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Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. <i>2022 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">https://doi.org/10.1109/ssi56489.2022.9901416</a>","bibtex":"@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }","mla":"Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” <i>2022 Smart Systems Integration (SSI)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>.","short":"S. 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