[{"date_created":"2024-04-26T07:39:41Z","file":[{"date_created":"2024-04-26T07:30:20Z","creator":"deffel","file_id":"53664","content_type":"application/pdf","file_name":"Noctua2_Supercomputer.pdf","access_level":"open_access","file_size":3825480,"relation":"main_file","date_updated":"2024-04-26T08:35:17Z"}],"department":[{"_id":"27"},{"_id":"518"}],"keyword":["Noctua 2","Supercomputer","FPGA","PC2","Paderborn Center for Parallel Computing"],"type":"journal_article","publication":"Journal of large-scale research facilities","abstract":[{"text":"Noctua 2 is a supercomputer operated at the Paderborn Center for Parallel Computing (PC2) at Paderborn University in Germany. Noctua 2 was inaugurated in 2022 and is an Atos BullSequana XH2000 system. It consists mainly of three node types: 1) CPU Compute nodes with AMD EPYC processors in different main memory configurations, 2) GPU nodes with NVIDIA A100 GPUs, and 3) FPGA nodes with Xilinx Alveo U280 and Intel Stratix 10 FPGA cards. While CPUs and GPUs are known off-the-shelf components in HPC systems, the operation of a large number of FPGA cards from different vendors and a dedicated FPGA-to-FPGA network are unique characteristics of Noctua 2. This paper describes in detail the overall setup of Noctua 2 and gives insights into the operation of the cluster from a hardware, software and facility perspective.","lang":"eng"}],"language":[{"iso":"eng"}],"doi":"10.17815/jlsrf-8-187 ","author":[{"full_name":"Bauer, Carsten","last_name":"Bauer","first_name":"Carsten","id":"90082"},{"full_name":"Kenter, Tobias","last_name":"Kenter","first_name":"Tobias","id":"3145"},{"id":"24135","first_name":"Michael","last_name":"Lass","orcid":"0000-0002-5708-7632","full_name":"Lass, Michael"},{"id":"90492","orcid":" 0000-0001-6304-7082","last_name":"Mazur","first_name":"Lukas","full_name":"Mazur, Lukas"},{"id":"40778","full_name":"Meyer, Marius","first_name":"Marius","last_name":"Meyer"},{"id":"15272","full_name":"Nitsche, Holger","first_name":"Holger","last_name":"Nitsche"},{"first_name":"Heinrich","last_name":"Riebler","full_name":"Riebler, Heinrich","id":"8961"},{"full_name":"Schade, Robert","first_name":"Robert","last_name":"Schade","orcid":"0000-0002-6268-5397","id":"75963"},{"id":"5312","last_name":"Schwarz","first_name":"Michael","full_name":"Schwarz, Michael"},{"id":"61189","last_name":"Winnwa","first_name":"Nils","full_name":"Winnwa, Nils"},{"orcid":"0000-0003-1764-9773","last_name":"Wiens","first_name":"Alex","full_name":"Wiens, Alex","id":"23522"},{"id":"77439","first_name":"Xin","last_name":"Wu","full_name":"Wu, Xin"},{"id":"16153","last_name":"Plessl","orcid":"0000-0001-5728-9982","first_name":"Christian","full_name":"Plessl, Christian"},{"first_name":"Jens","last_name":"Simon","full_name":"Simon, Jens","id":"15273"}],"year":"2024","title":"Noctua 2 Supercomputer","intvolume":"         9","article_type":"original","date_updated":"2024-04-26T08:44:30Z","publication_status":"published","oa":"1","citation":{"mla":"Bauer, Carsten, et al. “Noctua 2 Supercomputer.” <i>Journal of Large-Scale Research Facilities</i>, vol. 9, 2024, doi:<a href=\"https://doi.org/10.17815/jlsrf-8-187 \">10.17815/jlsrf-8-187 </a>.","bibtex":"@article{Bauer_Kenter_Lass_Mazur_Meyer_Nitsche_Riebler_Schade_Schwarz_Winnwa_et al._2024, title={Noctua 2 Supercomputer}, volume={9}, DOI={<a href=\"https://doi.org/10.17815/jlsrf-8-187 \">10.17815/jlsrf-8-187 </a>}, journal={Journal of large-scale research facilities}, author={Bauer, Carsten and Kenter, Tobias and Lass, Michael and Mazur, Lukas and Meyer, Marius and Nitsche, Holger and Riebler, Heinrich and Schade, Robert and Schwarz, Michael and Winnwa, Nils and et al.}, year={2024} }","ama":"Bauer C, Kenter T, Lass M, et al. Noctua 2 Supercomputer. <i>Journal of large-scale research facilities</i>. 2024;9. doi:<a href=\"https://doi.org/10.17815/jlsrf-8-187 \">10.17815/jlsrf-8-187 </a>","ieee":"C. Bauer <i>et al.</i>, “Noctua 2 Supercomputer,” <i>Journal of large-scale research facilities</i>, vol. 9, 2024, doi: <a href=\"https://doi.org/10.17815/jlsrf-8-187 \">10.17815/jlsrf-8-187 </a>.","apa":"Bauer, C., Kenter, T., Lass, M., Mazur, L., Meyer, M., Nitsche, H., Riebler, H., Schade, R., Schwarz, M., Winnwa, N., Wiens, A., Wu, X., Plessl, C., &#38; Simon, J. (2024). Noctua 2 Supercomputer. <i>Journal of Large-Scale Research Facilities</i>, <i>9</i>. <a href=\"https://doi.org/10.17815/jlsrf-8-187 \">https://doi.org/10.17815/jlsrf-8-187 </a>","short":"C. Bauer, T. Kenter, M. Lass, L. Mazur, M. Meyer, H. Nitsche, H. Riebler, R. Schade, M. Schwarz, N. Winnwa, A. Wiens, X. Wu, C. Plessl, J. Simon, Journal of Large-Scale Research Facilities 9 (2024).","chicago":"Bauer, Carsten, Tobias Kenter, Michael Lass, Lukas Mazur, Marius Meyer, Holger Nitsche, Heinrich Riebler, et al. “Noctua 2 Supercomputer.” <i>Journal of Large-Scale Research Facilities</i> 9 (2024). <a href=\"https://doi.org/10.17815/jlsrf-8-187 \">https://doi.org/10.17815/jlsrf-8-187 </a>."},"file_date_updated":"2024-04-26T08:35:17Z","project":[{"name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}],"_id":"53663","volume":9,"ddc":["004"],"user_id":"8961","status":"public","has_accepted_license":"1"},{"place":"Cham","oa":"1","citation":{"bibtex":"@inbook{Meyer_Kenter_Petrica_O’Brien_Blott_Plessl_2024, place={Cham}, title={Optimizing Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL}, DOI={<a href=\"https://doi.org/10.1007/978-3-031-69766-1_9\">10.1007/978-3-031-69766-1_9</a>}, booktitle={Lecture Notes in Computer Science}, publisher={Springer Nature Switzerland}, author={Meyer, Marius and Kenter, Tobias and Petrica, Lucian and O’Brien, Kenneth and Blott, Michaela and Plessl, Christian}, year={2024} }","chicago":"Meyer, Marius, Tobias Kenter, Lucian Petrica, Kenneth O’Brien, Michaela Blott, and Christian Plessl. “Optimizing Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL.” In <i>Lecture Notes in Computer Science</i>. Cham: Springer Nature Switzerland, 2024. <a href=\"https://doi.org/10.1007/978-3-031-69766-1_9\">https://doi.org/10.1007/978-3-031-69766-1_9</a>.","ama":"Meyer M, Kenter T, Petrica L, O’Brien K, Blott M, Plessl C. Optimizing Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL. In: <i>Lecture Notes in Computer Science</i>. Springer Nature Switzerland; 2024. doi:<a href=\"https://doi.org/10.1007/978-3-031-69766-1_9\">10.1007/978-3-031-69766-1_9</a>","short":"M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, C. Plessl, in: Lecture Notes in Computer Science, Springer Nature Switzerland, Cham, 2024.","ieee":"M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, and C. 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Springer Nature Switzerland. <a href=\"https://doi.org/10.1007/978-3-031-69766-1_9\">https://doi.org/10.1007/978-3-031-69766-1_9</a>"},"quality_controlled":"1","_id":"56606","publisher":"Springer Nature Switzerland","user_id":"3145","status":"public","date_created":"2024-10-14T07:51:51Z","department":[{"_id":"27"},{"_id":"518"}],"type":"book_chapter","publication":"Lecture Notes in Computer Science","abstract":[{"text":"<jats:title>Abstract</jats:title><jats:p>Most FPGA boards in the HPC domain are well-suited for parallel scaling because of the direct integration of versatile and high-throughput network ports. However, the utilization of their network capabilities is often challenging and error-prone because the whole network stack and communication patterns have to be implemented and managed on the FPGAs. Also, this approach conceptually involves a trade-off between the performance potential of improved communication and the impact of resource consumption for communication infrastructure, since the utilized resources on the FPGAs could otherwise be used for computations. In this work, we investigate this trade-off, firstly, by using synthetic benchmarks to evaluate the different configuration options of the communication framework ACCL and their impact on communication latency and throughput. Finally, we use our findings to implement a shallow water simulation whose scalability heavily depends on low-latency communication. With a suitable configuration of ACCL, good scaling behavior can be shown to all 48 FPGAs installed in the system. Overall, the results show that the availability of inter-FPGA communication frameworks as well as the configurability of framework and network stack are crucial to achieve the best application performance with low latency communication.</jats:p>","lang":"eng"}],"language":[{"iso":"eng"}],"main_file_link":[{"open_access":"1"}],"doi":"10.1007/978-3-031-69766-1_9","author":[{"first_name":"Marius","last_name":"Meyer","full_name":"Meyer, Marius"},{"full_name":"Kenter, Tobias","last_name":"Kenter","first_name":"Tobias"},{"full_name":"Petrica, Lucian","last_name":"Petrica","first_name":"Lucian"},{"last_name":"O’Brien","first_name":"Kenneth","full_name":"O’Brien, Kenneth"},{"full_name":"Blott, Michaela","last_name":"Blott","first_name":"Michaela"},{"full_name":"Plessl, Christian","first_name":"Christian","last_name":"Plessl"}],"publication_identifier":{"issn":["0302-9743","1611-3349"],"isbn":["9783031697654","9783031697661"]},"title":"Optimizing Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL","year":"2024","publication_status":"published","date_updated":"2024-10-14T07:55:50Z"},{"author":[{"id":"76938","full_name":"Tareen, Abdul Rehman","first_name":"Abdul Rehman","last_name":"Tareen"},{"id":"40778","first_name":"Marius","last_name":"Meyer","full_name":"Meyer, Marius"},{"id":"16153","full_name":"Plessl, Christian","orcid":"0000-0001-5728-9982","first_name":"Christian","last_name":"Plessl"},{"id":"3145","last_name":"Kenter","first_name":"Tobias","full_name":"Kenter, Tobias"}],"year":"2024","status":"public","title":"HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory","intvolume":"        35","publication_status":"published","date_updated":"2024-10-14T12:27:55Z","_id":"56607","publisher":"IEEE","language":[{"iso":"eng"}],"volume":35,"user_id":"3145","doi":"10.1109/fccm60383.2024.00014","citation":{"chicago":"Tareen, Abdul Rehman, Marius Meyer, Christian Plessl, and Tobias Kenter. “HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory.” In <i>2024 IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)</i>, Vol. 35. 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HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory. <i>2024 IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)</i>, <i>35</i>. <a href=\"https://doi.org/10.1109/fccm60383.2024.00014\">https://doi.org/10.1109/fccm60383.2024.00014</a>","bibtex":"@inproceedings{Tareen_Meyer_Plessl_Kenter_2024, title={HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory}, volume={35}, DOI={<a href=\"https://doi.org/10.1109/fccm60383.2024.00014\">10.1109/fccm60383.2024.00014</a>}, booktitle={2024 IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)}, publisher={IEEE}, author={Tareen, Abdul Rehman and Meyer, Marius and Plessl, Christian and Kenter, Tobias}, year={2024} }","ama":"Tareen AR, Meyer M, Plessl C, Kenter T. HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory. In: <i>2024 IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)</i>. Vol 35. IEEE; 2024. doi:<a href=\"https://doi.org/10.1109/fccm60383.2024.00014\">10.1109/fccm60383.2024.00014</a>","mla":"Tareen, Abdul Rehman, et al. “HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory.” <i>2024 IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)</i>, vol. 35, IEEE, 2024, doi:<a href=\"https://doi.org/10.1109/fccm60383.2024.00014\">10.1109/fccm60383.2024.00014</a>."},"publication":"2024 IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)","quality_controlled":"1","date_created":"2024-10-14T07:59:08Z","department":[{"_id":"27"},{"_id":"518"}],"type":"conference"},{"status":"public","_id":"62067","publisher":"Springer Nature Switzerland","user_id":"3145","citation":{"ieee":"M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, and C. 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Optimizing Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL. In: <i>Lecture Notes in Computer Science</i>. 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However, the utilization of their network capabilities is often challenging and error-prone because the whole network stack and communication patterns have to be implemented and managed on the FPGAs. Also, this approach conceptually involves a trade-off between the performance potential of improved communication and the impact of resource consumption for communication infrastructure, since the utilized resources on the FPGAs could otherwise be used for computations. In this work, we investigate this trade-off, firstly, by using synthetic benchmarks to evaluate the different configuration options of the communication framework ACCL and their impact on communication latency and throughput. Finally, we use our findings to implement a shallow water simulation whose scalability heavily depends on low-latency communication. With a suitable configuration of ACCL, good scaling behavior can be shown to all 48 FPGAs installed in the system. Overall, the results show that the availability of inter-FPGA communication frameworks as well as the configurability of framework and network stack are crucial to achieve the best application performance with low latency communication."}],"date_created":"2025-11-04T09:50:24Z","department":[{"_id":"27"},{"_id":"518"}],"type":"book_chapter"},{"type":"book_chapter","department":[{"_id":"7"},{"_id":"27"},{"_id":"518"},{"_id":"78"}],"file":[{"date_created":"2023-07-07T08:15:35Z","creator":"florida","file_id":"45894","content_type":"application/pdf","relation":"main_file","date_updated":"2023-07-07T11:17:33Z","file_name":"C2-Chapter-SFB-Buch-Final.pdf","access_level":"open_access","file_size":2288788}],"date_created":"2023-07-07T08:15:45Z","publication":"On-The-Fly Computing -- Individualized IT-services in dynamic markets","doi":"10.5281/zenodo.8068642","series_title":"Verlagsschriftenreihe des Heinz Nixdorf Instituts","language":[{"iso":"eng"}],"date_updated":"2024-05-02T10:33:00Z","intvolume":"       412","title":"Compute Centers I: Heterogeneous Execution Environments","year":"2023","author":[{"id":"49992","first_name":"Tim","last_name":"Hansmeier","orcid":"0000-0003-1377-3339","full_name":"Hansmeier, Tim"},{"last_name":"Kenter","first_name":"Tobias","full_name":"Kenter, Tobias","id":"3145"},{"id":"40778","first_name":"Marius","last_name":"Meyer","full_name":"Meyer, Marius"},{"full_name":"Riebler, Heinrich","last_name":"Riebler","first_name":"Heinrich","id":"8961"},{"full_name":"Platzner, Marco","first_name":"Marco","last_name":"Platzner","id":"398"},{"id":"16153","full_name":"Plessl, Christian","last_name":"Plessl","orcid":"0000-0001-5728-9982","first_name":"Christian"}],"oa":"1","place":"Paderborn","project":[{"name":"SFB 901: SFB 901: On-The-Fly Computing - Individualisierte IT-Dienstleistungen in dynamischen Märkten ","grant_number":"160364472","_id":"1"},{"name":"SFB 901 - C: SFB 901 - Project Area C","_id":"4"},{"name":"SFB 901 - C2: SFB 901 - On-The-Fly Compute Centers I: Heterogene Ausführungsumgebungen (Subproject C2)","grant_number":"160364472","_id":"14"}],"file_date_updated":"2023-07-07T11:17:33Z","citation":{"bibtex":"@inbook{Hansmeier_Kenter_Meyer_Riebler_Platzner_Plessl_2023, place={Paderborn}, series={Verlagsschriftenreihe des Heinz Nixdorf Instituts}, title={Compute Centers I: Heterogeneous Execution Environments}, volume={412}, DOI={<a href=\"https://doi.org/10.5281/zenodo.8068642\">10.5281/zenodo.8068642</a>}, booktitle={On-The-Fly Computing -- Individualized IT-services in dynamic markets}, publisher={Heinz Nixdorf Institut, Universität Paderborn}, author={Hansmeier, Tim and Kenter, Tobias and Meyer, Marius and Riebler, Heinrich and Platzner, Marco and Plessl, Christian}, editor={Haake, Claus-Jochen and Meyer auf der Heide, Friedhelm and Platzner, Marco and Wachsmuth, Henning and Wehrheim, Heike}, year={2023}, pages={165–182}, collection={Verlagsschriftenreihe des Heinz Nixdorf Instituts} }","ama":"Hansmeier T, Kenter T, Meyer M, Riebler H, Platzner M, Plessl C. Compute Centers I: Heterogeneous Execution Environments. In: Haake C-J, Meyer auf der Heide F, Platzner M, Wachsmuth H, Wehrheim H, eds. <i>On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets</i>. Vol 412. Verlagsschriftenreihe des Heinz Nixdorf Instituts. Heinz Nixdorf Institut, Universität Paderborn; 2023:165-182. doi:<a href=\"https://doi.org/10.5281/zenodo.8068642\">10.5281/zenodo.8068642</a>","mla":"Hansmeier, Tim, et al. “Compute Centers I: Heterogeneous Execution Environments.” <i>On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets</i>, edited by Claus-Jochen Haake et al., vol. 412, Heinz Nixdorf Institut, Universität Paderborn, 2023, pp. 165–82, doi:<a href=\"https://doi.org/10.5281/zenodo.8068642\">10.5281/zenodo.8068642</a>.","short":"T. Hansmeier, T. Kenter, M. Meyer, H. Riebler, M. Platzner, C. Plessl, in: C.-J. Haake, F. Meyer auf der Heide, M. Platzner, H. Wachsmuth, H. Wehrheim (Eds.), On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2023, pp. 165–182.","chicago":"Hansmeier, Tim, Tobias Kenter, Marius Meyer, Heinrich Riebler, Marco Platzner, and Christian Plessl. “Compute Centers I: Heterogeneous Execution Environments.” In <i>On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets</i>, edited by Claus-Jochen Haake, Friedhelm Meyer auf der Heide, Marco Platzner, Henning Wachsmuth, and Heike Wehrheim, 412:165–82. Verlagsschriftenreihe Des Heinz Nixdorf Instituts. Paderborn: Heinz Nixdorf Institut, Universität Paderborn, 2023. <a href=\"https://doi.org/10.5281/zenodo.8068642\">https://doi.org/10.5281/zenodo.8068642</a>.","ieee":"T. Hansmeier, T. Kenter, M. Meyer, H. Riebler, M. Platzner, and C. Plessl, “Compute Centers I: Heterogeneous Execution Environments,” in <i>On-The-Fly Computing -- Individualized IT-services in dynamic markets</i>, vol. 412, C.-J. Haake, F. Meyer auf der Heide, M. Platzner, H. Wachsmuth, and H. Wehrheim, Eds. Paderborn: Heinz Nixdorf Institut, Universität Paderborn, 2023, pp. 165–182.","apa":"Hansmeier, T., Kenter, T., Meyer, M., Riebler, H., Platzner, M., &#38; Plessl, C. (2023). Compute Centers I: Heterogeneous Execution Environments. In C.-J. Haake, F. Meyer auf der Heide, M. Platzner, H. Wachsmuth, &#38; H. Wehrheim (Eds.), <i>On-The-Fly Computing -- Individualized IT-services in dynamic markets</i> (Vol. 412, pp. 165–182). Heinz Nixdorf Institut, Universität Paderborn. <a href=\"https://doi.org/10.5281/zenodo.8068642\">https://doi.org/10.5281/zenodo.8068642</a>"},"ddc":["004"],"user_id":"398","editor":[{"last_name":"Haake","first_name":"Claus-Jochen","full_name":"Haake, Claus-Jochen"},{"full_name":"Meyer auf der Heide, Friedhelm","first_name":"Friedhelm","last_name":"Meyer auf der Heide"},{"full_name":"Platzner, Marco","last_name":"Platzner","first_name":"Marco"},{"last_name":"Wachsmuth","first_name":"Henning","full_name":"Wachsmuth, Henning"},{"first_name":"Heike","last_name":"Wehrheim","full_name":"Wehrheim, Heike"}],"volume":412,"page":"165-182","_id":"45893","publisher":"Heinz Nixdorf Institut, Universität Paderborn","has_accepted_license":"1","status":"public"},{"abstract":[{"lang":"eng","text":"<jats:p>While FPGA accelerator boards and their respective high-level design tools are maturing, there is still a lack of multi-FPGA applications, libraries, and not least, benchmarks and reference implementations towards sustained HPC usage of these devices. As in the early days of GPUs in HPC, for workloads that can reasonably be decoupled into loosely coupled working sets, multi-accelerator support can be achieved by using standard communication interfaces like MPI on the host side. However, for performance and productivity, some applications can profit from a tighter coupling of the accelerators. FPGAs offer unique opportunities here when extending the dataflow characteristics to their communication interfaces.</jats:p>\r\n          <jats:p>In this work, we extend the HPCC FPGA benchmark suite by multi-FPGA support and three missing benchmarks that particularly characterize or stress inter-device communication: b_eff, PTRANS, and LINPACK. With all benchmarks implemented for current boards with Intel and Xilinx FPGAs, we established a baseline for multi-FPGA performance. Additionally, for the communication-centric benchmarks, we explored the potential of direct FPGA-to-FPGA communication with a circuit-switched inter-FPGA network that is currently only available for one of the boards. The evaluation with parallel execution on up to 26 FPGA boards makes use of one of the largest academic FPGA installations.</jats:p>"}],"publication":"ACM Transactions on Reconfigurable Technology and Systems","department":[{"_id":"27"},{"_id":"518"}],"type":"journal_article","keyword":["General Computer Science"],"date_created":"2023-01-23T08:40:42Z","date_updated":"2023-07-28T08:02:05Z","publication_status":"published","author":[{"last_name":"Meyer","first_name":"Marius","full_name":"Meyer, Marius","id":"40778"},{"full_name":"Kenter, Tobias","first_name":"Tobias","last_name":"Kenter","id":"3145"},{"id":"16153","full_name":"Plessl, Christian","last_name":"Plessl","orcid":"0000-0001-5728-9982","first_name":"Christian"}],"publication_identifier":{"issn":["1936-7406","1936-7414"]},"title":"Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks","year":"2023","doi":"10.1145/3576200","language":[{"iso":"eng"}],"main_file_link":[{"url":"https://dl.acm.org/doi/10.1145/3576200","open_access":"1"}],"project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"},{"name":"SFB 901 - C: SFB 901 - Project Area C","_id":"4"},{"name":"SFB 901: SFB 901","grant_number":"160364472","_id":"1"},{"grant_number":"160364472","_id":"14","name":"SFB 901 - C2: SFB 901 - Subproject C2"}],"quality_controlled":"1","citation":{"bibtex":"@article{Meyer_Kenter_Plessl_2023, title={Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks}, DOI={<a href=\"https://doi.org/10.1145/3576200\">10.1145/3576200</a>}, journal={ACM Transactions on Reconfigurable Technology and Systems}, publisher={Association for Computing Machinery (ACM)}, author={Meyer, Marius and Kenter, Tobias and Plessl, Christian}, year={2023} }","ama":"Meyer M, Kenter T, Plessl C. Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks. <i>ACM Transactions on Reconfigurable Technology and Systems</i>. Published online 2023. doi:<a href=\"https://doi.org/10.1145/3576200\">10.1145/3576200</a>","mla":"Meyer, Marius, et al. “Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks.” <i>ACM Transactions on Reconfigurable Technology and Systems</i>, Association for Computing Machinery (ACM), 2023, doi:<a href=\"https://doi.org/10.1145/3576200\">10.1145/3576200</a>.","short":"M. Meyer, T. Kenter, C. Plessl, ACM Transactions on Reconfigurable Technology and Systems (2023).","chicago":"Meyer, Marius, Tobias Kenter, and Christian Plessl. “Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks.” <i>ACM Transactions on Reconfigurable Technology and Systems</i>, 2023. <a href=\"https://doi.org/10.1145/3576200\">https://doi.org/10.1145/3576200</a>.","ieee":"M. Meyer, T. Kenter, and C. Plessl, “Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks,” <i>ACM Transactions on Reconfigurable Technology and Systems</i>, 2023, doi: <a href=\"https://doi.org/10.1145/3576200\">10.1145/3576200</a>.","apa":"Meyer, M., Kenter, T., &#38; Plessl, C. (2023). Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks. <i>ACM Transactions on Reconfigurable Technology and Systems</i>. <a href=\"https://doi.org/10.1145/3576200\">https://doi.org/10.1145/3576200</a>"},"oa":"1","status":"public","user_id":"24135","_id":"38041","publisher":"Association for Computing Machinery (ACM)"},{"date_created":"2021-11-10T14:36:27Z","department":[{"_id":"27"},{"_id":"518"}],"type":"journal_article","citation":{"ieee":"M. Meyer, T. Kenter, and C. Plessl, “In-depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs using OpenCL,” <i>Journal of Parallel and Distributed Computing</i>, 2022, doi: <a href=\"https://doi.org/10.1016/j.jpdc.2021.10.007\">10.1016/j.jpdc.2021.10.007</a>.","apa":"Meyer, M., Kenter, T., &#38; Plessl, C. (2022). In-depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs using OpenCL. <i>Journal of Parallel and Distributed Computing</i>. <a href=\"https://doi.org/10.1016/j.jpdc.2021.10.007\">https://doi.org/10.1016/j.jpdc.2021.10.007</a>","short":"M. Meyer, T. Kenter, C. Plessl, Journal of Parallel and Distributed Computing (2022).","chicago":"Meyer, Marius, Tobias Kenter, and Christian Plessl. “In-Depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs Using OpenCL.” <i>Journal of Parallel and Distributed Computing</i>, 2022. <a href=\"https://doi.org/10.1016/j.jpdc.2021.10.007\">https://doi.org/10.1016/j.jpdc.2021.10.007</a>.","mla":"Meyer, Marius, et al. “In-Depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs Using OpenCL.” <i>Journal of Parallel and Distributed Computing</i>, 2022, doi:<a href=\"https://doi.org/10.1016/j.jpdc.2021.10.007\">10.1016/j.jpdc.2021.10.007</a>.","bibtex":"@article{Meyer_Kenter_Plessl_2022, title={In-depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs using OpenCL}, DOI={<a href=\"https://doi.org/10.1016/j.jpdc.2021.10.007\">10.1016/j.jpdc.2021.10.007</a>}, journal={Journal of Parallel and Distributed Computing}, author={Meyer, Marius and Kenter, Tobias and Plessl, Christian}, year={2022} }","ama":"Meyer M, Kenter T, Plessl C. In-depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs using OpenCL. <i>Journal of Parallel and Distributed Computing</i>. Published online 2022. doi:<a href=\"https://doi.org/10.1016/j.jpdc.2021.10.007\">10.1016/j.jpdc.2021.10.007</a>"},"publication":"Journal of Parallel and Distributed Computing","project":[{"_id":"52","name":"Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"quality_controlled":"1","_id":"27364","language":[{"iso":"eng"}],"user_id":"15278","doi":"10.1016/j.jpdc.2021.10.007","author":[{"full_name":"Meyer, Marius","last_name":"Meyer","first_name":"Marius","id":"40778"},{"id":"3145","full_name":"Kenter, Tobias","last_name":"Kenter","first_name":"Tobias"},{"id":"16153","first_name":"Christian","orcid":"0000-0001-5728-9982","last_name":"Plessl","full_name":"Plessl, Christian"}],"publication_identifier":{"issn":["0743-7315"]},"year":"2022","status":"public","title":"In-depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs using OpenCL","publication_status":"published","date_updated":"2023-09-26T10:26:56Z"},{"status":"public","has_accepted_license":"1","_id":"9980","page":"1","user_id":"210","publication_date":"31.03.2022","ddc":["620"],"citation":{"ieee":"K. Reinke, A. Bender, T. Meyer, W. Sextro, and J. K. Kimotho, “Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung der Bauteil-Restnutzungsdauer.” 2022.","apa":"Reinke, K., Bender, A., Meyer, T., Sextro, W., &#38; Kimotho, J. K. (2022). <i>Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung der Bauteil-Restnutzungsdauer.</i>","chicago":"Reinke, Kai, Amelie Bender, Tobias Meyer, Walter Sextro, and James Kuria Kimotho. “Patent DE 10 2017 000 926 B4: Gerät Mit Wenigstens Einem Elastisch Verformbaren Bauteil, Insbesondere Einem Gummi-Metall-Lager Und Mit Einer Einrichtung Zur Feststellung Des Beginns Einer Verschleißbedingten Bauteil-Restnutzungsdauer, Sowie Verfahren Zur Bestimmung Der Bauteil-Restnutzungsdauer.,” 2022.","short":"K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2022).","mla":"Reinke, Kai, et al. <i>Patent DE 10 2017 000 926 B4: Gerät Mit Wenigstens Einem Elastisch Verformbaren Bauteil, Insbesondere Einem Gummi-Metall-Lager Und Mit Einer Einrichtung Zur Feststellung Des Beginns Einer Verschleißbedingten Bauteil-Restnutzungsdauer, Sowie Verfahren Zur Bestimmung Der Bauteil-Restnutzungsdauer.</i> 2022.","bibtex":"@article{Reinke_Bender_Meyer_Sextro_Kimotho_2022, title={Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung der Bauteil-Restnutzungsdauer.}, author={Reinke, Kai and Bender, Amelie and Meyer, Tobias and Sextro, Walter and Kimotho, James Kuria}, year={2022} }","ama":"Reinke K, Bender A, Meyer T, Sextro W, Kimotho JK. Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung der Bauteil-Restnutzungsdauer. Published online 2022."},"file_date_updated":"2022-09-07T05:04:49Z","application_number":"10 2017 000 926.0","author":[{"full_name":"Reinke, Kai","last_name":"Reinke","first_name":"Kai"},{"full_name":"Bender, Amelie","last_name":"Bender","first_name":"Amelie","id":"54290"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"},{"last_name":"Kimotho","first_name":"James Kuria","full_name":"Kimotho, James Kuria"}],"title":"Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung der Bauteil-Restnutzungsdauer.","year":"2022","ipn":"DE: 10 2017 000 926 B4 ","date_updated":"2023-09-28T09:48:38Z","application_date":"02.02.2017","ipc":"G01M 7/00 (2006.01)","abstract":[{"text":"Die Erfindung betrifft ein Gerät mit wenigstens einem elastisch verformbaren Bauteil als Strukturteil und/oder Lagerteil, auf das im Betriebsverlauf von wechselnden Betriebszuständen abhängige, unterschiedliche Verformungskräfte einwirken, die zu einem die Bauteilnutzungsdauer begrenzenden Bauteilverschleiß führen, und mit einer Einrichtung zur Bestimmung der Bauteilnutzungsdauer und einer verschleißbedingten Bauteil-Restnutzungsdauer. Erfindungsgemäß wird ein sich zeitversetzt wiederholender, jeweils gleicher Betriebszustand vorbestimmt, dem eine jeweils gleiche, periodisch wirkende Verformungskraft zugeordnet ist, durch die das elastisch verformbare Bauteilmaterial periodisch verformt wird, wobei durch Walkarbeit ein Energieeintrag mit einem messbaren Temperaturanstieg im Vergleich zu einer Umgebungstemperatur erfolgt und wobei der jeweilige Temperaturanstieg als Kenngröße im Verlauf einer Bauteilnutzungsdauer entsprechend einer abnehmenden Bauteilsteifigkeit größer wird. Ein solcher vorbestimmter Betriebszustand wird jeweils von einer Messund Auswerteeinheit erkannt und ein Messvorgang durch ein Startsignal selbsttätig gestartet, wobei mit wenigstens einem bauteilzugeordneten Temperatursensor, der aktuelle Temperaturanstieg im Vergleich zur Umgebungstemperatur als Kenngröße für eine aktuelle Bauteilsteifigkeit gemessen und jeweils in einer Messkurve gespeichert und verglichen wird.","lang":"eng"}],"date_created":"2019-05-27T09:44:22Z","file":[{"file_name":"DE102017000926B4_1.pdf","file_size":244882,"access_level":"closed","relation":"main_file","date_updated":"2022-09-07T05:04:49Z","file_id":"33276","content_type":"application/pdf","success":1,"creator":"ekubi","date_created":"2022-09-07T05:04:49Z"}],"department":[{"_id":"151"}],"type":"patent"},{"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9306963"}],"language":[{"iso":"eng"}],"doi":"10.1109/h2rc51942.2020.00007","year":"2020","title":"Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite","publication_identifier":{"isbn":["9781665415927"]},"author":[{"id":"40778","last_name":"Meyer","first_name":"Marius","full_name":"Meyer, Marius"},{"last_name":"Kenter","first_name":"Tobias","full_name":"Kenter, Tobias","id":"3145"},{"id":"16153","first_name":"Christian","orcid":"0000-0001-5728-9982","last_name":"Plessl","full_name":"Plessl, Christian"}],"publication_status":"published","date_updated":"2023-09-26T11:42:53Z","date_created":"2021-04-16T10:17:22Z","keyword":["FPGA","OpenCL","High Level Synthesis","HPC benchmarking"],"type":"conference","department":[{"_id":"27"},{"_id":"518"}],"publication":"2020 IEEE/ACM International Workshop on Heterogeneous High-performance Reconfigurable Computing (H2RC)","abstract":[{"lang":"eng","text":"FPGAs have found increasing adoption in data center applications since a new generation of high-level tools have become available which noticeably reduce development time for FPGA accelerators and still provide high-quality results. There is, however, no high-level benchmark suite available, which specifically enables a comparison of FPGA architectures, programming tools, and libraries for HPC applications. To fill this gap, we have developed an OpenCL-based open-source implementation of the HPCC benchmark suite for Xilinx and Intel FPGAs. This benchmark can serve to analyze the current capabilities of FPGA devices, cards, and development tool flows, track progress over time, and point out specific difficulties for FPGA acceleration in the HPC domain. Additionally, the benchmark documents proven performance optimization patterns. We will continue optimizing and porting the benchmark for new generations of FPGAs and design tools and encourage active participation to create a valuable tool for the community. To fill this gap, we have developed an OpenCL-based open-source implementation of the HPCC benchmark suite for Xilinx and Intel FPGAs. This benchmark can serve to analyze the current capabilities of FPGA devices, cards, and development tool flows, track progress over time, and point out specific difficulties for FPGA acceleration in the HPC domain. Additionally, the benchmark documents proven performance optimization patterns. We will continue optimizing and porting the benchmark for new generations of FPGAs and design tools and encourage active participation to create a valuable tool for the community."}],"related_material":{"link":[{"url":"https://github.com/pc2/HPCC_FPGA","relation":"supplementary_material","description":"Official repository of the benchmark suite on GitHub"}]},"_id":"21632","user_id":"15278","status":"public","citation":{"ama":"Meyer M, Kenter T, Plessl C. Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite. In: <i>2020 IEEE/ACM International Workshop on Heterogeneous High-Performance Reconfigurable Computing (H2RC)</i>. ; 2020. doi:<a href=\"https://doi.org/10.1109/h2rc51942.2020.00007\">10.1109/h2rc51942.2020.00007</a>","short":"M. Meyer, T. Kenter, C. Plessl, in: 2020 IEEE/ACM International Workshop on Heterogeneous High-Performance Reconfigurable Computing (H2RC), 2020.","chicago":"Meyer, Marius, Tobias Kenter, and Christian Plessl. “Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite.” In <i>2020 IEEE/ACM International Workshop on Heterogeneous High-Performance Reconfigurable Computing (H2RC)</i>, 2020. <a href=\"https://doi.org/10.1109/h2rc51942.2020.00007\">https://doi.org/10.1109/h2rc51942.2020.00007</a>.","bibtex":"@inproceedings{Meyer_Kenter_Plessl_2020, title={Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite}, DOI={<a href=\"https://doi.org/10.1109/h2rc51942.2020.00007\">10.1109/h2rc51942.2020.00007</a>}, booktitle={2020 IEEE/ACM International Workshop on Heterogeneous High-performance Reconfigurable Computing (H2RC)}, author={Meyer, Marius and Kenter, Tobias and Plessl, Christian}, year={2020} }","mla":"Meyer, Marius, et al. “Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite.” <i>2020 IEEE/ACM International Workshop on Heterogeneous High-Performance Reconfigurable Computing (H2RC)</i>, 2020, doi:<a href=\"https://doi.org/10.1109/h2rc51942.2020.00007\">10.1109/h2rc51942.2020.00007</a>.","apa":"Meyer, M., Kenter, T., &#38; Plessl, C. (2020). Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite. <i>2020 IEEE/ACM International Workshop on Heterogeneous High-Performance Reconfigurable Computing (H2RC)</i>. <a href=\"https://doi.org/10.1109/h2rc51942.2020.00007\">https://doi.org/10.1109/h2rc51942.2020.00007</a>","ieee":"M. Meyer, T. Kenter, and C. Plessl, “Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite,” 2020, doi: <a href=\"https://doi.org/10.1109/h2rc51942.2020.00007\">10.1109/h2rc51942.2020.00007</a>."},"quality_controlled":"1","project":[{"name":"Computing Resources Provided by the Paderborn Center for Parallel Computing","_id":"52"}]},{"date_updated":"2023-09-28T09:49:19Z","ipn":"EP 3 358 332 B1","title":"Patent EP 3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines Geräts.","year":"2020","author":[{"last_name":"Reinke","first_name":"Kai","full_name":"Reinke, Kai"},{"id":"54290","first_name":"Amelie","last_name":"Bender","full_name":"Bender, Amelie"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"id":"21220","last_name":"Sextro","first_name":"Walter","full_name":"Sextro, Walter"},{"first_name":"James Kuria","last_name":"Kimotho","full_name":"Kimotho, James Kuria"}],"type":"patent","department":[{"_id":"151"}],"file":[{"creator":"ekubi","date_created":"2022-09-07T05:17:34Z","file_name":"EP000003358332B1_1.pdf","access_level":"closed","file_size":115020,"relation":"main_file","date_updated":"2022-09-07T05:17:34Z","file_id":"33277","success":1,"content_type":"application/pdf"}],"date_created":"2019-05-27T09:46:54Z","abstract":[{"text":"Die Erfindung betrifft ein Gerät mit wenigstens einem elastisch verformbaren Bauteil als Strukturteil und/oder Lagerteil, auf das im Betriebsverlauf von wechselnden Betriebszuständen abhängige, unterschiedliche Verformungskräfte einwirken, die zu einem die Bauteilnutzungsdauer begrenzenden Bauteilverschleiß führen, und mit einer Einrichtung zur Bestimmung der Bauteilnutzungsdauer und einer verschleißbedingten Bauteil-Restnutzungsdauer. Erfindungsgemäß wird ein sich zeitversetzt wiederholender, jeweils gleicher Betriebszustand vorbestimmt, dem eine jeweils gleiche Verformungskraft zugeordnet ist, durch die das elastisch verformbare Bauteilmaterial verformt wird. Ein solcher vorbestimmter Betriebszustand wird jeweils von einer Mess- und Auswerteeinheit erkannt und ein Messvorgang durch ein Startsignal selbsttätig gestartet, wobei mit wenigstens einem bauteilzugeordneten Beschleunigungssensor, die aktuelle Beschleunigung der Verformung oder daraus abgeleitete Kennwerte als Kenngröße für eine aktuelle Bauteilsteifigkeit gemessen und jeweils in einer Messkurve gespeichert und verglichen wird.","lang":"ger"}],"ipc":"G01M 13/00","application_date":"01.02.2018","user_id":"210","publication_date":"15.07.2020","ddc":["620"],"page":"1","_id":"9981","has_accepted_license":"1","status":"public","application_number":"18154730.8","file_date_updated":"2022-09-07T05:17:34Z","citation":{"mla":"Reinke, Kai, et al. <i>Patent EP 3 358 332 B1: Verfahren Zur Bestimmung Des Beginns Einer Verschleißbedingten Bauteil-Restnutzungsdauer Eines Elastisch Verformbaren Bauteils, Als Strukturteil Und/Oder Lagerteil Eines Geräts.</i> 2020.","apa":"Reinke, K., Bender, A., Meyer, T., Sextro, W., &#38; Kimotho, J. K. (2020). <i>Patent EP 3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines Geräts.</i>","ieee":"K. Reinke, A. Bender, T. Meyer, W. Sextro, and J. K. Kimotho, “Patent EP 3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines Geräts.” 2020.","chicago":"Reinke, Kai, Amelie Bender, Tobias Meyer, Walter Sextro, and James Kuria Kimotho. “Patent EP 3 358 332 B1: Verfahren Zur Bestimmung Des Beginns Einer Verschleißbedingten Bauteil-Restnutzungsdauer Eines Elastisch Verformbaren Bauteils, Als Strukturteil Und/Oder Lagerteil Eines Geräts.,” 2020.","short":"K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2020).","ama":"Reinke K, Bender A, Meyer T, Sextro W, Kimotho JK. Patent EP 3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines Geräts. Published online 2020.","bibtex":"@article{Reinke_Bender_Meyer_Sextro_Kimotho_2020, title={Patent EP 3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines Geräts.}, author={Reinke, Kai and Bender, Amelie and Meyer, Tobias and Sextro, Walter and Kimotho, James Kuria}, year={2020} }"}},{"abstract":[{"text":"Selbstoptimierung bietet die Möglichkeit der autonomen Anpassung des Systemverhaltens an veränderliche Ziele. Dabei ist vor allem der Aspekt Zuverlässigkeit von maßgeblicher Bedeutung, da über einen an die aktuelle Systemzuverlässigkeit angepassten Betriebspunkt die Leistungsfähigkeit verbessert wird, während das Ausfallverhalten besser vorhersehbar wird. Zur Anpassung des Systemverhaltens an die aktuelle Zuverlässigkeit mittels Selbstoptimierung müssen die ersten beiden Schritte des Selbstoptimierungsprozesses unterstützt werden. Für die Analyse der Ist-Situation ist eine Erkennung des aktuellen Degradationszustands mittels Condition Monitoring notwendig. Zur Auswahl geeigneter Verfahren werden bestehende Ansätze hinsichtlich ihrer Eignung klassifiziert. Der zweite Schritt, die Bestimmung der Systemziele, wird durch eine strukturierte Methode zum Finden verlässlichkeitsrelevanter Zielfunktionen ergänzt. Dabei werden kritische Komponenten identifiziert, Optimierungsparameter festgelegt und die Verlässlichkeit in Abhängigkeit des Systemverhaltens quantifiziert. Entwickler selbstoptimierender Systeme werden somit durch geeignete Mittel bei der Implementierung beider Schritte unterstützt. Abschließend wird der praktische Einsatz der vorgestellten Methoden anhand zweier Beispiele gezeigt.","lang":"ger"}],"citation":{"bibtex":"@book{Meyer_Kaul_Kimotho_Sextro_2018, title={Steigerung der Intelligenz mechatronischer Systeme}, volume={Steigerung der Verlässlichkeit technischer Systeme}, publisher={Springer Nature Switzerland AG. Part of Springer Nature.}, author={Meyer, Tobias and Kaul, Thorben and Kimotho, James Kuria and Sextro, Walter}, year={2018}, pages={193–213} }","ama":"Meyer T, Kaul T, Kimotho JK, Sextro W. <i>Steigerung Der Intelligenz Mechatronischer Systeme</i>. Vol Steigerung der Verlässlichkeit technischer Systeme. Springer Nature Switzerland AG. Part of Springer Nature.; 2018:193-213.","short":"T. Meyer, T. Kaul, J.K. Kimotho, W. Sextro, Steigerung Der Intelligenz Mechatronischer Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018.","chicago":"Meyer, Tobias, Thorben Kaul, James Kuria Kimotho, and Walter Sextro. <i>Steigerung Der Intelligenz Mechatronischer Systeme</i>. Vol. Steigerung der Verlässlichkeit technischer Systeme. Springer Nature Switzerland AG. Part of Springer Nature., 2018.","ieee":"T. Meyer, T. Kaul, J. K. Kimotho, and W. Sextro, <i>Steigerung der Intelligenz mechatronischer Systeme</i>, vol. Steigerung der Verlässlichkeit technischer Systeme. Springer Nature Switzerland AG. Part of Springer Nature., 2018, pp. 193–213.","mla":"Meyer, Tobias, et al. <i>Steigerung Der Intelligenz Mechatronischer Systeme</i>. Vol. Steigerung der Verlässlichkeit technischer Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018, pp. 193–213.","apa":"Meyer, T., Kaul, T., Kimotho, J. K., &#38; Sextro, W. (2018). <i>Steigerung der Intelligenz mechatronischer Systeme</i> (Vol. Steigerung der Verlässlichkeit technischer Systeme, pp. 193–213). Springer Nature Switzerland AG. Part of Springer Nature."},"department":[{"_id":"151"}],"type":"book","date_created":"2019-05-27T10:22:20Z","date_updated":"2019-05-27T10:23:51Z","author":[{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"full_name":"Kaul, Thorben","first_name":"Thorben","last_name":"Kaul","id":"14802"},{"first_name":"James Kuria","last_name":"Kimotho","full_name":"Kimotho, James Kuria"},{"id":"21220","full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro"}],"year":"2018","title":"Steigerung der Intelligenz mechatronischer Systeme","status":"public","volume":"Steigerung der Verlässlichkeit technischer Systeme","user_id":"55222","language":[{"iso":"eng"}],"_id":"9995","publisher":"Springer Nature Switzerland AG. Part of Springer Nature.","page":"193-213"},{"date_created":"2019-05-27T10:27:45Z","type":"conference","keyword":["wire bonding","multi-objective optimization","process model","copper wire","self-optimization"],"department":[{"_id":"151"}],"publication":"In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018","citation":{"mla":"Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>.","bibtex":"@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }","ama":"Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:<a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">10.4071/2380-4505-2018.1.000572</a>","ieee":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.","apa":"Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., &#38; Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i> (Vol. Vol. 2018, No. 1, pp. 000572-000577.). <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>","chicago":"Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In <i>In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018</i>, Vol. Vol. 2018, No. 1, pp. 000572-000577., 2018. <a href=\"https://doi.org/10.4071/2380-4505-2018.1.000572\">https://doi.org/10.4071/2380-4505-2018.1.000572</a>.","short":"A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018."},"abstract":[{"text":"Ultrasonic wire bonding is an indispensable process in the industrial manufacturing of semiconductor devices. Copper wire is increasingly replacing the well-established aluminium wire because of its superior electrical, thermal and mechanical properties. Copper wire processes differ significantly from aluminium processes and are more sensitive to disturbances, which reduces the range of parameter values suitable for a stable process. Disturbances can be compensated by an adaption of process parameters, but finding suitable parameters manually is difficult and time-consuming. This paper presents a physical model of the ultrasonic wire bonding process including the friction contact between tool and wire. This model yields novel insights into the process. A prototype of a multi-objective optimizing bonding machine (MOBM) is presented. It uses multi-objective optimization, based on the complete process model, to automatically select the best operating point as a compromise of concurrent objectives.","lang":"eng"}],"quality_controlled":"1","project":[{"_id":"92","grant_number":"02 PQ2210","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"language":[{"iso":"eng"}],"_id":"9999","user_id":"210","doi":"10.4071/2380-4505-2018.1.000572","volume":"Vol. 2018, No. 1, pp. 000572-000577.","title":"Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges","status":"public","year":"2018","author":[{"first_name":"Andreas","last_name":"Unger","full_name":"Unger, Andreas"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"}],"date_updated":"2020-05-07T05:33:56Z"},{"abstract":[{"lang":"eng","text":"Reliability-adaptive systems allow an adaptation of system behavior based on current system reliability. They can extend their lifetime at the cost of lowered performance or vice versa. This can be used to adapt failure behavior according to a maintenance plan, thus increasing availability while using up system capability fully. To facilitate setup, a control algorithm independent of a degradation model is desired. A closed loop control technique for reliability based on a health index, a measure for system degradation, is introduced. It uses self-optimization as means to implement behavior adaptation. This is based on selecting the priorities of objectives that the system pursues. Possible working points are computed beforehand using model-based multiobjective optimization techniques. The controller selects the priorities of objectives and this way balances reliability and performance. As exemplary application, an automatically actuated single plate dry clutch is introduced. The entire reliability control is setup and lifetime experiments are conducted. Results show that the variance of time to failure is reduced greatly, making the failure behavior more predictable. At the same time, the desired usable lifetime can be extended at the cost of system performance to allow for changed maintenance intervals. Together, these possibilities allow for greater system usage and better planning of maintenance."}],"citation":{"bibtex":"@book{Meyer_2018, title={Optimization-based reliability control of mechatronic systems}, publisher={Shaker}, author={Meyer, Tobias}, year={2018} }","ama":"Meyer T. <i>Optimization-Based Reliability Control of Mechatronic Systems</i>. Shaker; 2018.","mla":"Meyer, Tobias. <i>Optimization-Based Reliability Control of Mechatronic Systems</i>. Shaker, 2018.","chicago":"Meyer, Tobias. <i>Optimization-Based Reliability Control of Mechatronic Systems</i>. Shaker, 2018.","short":"T. Meyer, Optimization-Based Reliability Control of Mechatronic Systems, Shaker, 2018.","ieee":"T. Meyer, <i>Optimization-based reliability control of mechatronic systems</i>. Shaker, 2018.","apa":"Meyer, T. (2018). <i>Optimization-based reliability control of mechatronic systems</i>. Shaker."},"department":[{"_id":"151"}],"keyword":["dependability","reliability","behavior adaptation","self-optimization","multiobjective optimization","optimal control","automotive drivetrain","clutch system","reliability-adaptive system"],"type":"dissertation","date_created":"2019-05-27T10:21:17Z","date_updated":"2023-09-15T12:26:09Z","author":[{"full_name":"Meyer, Tobias","first_name":"Tobias","last_name":"Meyer"}],"title":"Optimization-based reliability control of mechatronic systems","status":"public","year":"2018","user_id":"210","_id":"9994","publisher":"Shaker","language":[{"iso":"eng"}]},{"citation":{"ieee":"Y. Fleischmann, L. Kempen, T. Mai, and R. Biehler, “Die online Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning Format in mathematischen Vorkursen,” in <i>Hanse-Kolloquium zur Hochschuldidaktik der Mathematik</i>, 2018, pp. 101–116.","mla":"Fleischmann, Yael, et al. “Die Online Lernmaterialien von StudiVEMINT: Einsatzszenarien Im Blended Learning Format in Mathematischen Vorkursen.” <i>Hanse-Kolloquium Zur Hochschuldidaktik Der Mathematik</i>, edited by M. Klinger et al., WTM-Verlag, 2018, pp. 101–116.","apa":"Fleischmann, Y., Kempen, L., Mai, T., &#38; Biehler, R. (2018). Die online Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning Format in mathematischen Vorkursen. In M. Klinger, A. Schüler-Meyer, &#38; L. Wessel (Eds.), <i>Hanse-Kolloquium zur Hochschuldidaktik der Mathematik</i> (pp. 101–116). WTM-Verlag.","bibtex":"@inproceedings{Fleischmann_Kempen_Mai_Biehler_2018, place={Münster}, title={Die online Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning Format in mathematischen Vorkursen}, booktitle={Hanse-Kolloquium zur Hochschuldidaktik der Mathematik}, publisher={WTM-Verlag}, author={Fleischmann, Yael and Kempen, Leander and Mai, Tobias and Biehler, Rolf}, editor={Klinger, M. and Schüler-Meyer, A. and Wessel, L.}, year={2018}, pages={101–116} }","chicago":"Fleischmann, Yael, Leander Kempen, Tobias Mai, and Rolf Biehler. “Die Online Lernmaterialien von StudiVEMINT: Einsatzszenarien Im Blended Learning Format in Mathematischen Vorkursen.” In <i>Hanse-Kolloquium Zur Hochschuldidaktik Der Mathematik</i>, edited by M. Klinger, A. Schüler-Meyer, and L. Wessel, 101–116. Münster: WTM-Verlag, 2018.","ama":"Fleischmann Y, Kempen L, Mai T, Biehler R. Die online Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning Format in mathematischen Vorkursen. In: Klinger M, Schüler-Meyer A, Wessel L, eds. <i>Hanse-Kolloquium Zur Hochschuldidaktik Der Mathematik</i>. WTM-Verlag; 2018:101–116.","short":"Y. Fleischmann, L. Kempen, T. Mai, R. Biehler, in: M. Klinger, A. Schüler-Meyer, L. Wessel (Eds.), Hanse-Kolloquium Zur Hochschuldidaktik Der Mathematik, WTM-Verlag, Münster, 2018, pp. 101–116."},"publication":"Hanse-Kolloquium zur Hochschuldidaktik der Mathematik","date_created":"2024-09-25T08:20:25Z","place":"Münster","department":[{"_id":"363"}],"type":"conference","author":[{"first_name":"Yael","last_name":"Fleischmann","full_name":"Fleischmann, Yael"},{"full_name":"Kempen, Leander","first_name":"Leander","last_name":"Kempen"},{"full_name":"Mai, Tobias","first_name":"Tobias","last_name":"Mai"},{"id":"16274","full_name":"Biehler, Rolf","first_name":"Rolf","last_name":"Biehler"}],"title":"Die online Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning Format in mathematischen Vorkursen","year":"2018","status":"public","date_updated":"2024-09-25T08:28:10Z","language":[{"iso":"eng"}],"_id":"56249","publisher":"WTM-Verlag","page":"101–116","main_file_link":[{"url":"https://www.researchgate.net/profile/Rolf-Biehler/publication/348551970_Die_Online-Lernmaterialien_von_studiVEMINT_Einsatzszenarien_im_Blended_Learning_Format_in_mathematischen_Vorkursen/links/602286d5a6fdcc37a813a04b/Die-Online-Lernmaterialien-von-studiVEMINT-Einsatzszenarien-im-Blended-Learning-Format-in-mathematischen-Vorkursen.pdf"}],"editor":[{"first_name":"M.","last_name":"Klinger","full_name":"Klinger, M."},{"full_name":"Schüler-Meyer, A.","first_name":"A.","last_name":"Schüler-Meyer"},{"first_name":"L.","last_name":"Wessel","full_name":"Wessel, L."}],"user_id":"37888"},{"volume":"Vol. 231(4)","user_id":"55222","doi":"10.1177/1748006X17709376","_id":"9976","language":[{"iso":"eng"}],"page":"390 - 399","date_updated":"2019-09-16T10:20:49Z","author":[{"full_name":"Kaul, Thorben","last_name":"Kaul","first_name":"Thorben","id":"14802"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"}],"year":"2017","title":"Formulation of reliability-related objective functions for design of intelligent mechatronic systems","status":"public","department":[{"_id":"151"}],"keyword":["Integrated model","reliability","system behavior","Bayesian network","multiobjective optimization"],"type":"journal_article","date_created":"2019-05-27T09:37:46Z","abstract":[{"lang":"eng","text":"State-of-the-art mechatronic systems offer inherent intelligence that enables them to autonomously adapt their behavior to current environmental conditions and to their own system state. This autonomous behavior adaptation is made possible by software in combination with complex sensor and actuator systems and by sophisticated information processing, all of which make these systems increasingly complex. This increasing complexity makes the design process a challenging task and brings new complex possibilities for operation and maintenance. However, with the risk of increased system complexity also comes the chance to adapt system behavior based on current reliability, which in turn increases reliability. The development of such an adaption strategy requires appropriate methods to evaluate reliability based on currently selected system behavior. A common approach to implement such adaptivity is to base system behavior on different working points that are obtained using multiobjective optimization. During operation, selection among these allows a changed operating strategy. To allow for multiobjective optimization, an accurate system model including system reliability is required. This model is repeatedly evaluated by the optimization algorithm. At present, modeling of system reliability and synchronization of the models of behavior and reliability is a laborious manual task and thus very error-prone. Since system behavior is crucial for system reliability, an integrated model is introduced that integrates system behavior and system reliability. The proposed approach is used to formulate reliability-related objective functions for a clutch test rig that are used to compute feasible working points using multiobjective optimization."}],"quality_controlled":"1","citation":{"bibtex":"@article{Kaul_Meyer_Sextro_2017, title={Formulation of reliability-related objective functions for design of intelligent mechatronic systems}, volume={Vol. 231(4)}, DOI={<a href=\"https://doi.org/10.1177/1748006X17709376\">10.1177/1748006X17709376</a>}, journal={SAGE Journals}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, year={2017}, pages={390–399} }","ama":"Kaul T, Meyer T, Sextro W. Formulation of reliability-related objective functions for design of intelligent mechatronic systems. <i>SAGE Journals</i>. 2017;Vol. 231(4):390-399. doi:<a href=\"https://doi.org/10.1177/1748006X17709376\">10.1177/1748006X17709376</a>","mla":"Kaul, Thorben, et al. “Formulation of Reliability-Related Objective Functions for Design of Intelligent Mechatronic Systems.” <i>SAGE Journals</i>, vol. Vol. 231(4), 2017, pp. 390–99, doi:<a href=\"https://doi.org/10.1177/1748006X17709376\">10.1177/1748006X17709376</a>.","chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Formulation of Reliability-Related Objective Functions for Design of Intelligent Mechatronic Systems.” <i>SAGE Journals</i> Vol. 231(4) (2017): 390–99. <a href=\"https://doi.org/10.1177/1748006X17709376\">https://doi.org/10.1177/1748006X17709376</a>.","short":"T. Kaul, T. Meyer, W. Sextro, SAGE Journals Vol. 231(4) (2017) 390–399.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Formulation of reliability-related objective functions for design of intelligent mechatronic systems,” <i>SAGE Journals</i>, vol. Vol. 231(4), pp. 390–399, 2017.","apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2017). Formulation of reliability-related objective functions for design of intelligent mechatronic systems. <i>SAGE Journals</i>, <i>Vol. 231(4)</i>, 390–399. <a href=\"https://doi.org/10.1177/1748006X17709376\">https://doi.org/10.1177/1748006X17709376</a>"},"publication":"SAGE Journals"},{"date_created":"2019-05-27T09:52:37Z","place":"Leonberg","type":"conference","keyword":["intelligente Systeme"],"department":[{"_id":"151"}],"publication":"VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.","citation":{"bibtex":"@inproceedings{Sextro_Meyer_Kaul_Kimotho_2017, place={Leonberg}, title={Entwicklung verlässlicher, intelligenter Systeme}, booktitle={VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.}, author={Sextro, Walter and Meyer, Tobias and Kaul, Thorben and Kimotho, James Kuria}, year={2017}, pages={17–30} }","short":"W. Sextro, T. Meyer, T. Kaul, J.K. Kimotho, in: VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte., Leonberg, 2017, pp. 17–30.","ama":"Sextro W, Meyer T, Kaul T, Kimotho JK. Entwicklung verlässlicher, intelligenter Systeme. In: <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte.</i> Leonberg; 2017:17–30.","chicago":"Sextro, Walter, Tobias Meyer, Thorben Kaul, and James Kuria Kimotho. “Entwicklung Verlässlicher, Intelligenter Systeme.” In <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte.</i>, 17–30. Leonberg, 2017.","ieee":"W. Sextro, T. Meyer, T. Kaul, and J. K. Kimotho, “Entwicklung verlässlicher, intelligenter Systeme,” in <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.</i>, 2017, pp. 17–30.","mla":"Sextro, Walter, et al. “Entwicklung Verlässlicher, Intelligenter Systeme.” <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte.</i>, 2017, pp. 17–30.","apa":"Sextro, W., Meyer, T., Kaul, T., &#38; Kimotho, J. K. (2017). Entwicklung verlässlicher, intelligenter Systeme. In <i>VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte.</i> (pp. 17–30). Leonberg."},"quality_controlled":"1","abstract":[{"text":"Intelligente technische Systeme sind durch einen erhöhten Funktionsumfang charakterisiert, der diese dazu befähigt, autonom auf wechselnde Umgebungsbedingungen, Anforderungen und inhärente Systemzustände zu reagieren. Dies kann mit den Methoden der Selbstoptimie-rung erreicht werden. Hier werden mit Verfahren der Mehrzieloptimierung mögliche Betriebs-punkte des Systems bestimmt zwischen denen das System im Betrieb autonom auswählt und somit eine Verhaltensadaption erwirkt. Zur Berechnung der Betriebspunkte ist es notwendig ein Modell des Systemverhaltens aufzustellen und das Verhalten hinsichtlich verschiedener, meist konfliktärer, Ziele zu quantifizieren. Bei der Modellierung des Systemverhaltens und der Formulierung der Ziele stellt die Absiche-rung der Verlässlichkeit auf Grund der zunehmenden Systemkomplexität eine große Heraus-forderung dar, der im Entwicklungsprozess begegnet werden muss. Die Implementierung von Selbstoptimierung bietet darüber hinaus in Kombination mit einer Zustandsüberwachung im Betrieb die Möglichkeit einer zuverlässigkeitsbasierten Verhaltensanpassung, deren Potential zu einer Steigerung der Verlässlichkeit genutzt werden kann. In dieser Arbeit werden die Entwicklung intelligenter technischer Systeme und die damit ver-bundenen notwendigen Entwicklungsschritte zur Absicherung der Verlässlichkeit anhand von selbstoptimierenden Systemen betrachtet. Dazu gehören die Formulierung verlässlichkeitsre-levanter Ziele und die Implementierung einer Zustandsüberwachung als Basis für eine zuver-lässigkeitsbasierte Verhaltensanpassung. Es werden auf Grundlage einer Beschreibung der Entwicklungsschritte, Potentiale zur Steigerung der Verlässlichkeit sowie Chancen und zukünf-tige Herausforderungen herausgestellt und diskutiert.","lang":"ger"}],"page":"17–30","language":[{"iso":"eng"}],"_id":"9985","user_id":"55222","year":"2017","status":"public","title":"Entwicklung verlässlicher, intelligenter Systeme","author":[{"full_name":"Sextro, Walter","first_name":"Walter","last_name":"Sextro","id":"21220"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"full_name":"Kaul, Thorben","first_name":"Thorben","last_name":"Kaul","id":"14802"},{"full_name":"Kimotho, James Kuria","last_name":"Kimotho","first_name":"James Kuria"}],"date_updated":"2019-09-30T09:03:57Z"},{"date_created":"2019-05-27T08:47:52Z","type":"conference","keyword":["finite element simulation","wire bonding","tool geometry"],"department":[{"_id":"151"}],"publication":"IEEE 66th Electronic Components and Technology Conference","citation":{"short":"S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–2110.","ama":"Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:2103-2110. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>","chicago":"Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 2103–10, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>.","bibtex":"@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent Transmittable Tangential Force of Wire Bond Tools}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff, Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian}, year={2016}, pages={2103–2110} }","mla":"Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–10, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.234\">10.1109/ECTC.2016.234</a>.","apa":"Althoff, S., Meyer, T., Unger, A., Sextro, W., &#38; Eacock, F. (2016). Shape-Dependent Transmittable Tangential Force of Wire Bond Tools. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 2103–2110). <a href=\"https://doi.org/10.1109/ECTC.2016.234\">https://doi.org/10.1109/ECTC.2016.234</a>","ieee":"S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 2103–2110."},"quality_controlled":"1","abstract":[{"lang":"eng","text":"Wire bonding has been an established packaging technology for decades. When introducing copper as wire material for high power applications, adaptations to the bonding process and to machines became necessary. Here, challenges occur due to the stiffer wire material and changing oxide layers on the contact partners. To achieve sufficient process stability, a clean bond area is required, which can only be achieved with high shear stresses in the contact partners surfaces. These necessitate high normal forces to plastically deform the wire and substrate. To achieve such high stresses in the contact area, the bonding tool needs to be able to transmit the needed tangential forces to the top side of the wire. The wire itself performs a shear movement and transmits the force into the contact area to clean the contaminant and oxide layers and to level the desired bond surfaces. The main function of the tool is to transmit these forces. If the bond tool can only transmit low forces in the direction of excitation, the parameter space for a stable bond process is severely restricted. Here, a modeling approach to estimate how well different tool shapes meet the demand of transmitting high tangential forces is presented. The model depends on wire deformation and thus on the ultrasonic softening effect."}],"project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}],"page":"2103-2110","language":[{"iso":"eng"}],"_id":"9955","user_id":"210","doi":"10.1109/ECTC.2016.234","title":"Shape-Dependent Transmittable Tangential Force of Wire Bond Tools","status":"public","year":"2016","author":[{"full_name":"Althoff, Simon","last_name":"Althoff","first_name":"Simon"},{"last_name":"Meyer","first_name":"Tobias","full_name":"Meyer, Tobias"},{"full_name":"Unger, Andreas","first_name":"Andreas","last_name":"Unger"},{"id":"21220","first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter"},{"full_name":"Eacock, Florian","last_name":"Eacock","first_name":"Florian"}],"date_updated":"2020-05-07T05:33:52Z"},{"volume":"7/8","user_id":"210","language":[{"iso":"eng"}],"_id":"9957","page":"512-519","date_updated":"2020-05-07T05:33:52Z","author":[{"last_name":"Brökelmann","first_name":"Michael","full_name":"Brökelmann, Michael"},{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"},{"full_name":"Hunstig, Matthias","last_name":"Hunstig","first_name":"Matthias"},{"first_name":"Florian","last_name":"Biermann","full_name":"Biermann, Florian"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"year":"2016","title":"Kupferbondverbindungen intelligent herstellen","status":"public","department":[{"_id":"151"}],"type":"journal_article","date_created":"2019-05-27T08:53:18Z","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}],"abstract":[{"lang":"eng","text":"Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL – Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit, sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in Form einer modifizierten Bondmaschine. Intelligent production of heavy copper wire bonds It is the aim of this innovation-project to develop a self-optimization system for ultrasonic copper wire bonding. It is part of the leading edge cluster “it’s OWL”. The bonding machine will be able to react autonomously to changing boundary conditions to ensure constant and reliable bonding results. For this, the hole bonding process is modeled in great detail and newest self-optimization techniques are utilized. A prototype-system incorporated in a serial machine is used for evaluation."}],"citation":{"ieee":"M. Brökelmann <i>et al.</i>, “Kupferbondverbindungen intelligent herstellen,” <i>wt-online</i>, vol. 7/8, pp. 512–519, 2016.","apa":"Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M., … Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. <i>Wt-Online</i>, <i>7/8</i>, 512–519.","short":"M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.","chicago":"Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i> 7/8 (2016): 512–19.","mla":"Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i>, vol. 7/8, 2016, pp. 512–19.","bibtex":"@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016, title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online}, author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten}, year={2016}, pages={512–519} }","ama":"Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen. <i>wt-online</i>. 2016;7/8:512-519."},"publication":"wt-online","popular_science":"1"},{"quality_controlled":"1","abstract":[{"text":"Redundancy is a common approach to improve system reliability, availability and safety in technical systems. It is achieved by adding functionally equivalent elements that enable the system to remain operational even though one or more of those elements fail. This paper begins with an overview on the various terminologies and methods for redundancy concepts that can be modeled sufficiently using established reliability analysis methods. However, these approaches yield very complex system models, which limits their applicability. In current research, Bayesian Networks (BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used for reliability analysis because of their benefits in modeling complex systems and in representing multi-state variables. However, these approaches lack appropriate methods to model all commonly used redundancy concepts. To overcome this limitation, three different modeling approaches based on BNs and DBNs are described in this paper. Addressing those approaches, the benefits and limitations of BNs and DBNs for modeling reliability of redundant technical systems are discussed and evaluated.","lang":"eng"}],"publication":"Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016","citation":{"apa":"Kaul, T., Meyer, T., &#38; Sextro, W. (2016). Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>.","ieee":"T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks,” in <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","short":"T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016, 2016.","chicago":"Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” In <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","mla":"Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems with Bayesian Networks.” <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>, 2016.","ama":"Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems with Bayesian Networks. In: <i>Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016</i>. ; 2016.","bibtex":"@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third European Conference of the Prognostics and Health Management Society 2016}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }"},"type":"conference","department":[{"_id":"151"}],"date_created":"2019-05-27T09:10:07Z","date_updated":"2019-09-30T08:05:55Z","title":"Modeling of Complex Redundancy in Technical Systems with Bayesian Networks","status":"public","year":"2016","author":[{"id":"14802","first_name":"Thorben","last_name":"Kaul","full_name":"Kaul, Thorben"},{"full_name":"Meyer, Tobias","last_name":"Meyer","first_name":"Tobias"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"user_id":"55222","language":[{"iso":"eng"}],"_id":"9961"},{"citation":{"mla":"Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–28, doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>.","bibtex":"@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation}, DOI={<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>}, booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer , Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628} }","ama":"Meyer  T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: <i>IEEE 66th Electronic Components and Technology Conference</i>. ; 2016:622-628. doi:<a href=\"https://doi.org/10.1109/ECTC.2016.215\">10.1109/ECTC.2016.215</a>","ieee":"T. Meyer  <i>et al.</i>, “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation,” in <i>IEEE 66th Electronic Components and Technology Conference</i>, 2016, pp. 622–628.","apa":"Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M., &#38; Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In <i>IEEE 66th Electronic Components and Technology Conference</i> (pp. 622–628). <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>","short":"T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.","chicago":"Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In <i>IEEE 66th Electronic Components and Technology Conference</i>, 622–28, 2016. <a href=\"https://doi.org/10.1109/ECTC.2016.215\">https://doi.org/10.1109/ECTC.2016.215</a>."},"publication":"IEEE 66th Electronic Components and Technology Conference","project":[{"name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen","grant_number":"02 PQ2210","_id":"92"}],"quality_controlled":"1","abstract":[{"lang":"eng","text":"Usage of copper wire bonds allows to push power boundaries imposed by aluminum wire bonds. Copper allows higher electrical, thermal and mechanical loads than aluminum, which currently is the most commonly used material in heavy wire bonding. This is the main driving factor for increased usage of copper in high power applications such as wind turbines, locomotives or electric vehicles. At the same time, usage of copper also increases tool wear and reduces the range of parameter values for a stable process, making the process more challenging. To overcome these drawbacks, parameter adaptation at runtime using self-optimization is desired. A self-optimizing system is based on system objectives that evaluate and quantify system performance. System parameters can be changed at runtime such that pre-selected objective values are reached. For adaptation of bond process parameters, model-based self-optimization is employed. Since it is based on a model of the system, the bond process was modeled. In addition to static model parameters such as wire and substrate material properties and vibration characteristics of transducer and tool, variable model inputs are process parameters. Main simulation result is bonded area in the wiresubstrate contact. This model is then used to find valid and optimal working points before operation. The working point is composed of normal force and ultrasonic voltage trajectories, which are usually determined experimentally. Instead, multiobjective optimalization is used to compute trajectories that simultaneously optimize bond quality, process duration, tool wear and probability of tool-substrate contacts. The values of these objectives are computed using the process model. At runtime, selection among pre-determined optimal working points is sufficient to prioritize individual objectives. This way, the computationally expensive process of numerically solving a multiobjective optimal control problem and the demanding high speed bonding process are separated. To evaluate to what extent the pre-defined goals of self-optimization are met, an offthe- shelf heavy wire bonding machine was modified to allow for parameter adaptation and for transmitting of measurement data at runtime. This data is received by an external computer system and evaluated to select a new working point. Then, new process parameters are sent to the modified bonding machine for use for subsequent bonds. With these components, a full self-optimizing system has been implemented."}],"date_created":"2019-05-27T09:17:26Z","department":[{"_id":"151"}],"keyword":["Self-optimization","adaptive system","bond process","copper wire"],"type":"conference","author":[{"first_name":"Tobias","last_name":"Meyer ","full_name":"Meyer , Tobias"},{"last_name":"Unger","first_name":"Andreas","full_name":"Unger, Andreas"},{"last_name":"Althoff","first_name":"Simon","full_name":"Althoff, Simon"},{"id":"21220","first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter"},{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Hunstig, Matthias","first_name":"Matthias","last_name":"Hunstig"},{"full_name":"Guth, Karsten","first_name":"Karsten","last_name":"Guth"}],"year":"2016","title":"Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation","status":"public","date_updated":"2020-05-07T05:33:53Z","_id":"9966","language":[{"iso":"eng"}],"page":"622-628","user_id":"210","doi":"10.1109/ECTC.2016.215"}]