding yield the same or even better bond quality while reducing the load on the components. This contribution is intended to show whether multidi-mensional thick wire bonding is a promising concept to over-come the new challenges. The focus is on experimental investi-gations of different bond tool trajectories in ultrasonic wire bonding of aluminum and copper wire on DCB's and chips. The bond quality is analyzed by shear tests, microsections and, in the case of aluminum bonding, by a new machine learning method for an objective automated evaluation of the sheared area."}],"date_created":"2022-11-17T15:17:39Z","type":"conference","department":[{"_id":"151"}]},{"publication_status":"published","date_updated":"2023-09-21T14:28:50Z","author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"first_name":"Florian","last_name":"Eacock","full_name":"Eacock, Florian"},{"full_name":"Dymel, Collin","last_name":"Dymel","first_name":"Collin"},{"full_name":"Hemsel, Tobias","first_name":"Tobias","last_name":"Hemsel"},{"full_name":"Hunstig, Matthias","first_name":"Matthias","last_name":"Hunstig"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter"}],"publication_identifier":{"issn":["2380-4505"]},"year":"2019","title":"Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding","doi":"10.4071/2380-4505-2019.1.000509","language":[{"iso":"eng"}],"abstract":[{"text":"<jats:p> Ultrasonic joining is a common industrial process. To build electrical connections in the electronics industry, uni-axial and torsional ultrasonic vibration have been used to join different types of workpieces for decades. Many influencing factors like ultrasonic power, bond normal force, bond duration and frequency are known to have a high impact on bond quality and reliability. Multi-dimensional bonding has been investigated in the past to increase ultrasonic power and consequently bond strength. This contribution is focused on the comparison of circular, multi-frequency planar and uniaxial vibration trajectories used for ultrasonic bonding of copper pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic microscopy and interface cross-sections. </jats:p>","lang":"eng"}],"publication":"International Symposium on Microelectronics","department":[{"_id":"151"}],"type":"conference","date_created":"2019-12-24T21:41:04Z","file":[{"content_type":"application/pdf","success":1,"file_id":"15413","date_updated":"2019-12-24T21:43:59Z","relation":"main_file","access_level":"closed","file_size":1010930,"file_name":"2380-4505-2019.1.000509.pdf","date_created":"2019-12-24T21:43:59Z","creator":"schemmel"}],"has_accepted_license":"1","conference":{"name":"International Symposium on Microelectronics","location":"Boston"},"status":"public","user_id":"210","ddc":["620"],"_id":"15412","page":"509-514","quality_controlled":"1","citation":{"chicago":"Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In <i>International Symposium on Microelectronics</i>, 509–14, 2019. <a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">https://doi.org/10.4071/2380-4505-2019.1.000509</a>.","short":"R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.","ieee":"R. Schemmel <i>et al.</i>, “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in <i>International Symposium on Microelectronics</i>, Boston, 2019, pp. 509–514, doi: <a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>.","apa":"Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. <i>International Symposium on Microelectronics</i>, 509–514. <a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">https://doi.org/10.4071/2380-4505-2019.1.000509</a>","bibtex":"@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title={Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>}, booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }","ama":"Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. In: <i>International Symposium on Microelectronics</i>. ; 2019:509-514. doi:<a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>","mla":"Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” <i>International Symposium on Microelectronics</i>, 2019, pp. 509–14, doi:<a href=\"https://doi.org/10.4071/2380-4505-2019.1.000509\">10.4071/2380-4505-2019.1.000509</a>."},"file_date_updated":"2019-12-24T21:43:59Z"},{"user_id":"210","volume":295,"page":"653 - 662","_id":"10334","status":"public","quality_controlled":"1","project":[{"grant_number":"MP-1-1-015","_id":"93","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"citation":{"chicago":"Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295 (2019): 653–62. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>.","short":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.","apa":"Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>","ieee":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662, 2019, doi: <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","ama":"Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>","bibtex":"@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }","mla":"Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>, vol. 295, 2019, pp. 653–62, doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>."},"doi":"10.1016/j.sna.2019.04.025","language":[{"iso":"eng"}],"date_updated":"2023-09-21T14:12:15Z","intvolume":"       295","year":"2019","title":"Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding","publication_identifier":{"issn":["0924-4247"]},"author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias"},{"full_name":"Dymel, Collin","first_name":"Collin","last_name":"Dymel","id":"66833"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"}],"type":"journal_article","keyword":["Ultrasonic bonding","Ultrasonic welding","Multi-dimensional bonding","Complex vibration","Multi-frequent","Two-dimensional friction model"],"department":[{"_id":"151"}],"date_created":"2019-07-01T07:32:07Z","abstract":[{"text":"Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.","lang":"eng"}],"publication":"Sensors and Actuators A: Physical"},{"citation":{"apa":"Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>, <i>Vol. 2017</i>, <i>No. 1</i>.","ieee":"P. Eichwald <i>et al.</i>, “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","chicago":"Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i> Vol. 2017, No. 1 (2017).","short":"P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).","mla":"Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.","ama":"Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. <i>IMAPSource</i>. 2017;Vol. 2017, No. 1.","bibtex":"@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017, title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design}, volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff, Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann, Michael and Hunstig, Matthias}, year={2017} }"},"publication":"IMAPSource","project":[{"_id":"93","grant_number":"MP-1-1-015","name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen"}],"abstract":[{"lang":"eng","text":"In power electronics, copper connector pins are e.g. used to connect control boards with power modules. The new chip generation based on SiC and GaN technology increase the power density of semiconductor modules significantly with junction temperatures reaching 200°C. To enable reliable operation at such high temperature, the soldering of these connector pins should be substituted by a multi-dimensional copper-copper bonding technology. A copper pin welded directly on DBC substrate also simplifies the assembly. With this aim, a proper bond tool and a suitable connector pin geometry are designed. This paper presents a two-dimensional trajectory approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the intention to minimize mechanical stresses exposed to the substrate. This is achieved using a multi-dimensional vibration system with multiple transducers known from flip chip bonding. Applying a planar relative motion between the bonding piece and the substrate increases the induced frictional power compared to one-dimensional excitation. The core of this work is the development of a new tool design which enables a reliable and effective transmission of the multidimensional vibration into the contact area between nail-shaped bonding piece and substrate. For this purpose, different bonding tool as well as bonding piece designs are discussed. A proper bonding tool design is selected based on the simulated alternatives. This tool is examined in bonding experiments and the results are presented. In addition, different grades of hardness for bonding piece and substrate are examined as well as different bonding parameters. Optical inspection of the bonded area shows the emergence of initial micro welds in form of a ring which is growing in direction of the interface boundaries with increasing bonding duration."}],"quality_controlled":"1","date_created":"2019-05-27T09:32:42Z","department":[{"_id":"151"}],"keyword":["International Symposium on Microelectronics"],"type":"journal_article","author":[{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"first_name":"Reinhard","last_name":"Schemmel","full_name":"Schemmel, Reinhard","id":"28647"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"}],"title":"Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design","year":"2017","status":"public","date_updated":"2020-05-07T05:33:54Z","language":[{"iso":"eng"}],"_id":"9973","volume":"Vol. 2017, No. 1","user_id":"210"},{"language":[{"iso":"eng"}],"_id":"9895","page":"289-294","user_id":"210","author":[{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Althoff, Simon","first_name":"Simon","last_name":"Althoff"},{"full_name":"Eichwald, Paul","last_name":"Eichwald","first_name":"Paul"},{"full_name":"Meyer, Tobias","first_name":"Tobias","last_name":"Meyer"},{"full_name":"Eacock, Florian","first_name":"Florian","last_name":"Eacock"},{"full_name":"Brökelmann, Michael","first_name":"Michael","last_name":"Brökelmann"}],"title":"Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds","status":"public","year":"2014","date_updated":"2020-05-07T05:33:47Z","date_created":"2019-05-20T13:35:09Z","place":"San Diego, CA, US","department":[{"_id":"151"}],"keyword":["pre-deformation","copper wire bonding","finite element model"],"type":"conference","citation":{"ieee":"A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–294.","apa":"Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38; Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.","chicago":"Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego, CA, US, 2014.","short":"A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.","mla":"Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>, 2014, pp. 289–94.","bibtex":"@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }","ama":"Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the 47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US; 2014:289-294."},"publication":"Proceedings of the 47th International Symposium on Microelectronics (IMAPS)","project":[{"_id":"92","grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"abstract":[{"lang":"eng","text":"Power semiconductor modules are used to control and switch high electrical currents and voltages. Within the power module package wire bonding is used as an interconnection technology. In recent years, aluminum wire has been used preferably, but an ever-growing market of powerful and efficient power modules requires a material with better mechanical and electrical properties. For this reason, a technology change from aluminum to copper is indispensable. However, the copper wire bonding process reacts more sensitive to parameter changes. This makes manufacturing reliable copper bond connections a challenging task. The aim of the BMBF funded project Itsowl-InCuB is the development of self-optimizing techniques to enable the reliable production of copper bond connections under varying conditions. A model of the process is essential to achieve this aim. This model needs to include the dynamic elasto-plastic deformation, the ultrasonic softening effect and the proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation process. In the touchdown phase, the wire is pressed into the V-groove of the tool and a small initial contact area between wire and substrate arise. The local characteristics of the material change abruptly because of the cold forming. Consequently, the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning effect during the touchdown process of aluminum wires by cracking of oxide layers was presented. These interactions of the process parameters are still largely unknown for copper. In a first step, this paper validates the importance of modeling the pre-deformation by showing its impact on the wire deformation characteristic experimentally. Creating cross-section views of pre-deformed copper wires has shown a low deformation degree compared to aluminum. By using a digital microscope and a scanning confocal microscope an analysis about the contact areas and penetration depths after touchdown has been made. Additionally, it has to be taken into account that the dynamical touchdown force depends on the touchdown speed and the touchdown force set in the bonding machine. In order to measure the overshoot in the force signals, a strain gauge sensor has been used. Subsequently, the affecting factors have been interpreted independently Furthermore, the material properties of copper wire have been investigated with tensile tests and hardness measurements. In a second step, the paper presents finite element models of the touchdown process for source and destination bonds. These models take the measured overshoot in the touchdown forces into account. A multi-linear, isotropic material model has been selected to map the material properties of the copper. A validation of the model with the experimental determined contact areas, normal pressures and penetration depths reveals the high model quality. Thus, the simulation is able to calculate and visualize the three dimensional pre-deformation with an integrated material parameter of the wire if the touchdown parameters of the bonding machine are known. Based on the calculated deformation degrees of wire and substrate, it is probably possible to investigate the effect of the pre-deformation on the pre-cleaning phase in the copper wire bonding."}]}]