---
_id: '53624'
author:
- first_name: Timo
  full_name: Neuhausen, Timo
  id: '99991'
  last_name: Neuhausen
  orcid: 0000-0002-8262-767X
- first_name: Michael
  full_name: Ahlers, Michael
  last_name: Ahlers
citation:
  ama: 'Neuhausen T, Ahlers M. Modellierungen außerinstitutioneller Aneignungsprozesse
    digital-materieller Interfaces und (musik-)pädagogische Anschlüsse. In: Neuhaus
    D, Keden HJ, eds. <i>Musik – Digitalisierung – Bildung</i>. kopaed; 2024:77-96.'
  apa: Neuhausen, T., &#38; Ahlers, M. (2024). Modellierungen außerinstitutioneller
    Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse.
    In D. Neuhaus &#38; H. J. Keden (Eds.), <i>Musik – Digitalisierung – Bildung</i>
    (pp. 77–96). kopaed.
  bibtex: '@inbook{Neuhausen_Ahlers_2024, place={München}, title={Modellierungen außerinstitutioneller
    Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse},
    booktitle={Musik – Digitalisierung – Bildung}, publisher={kopaed}, author={Neuhausen,
    Timo and Ahlers, Michael}, editor={Neuhaus, Daniela and Keden, Helmke Jan}, year={2024},
    pages={77–96} }'
  chicago: 'Neuhausen, Timo, and Michael Ahlers. “Modellierungen außerinstitutioneller
    Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse.”
    In <i>Musik – Digitalisierung – Bildung</i>, edited by Daniela Neuhaus and Helmke
    Jan Keden, 77–96. München: kopaed, 2024.'
  ieee: 'T. Neuhausen and M. Ahlers, “Modellierungen außerinstitutioneller Aneignungsprozesse
    digital-materieller Interfaces und (musik-)pädagogische Anschlüsse,” in <i>Musik
    – Digitalisierung – Bildung</i>, D. Neuhaus and H. J. Keden, Eds. München: kopaed,
    2024, pp. 77–96.'
  mla: Neuhausen, Timo, and Michael Ahlers. “Modellierungen außerinstitutioneller
    Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse.”
    <i>Musik – Digitalisierung – Bildung</i>, edited by Daniela Neuhaus and Helmke
    Jan Keden, kopaed, 2024, pp. 77–96.
  short: 'T. Neuhausen, M. Ahlers, in: D. Neuhaus, H.J. Keden (Eds.), Musik – Digitalisierung
    – Bildung, kopaed, München, 2024, pp. 77–96.'
date_created: 2024-04-23T12:56:15Z
date_updated: 2025-02-06T10:49:26Z
ddc:
- '780'
department:
- _id: '131'
- _id: '540'
editor:
- first_name: Daniela
  full_name: Neuhaus, Daniela
  last_name: Neuhaus
- first_name: Helmke Jan
  full_name: Keden, Helmke Jan
  last_name: Keden
language:
- iso: ger
main_file_link:
- open_access: '1'
  url: https://www.pedocs.de/volltexte/2024/31459/pdf/Neuhaus_Keden_2024_Musik_Digitalisierung_Bildung.pdf
oa: '1'
page: 77-96
place: München
publication: Musik – Digitalisierung – Bildung
publication_identifier:
  unknown:
  - 978-3-96848-728-1
publication_status: published
publisher: kopaed
status: public
title: Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller
  Interfaces und (musik-)pädagogische Anschlüsse
type: book_chapter
user_id: '99991'
year: '2024'
...
---
_id: '9979'
author:
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
citation:
  ama: Neuhaus J. <i>Multiskalen-Kontaktmodellierung Unter Berücksichtigung Der Rauigkeit
    Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts</i>. Shaker;
    2017.
  apa: Neuhaus, J. (2017). <i>Multiskalen-Kontaktmodellierung unter Berücksichtigung
    der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts</i>.
    Shaker.
  bibtex: '@book{Neuhaus_2017, title={Multiskalen-Kontaktmodellierung unter Berücksichtigung
    der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts},
    publisher={Shaker}, author={Neuhaus, Jan}, year={2017} }'
  chicago: Neuhaus, Jan. <i>Multiskalen-Kontaktmodellierung Unter Berücksichtigung
    Der Rauigkeit Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts</i>.
    Shaker, 2017.
  ieee: J. Neuhaus, <i>Multiskalen-Kontaktmodellierung unter Berücksichtigung der
    Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts</i>.
    Shaker, 2017.
  mla: Neuhaus, Jan. <i>Multiskalen-Kontaktmodellierung Unter Berücksichtigung Der
    Rauigkeit Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts</i>.
    Shaker, 2017.
  short: J. Neuhaus, Multiskalen-Kontaktmodellierung Unter Berücksichtigung Der Rauigkeit
    Und Fluiden Zwischenschichten Am Beispiel Des Rad-Schiene-Kontakts, Shaker, 2017.
date_created: 2019-05-27T09:43:14Z
date_updated: 2023-09-15T12:26:35Z
department:
- _id: '151'
keyword:
- Kontaktmodellierung
- Rauigkeit
language:
- iso: eng
publisher: Shaker
status: public
title: Multiskalen-Kontaktmodellierung unter Berücksichtigung der Rauigkeit und fluiden
  Zwischenschichten am Beispiel des Rad-Schiene-Kontakts
type: dissertation
user_id: '210'
year: '2017'
...
---
_id: '9952'
abstract:
- lang: eng
  text: The contact between viscoelastic materials e.g. elastomers and a rough surface
    leads to a special friction characteristic, which differs greatly in its properties
    comparing to other materials like metals. In practice, this friction combination
    occurs for example in the tire-road contact, or in the use of rubber gaskets.
    Due to the frictional forces a system is significantly influenced in its vibrational
    properties. The friction force is composed of two main components adhesion and
    hysteresis. The adhesion results from molecular bounds between the contact partners,
    while the deformation of the viscoelastic material by the roughness of the counter
    body leads to power loss. This internal friction results in an additional frictional
    force, which is described by the hysteresis. To simulate the frictional behaviour
    of elastomers on rough surfaces and thus to determine the energy dissipation in
    contact, it is necessary to develop a mechanical model which considers the roughness
    of the contact partners, as well as dynamic effects and the dependence on normal
    pressure and sliding speed. The viscoelastic material behaviour must also be considered.
    The contact between two rough surfaces is modelled as a rough rigid layer contacting
    a rough elas- tic layer. The elastic layer is modelled by point masses connected
    by Maxwell-elements. This allows the viscoelastic properties of the elastomer
    to be considered. The behaviour of whole system can be described by equations
    of motion with integrated constraints. The degrees of freedom of the model depends
    on the varying contact conditions. A point mass not in contact has two degrees
    of freedom. A point mass in contact moving along the roughness path can be described
    by only one degree of freedom. For each Maxwell-Element also an inner coordinate
    and thus a further degree of freedom is needed. Because of varying contact conditions
    dur- ing the simulation, the simulation interrupts in case the contact conditions
    change. Then the equations of motions are adapted with respect to the contact
    constraints. As a result of the simulation one obtain the energy dissipation and
    thus the friction char- acteristic during the friction process. It is possible
    to use these results in three dimensional point-contact elements in order to model
    contact surfaces on lager length scales.
author:
- first_name: Frank
  full_name: Schulte, Frank
  last_name: Schulte
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schulte F, Neuhaus J, Sextro W. A Mechanical Model for the Dynamical Contact
    of Elastic Rough Bodies with Viscoelastic Properties. In: <i>Proceedings of ICoEV
    2015 International Conference on Engineering Vibration</i>. ; 2015:1109-1117.'
  apa: Schulte, F., Neuhaus, J., &#38; Sextro, W. (2015). A Mechanical Model for the
    Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties. In <i>Proceedings
    of ICoEV 2015 International Conference on Engineering Vibration</i> (pp. 1109–1117).
  bibtex: '@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for
    the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings
    of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte,
    Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }'
  chicago: Schulte, Frank, Jan Neuhaus, and Walter Sextro. “A Mechanical Model for
    the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties.” In
    <i>Proceedings of ICoEV 2015 International Conference on Engineering Vibration</i>,
    1109–17, 2015.
  ieee: F. Schulte, J. Neuhaus, and W. Sextro, “A Mechanical Model for the Dynamical
    Contact of Elastic Rough Bodies with Viscoelastic Properties,” in <i>Proceedings
    of ICoEV 2015 International Conference on Engineering Vibration</i>, 2015, pp.
    1109–1117.
  mla: Schulte, Frank, et al. “A Mechanical Model for the Dynamical Contact of Elastic
    Rough Bodies with Viscoelastic Properties.” <i>Proceedings of ICoEV 2015 International
    Conference on Engineering Vibration</i>, 2015, pp. 1109–17.
  short: 'F. Schulte, J. Neuhaus, W. Sextro, in: Proceedings of ICoEV 2015 International
    Conference on Engineering Vibration, 2015, pp. 1109–1117.'
date_created: 2019-05-27T08:37:22Z
date_updated: 2019-09-16T10:47:53Z
department:
- _id: '151'
keyword:
- Contact Mechanics
- Viscoelastic Material
- Adhesive Friction
- Hysteresis Friction
- Energy Dissipation
- Vibration
language:
- iso: eng
page: 1109-1117
publication: Proceedings of ICoEV 2015 International Conference on Engineering Vibration
quality_controlled: '1'
status: public
title: A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic
  Properties
type: conference
user_id: '55222'
year: '2015'
...
---
_id: '9868'
abstract:
- lang: eng
  text: In order to increase mechanical strength, heat dissipation and ampacity and
    to decrease failure through fatigue fracture, wedge copper wire bonding is being
    introduced as a standard interconnection method for mass production. To achieve
    the same process stability when using copper wire instead of aluminum wire a profound
    understanding of the bonding process is needed. Due to the higher hardness of
    copper compared to aluminum wire it is more difficult to approach the surfaces
    of wire and substrate to a level where van der Waals forces are able to arise
    between atoms. Also, enough friction energy referred to the total contact area
    has to be generated to activate the surfaces. Therefore, a friction model is used
    to simulate the joining process. This model calculates the resulting energy of
    partial areas in the contact surface and provides information about the adhesion
    process of each area. The focus here is on the arising of micro joints in the
    contact area depending on the location in the contact and time. To validate the
    model, different touchdown forces are used to vary the initial contact areas of
    wire and substrate. Additionally, a piezoelectric tri-axial force sensor is built
    up to identify the known phases of pre-deforming, cleaning, adhering and diffusing
    for the real bonding process to map with the model. Test substrates as DBC and
    copper plate are used to show the different formations of a wedge bond connection
    due to hardness and reaction propensity. The experiments were done by using 500
    $\mu$m copper wire and a standard V-groove tool.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper
    wire bonds using a friction model approach. In: <i>Electronic Components and Technology
    Conference (ECTC), 2014 IEEE 64th</i>. ; 2014:1549-1555. doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2014). Improving the
    bond quality of copper wire bonds using a friction model approach. In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i> (pp. 1549–1555).
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the
    bond quality of copper wire bonds using a friction model approach}, DOI={<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>},
    booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th},
    author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter},
    year={2014}, pages={1549–1555} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving
    the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In <i>Electronic
    Components and Technology Conference (ECTC), 2014 IEEE 64th</i>, 1549–55, 2014.
    <a href="https://doi.org/10.1109/ECTC.2014.6897500">https://doi.org/10.1109/ECTC.2014.6897500</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality
    of copper wire bonds using a friction model approach,” in <i>Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–1555.
  mla: Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using
    a Friction Model Approach.” <i>Electronic Components and Technology Conference
    (ECTC), 2014 IEEE 64th</i>, 2014, pp. 1549–55, doi:<a href="https://doi.org/10.1109/ECTC.2014.6897500">10.1109/ECTC.2014.6897500</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components
    and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.'
date_created: 2019-05-20T12:11:44Z
date_updated: 2019-09-16T10:57:58Z
department:
- _id: '151'
doi: 10.1109/ECTC.2014.6897500
keyword:
- adhesion
- circuit reliability
- deformation
- diffusion
- fatigue cracks
- friction
- interconnections
- lead bonding
- van der Waals forces
- Cu
- adhering process
- adhesion process
- ampacity improvement
- bond quality improvement
- cleaning process
- diffusing process
- fatigue fracture failure
- friction energy
- friction model
- heat dissipation
- mechanical strength
- piezoelectric triaxial force sensor
- predeforming process
- size 500 mum
- total contact area
- van der Waals forces
- wedge copper wire bonding
- Bonding
- Copper
- Finite element analysis
- Force
- Friction
- Substrates
- Wires
language:
- iso: eng
page: 1549-1555
publication: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
quality_controlled: '1'
status: public
title: Improving the bond quality of copper wire bonds using a friction model approach
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9887'
abstract:
- lang: eng
  text: A model to calculate the locally resolved tangential contact forces of the
    wheel rail contact with respect to contact kinematics, material and surface properties
    as well as temperature is introduced. The elasticity of wheel and rail is modeled
    as an elastic layer consisting of point contact elements connected by springs
    to each other and to the wheel. Each element has two degrees of freedom in tangential
    directions. The resulting total stiffness matrix is reduced to calculate only
    the position of the elements in contact. Friction forces as well as contact stiffnesses
    are incorporated by a nonlinear force-displacement characteristic, which originates
    from a detailed contact model. The contact elements are transported through the
    contact zone in discrete time steps. After each time step an equilibrium is calculated.
    For all elements, their temperature and its influence on local friction are regarded
    by calculating friction power and temperature each time step.
author:
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Neuhaus J, Sextro W. Thermo-Mechanical Model for Wheel Rail Contact using
    Coupled Point Contact Elements. In: Liu GR, Guan ZW, eds. <i>Proceedings of the
    5th International Conference on Computational Methods</i>. ScienTech Publisher;
    2014.'
  apa: Neuhaus, J., &#38; Sextro, W. (2014). Thermo-Mechanical Model for Wheel Rail
    Contact using Coupled Point Contact Elements. In G. R. Liu &#38; Z. W. Guan (Eds.),
    <i>Proceedings of the 5th International Conference on Computational Methods</i>.
    ScienTech Publisher.
  bibtex: '@inproceedings{Neuhaus_Sextro_2014, title={Thermo-Mechanical Model for
    Wheel Rail Contact using Coupled Point Contact Elements}, booktitle={Proceedings
    of the 5th International Conference on Computational Methods}, publisher={ScienTech
    Publisher}, author={Neuhaus, Jan and Sextro, Walter}, editor={Liu, G.R. and Guan,
    Z.W.Editors}, year={2014} }'
  chicago: Neuhaus, Jan, and Walter Sextro. “Thermo-Mechanical Model for Wheel Rail
    Contact Using Coupled Point Contact Elements.” In <i>Proceedings of the 5th International
    Conference on Computational Methods</i>, edited by G.R. Liu and Z.W. Guan. ScienTech
    Publisher, 2014.
  ieee: J. Neuhaus and W. Sextro, “Thermo-Mechanical Model for Wheel Rail Contact
    using Coupled Point Contact Elements,” in <i>Proceedings of the 5th International
    Conference on Computational Methods</i>, 2014.
  mla: Neuhaus, Jan, and Walter Sextro. “Thermo-Mechanical Model for Wheel Rail Contact
    Using Coupled Point Contact Elements.” <i>Proceedings of the 5th International
    Conference on Computational Methods</i>, edited by G.R. Liu and Z.W. Guan, ScienTech
    Publisher, 2014.
  short: 'J. Neuhaus, W. Sextro, in: G.R. Liu, Z.W. Guan (Eds.), Proceedings of the
    5th International Conference on Computational Methods, ScienTech Publisher, 2014.'
date_created: 2019-05-20T13:23:02Z
date_updated: 2019-09-16T10:59:46Z
department:
- _id: '151'
editor:
- first_name: G.R.
  full_name: Liu, G.R.
  last_name: Liu
- first_name: Z.W.
  full_name: Guan, Z.W.
  last_name: Guan
keyword:
- Rolling Contact
- Discrete Elements
- Contact Stiffness
- Temperature
language:
- iso: eng
publication: Proceedings of the 5th International Conference on Computational Methods
publisher: ScienTech Publisher
quality_controlled: '1'
status: public
title: Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact
  Elements
type: conference
user_id: '55222'
year: '2014'
...
---
_id: '9797'
abstract:
- lang: eng
  text: A model approach for wedge/wedge bonding copper wire is presented. The connection
    between wire and substrate is based on a variety of physical effects, but the
    dominant one is the friction based welding while applying ultrasound. Consequently,
    a friction model was used to investigate the welding process. This model is built
    up universal and can be used to describe the formation of micro welds in the time
    variant contact area between wire and substrate. Aim of the model is to identify
    the interactions between touchdown, bond normal force, ultrasonic power and bonding
    time. To do so, the contact area is discretized into partial areas where a Point
    Contact Model is applied. Based on this approach it is possible to simulate micro
    and macro slip inside the contact area between wire and substrate. The work done
    by friction force is a main criterion to define occurring micro joints which influence
    the subsequent welding.
author:
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Jan
  full_name: Neuhaus, Jan
  last_name: Neuhaus
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling
    wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>.
    Orlando (Florida), USA; 2013. doi:<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>'
  apa: Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based
    approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium
    on Microelectronics</i>. Orlando (Florida), USA. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>
  bibtex: '@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida),
    USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>},
    booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff,
    Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }'
  chicago: Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction
    Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International
    Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href="https://doi.org/10.4071/isom-2013-TA67">https://doi.org/10.4071/isom-2013-TA67</a>.
  ieee: S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach
    for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on
    Microelectronics</i>, 2013.
  mla: Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.”
    <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a
    href="https://doi.org/10.4071/isom-2013-TA67">10.4071/isom-2013-TA67</a>.
  short: 'S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International
    Symposium on Microelectronics, Orlando (Florida), USA, 2013.'
date_created: 2019-05-13T13:55:36Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.4071/isom-2013-TA67
keyword:
- Wire bonding
- friction modeling
- wire bond quality
- contact element modeling
language:
- iso: eng
place: Orlando (Florida), USA
publication: IMAPS 2013, 46th International Symposium on Microelectronics
status: public
title: A friction based approach for modeling wire bonding
type: conference
user_id: '55222'
year: '2013'
...