---
_id: '30371'
abstract:
- lang: eng
text: "To achieve optimum bond results at ultrasonic bonding thick copper wire on
sensitive components is quite challenging.\r\nBearing in mind that high normal
force and ultrasonic power are needed for bond quality but as well increase stress
and finally failure risk of the substrate, methods should be found to achieve
high bond quality even at lower bond parameters. Therefore, bond experiments with
different bond tool grove geometries have been conducted for copper and aluminum
wire on direct copper bonded (DCB) substrates to investigate the impact of geometric
parameters on bond formation and bond quality. The wire material depending impact
of geometry changes on the bond formation and deformation was quantified. Additionally,
a bonding parameter design of experiments (DOE) has been conducted for the reference
and the most promising groove geometry. Higher shear values were achieved at reduced
vertical tool displacement for most bonding parameter combinations, compared to
the reference tool. This behavior allows for reducing ultrasonic power to obtain
equal shear values; consequently, mechanical stresses in the interface decrease.
This could potentially reduce the risk of chip damage and thus yield loss."
author:
- first_name: Oliver Ernst Caspar
full_name: Hagedorn, Oliver Ernst Caspar
id: '53321'
last_name: Hagedorn
- first_name: Marian
full_name: Broll, Marian
last_name: Broll
- first_name: Olaf
full_name: Kirsch, Olaf
last_name: Kirsch
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental Investigation
of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic
Thick Wire Bonding. In: CIPS 2022 - 12th International Conference on Integrated
Power Electronics Systems. VDE VERLAG GMBH; 2022:138-143.'
apa: Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., & Sextro, W. (2022).
Experimental Investigation of the Influence of different Bond Tool Grooves on
the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International
Conference on Integrated Power Electronics Systems, 138–143.
bibtex: '@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2022, place={Berlin},
title={Experimental Investigation of the Influence of different Bond Tool Grooves
on the Bond Quality for Ultrasonic Thick Wire Bonding}, booktitle={CIPS 2022 -
12th International Conference on Integrated Power Electronics Systems}, publisher={VDE
VERLAG GMBH}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch,
Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022}, pages={138–143} }'
chicago: 'Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel,
and Walter Sextro. “Experimental Investigation of the Influence of Different Bond
Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS
2022 - 12th International Conference on Integrated Power Electronics Systems,
138–43. Berlin: VDE VERLAG GMBH, 2022.'
ieee: O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental
Investigation of the Influence of different Bond Tool Grooves on the Bond Quality
for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference
on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
mla: Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence
of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.”
CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems,
VDE VERLAG GMBH, 2022, pp. 138–43.
short: 'O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022
- 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG
GMBH, Berlin, 2022, pp. 138–143.'
conference:
end_date: 2022.03.17
location: Berlin
name: CIPS 2022 - 12th International Conference on Integrated Power Electronics
Systems
start_date: 2022.03.15
date_created: 2022-03-17T15:00:06Z
date_updated: 2023-09-21T14:22:17Z
department:
- _id: '151'
language:
- iso: eng
page: 138-143
place: Berlin
publication: CIPS 2022 - 12th International Conference on Integrated Power Electronics
Systems
publication_identifier:
isbn:
- 'ISBN 978-3-8007-5757-2 '
publisher: VDE VERLAG GMBH
quality_controlled: '1'
status: public
title: Experimental Investigation of the Influence of different Bond Tool Grooves
on the Bond Quality for Ultrasonic Thick Wire Bonding
type: conference
user_id: '210'
year: '2022'
...
---
_id: '34104'
abstract:
- lang: eng
text: 'ue to the constantly growing energy demand of power electronics and the need
to reduce the size of electronic components like power modules for e-mobility,
new challenges arise for ultrasonic wire bonding: the electrical connection must
endure higher thermal and mechanical stress while the connecting partners become
more sensitive or require more energy to get bonded. Past investigations have
shown already that multi-dimensional ultrasonic bonding and welding yield the
same or even better bond quality while reducing the load on the components. This
contribution is intended to show whether multidi-mensional thick wire bonding
is a promising concept to over-come the new challenges. The focus is on experimental
investi-gations of different bond tool trajectories in ultrasonic wire bonding
of aluminum and copper wire on DCB''s and chips. The bond quality is analyzed
by shear tests, microsections and, in the case of aluminum bonding, by a new machine
learning method for an objective automated evaluation of the sheared area.'
author:
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Olaf
full_name: Kirsch, Olaf
last_name: Kirsch
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of
Multidimensional Ultrasonic Heavy Wire Bonding. In: 2022 IEEE 9th Electronics
System-Integration Technology Conference (ESTC). IEEE; 2022. doi:10.1109/estc55720.2022.9939478'
apa: Scheidemann, C., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental
Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE
9th Electronics System-Integration Technology Conference (ESTC). https://doi.org/10.1109/estc55720.2022.9939478
bibtex: '@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental
Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={10.1109/estc55720.2022.9939478},
booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference
(ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel,
Tobias and Sextro, Walter}, year={2022} }'
chicago: Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental
Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE
9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022.
https://doi.org/10.1109/estc55720.2022.9939478.
ieee: 'C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation
of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.'
mla: Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional
Ultrasonic Heavy Wire Bonding.” 2022 IEEE 9th Electronics System-Integration
Technology Conference (ESTC), IEEE, 2022, doi:10.1109/estc55720.2022.9939478.
short: 'C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics
System-Integration Technology Conference (ESTC), IEEE, 2022.'
date_created: 2022-11-17T15:17:39Z
date_updated: 2023-09-22T12:24:18Z
department:
- _id: '151'
doi: 10.1109/estc55720.2022.9939478
language:
- iso: eng
publication: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
publication_status: published
publisher: IEEE
quality_controlled: '1'
status: public
title: Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
type: conference
user_id: '38259'
year: '2022'
...
---
_id: '21436'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a solid-state joining process, used in the electronics
industry to form electrical connections, e.g. to connect electrical terminals
within semiconductor modules. Many process parameters affect the bond strength,
such like the bond normal force, ultrasonic power, wire material and bonding frequency.
Today, process design, development, and optimization is most likely based on the
knowledge of process engineers and is mainly performed by experimental testing.
In this contribution, a newly developed simulation tool is presented, to reduce
time and costs and efficiently determine optimized process parameter. Based on
a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
bonding process are considered using finite element simulation for the complex
plastic deformation of the wire and reduced order models for the transient dynamics
of the transducer, wire, substrate and bond formation. The model parameters such
as the coefficients of friction between bond tool and wire and between wire and
substrate were determined for aluminium and copper wire in experiments with a
test rig specially developed for the requirements of heavy wire bonding. To reduce
simulation time, for the finite element simulation a restart analysis and high
performance computing is utilized. Detailed analysis of the bond formation showed,
that the normal pressure distribution in the contact between wire and substrate
has high impact on bond formation and distribution of welded areas in the contact
area.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. Microelectronics Reliability.
2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics
Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
bibtex: '@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077},
journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger,
Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }'
chicago: 'Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro.
“Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.”
Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.'
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics
Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” Microelectronics Reliability, vol.
119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
short: R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability
119 (2021) 114077.
date_created: 2021-03-10T09:37:02Z
date_updated: 2023-09-21T14:15:33Z
department:
- _id: '151'
doi: https://doi.org/10.1016/j.microrel.2021.114077
intvolume: ' 119'
keyword:
- Ultrasonic heavy wire bonding
- Co-simulation
- ANSYS
- MATLAB
- Process optimization
- Friction coefficient
- Copper-copper
- Aluminium-copper
language:
- iso: eng
page: '114077'
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
publication_status: published
quality_controlled: '1'
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: journal_article
user_id: '210'
volume: 119
year: '2021'
...
---
_id: '17355'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a process to form electrical connections in electronics
well established industry. Typically, a clamping tool is pressed on the wire and
forced to vibrate at relative high frequency 40 to 100 kHz. The ultrasonic vibration
is transmitted through the wire into the interface between wire and substrate.
Due to frictional processes, contamination like oxide layers are removed from
the contact zone, the surface roughness is reduced, and with increasing bond duration
an metallic connection of wire and substrate is established. It is known that
the amount of ultrasonic energy over time directly influences the strength and
reliability of the bond connection, but the determination of optimum bond parameters
is still a challenging experimental task. For this, in the past different model
approaches have been presented, to calculate the bond quality by simulation. Measuring
the friction between wire and substrate to validate these models is a challenging
task at ultrasonic bonding frequency. Therefore a versatile test rig for bonding
experiments at frequencies lower than 1 kHz is setup to get detailed insight into
the different phases of the connection process. It includes a piezoelectric force
sensor for the measurement of the three-dimensional process forces, an electrodynamic
shaker for the vibration excitation and a conventional tension-compression testing
machine to apply the bond normal force. Using this test rig, it is possible to
observe the different phases of bond formation in detail, validate and enhance
existing models and finally optimize bond parameters for different processes.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: 'Olaf '
full_name: 'Kirsch, Olaf '
last_name: Kirsch
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis
and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS
2020; 11th International Conference on Integrated Power Electronics Systems.
; 2020:1-6.'
apa: Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020).
Experimental analysis and modelling of bond formation in ultrasonic heavy wire
bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics
Systems, 1–6.
bibtex: '@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental
analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS
2020; 11th International Conference on Integrated Power Electronics Systems},
author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch,
Olaf and Sextro, Walter}, year={2020}, pages={1–6} }'
chicago: Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf Kirsch, and
Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic
Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated
Power Electronics Systems, 1–6, 2020.
ieee: R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental
analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in
CIPS 2020; 11th International Conference on Integrated Power Electronics Systems,
2020, pp. 1–6.
mla: Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation
in Ultrasonic Heavy Wire Bonding.” CIPS 2020; 11th International Conference
on Integrated Power Electronics Systems, 2020, pp. 1–6.
short: 'R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020;
11th International Conference on Integrated Power Electronics Systems, 2020, pp.
1–6.'
date_created: 2020-07-06T07:41:21Z
date_updated: 2023-09-21T14:27:32Z
department:
- _id: '151'
language:
- iso: eng
page: 1-6
publication: CIPS 2020; 11th International Conference on Integrated Power Electronics
Systems
quality_controlled: '1'
status: public
title: Experimental analysis and modelling of bond formation in ultrasonic heavy wire
bonding
type: conference
user_id: '210'
year: '2020'
...
---
_id: '17706'
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Viktor
full_name: Krieger, Viktor
last_name: Krieger
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS
for ultrasonic wire bonding process optimization. In: 2020 21st International
Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments
in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679'
apa: Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679
bibtex: '@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation
of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={10.1109/eurosime48426.2020.9152679},
booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel,
Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020}
}'
chicago: Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation
of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In 2020
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation
and Experiments in Microelectronics and Microsystems (EuroSimE), 2020. https://doi.org/10.1109/eurosime48426.2020.9152679.
ieee: 'R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB
and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.'
mla: Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic
Wire Bonding Process Optimization.” 2020 21st International Conference on Thermal,
Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.
short: 'R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International
Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments
in Microelectronics and Microsystems (EuroSimE), 2020.'
date_created: 2020-08-07T09:49:17Z
date_updated: 2023-09-21T14:16:41Z
department:
- _id: '151'
doi: 10.1109/eurosime48426.2020.9152679
language:
- iso: eng
publication: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
publication_identifier:
isbn:
- '9781728160498'
publication_status: published
status: public
title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
type: conference
user_id: '210'
year: '2020'
...
---
_id: '14852'
abstract:
- lang: eng
text: In a variety of industrial applications, liquids are atomized to produce aerosols
for further processing. Example applications are the coating of surfaces with
paints, the application of ultra-thin adhesive layers and the atomization of fuels
for the production of combustible dispersions. In this publication different atomizing
principles (standing-wave, capillary-wave, vibrating-mesh) are examined and discussed.
Using an optimized standing-wave system, tough liquids with viscosities of up
to about 100 Pas could be successfully atomized.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: 'Walter '
full_name: 'Littmann, Walter '
last_name: Littmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Atomization of Fluids
with Ultrasound. In: Lötters J, Urban G, eds. Conference Proceedings - The
4th Conference on MicroFluidic Handling Systems (MFHS2019). Enschede, The
Netherlands; 2019:140-143.'
apa: Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., & Sextro, W. (2019).
Atomization of Fluids with Ultrasound. In J. Lötters & G. Urban (Eds.), Conference
Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)
(pp. 140–143). Enschede, The Netherlands.
bibtex: '@inproceedings{Dunst_Bornmann_Hemsel_Littmann_Sextro_2019, place={Enschede,
The Netherlands}, title={Atomization of Fluids with Ultrasound}, booktitle={Conference
Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019)},
author={Dunst, Paul and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter and
Sextro, Walter}, editor={Lötters, Joost and Urban, GeraldEditors}, year={2019},
pages={140–143} }'
chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter Littmann, and Walter
Sextro. “Atomization of Fluids with Ultrasound.” In Conference Proceedings
- The 4th Conference on MicroFluidic Handling Systems (MFHS2019), edited by
Joost Lötters and Gerald Urban, 140–43. Enschede, The Netherlands, 2019.
ieee: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Atomization
of Fluids with Ultrasound,” in Conference Proceedings - The 4th Conference
on MicroFluidic Handling Systems (MFHS2019), Enschede, The Netherlands, 2019,
pp. 140–143.
mla: Dunst, Paul, et al. “Atomization of Fluids with Ultrasound.” Conference
Proceedings - The 4th Conference on MicroFluidic Handling Systems (MFHS2019),
edited by Joost Lötters and Gerald Urban, 2019, pp. 140–43.
short: 'P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, in: J. Lötters,
G. Urban (Eds.), Conference Proceedings - The 4th Conference on MicroFluidic Handling
Systems (MFHS2019), Enschede, The Netherlands, 2019, pp. 140–143.'
conference:
end_date: 2019-10-04
location: Enschede, The Netherlands
name: 4th Conference on MicroFluidic Handling Systems
start_date: 2019-10-02
date_created: 2019-11-07T15:25:30Z
date_updated: 2022-01-06T06:52:08Z
ddc:
- '620'
department:
- _id: '151'
editor:
- first_name: Joost
full_name: Lötters, Joost
last_name: Lötters
- first_name: Gerald
full_name: Urban, Gerald
last_name: Urban
file:
- access_level: closed
content_type: application/pdf
creator: pdunst
date_created: 2019-11-07T15:22:56Z
date_updated: 2019-11-07T15:22:56Z
file_id: '14853'
file_name: Dunst_MFHS_2019.pdf
file_size: 3850591
relation: main_file
success: 1
file_date_updated: 2019-11-07T15:22:56Z
has_accepted_license: '1'
keyword:
- atomization
- ultrasound
- standing-wave
- capillarywave
- vibrating-mesh
language:
- iso: eng
page: 140-143
place: Enschede, The Netherlands
publication: Conference Proceedings - The 4th Conference on MicroFluidic Handling
Systems (MFHS2019)
publication_status: published
quality_controlled: '1'
status: public
title: Atomization of Fluids with Ultrasound
type: conference
user_id: '22130'
year: '2019'
...
---
_id: '15244'
author:
- first_name: Oliver Ernst Caspar
full_name: Hagedorn, Oliver Ernst Caspar
id: '53321'
last_name: Hagedorn
- first_name: Daniel
full_name: Pielsticker, Daniel
id: '76966'
last_name: Pielsticker
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hagedorn OEC, Pielsticker D, Hemsel T, Sextro W. Messung hochfrequenter In-Plane-Schwingungen
mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In: 2. VDI-Fachtagung
Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019; 2019.'
apa: Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., & Sextro, W. (2019). Messung
hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten
Umgebungen. In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf
2019.
bibtex: '@inproceedings{Hagedorn_Pielsticker_Hemsel_Sextro_2019, title={Messung
hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten
Umgebungen}, booktitle={2. VDI-Fachtagung Schwingungen 2019}, publisher={VDI Verlag
GmbH · Düsseldorf 2019}, author={Hagedorn, Oliver Ernst Caspar and Pielsticker,
Daniel and Hemsel, Tobias and Sextro, Walter}, year={2019} }'
chicago: Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter
Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie
in räumlich eingeschränkten Umgebungen.” In 2. VDI-Fachtagung Schwingungen
2019. VDI Verlag GmbH · Düsseldorf 2019, 2019.
ieee: O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter
In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,”
in 2. VDI-Fachtagung Schwingungen 2019, 2019.
mla: Hagedorn, Oliver Ernst Caspar, et al. “Messung hochfrequenter In-Plane-Schwingungen
mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” 2. VDI-Fachtagung
Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
short: 'O.E.C. Hagedorn, D. Pielsticker, T. Hemsel, W. Sextro, in: 2. VDI-Fachtagung
Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.'
date_created: 2019-12-04T11:59:52Z
date_updated: 2022-01-06T06:52:19Z
department:
- _id: '151'
language:
- iso: ger
publication: 2. VDI-Fachtagung Schwingungen 2019
publication_identifier:
isbn:
- 978-3-18-092366-6
publisher: VDI Verlag GmbH · Düsseldorf 2019
status: public
title: Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich
eingeschränkten Umgebungen
type: conference
user_id: '53321'
year: '2019'
...
---
_id: '10258'
abstract:
- lang: eng
text: Für die Zerstäubung hochviskoser Flüssigkeiten werden neben Düsenzerstäubern
vor allem UltraschallStehwellenzerstäuber angewendet [1]. Diese ermöglichen ohne
weitere Maßnahmen zwar keine gerichtete Zerstäubung, benötigen jedoch im Gegensatz
zu Düsenzerstäubern keine hohen Drücke und haben keine hohen Austrittsgeschwindigkeiten.
Zur Erzeugung der Ultraschallwellen werden typischerweise piezoelektrische, mit
Bolzen verschraubte LangevinWandler verwendet [1-4], die eine starke Schallabstrahlung
bei einer elektrischen Eingangsleistung von bis zu einigen Kilowatt erzeugen können.
Wie bei jedem anderen schwingenden System emittiert der Ultraschallwandler zunächst
eine Wanderwelle. Mit einem Reflektor, der gegenüber der Sonotrode angeordnet
ist, wird eine stehende Welle erzeugt. Im Resonanzabstand zwischen Reflektor und
Wandler werden abgestrahlte und reflektierte Wellen so überlagert, dass höhere
Schalldruckamplituden erzielt werden. Ein einfacher Ansatz zur Maximierung des
Schallpegels im Stehwellenfeld ist die Erhöhung der Schwingungsamplituden des
Wandlers, die jedoch zu Schäden oder zumindest zu einer Verringerung der Lebensdauer
führen kann. Hohe Schalldrücke werden auch bei geringen Abständen zwischen Wandler
und Reflektor erreicht. Das Volumen des Schallfeldes ist in diesem Fall jedoch
für die meisten Prozesse zu klein. Ein weiterer Ansatz ist die Verwendung zweier
entgegengesetzt angeordneter Wandler [5]. In diesem Fall erfordert jedoch die
Erzeugung einer stehenden Welle eine genaue Abstimmung von Frequenz und Phase
beider Wandler, was eine komplexe Steuerung erfordert. Ebenso ist es möglich,
geometrische Randbedingungen des Stehwellensystems zu optimieren, sodass es zu
optimaler Interferenz der Wellen kommt. Im Folgenden wird der Anschaulichkeit
halber vereinfachend angenommen, dass der Wandler an seiner Sonotrodenoberfläche
einzelne Schallstrahlen aussendet, die in Nähe des Wandlers nahezu parallel verlaufen
und sich mit zunehmender Entfernung vom Wandler auffächern. Ein einfaches Stehwellensystem,
bestehend aus ebener Sonotrode und ebenem Reflektor, erzeugt bei kleinem Abstand
zwischen Sonotrode und Reflektor sehr hohe Schallpegel, da nahezu sämtliche ausgesandten
Schallstrahlen in Richtung der Sonotrode reflektiert werden positive Interferenz
entsteht. Erhöht man jedoch den Abstand zwischen Sonotrode und Reflektor, so nehmen
die Verluste durch Schallstrahlen, die den Prozessraum verlassen, zu. Wie Abbildung
1 gezeigt, werden nur Schallstrahlen, die in etwa parallel zur Rotationsachse
verlaufen, zum Wandler zurück reflektiert und tragen zum Stehwellenfeld bei. Die
Strahlen haben zudem abhängig vom Abstrahlwinkel unterschiedliche Weglängen. Die
Stehwellenbedingung ist demnach nur für Strahlen in der Nähe der Rotationsachse
exakt erfüllt. Um dies zu vermeiden, müssen die Geometrien von Wandler und Reflektor
optimiert werden. In den folgenden Abschnitten wird zunächst ein Optimierungsansatz
vorgestellt. Mithilfe eines FiniteElemente-Modells werden die Auswirkungen einer
optimierten Geometrie auf den maximalen Schalldruckpegel untersucht. Ergebnisse
werden durch Messungen an einem experimentellen Aufbau eines Stehwellensystems
validiert. Es wird gezeigt, wie sich die Optimierung der geometrischen Randbedingungen
auf die Zerstäubung hochviskoser Flüssigkeiten auswirkt.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: 'Walter '
full_name: 'Littmann, Walter '
last_name: Littmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dunst P, Hemsel T, Bornmann P, Littmann W, Sextro W. Modellbasierte und experimentelle
Charakterisierung von intensiven Ultraschall-Stehwellenfeldern für die Zerstäubung
hochviskoser Flüssigkeiten. In: DAGA 2019. ; 2019.'
apa: Dunst, P., Hemsel, T., Bornmann, P., Littmann, W., & Sextro, W. (2019).
Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
für die Zerstäubung hochviskoser Flüssigkeiten. In DAGA 2019. Rostock.
bibtex: '@inproceedings{Dunst_Hemsel_Bornmann_Littmann_Sextro_2019, title={Modellbasierte
und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
für die Zerstäubung hochviskoser Flüssigkeiten}, booktitle={DAGA 2019}, author={Dunst,
Paul and Hemsel, Tobias and Bornmann, Peter and Littmann, Walter and Sextro,
Walter}, year={2019} }'
chicago: Dunst, Paul, Tobias Hemsel, Peter Bornmann, Walter Littmann, and Walter
Sextro. “Modellbasierte Und Experimentelle Charakterisierung von Intensiven Ultraschall-Stehwellenfeldern
Für Die Zerstäubung Hochviskoser Flüssigkeiten.” In DAGA 2019, 2019.
ieee: P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, and W. Sextro, “Modellbasierte
und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
für die Zerstäubung hochviskoser Flüssigkeiten,” in DAGA 2019, Rostock,
2019.
mla: Dunst, Paul, et al. “Modellbasierte Und Experimentelle Charakterisierung von
Intensiven Ultraschall-Stehwellenfeldern Für Die Zerstäubung Hochviskoser Flüssigkeiten.”
DAGA 2019, 2019.
short: 'P. Dunst, T. Hemsel, P. Bornmann, W. Littmann, W. Sextro, in: DAGA 2019,
2019.'
conference:
end_date: 2019-03-21
location: Rostock
name: Deutsche Jahrestagung für Akustik - DAGA 2019
start_date: 2019-03-18
date_created: 2019-06-17T13:01:47Z
date_updated: 2022-01-06T06:50:33Z
department:
- _id: '151'
language:
- iso: eng
publication: DAGA 2019
status: public
title: Modellbasierte und experimentelle Charakterisierung von intensiven Ultraschall-Stehwellenfeldern
für die Zerstäubung hochviskoser Flüssigkeiten
type: conference
user_id: '22130'
year: '2019'
...
---
_id: '15412'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. To build electrical
connections in the electronics industry, uni-axial and torsional ultrasonic vibration
have been used to join different types of workpieces for decades. Many influencing
factors like ultrasonic power, bond normal force, bond duration and frequency
are known to have a high impact on bond quality and reliability. Multi-dimensional
bonding has been investigated in the past to increase ultrasonic power and consequently
bond strength. This contribution is focused on the comparison of circular, multi-frequency
planar and uniaxial vibration trajectories used for ultrasonic bonding of copper
pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic
microscopy and interface cross-sections.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Collin
full_name: Dymel, Collin
last_name: Dymel
- first_name: Tobias
full_name: Hemsel, Tobias
last_name: Hemsel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
last_name: Sextro
citation:
ama: 'Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration
trajectories on quality and failure modes in ultrasonic bonding. In: International
Symposium on Microelectronics. ; 2019:509-514. doi:10.4071/2380-4505-2019.1.000509'
apa: Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M.,
& Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on
quality and failure modes in ultrasonic bonding. International Symposium on
Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
bibtex: '@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019,
title={Impact of multi-dimensional vibration trajectories on quality and failure
modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509},
booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard
and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias
and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }'
chicago: Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias
Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration
Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In International
Symposium on Microelectronics, 509–14, 2019. https://doi.org/10.4071/2380-4505-2019.1.000509.
ieee: 'R. Schemmel et al., “Impact of multi-dimensional vibration trajectories
on quality and failure modes in ultrasonic bonding,” in International Symposium
on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.'
mla: Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories
on Quality and Failure Modes in Ultrasonic Bonding.” International Symposium
on Microelectronics, 2019, pp. 509–14, doi:10.4071/2380-4505-2019.1.000509.
short: 'R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann,
W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.'
conference:
location: Boston
name: International Symposium on Microelectronics
date_created: 2019-12-24T21:41:04Z
date_updated: 2023-09-21T14:28:50Z
ddc:
- '620'
department:
- _id: '151'
doi: 10.4071/2380-4505-2019.1.000509
file:
- access_level: closed
content_type: application/pdf
creator: schemmel
date_created: 2019-12-24T21:43:59Z
date_updated: 2019-12-24T21:43:59Z
file_id: '15413'
file_name: 2380-4505-2019.1.000509.pdf
file_size: 1010930
relation: main_file
success: 1
file_date_updated: 2019-12-24T21:43:59Z
has_accepted_license: '1'
language:
- iso: eng
page: 509-514
publication: International Symposium on Microelectronics
publication_identifier:
issn:
- 2380-4505
publication_status: published
quality_controlled: '1'
status: public
title: Impact of multi-dimensional vibration trajectories on quality and failure modes
in ultrasonic bonding
type: conference
user_id: '210'
year: '2019'
...
---
_id: '10334'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. In the electronics industry
it is used to form electrical connections, including those of dissimilar materials.
Multiple influencing factors in ultrasonic joining are known and extensively investigated;
process parameters like ultrasonic power, bond force, and bonding frequency of
the ultrasonic vibration are known to have a high impact on a reliable joining
process and need to be adapted for each new application with different geometry
or materials. This contribution is focused on increasing ultrasonic power transmitted
to the interface and keeping mechanical stresses during ultrasonic bonding low
by using a multi-dimensional ultrasonic transducer concept. Bonding results for
a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
bonding are discussed.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors
and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025'
apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro,
W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.
https://doi.org/10.1016/j.sna.2019.04.025'
bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
volume={295}, DOI={10.1016/j.sna.2019.04.025},
journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
Walter}, year={2019}, pages={653–662} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295
(2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.'
ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
“Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662,
2019, doi: 10.1016/j.sna.2019.04.025.'
mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical,
vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.'
short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: ' 295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
issn:
- 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '9990'
abstract:
- lang: eng
text: The handling of fine powders is an important task in modern production processes.
However, as fine powders strongly tend to adhesion and agglomeration, their processing
with conventional methods is difficult or impossible. Especially when processing
small amounts of highly sensitive fine powders, conventional methods reach their
technical limits. In process steps such as dosing, transport, and especially mixing
of fine powders new methods are required. Apart from the well-known method of
manipulating powder properties by adding chemical additives, this contribution
aims at improving the handling of dry fine powders by using vibrations at different
frequencies. Modules are presented, which enable the continuous dosing, the homogeneous
mixing and the transport of dry fine powders. Finally, these modules are combined
for the production of a homogeneous mixture of two dry fine powders.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter.
full_name: Littmann, Walter.
last_name: Littmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Dunst P, Bornmann P, Hemsel T, Littmann W, Sextro W. Vibration Assisted Dosing,
Mixing and Transport of Dry Fine Powders. ACTUATOR 2018; 16th International
Conference on New Actuators. 2018:142-145.
apa: Dunst, P., Bornmann, P., Hemsel, T., Littmann, W., & Sextro, W. (2018).
Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders. ACTUATOR
2018; 16th International Conference on New Actuators, 142–145.
bibtex: '@article{Dunst_Bornmann_Hemsel_Littmann_Sextro_2018, title={Vibration Assisted
Dosing, Mixing and Transport of Dry Fine Powders}, journal={ACTUATOR 2018; 16th
International Conference on New Actuators}, author={Dunst, Paul and Bornmann,
Peter and Hemsel, Tobias and Littmann, Walter. and Sextro, Walter}, year={2018},
pages={142–145} }'
chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, Walter. Littmann, and Walter
Sextro. “Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders.”
ACTUATOR 2018; 16th International Conference on New Actuators, 2018, 142–45.
ieee: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, and W. Sextro, “Vibration Assisted
Dosing, Mixing and Transport of Dry Fine Powders,” ACTUATOR 2018; 16th International
Conference on New Actuators, pp. 142–145, 2018.
mla: Dunst, Paul, et al. “Vibration Assisted Dosing, Mixing and Transport of Dry
Fine Powders.” ACTUATOR 2018; 16th International Conference on New Actuators,
2018, pp. 142–45.
short: P. Dunst, P. Bornmann, T. Hemsel, W. Littmann, W. Sextro, ACTUATOR 2018;
16th International Conference on New Actuators (2018) 142–145.
date_created: 2019-05-27T10:13:10Z
date_updated: 2019-09-16T09:45:13Z
department:
- _id: '151'
language:
- iso: eng
page: 142-145
publication: ACTUATOR 2018; 16th International Conference on New Actuators
quality_controlled: '1'
status: public
title: Vibration Assisted Dosing, Mixing and Transport of Dry Fine Powders
type: journal_article
user_id: '55222'
year: '2018'
...
---
_id: '9991'
abstract:
- lang: eng
text: Abstract:Since fine powders tend strongly to adhesion and agglomeration, their
processing withconventional methods is difficult or impossible. Typically, in order
to enable the handling of finepowders, chemicals are added to increase the flowability
and reduce adhesion. This contributionshows that instead of additives also vibrations
can be used to increase the flowability, to reduceadhesion and cohesion, and thus
to enable or improve processes such as precision dosing, mixing,and transport
of very fine powders. The methods for manipulating powder properties are describedin
detail and prototypes for experimental studies are presented. It is shown that
the handling of finepowders can be improved by using low-frequency, high-frequency
or a combination of low- andhigh-frequency vibration.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Dunst P, Bornmann P, Hemsel T, Sextro W. Vibration-Assisted Handling of Dry
Fine Powders. Actuators 2018, 7(2). 2018:1-11. doi:10.3390/act7020018
apa: Dunst, P., Bornmann, P., Hemsel, T., & Sextro, W. (2018). Vibration-Assisted
Handling of Dry Fine Powders. Actuators 2018, 7(2)., 1–11. https://doi.org/10.3390/act7020018
bibtex: '@article{Dunst_Bornmann_Hemsel_Sextro_2018, title={Vibration-Assisted Handling
of Dry Fine Powders}, DOI={10.3390/act7020018},
journal={Actuators 2018, 7(2).}, author={Dunst, Paul and Bornmann, Peter and Hemsel,
Tobias and Sextro, Walter}, year={2018}, pages={1–11} }'
chicago: Dunst, Paul, Peter Bornmann, Tobias Hemsel, and Walter Sextro. “Vibration-Assisted
Handling of Dry Fine Powders.” Actuators 2018, 7(2)., 2018, 1–11. https://doi.org/10.3390/act7020018.
ieee: P. Dunst, P. Bornmann, T. Hemsel, and W. Sextro, “Vibration-Assisted Handling
of Dry Fine Powders,” Actuators 2018, 7(2)., pp. 1–11, 2018.
mla: Dunst, Paul, et al. “Vibration-Assisted Handling of Dry Fine Powders.” Actuators
2018, 7(2)., 2018, pp. 1–11, doi:10.3390/act7020018.
short: P. Dunst, P. Bornmann, T. Hemsel, W. Sextro, Actuators 2018, 7(2). (2018)
1–11.
date_created: 2019-05-27T10:16:16Z
date_updated: 2019-09-16T09:44:54Z
department:
- _id: '151'
doi: 10.3390/act7020018
keyword:
- powder handling
- flowability
- dosing
- transport
- mixing
- dispersion
- piezoelectricactuators
- vibrations
language:
- iso: eng
page: 1-11
publication: Actuators 2018, 7(2).
quality_controlled: '1'
status: public
title: Vibration-Assisted Handling of Dry Fine Powders
type: journal_article
user_id: '55222'
year: '2018'
...
---
_id: '9992'
abstract:
- lang: eng
text: State-of-the-art industrial compact high power electronic packages require
copper-copper interconnections with larger cross sections made by ultrasonic bonding.
In comparison to aluminium-copper, copper-copper interconnections require increased
normal forces and ultrasonic power, which might lead to substrate damage due to
increased mechanical stresses. One option to raise friction energy without increasing
vibration amplitude between wire and substrate or bonding force is the use of
two-dimensional vibration. The first part of this contribution reports on the
development of a novel bonding system that executes two-dimensional vibrations
of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
bonds only form properly when surfaces are clean, oxide free and activated, the
geometries of tool-tip and pin were optimised using finite element analysis. To
maximize the area of the bonded annulus the distribution of normal pressure was
optimized by varying the convexity of the bottom side of the pin. Second, a statistical
model obtained from an experimental parameter study shows the influence of different
bonding parameters on the bond result. To find bonding parameters with the minimum
number of tests, the experiments have been planned using a D-optimal experimental
design approach.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
of weld formation in a novel two-dimensional copper-copper bonding process. In:
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany). ; 2018:1-6.'
apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process. In (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany)
(pp. 1–6).
bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
title={Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany), 1–6, 2018.
ieee: C. Dymel et al., “Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process,” in (Proceedings
of 7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
text: Ultrasonic bonding and welding are common friction based approaches in the
assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
up to 12 mm² made from copper are well suited in high power applications. For
increasing friction energy, which is responsible for bond formation, a two-dimensional
vibration approach is applied to newly developed interconnection pins. Using two-dimensional
vibration for bonding requires identification of suitable bonding parameters.
Even though simulation models of wire bonding processes exist, parameters for
the two-dimensional pin-bonding process cannot be derived accurately yet. Within
this contribution, a methodology and workflow for experimental studies identifying
a suitable bond parameter space are presented. The results of a pre-study are
used to set up an extensive statistical parameter study, which gives insights
about the bond strength change due to bond process parameter variation. By evaluation
of electrical data captured during bonding, errors biasing the resulting shear
forces are identified. All data obtained during the experimental study is used
to build a statistical regression model suitable for predicting shear forces.
The accuracy of the regression model’s predictions is determined and the applicability
to predict process parameters or validate simulation models is assessed. Finally,
the influence of the tool trajectory on the bond formation is determined, comparing
one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan
(ICSJ 2018), Kyoto, Japan). ; 2018:41-44.'
apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig,
M. (2018). Experimental investigations on the impact of bond process parameters
in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics
IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
year={2018}, pages={41–44} }'
chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings
of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44,
2018.
ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
“Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th
Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp.
41–44.
short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9998'
abstract:
- lang: eng
text: Ultrasonic wedge/wedge-wire bonding is used to connect electrical terminals
of semiconductor modules in power electronics. The wire is clamped with a tool
by a normal force and ultrasonic vibration is transmitted through the wire into
the interface between wire and substrate. Due to frictional processes contaminations
like oxide layers are removed from the contact zone and the surface roughness
is reduced, thus the real contact area is increased. In the next step of bond
formation, thermomechanical forces create micro-junctions between the wire and
substrate and the bond strength increases. The bond parameters like the bond normal
force, the ultrasonic vibration amplitude and the geometry of the clamping tool
show a high influence on the strength and reliability of the wire bond and need
to be investigated in detail. Therefore, in this contribution the dynamical behaviour
of the ultrasonic system, the wire and the substrate are modeled in form of substructures,
which are connected by the friction contacts between tool and wire and between
wire and substrate. Approaches for modelling the time variant contact behaviour,
the substrate dynamics, and the model order reduction for a time efficient simulation
are described to simulate the full bonding process.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. Numerical and experimental investigations
in ultrasonic heavy wire bonding. In: 6th European Conference on Computational
Mechanics (ECCM 6). Glasgow, UK; 2018:1-12.'
apa: Schemmel, R., Hemsel, T., & Sextro, W. (2018). Numerical and experimental
investigations in ultrasonic heavy wire bonding. In 6th European Conference
on Computational Mechanics (ECCM 6) (pp. 1–12). Glasgow, UK.
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2018, place={Glasgow, UK}, title={Numerical
and experimental investigations in ultrasonic heavy wire bonding}, booktitle={6th
European Conference on Computational Mechanics (ECCM 6)}, author={Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter}, year={2018}, pages={1–12} }'
chicago: Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental
Investigations in Ultrasonic Heavy Wire Bonding.” In 6th European Conference
on Computational Mechanics (ECCM 6), 1–12. Glasgow, UK, 2018.
ieee: R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations
in ultrasonic heavy wire bonding,” in 6th European Conference on Computational
Mechanics (ECCM 6), 2018, pp. 1–12.
mla: Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic
Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM
6), 2018, pp. 1–12.
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 6th European Conference on Computational
Mechanics (ECCM 6), Glasgow, UK, 2018, pp. 1–12.'
date_created: 2019-05-27T10:24:38Z
date_updated: 2019-09-23T08:48:04Z
department:
- _id: '151'
language:
- iso: eng
page: 1-12
place: Glasgow, UK
publication: 6th European Conference on Computational Mechanics (ECCM 6)
status: public
title: Numerical and experimental investigations in ultrasonic heavy wire bonding
type: conference
user_id: '55222'
year: '2018'
...
---
_id: '9972'
abstract:
- lang: eng
text: The transportation of dry fine powders is an emerging technologic task, as
in biotechnology, pharmaceu-tical and coatings industry the particle sizes of
processed powders get smaller and smaller. Fine powdersare primarily defined by
the fact that adhesive and cohesive forces outweigh the weight forces, leadingto
mostly unwanted agglomeration (clumping) and adhesion to surfaces. Thereby it
gets more difficult touse conventional conveyor systems (e.g. pneumatic or vibratory
conveyors) for transport. A rather newmethod for transporting these fine powders
is based on ultrasonic vibrations, which are used to reducefriction between powder
and substrate. Within this contribution an experimental set-up consisting of apipe,
a solenoid actuator for axial vibration and an annular piezoelectric actuator
for the high frequencyradial vibration of the pipe is described. Since amplitudes
of the radial pipe vibration should be as large aspossible to get high effects
of friction reduction, the pipe is excited to vibrate in resonance. To determinethe
optimum excitation frequency and actuator position the vibration modes and resonance
frequenciesof the pipe are calculated and measured. Results are in good accordance.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Dunst P, Hemsel T, Sextro W. Analysis of pipe vibration in an ultrasonic powder
transportationsystem. elsevier. 2017;Sensors and Actuators A 263:733-736.
apa: Dunst, P., Hemsel, T., & Sextro, W. (2017). Analysis of pipe vibration
in an ultrasonic powder transportationsystem. Elsevier, Sensors and
Actuators A 263, 733–736.
bibtex: '@article{Dunst_Hemsel_Sextro_2017, title={Analysis of pipe vibration in
an ultrasonic powder transportationsystem}, volume={Sensors and Actuators A 263},
journal={elsevier}, author={Dunst, Paul and Hemsel, Tobias and Sextro, Walter},
year={2017}, pages={733–736} }'
chicago: 'Dunst, Paul, Tobias Hemsel, and Walter Sextro. “Analysis of Pipe Vibration
in an Ultrasonic Powder Transportationsystem.” Elsevier Sensors and Actuators
A 263 (2017): 733–36.'
ieee: P. Dunst, T. Hemsel, and W. Sextro, “Analysis of pipe vibration in an ultrasonic
powder transportationsystem,” elsevier, vol. Sensors and Actuators A 263,
pp. 733–736, 2017.
mla: Dunst, Paul, et al. “Analysis of Pipe Vibration in an Ultrasonic Powder Transportationsystem.”
Elsevier, vol. Sensors and Actuators A 263, 2017, pp. 733–36.
short: P. Dunst, T. Hemsel, W. Sextro, Elsevier Sensors and Actuators A 263 (2017)
733–736.
date_created: 2019-05-27T09:31:13Z
date_updated: 2019-09-16T10:23:40Z
department:
- _id: '151'
keyword:
- Powder transport Piezoelectrics Ultrasonics Pipe vibration Finite element simulation
Fine powder
language:
- iso: eng
page: 733-736
publication: elsevier
quality_controlled: '1'
status: public
title: Analysis of pipe vibration in an ultrasonic powder transportationsystem
type: journal_article
user_id: '55222'
volume: Sensors and Actuators A 263
year: '2017'
...
---
_id: '9978'
abstract:
- lang: eng
text: Piezoelectric transducers are used in a wide range of applications. Reliability
of these transducers is an important aspect in their application. Prognostics,
which involve continuous monitoring of the health of technical systems and using
this information to estimate the current health state and consequently predict
the remaining useful lifetime (RUL), can be used to increase the reliability,
safety, and availability of the transducers. This is achieved by utilizing the
health state and RUL predictions to adaptively control the usage of the components
or to schedule appropriate maintenance without interrupting operation. In this
work, a prognostic approach utilizing self-sensing, where electric signals of
a piezoelectric transducer are used as the condition monitoring data, is proposed.
The approach involves training machine learning algorithms to model the degradation
of the transducers through a health index and the use of the learned model to
estimate the health index of similar transducers. The current health index is
then used to estimate RUL of test components. The feasibility of the approach
is demonstrated using piezoelectric bimorphs and the results show that the method
is accurate in predicting the health index and RUL.
author:
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
citation:
ama: 'Kimotho JK, Sextro W, Hemsel T. Estimation of Remaining Useful Lifetime of
Piezoelectric Transducers Based on Self-Sensing. In: IEEE Transactions on Reliability.
; 2017:1-10. doi:10.1109/TR.2017.2710260'
apa: Kimotho, J. K., Sextro, W., & Hemsel, T. (2017). Estimation of Remaining
Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing. In IEEE
Transactions on Reliability (pp. 1–10). https://doi.org/10.1109/TR.2017.2710260
bibtex: '@inproceedings{Kimotho_Sextro_Hemsel_2017, title={Estimation of Remaining
Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing}, DOI={10.1109/TR.2017.2710260},
booktitle={IEEE Transactions on Reliability}, author={Kimotho, James Kuria and
Sextro, Walter and Hemsel, Tobias}, year={2017}, pages={1–10} }'
chicago: Kimotho, James Kuria, Walter Sextro, and Tobias Hemsel. “Estimation of
Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing.”
In IEEE Transactions on Reliability, 1–10, 2017. https://doi.org/10.1109/TR.2017.2710260.
ieee: J. K. Kimotho, W. Sextro, and T. Hemsel, “Estimation of Remaining Useful Lifetime
of Piezoelectric Transducers Based on Self-Sensing,” in IEEE Transactions on
Reliability, 2017, pp. 1–10.
mla: Kimotho, James Kuria, et al. “Estimation of Remaining Useful Lifetime of Piezoelectric
Transducers Based on Self-Sensing.” IEEE Transactions on Reliability, 2017,
pp. 1–10, doi:10.1109/TR.2017.2710260.
short: 'J.K. Kimotho, W. Sextro, T. Hemsel, in: IEEE Transactions on Reliability,
2017, pp. 1–10.'
date_created: 2019-05-27T09:41:06Z
date_updated: 2019-09-16T10:32:05Z
department:
- _id: '151'
doi: 10.1109/TR.2017.2710260
keyword:
- Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based on Self-Sensing
language:
- iso: eng
page: 1 - 10
publication: IEEE Transactions on Reliability
quality_controlled: '1'
status: public
title: Estimation of Remaining Useful Lifetime of Piezoelectric Transducers Based
on Self-Sensing
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9982'
abstract:
- lang: ger
text: ln der industriellen Fertigung werden zum Transport von Bauteilen häufig Förderketten
genutzt. Obwohl die Förderketten meist nicht direkt mit den Arbeitsmedien in Berührung
kommen, werden sie indirekt durch vagabundierende Stäube und Pulver, die an der
geölten Kette anhaften, im Laufe der Zeit stark verschmutzt. Ein derart im Betrieb
verschmutztes Kettenglied ist in Abbildung 1 dargestellt. Um die Lebensdauer der
Ketten zu erhöhen und das Herunterfallen von Schmutzpartikel auf die Produkte
zu vermeiden, muss die Kette regelmäßig gereinigt werden. Ziel des hier beschriebenen
Forschungsvorhabens ist die Entwicklung eines Systems, das in der Lage ist, ein
einzelnes Kettenglied in unter 60 s mittels Ultraschall zu reinigen. In [1] wurde
in ersten Versuchen nachgewiesen, dass Stabschwinger in Abhängigkeit des Sonotrodenabstands
zum Reinigungsobjekt und der Ultraschallamplitude eine intensive Reinigungswirkung
entfalten. Das Konzept der Reinigungsanlage sieht deshalb vor, im ersten Schritt
die stark verschmutzten Kettenglieder durch ein hochintensives Kavitationsfeld
von direkt eingetauchten Stabschwingern vorzureinigen und anschließend schwer
zugängliche Be- reiche wie Hinterschneidungen oder Bohrungen mittels konventioneller
Tauchschwinger von Verschmutzungen zu befreien. Für den Stabschwinger wird die
sogenannte - Sonotrode untersucht; diese wird unter anderem auch in der Sonochemie
verwendet. Ein wesentliches Merkmal der Sonotrode ist eine hohe Amplitudenübersetzung
bei einer gleichzeitig großen Abstrahlfläche. Neben dem Entwurf mittels der L
/2 -Synthese wird die Reinigungswirkung der Sonotrode in Abhängigkeit der Ultraschallamplitude
und dem Abstand zum Reinigungsobjekt in einer Versuchsreihe untersucht. Zur genaueren
Betrachtung der Reinigungs- mechanismen eines Stabschwingers werden abschließend
Hochgeschwindigkeitsaufnahmen vorgestellt und analysieren.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Sextro W. MoRFUS: Mobile Reinigungseinheit für Förderketten
basierend auf Ultraschall. In: 43. Deutsche Jahrestagung Für Akustik. Kiel
2017; 2017:611-614.'
apa: 'Schemmel, R., Hemsel, T., & Sextro, W. (2017). MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall. In 43. Deutsche Jahrestagung für
Akustik (pp. 611–614). Kiel 2017.'
bibtex: '@inproceedings{Schemmel_Hemsel_Sextro_2017, place={Kiel 2017}, title={MoRFUS:
Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall}, booktitle={43.
Deutsche Jahrestagung für Akustik}, author={Schemmel, Reinhard and Hemsel, Tobias
and Sextro, Walter}, year={2017}, pages={611–614} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “MoRFUS: Mobile
Reinigungseinheit Für Förderketten Basierend Auf Ultraschall.” In 43. Deutsche
Jahrestagung Für Akustik, 611–14. Kiel 2017, 2017.'
ieee: 'R. Schemmel, T. Hemsel, and W. Sextro, “MoRFUS: Mobile Reinigungseinheit
für Förderketten basierend auf Ultraschall,” in 43. Deutsche Jahrestagung für
Akustik, 2017, pp. 611–614.'
mla: 'Schemmel, Reinhard, et al. “MoRFUS: Mobile Reinigungseinheit Für Förderketten
Basierend Auf Ultraschall.” 43. Deutsche Jahrestagung Für Akustik, 2017,
pp. 611–14.'
short: 'R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik,
Kiel 2017, 2017, pp. 611–614.'
date_created: 2019-05-27T09:48:10Z
date_updated: 2019-05-27T09:49:49Z
department:
- _id: '151'
keyword:
- wire bonding
- dynamic behavior
- modeling
language:
- iso: eng
page: 611-614
place: Kiel 2017
publication: 43. Deutsche Jahrestagung für Akustik
status: public
title: 'MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall'
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9958'
abstract:
- lang: eng
text: The transportation of dry fine powders is an emerging technologic task, as
in biotechnology, pharmaceutical or coatings industry particle sizes of processed
powders are getting smaller and smaller. Fine powders are primarily defined by
the fact that adhesive and cohesive forces outweigh the weight forces. This leads
to mostly unwanted agglomeration (clumping) and adhesion to surfaces, what makes
it more difficult to use conventional conveyor systems (e. g. pneumatic or vibratory
conveyors) for transport. A rather new method for transporting these fine powders
is based on ultrasonic vibrations, which are used to reduce friction and adhesion
between powder and the substrate. One very effective set-up consists of a pipe,
which vibrates harmoniously in axial direction at low frequency combined with
a pulsed radial high frequency vibration. The high frequency vibration accelerates
the particles perpendicular to the surface of the pipe, which in average leads
to lower normal and thereby smaller friction force. With coordinated friction
manipulation the powder acceleration can be varied so that the powder may be greatly
accelerated and only slightly decelerated in each excitation period of the low
frequency axial vibration of the pipe. The amount of powder flow is adjustable
by vibration amplitudes, frequencies, and pulse rate, which makes the device versatile
for comparable high volume and fine dosing using one setup. Within this contribution
an experimental set-up consisting of a pipe, a solenoid actuator for axial vibration
and a piezoelectric actuator for the radial high frequency vibration is described.
An analytical model is shown, that simulates the powder velocity. Finally, simulation
results are validated by experimental data for different driving parameters such
as amplitude of low frequency vibration, pipe material and inclination angle.
author:
- first_name: Paul
full_name: Dunst, Paul
id: '22130'
last_name: Dunst
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Littmann, Walter
last_name: Littmann
citation:
ama: 'Dunst P, Sextro W, Bornmann P, Hemsel T, Littmann W. Transportation of dry
fine powders by coordinated friction manipulation. In: PAMM Proc. Appl. Math.
Mech. 16. Braunschweig; 2016:635-636. doi:10.1002/pamm.201610306'
apa: Dunst, P., Sextro, W., Bornmann, P., Hemsel, T., & Littmann, W. (2016).
Transportation of dry fine powders by coordinated friction manipulation. In PAMM
Proc. Appl. Math. Mech. 16 (pp. 635–636). Braunschweig. https://doi.org/10.1002/pamm.201610306
bibtex: '@inproceedings{Dunst_Sextro_Bornmann_Hemsel_Littmann_2016, place={Braunschweig},
title={Transportation of dry fine powders by coordinated friction manipulation},
DOI={10.1002/pamm.201610306},
booktitle={PAMM Proc. Appl. Math. Mech. 16}, author={Dunst, Paul and Sextro, Walter
and Bornmann, Peter and Hemsel, Tobias and Littmann, Walter}, year={2016}, pages={635–636}
}'
chicago: Dunst, Paul, Walter Sextro, Peter Bornmann, Tobias Hemsel, and Walter Littmann.
“Transportation of Dry Fine Powders by Coordinated Friction Manipulation.” In
PAMM Proc. Appl. Math. Mech. 16, 635–36. Braunschweig, 2016. https://doi.org/10.1002/pamm.201610306.
ieee: P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, and W. Littmann, “Transportation
of dry fine powders by coordinated friction manipulation,” in PAMM Proc. Appl.
Math. Mech. 16, 2016, pp. 635–636.
mla: Dunst, Paul, et al. “Transportation of Dry Fine Powders by Coordinated Friction
Manipulation.” PAMM Proc. Appl. Math. Mech. 16, 2016, pp. 635–36, doi:10.1002/pamm.201610306.
short: 'P. Dunst, W. Sextro, P. Bornmann, T. Hemsel, W. Littmann, in: PAMM Proc.
Appl. Math. Mech. 16, Braunschweig, 2016, pp. 635–636.'
date_created: 2019-05-27T08:57:25Z
date_updated: 2019-05-27T08:59:25Z
department:
- _id: '151'
doi: 10.1002/pamm.201610306
language:
- iso: eng
page: 635-636
place: Braunschweig
publication: PAMM Proc. Appl. Math. Mech. 16
status: public
title: Transportation of dry fine powders by coordinated friction manipulation
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9944'
abstract:
- lang: eng
text: Eine Vielzahl von Prozessen in der Chemie und Verfahrenstechnik kann durch
Ultraschall positiv beeinflusst werden. Oftmals ist ultraschallinduzierte Kavitation
der Hauptwirkmechanismus für die positiven Effekte der Beschallung. Daher ist
es notwendig die Kavitationsaktivität während des Prozesses zu quantifizieren
um die Beschallung für den jeweiligen Prozess optimal gestalten und überwachen
zu können. Eine Möglichkeit der prozessbegleitenden Kavitationsdetektion ist die
Auswertung der akustischen Emissionen von oszillierenden und kollabierenden Kavitationsblasen
mittels Drucksensoren in der Flüssigkeit. Raue Prozessrandbedingungen wie hohe
Temperaturen oder aggressive Flüssigkeiten erschweren es jedoch geeignete Sensoren
zu finden. Als Alternative wurde daher die Nutzbarkeit der Rückwirkung von Kavitationsereignissen
auf das elektrische Eingansgssignal des Ultraschallwandlers zur Quantifizierung
von Kavitation untersucht. Die experimentelle Analyse hat ergeben, dass das Einsetzen
und in einigen Fällen auch die Art der Kavitation auf Basis der Rückwirkung auf
das Stromsignal des Ultraschallwandlers bestimmt werden kann. Die Stärke der Kavitation
war hingegen nicht aus den Stromsignalen abzuleiten.
author:
- first_name: Peter
full_name: Bornmann, Peter
last_name: Bornmann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Gianluca
full_name: Memoli, Gianluca
last_name: Memoli
- first_name: Mark
full_name: Hodnett, Mark
last_name: Hodnett
- first_name: Bajram
full_name: Zeqiri, Bajram
last_name: Zeqiri
citation:
ama: Bornmann P, Hemsel T, Sextro W, Memoli G, Hodnett M, Zeqiri B. Kavitationsdetektion
mittels Self-Sensing-Ultraschallwandler. tm - Technisches Messen. 2015;82(2):73-84.
doi:10.1515/teme-2015-0017
apa: Bornmann, P., Hemsel, T., Sextro, W., Memoli, G., Hodnett, M., & Zeqiri,
B. (2015). Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler. Tm
- Technisches Messen, 82(2), 73–84. https://doi.org/10.1515/teme-2015-0017
bibtex: '@article{Bornmann_Hemsel_Sextro_Memoli_Hodnett_Zeqiri_2015, title={Kavitationsdetektion
mittels Self-Sensing-Ultraschallwandler}, volume={82}, DOI={10.1515/teme-2015-0017},
number={2}, journal={tm - Technisches Messen}, author={Bornmann, Peter and Hemsel,
Tobias and Sextro, Walter and Memoli, Gianluca and Hodnett, Mark and Zeqiri, Bajram},
year={2015}, pages={73–84} }'
chicago: 'Bornmann, Peter, Tobias Hemsel, Walter Sextro, Gianluca Memoli, Mark Hodnett,
and Bajram Zeqiri. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.”
Tm - Technisches Messen 82, no. 2 (2015): 73–84. https://doi.org/10.1515/teme-2015-0017.'
ieee: P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, and B. Zeqiri, “Kavitationsdetektion
mittels Self-Sensing-Ultraschallwandler,” tm - Technisches Messen, vol.
82, no. 2, pp. 73–84, 2015.
mla: Bornmann, Peter, et al. “Kavitationsdetektion Mittels Self-Sensing-Ultraschallwandler.”
Tm - Technisches Messen, vol. 82, no. 2, 2015, pp. 73–84, doi:10.1515/teme-2015-0017.
short: P. Bornmann, T. Hemsel, W. Sextro, G. Memoli, M. Hodnett, B. Zeqiri, Tm -
Technisches Messen 82 (2015) 73–84.
date_created: 2019-05-27T08:13:40Z
date_updated: 2019-09-16T10:44:38Z
department:
- _id: '151'
doi: 10.1515/teme-2015-0017
intvolume: ' 82'
issue: '2'
keyword:
- Kavitationsdetektion
- Self-Sensing
- So- nochemie
- Ultraschallwandler
language:
- iso: eng
page: 73-84
popular_science: '1'
publication: tm - Technisches Messen
status: public
title: Kavitationsdetektion mittels Self-Sensing-Ultraschallwandler
type: journal_article
user_id: '55222'
volume: 82
year: '2015'
...