---
_id: '57185'
author:
- first_name: Fabian
full_name: Reiling, Fabian
last_name: Reiling
- first_name: Christian
full_name: Henke, Christian
last_name: Henke
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Stefan
full_name: Gröger, Stefan
last_name: Gröger
- first_name: Ansgar
full_name: Trächtler, Ansgar
id: '552'
last_name: Trächtler
citation:
ama: 'Reiling F, Henke C, Hunstig M, Gröger S, Trächtler A. Batch constrained multi-objective
Bayesian optimization using the example of ultrasonic wire bonding. In: 2024
IEEE International Conference on Advanced Intelligent Mechatronics (AIM).
IEEE; 2024. doi:10.1109/aim55361.2024.10637123'
apa: Reiling, F., Henke, C., Hunstig, M., Gröger, S., & Trächtler, A. (2024).
Batch constrained multi-objective Bayesian optimization using the example of ultrasonic
wire bonding. 2024 IEEE International Conference on Advanced Intelligent Mechatronics
(AIM). https://doi.org/10.1109/aim55361.2024.10637123
bibtex: '@inproceedings{Reiling_Henke_Hunstig_Gröger_Trächtler_2024, title={Batch
constrained multi-objective Bayesian optimization using the example of ultrasonic
wire bonding}, DOI={10.1109/aim55361.2024.10637123},
booktitle={2024 IEEE International Conference on Advanced Intelligent Mechatronics
(AIM)}, publisher={IEEE}, author={Reiling, Fabian and Henke, Christian and Hunstig,
Matthias and Gröger, Stefan and Trächtler, Ansgar}, year={2024} }'
chicago: Reiling, Fabian, Christian Henke, Matthias Hunstig, Stefan Gröger, and
Ansgar Trächtler. “Batch Constrained Multi-Objective Bayesian Optimization Using
the Example of Ultrasonic Wire Bonding.” In 2024 IEEE International Conference
on Advanced Intelligent Mechatronics (AIM). IEEE, 2024. https://doi.org/10.1109/aim55361.2024.10637123.
ieee: 'F. Reiling, C. Henke, M. Hunstig, S. Gröger, and A. Trächtler, “Batch constrained
multi-objective Bayesian optimization using the example of ultrasonic wire bonding,”
2024, doi: 10.1109/aim55361.2024.10637123.'
mla: Reiling, Fabian, et al. “Batch Constrained Multi-Objective Bayesian Optimization
Using the Example of Ultrasonic Wire Bonding.” 2024 IEEE International Conference
on Advanced Intelligent Mechatronics (AIM), IEEE, 2024, doi:10.1109/aim55361.2024.10637123.
short: 'F. Reiling, C. Henke, M. Hunstig, S. Gröger, A. Trächtler, in: 2024 IEEE
International Conference on Advanced Intelligent Mechatronics (AIM), IEEE, 2024.'
date_created: 2024-11-18T10:18:18Z
date_updated: 2024-11-18T10:40:23Z
department:
- _id: '153'
- _id: '241'
doi: 10.1109/aim55361.2024.10637123
language:
- iso: eng
publication: 2024 IEEE International Conference on Advanced Intelligent Mechatronics
(AIM)
publication_status: published
publisher: IEEE
quality_controlled: '1'
status: public
title: Batch constrained multi-objective Bayesian optimization using the example of
ultrasonic wire bonding
type: conference
user_id: '41470'
year: '2024'
...
---
_id: '29803'
abstract:
- lang: eng
text: "Ultrasonic wire bonding is a solid-state joining process used to form electrical
interconnections in micro and\r\npower electronics and batteries. A high frequency
oscillation causes a metallurgical bond deformation in\r\nthe contact area. Due
to the numerous physical influencing factors, it is very difficult to accurately
capture\r\nthis process in a model. Therefore, our goal is to determine a suitable
feed-forward control strategy for the\r\nbonding process even without detailed
model knowledge. We propose the use of batch constrained Bayesian\r\noptimization
for the control design. Hence, Bayesian optimization is precisely adapted to the
application of\r\nbonding: the constraint is used to check one quality feature
of the process and the use of batches leads to\r\nmore efficient experiments.
Our approach is suitable to determine a feed-forward control for the bonding\r\nprocess
that provides very high quality bonds without using a physical model. We also
show that the quality\r\nof the Bayesian optimization based control outperforms
random search as well as manual search by a user.\r\nUsing a simple prior knowledge
model derived from data further improves the quality of the connection.\r\nThe
Bayesian optimization approach offers the possibility to perform a sensitivity
analysis of the control\r\nparameters, which allows to evaluate the influence
of each control parameter on the bond quality. In summary,\r\nBayesian optimization
applied to the bonding process provides an excellent opportunity to develop a
feedforward\r\ncontrol without full modeling of the underlying physical processes."
author:
- first_name: Michael
full_name: Hesse, Michael
id: '29222'
last_name: Hesse
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Julia
full_name: Timmermann, Julia
id: '15402'
last_name: Timmermann
- first_name: Ansgar
full_name: Trächtler, Ansgar
id: '552'
last_name: Trächtler
citation:
ama: 'Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian
Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: Proceedings
of the 11th International Conference on Pattern Recognition Applications and Methods
(ICPRAM). ; 2022:383-394.'
apa: Hesse, M., Hunstig, M., Timmermann, J., & Trächtler, A. (2022). Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design.
Proceedings of the 11th International Conference on Pattern Recognition Applications
and Methods (ICPRAM), 383–394.
bibtex: '@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design},
booktitle={Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias
and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }'
chicago: Hesse, Michael, Matthias Hunstig, Julia Timmermann, and Ansgar Trächtler.
“Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward
Control Design.” In Proceedings of the 11th International Conference on Pattern
Recognition Applications and Methods (ICPRAM), 383–94, 2022.
ieee: M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained
Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,”
in Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM), Online, 2022, pp. 383–394.
mla: Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire
Bonding Feed-Forward Control Design.” Proceedings of the 11th International
Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022,
pp. 383–94.
short: 'M. Hesse, M. Hunstig, J. Timmermann, A. Trächtler, in: Proceedings of the
11th International Conference on Pattern Recognition Applications and Methods
(ICPRAM), 2022, pp. 383–394.'
conference:
end_date: 2022-02-05
location: Online
name: 11th International Conference on Pattern Recognition Applications and Methods
start_date: 2022-02-03
date_created: 2022-02-09T12:50:25Z
date_updated: 2024-11-13T08:44:17Z
department:
- _id: '153'
- _id: '880'
keyword:
- Bayesian optimization
- Wire bonding
- Feed-forward control
- model-free design
language:
- iso: eng
page: 383-394
publication: Proceedings of the 11th International Conference on Pattern Recognition
Applications and Methods (ICPRAM)
publication_identifier:
isbn:
- 978-989-758-549-4
quality_controlled: '1'
status: public
title: Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward
Control Design
type: conference
user_id: '82875'
year: '2022'
...
---
_id: '15412'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. To build electrical
connections in the electronics industry, uni-axial and torsional ultrasonic vibration
have been used to join different types of workpieces for decades. Many influencing
factors like ultrasonic power, bond normal force, bond duration and frequency
are known to have a high impact on bond quality and reliability. Multi-dimensional
bonding has been investigated in the past to increase ultrasonic power and consequently
bond strength. This contribution is focused on the comparison of circular, multi-frequency
planar and uniaxial vibration trajectories used for ultrasonic bonding of copper
pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic
microscopy and interface cross-sections.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Collin
full_name: Dymel, Collin
last_name: Dymel
- first_name: Tobias
full_name: Hemsel, Tobias
last_name: Hemsel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
last_name: Sextro
citation:
ama: 'Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration
trajectories on quality and failure modes in ultrasonic bonding. In: International
Symposium on Microelectronics. ; 2019:509-514. doi:10.4071/2380-4505-2019.1.000509'
apa: Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M.,
& Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on
quality and failure modes in ultrasonic bonding. International Symposium on
Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
bibtex: '@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019,
title={Impact of multi-dimensional vibration trajectories on quality and failure
modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509},
booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard
and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias
and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }'
chicago: Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias
Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration
Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In International
Symposium on Microelectronics, 509–14, 2019. https://doi.org/10.4071/2380-4505-2019.1.000509.
ieee: 'R. Schemmel et al., “Impact of multi-dimensional vibration trajectories
on quality and failure modes in ultrasonic bonding,” in International Symposium
on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.'
mla: Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories
on Quality and Failure Modes in Ultrasonic Bonding.” International Symposium
on Microelectronics, 2019, pp. 509–14, doi:10.4071/2380-4505-2019.1.000509.
short: 'R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann,
W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.'
conference:
location: Boston
name: International Symposium on Microelectronics
date_created: 2019-12-24T21:41:04Z
date_updated: 2023-09-21T14:28:50Z
ddc:
- '620'
department:
- _id: '151'
doi: 10.4071/2380-4505-2019.1.000509
file:
- access_level: closed
content_type: application/pdf
creator: schemmel
date_created: 2019-12-24T21:43:59Z
date_updated: 2019-12-24T21:43:59Z
file_id: '15413'
file_name: 2380-4505-2019.1.000509.pdf
file_size: 1010930
relation: main_file
success: 1
file_date_updated: 2019-12-24T21:43:59Z
has_accepted_license: '1'
language:
- iso: eng
page: 509-514
publication: International Symposium on Microelectronics
publication_identifier:
issn:
- 2380-4505
publication_status: published
quality_controlled: '1'
status: public
title: Impact of multi-dimensional vibration trajectories on quality and failure modes
in ultrasonic bonding
type: conference
user_id: '210'
year: '2019'
...
---
_id: '10334'
abstract:
- lang: eng
text: Ultrasonic joining is a common industrial process. In the electronics industry
it is used to form electrical connections, including those of dissimilar materials.
Multiple influencing factors in ultrasonic joining are known and extensively investigated;
process parameters like ultrasonic power, bond force, and bonding frequency of
the ultrasonic vibration are known to have a high impact on a reliable joining
process and need to be adapted for each new application with different geometry
or materials. This contribution is focused on increasing ultrasonic power transmitted
to the interface and keeping mechanical stresses during ultrasonic bonding low
by using a multi-dimensional ultrasonic transducer concept. Bonding results for
a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
bonding are discussed.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors
and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025'
apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro,
W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
bonding and welding. Sensors and Actuators A: Physical, 295, 653–662.
https://doi.org/10.1016/j.sna.2019.04.025'
bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
volume={295}, DOI={10.1016/j.sna.2019.04.025},
journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
Walter}, year={2019}, pages={653–662} }'
chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295
(2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.'
ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
“Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662,
2019, doi: 10.1016/j.sna.2019.04.025.'
mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical,
vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.'
short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: ' 295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
issn:
- 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '9992'
abstract:
- lang: eng
text: State-of-the-art industrial compact high power electronic packages require
copper-copper interconnections with larger cross sections made by ultrasonic bonding.
In comparison to aluminium-copper, copper-copper interconnections require increased
normal forces and ultrasonic power, which might lead to substrate damage due to
increased mechanical stresses. One option to raise friction energy without increasing
vibration amplitude between wire and substrate or bonding force is the use of
two-dimensional vibration. The first part of this contribution reports on the
development of a novel bonding system that executes two-dimensional vibrations
of a tool-tip to bond a nail- like pin onto a copper substrate. Since intermetallic
bonds only form properly when surfaces are clean, oxide free and activated, the
geometries of tool-tip and pin were optimised using finite element analysis. To
maximize the area of the bonded annulus the distribution of normal pressure was
optimized by varying the convexity of the bottom side of the pin. Second, a statistical
model obtained from an experimental parameter study shows the influence of different
bonding parameters on the bond result. To find bonding parameters with the minimum
number of tests, the experiments have been planned using a D-optimal experimental
design approach.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation
of weld formation in a novel two-dimensional copper-copper bonding process. In:
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany). ; 2018:1-6.'
apa: Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig,
M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process. In (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany)
(pp. 1–6).
bibtex: '@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018,
title={Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration
Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald,
Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig,
Matthias and Sextro, Walter}, year={2018}, pages={1–6} }'
chicago: Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael
Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation
of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In
(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden,
Germany), 1–6, 2018.
ieee: C. Dymel et al., “Numerical and statistical investigation of weld formation
in a novel two-dimensional copper-copper bonding process,” in (Proceedings
of 7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
mla: Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation
in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of
7th Electronics System-Integration Technology Conference, Dresden, Germany),
2018, pp. 1–6.
short: 'C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig,
W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany), 2018, pp. 1–6.'
date_created: 2019-05-27T10:18:10Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic wire-bonding
- bond-tool design
- parameter identification
- statistical engineering
language:
- iso: eng
page: 1-6
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 7th Electronics System-Integration Technology Conference,
Dresden, Germany)
quality_controlled: '1'
status: public
title: Numerical and statistical investigation of weld formation in a novel two-dimensional
copper-copper bonding process
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9993'
abstract:
- lang: eng
text: Ultrasonic bonding and welding are common friction based approaches in the
assembly of power electronics. Interconnections with cross-sections of 0.3 mm²
up to 12 mm² made from copper are well suited in high power applications. For
increasing friction energy, which is responsible for bond formation, a two-dimensional
vibration approach is applied to newly developed interconnection pins. Using two-dimensional
vibration for bonding requires identification of suitable bonding parameters.
Even though simulation models of wire bonding processes exist, parameters for
the two-dimensional pin-bonding process cannot be derived accurately yet. Within
this contribution, a methodology and workflow for experimental studies identifying
a suitable bond parameter space are presented. The results of a pre-study are
used to set up an extensive statistical parameter study, which gives insights
about the bond strength change due to bond process parameter variation. By evaluation
of electrical data captured during bonding, errors biasing the resulting shear
forces are identified. All data obtained during the experimental study is used
to build a statistical regression model suitable for predicting shear forces.
The accuracy of the regression model’s predictions is determined and the applicability
to predict process parameters or validate simulation models is assessed. Finally,
the influence of the tool trajectory on the bond formation is determined, comparing
one dimensional, elliptic and circular trajectories.
author:
- first_name: Collin
full_name: Dymel, Collin
id: '66833'
last_name: Dymel
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan
(ICSJ 2018), Kyoto, Japan). ; 2018:41-44.'
apa: Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig,
M. (2018). Experimental investigations on the impact of bond process parameters
in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics
IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
bibtex: '@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental
investigations on the impact of bond process parameters in two-dimensional ultrasonic
copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard
and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias},
year={2018}, pages={41–44} }'
chicago: Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael
Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of
Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings
of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44,
2018.
ieee: C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig,
“Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium
Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
mla: Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process
Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th
Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp.
41–44.
short: 'C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig,
in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto,
Japan), 2018, pp. 41–44.'
date_created: 2019-05-27T10:19:18Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
keyword:
- ultrasonic two-dimensional bonding
- electrical interconnection
- process parameters
language:
- iso: eng
page: 41-44
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018),
Kyoto, Japan)
quality_controlled: '1'
status: public
title: Experimental investigations on the impact of bond process parameters in two-dimensional
ultrasonic copper bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9997'
abstract:
- lang: eng
text: Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor
modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding
are known and extensively investigated. A constructively settable but rarely examined
parameter is the bonding frequency. In case of bonding on challenging substrates,
e.g. supple substruc- tures, a high influence of the working frequency is observed.
The choice of the working frequency is typically based on experimental investigations
for a certain component or substrate and needs to be evaluated anew for new applications.
A profound understanding of the influence of the working frequency is required
to achieve a reliable bond process and a short process development. Here a generalized
model for the numerical simulation of the bond formation with respect to the dynamics
of the substructure is presented. The simulation results are compared to experiments
using 300 µm copper wire at different working frequencies and geometries of the
substructure.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: 'Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects
of different working frequencies on the joint formation in copper wire bonding.
In: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018). Stuttgart, Germany; 2018:230-235.'
apa: Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., & Hunstig,
M. (2018). Effects of different working frequencies on the joint formation in
copper wire bonding. In CIPS 2018 - 10th International Conference on Integrated
Power Electronics Systems (CIPS 2018) (pp. 230–235). Stuttgart, Germany.
bibtex: '@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart,
Germany}, title={Effects of different working frequencies on the joint formation
in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference
on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard
and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael
and Hunstig, Matthias}, year={2018}, pages={230–235} }'
chicago: Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael
Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on
the Joint Formation in Copper Wire Bonding.” In CIPS 2018 - 10th International
Conference on Integrated Power Electronics Systems (CIPS 2018), 230–35. Stuttgart,
Germany, 2018.
ieee: R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig,
“Effects of different working frequencies on the joint formation in copper wire
bonding,” in CIPS 2018 - 10th International Conference on Integrated Power
Electronics Systems (CIPS 2018), 2018, pp. 230–235.
mla: Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the
Joint Formation in Copper Wire Bonding.” CIPS 2018 - 10th International Conference
on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–35.
short: 'R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig,
in: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.'
date_created: 2019-05-27T10:24:37Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
language:
- iso: eng
page: 230-235
place: Stuttgart, Germany
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics
Systems (CIPS 2018)
quality_controlled: '1'
status: public
title: Effects of different working frequencies on the joint formation in copper wire
bonding
type: conference
user_id: '210'
year: '2018'
...
---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '9973'
abstract:
- lang: eng
text: In power electronics, copper connector pins are e.g. used to connect control
boards with power modules. The new chip generation based on SiC and GaN technology
increase the power density of semiconductor modules significantly with junction
temperatures reaching 200°C. To enable reliable operation at such high temperature,
the soldering of these connector pins should be substituted by a multi-dimensional
copper-copper bonding technology. A copper pin welded directly on DBC substrate
also simplifies the assembly. With this aim, a proper bond tool and a suitable
connector pin geometry are designed. This paper presents a two-dimensional trajectory
approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the
intention to minimize mechanical stresses exposed to the substrate. This is achieved
using a multi-dimensional vibration system with multiple transducers known from
flip chip bonding. Applying a planar relative motion between the bonding piece
and the substrate increases the induced frictional power compared to one-dimensional
excitation. The core of this work is the development of a new tool design which
enables a reliable and effective transmission of the multidimensional vibration
into the contact area between nail-shaped bonding piece and substrate. For this
purpose, different bonding tool as well as bonding piece designs are discussed.
A proper bonding tool design is selected based on the simulated alternatives.
This tool is examined in bonding experiments and the results are presented. In
addition, different grades of hardness for bonding piece and substrate are examined
as well as different bonding parameters. Optical inspection of the bonded area
shows the emergence of initial micro welds in form of a ring which is growing
in direction of the interface boundaries with increasing bonding duration.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper
Bonding – New Challenges for Tool Design. IMAPSource. 2017;Vol. 2017, No.
1.
apa: Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann,
M., & Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New
Challenges for Tool Design. IMAPSource, Vol. 2017, No. 1.
bibtex: '@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017,
title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design},
volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff,
Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann,
Michael and Hunstig, Matthias}, year={2017} }'
chicago: Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas
Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic
Copper Bonding – New Challenges for Tool Design.” IMAPSource Vol. 2017,
No. 1 (2017).
ieee: P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding –
New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
mla: Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges
for Tool Design.” IMAPSource, vol. Vol. 2017, No. 1, 2017.
short: P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann,
M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
date_created: 2019-05-27T09:32:42Z
date_updated: 2020-05-07T05:33:54Z
department:
- _id: '151'
keyword:
- International Symposium on Microelectronics
language:
- iso: eng
project:
- _id: '93'
grant_number: MP-1-1-015
name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: IMAPSource
quality_controlled: '1'
status: public
title: Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
type: journal_article
user_id: '210'
volume: Vol. 2017, No. 1
year: '2017'
...
---
_id: '9975'
abstract:
- lang: eng
text: Piezoelectric inertia motors also known as stick-slip motors or (smooth) impact
drives use the inertia of a body to drive it in small steps by means of an uninterrupted
friction contact. In addition to the typical advantages of piezoelectric motors,
they are especially suited for miniaturisation due to their simple structure and
inherent fine-positioning capability. Originally developed for positioning in
microscopy in the 1980s, they have nowadays also found application in mass-produced
consumer goods. Recent research results are likely to enable more applications
of piezoelectric inertia motors in the future. This contribution gives a critical
overview of their historical development, functional principles, and related terminology.
The most relevant aspects regarding their design i.e., friction contact, solid
state actuator, and electrical excitation are discussed, including aspects of
control and simulation. The article closes with an outlook on possible future
developments and research perspectives.
author:
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: Hunstig M. Piezoelectric Inertia Motors—A Critical Review of History, Concepts,
Design, Applications, and Perspectives. Actuators 2017, 6(1)-7. 2017:1-35.
doi:10.3390/act6010007
apa: Hunstig, M. (2017). Piezoelectric Inertia Motors—A Critical Review of History,
Concepts, Design, Applications, and Perspectives. Actuators. 2017, 6(1)-7.,
1–35. https://doi.org/10.3390/act6010007
bibtex: '@article{Hunstig_2017, title={Piezoelectric Inertia Motors—A Critical Review
of History, Concepts, Design, Applications, and Perspectives.}, DOI={10.3390/act6010007},
journal={Actuators. 2017, 6(1)-7.}, author={Hunstig, Matthias}, year={2017}, pages={1–35}
}'
chicago: Hunstig, Matthias. “Piezoelectric Inertia Motors—A Critical Review of History,
Concepts, Design, Applications, and Perspectives.” Actuators. 2017, 6(1)-7.,
2017, 1–35. https://doi.org/10.3390/act6010007.
ieee: M. Hunstig, “Piezoelectric Inertia Motors—A Critical Review of History, Concepts,
Design, Applications, and Perspectives.,” Actuators. 2017, 6(1)-7., pp.
1–35, 2017.
mla: Hunstig, Matthias. “Piezoelectric Inertia Motors—A Critical Review of History,
Concepts, Design, Applications, and Perspectives.” Actuators. 2017, 6(1)-7.,
2017, pp. 1–35, doi:10.3390/act6010007.
short: M. Hunstig, Actuators. 2017, 6(1)-7. (2017) 1–35.
date_created: 2019-05-27T09:36:55Z
date_updated: 2019-09-16T09:57:39Z
department:
- _id: '151'
doi: 10.3390/act6010007
language:
- iso: eng
page: 1-35
publication: Actuators. 2017, 6(1)-7.
quality_controlled: '1'
status: public
title: Piezoelectric Inertia Motors—A Critical Review of History, Concepts, Design,
Applications, and Perspectives.
type: journal_article
user_id: '55222'
year: '2017'
...
---
_id: '9957'
abstract:
- lang: eng
text: Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter
und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL –
Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden
Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen
herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit,
sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte
Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der
Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in
Form einer modifizierten Bondmaschine. Intelligent production of heavy copper
wire bonds It is the aim of this innovation-project to develop a self-optimization
system for ultrasonic copper wire bonding. It is part of the leading edge cluster
“it’s OWL”. The bonding machine will be able to react autonomously to changing
boundary conditions to ensure constant and reliable bonding results. For this,
the hole bonding process is modeled in great detail and newest self-optimization
techniques are utilized. A prototype-system incorporated in a serial machine is
used for evaluation.
author:
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Florian
full_name: Biermann, Florian
last_name: Biermann
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen.
wt-online. 2016;7/8:512-519.
apa: Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M.,
… Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. Wt-Online,
7/8, 512–519.
bibtex: '@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016,
title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online},
author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff,
Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth,
Karsten}, year={2016}, pages={512–519} }'
chicago: 'Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter
Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen
Intelligent Herstellen.” Wt-Online 7/8 (2016): 512–19.'
ieee: M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,”
wt-online, vol. 7/8, pp. 512–519, 2016.
mla: Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.”
Wt-Online, vol. 7/8, 2016, pp. 512–19.
short: M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F.
Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
date_created: 2019-05-27T08:53:18Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
language:
- iso: eng
page: 512-519
popular_science: '1'
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: wt-online
status: public
title: Kupferbondverbindungen intelligent herstellen
type: journal_article
user_id: '210'
volume: 7/8
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9951'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the manufacturing of
semiconductor components. It is used for interconnecting the silicon die to e.g.
connectors in the housing or to other semiconductors in complex components. In
high power applications, such as wind turbines, locomotives or electric vehicles,
the thermal and mechanical limits of interconnects made from aluminum are nearing.
The limits could be overcome using copper wire bonds, but their manufacturing
poses challenges due to the harder material, which leads to increased wear of
the bond tools and to less reliable production. To overcome these drawbacks, adaptation
of process parameters at runtime is employed. However, the range of parameter
values for which a stable process can be maintained is very small, making it necessary
to compute suitable parameters beforehand. To this end, and to gain insights into
the process itself, the ultrasonic bonding process is modeled. The full model
is composed of several partial models, some of which were introduced before. This
paper focuses on the modularization of the full model and on the interaction of
partial models. All partial models are presented, their interaction is shown and
the general outline of the simulation process is given.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Modeling and simulation of the ultrasonic
wire bonding process. In: 2015 17th Electronics Packaging Technology Conference.
; 2015. doi:10.1109/EPTC.2015.7412377'
apa: Meyer, T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2015). Modeling and simulation of the ultrasonic wire bonding
process. In 2015 17th Electronics Packaging Technology Conference. https://doi.org/10.1109/EPTC.2015.7412377
bibtex: '@inproceedings{Meyer_Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2015,
title={Modeling and simulation of the ultrasonic wire bonding process}, DOI={10.1109/EPTC.2015.7412377},
booktitle={2015 17th Electronics Packaging Technology Conference}, author={Meyer,
Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2015} }'
chicago: Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic
Wire Bonding Process.” In 2015 17th Electronics Packaging Technology Conference,
2015. https://doi.org/10.1109/EPTC.2015.7412377.
ieee: T. Meyer et al., “Modeling and simulation of the ultrasonic wire bonding
process,” in 2015 17th Electronics Packaging Technology Conference, 2015.
mla: Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding
Process.” 2015 17th Electronics Packaging Technology Conference, 2015,
doi:10.1109/EPTC.2015.7412377.
short: 'T. Meyer, A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: 2015 17th Electronics Packaging Technology Conference, 2015.'
date_created: 2019-05-27T08:34:21Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/EPTC.2015.7412377
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: 2015 17th Electronics Packaging Technology Conference
quality_controlled: '1'
status: public
title: Modeling and simulation of the ultrasonic wire bonding process
type: conference
user_id: '210'
year: '2015'
...
---
_id: '9876'
abstract:
- lang: eng
text: Piezoelectric inertia motors use the inertia of a body to drive it by means
of a friction contact in a series of small steps. It has been shown previously
in theoretical investigations that higher velocities and smoother movements can
be obtained if these steps do not contain phases of stiction (''stick-slip`` operation),
but use sliding friction only (''slip-slip`` operation). One very promising driving
option for such motors is the superposition of multiple sinusoidal signals or
harmonics. In this contribution, the theoretical results are validated experimentally.
In this context, a quick and reliable identification process for parameters describing
the friction contact is proposed. Additionally, the force generation potential
of inertia motors is investigated theoretically and experimentally. The experimental
results confirm the theoretical result that for a given maximum frequency, a signal
with a high fundamental frequency and consisting of two superposed sine waves
leads to the highest velocity and the smoothest motion, while the maximum motor
force is obtained with signals containing more harmonics. These results are of
fundamental importance for the further development of high-velocity piezoelectric
inertia motors.
author:
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hunstig M, Hemsel T, Sextro W. High-velocity operation of piezoelectric inertia
motors: experimental validation. Archive of Applied Mechanics. 2014:1-9.
doi:10.1007/s00419-014-0940-0'
apa: 'Hunstig, M., Hemsel, T., & Sextro, W. (2014). High-velocity operation
of piezoelectric inertia motors: experimental validation. Archive of Applied
Mechanics, 1–9. https://doi.org/10.1007/s00419-014-0940-0'
bibtex: '@article{Hunstig_Hemsel_Sextro_2014, title={High-velocity operation of
piezoelectric inertia motors: experimental validation}, DOI={10.1007/s00419-014-0940-0},
journal={Archive of Applied Mechanics}, publisher={Springer Berlin Heidelberg},
author={Hunstig, Matthias and Hemsel, Tobias and Sextro, Walter}, year={2014},
pages={1–9} }'
chicago: 'Hunstig, Matthias, Tobias Hemsel, and Walter Sextro. “High-Velocity Operation
of Piezoelectric Inertia Motors: Experimental Validation.” Archive of Applied
Mechanics, 2014, 1–9. https://doi.org/10.1007/s00419-014-0940-0.'
ieee: 'M. Hunstig, T. Hemsel, and W. Sextro, “High-velocity operation of piezoelectric
inertia motors: experimental validation,” Archive of Applied Mechanics,
pp. 1–9, 2014.'
mla: 'Hunstig, Matthias, et al. “High-Velocity Operation of Piezoelectric Inertia
Motors: Experimental Validation.” Archive of Applied Mechanics, Springer
Berlin Heidelberg, 2014, pp. 1–9, doi:10.1007/s00419-014-0940-0.'
short: M. Hunstig, T. Hemsel, W. Sextro, Archive of Applied Mechanics (2014) 1–9.
date_created: 2019-05-20T13:08:08Z
date_updated: 2019-05-20T13:08:43Z
department:
- _id: '151'
doi: 10.1007/s00419-014-0940-0
keyword:
- Inertia motor
- High velocity
- Stick-slip motor
- Slip-slip operation
- Friction parameter identification
language:
- iso: eng
page: 1-9
publication: Archive of Applied Mechanics
publication_identifier:
issn:
- 0939-1533
publisher: Springer Berlin Heidelberg
status: public
title: 'High-velocity operation of piezoelectric inertia motors: experimental validation'
type: journal_article
user_id: '55222'
year: '2014'
...
---
_id: '9875'
abstract:
- lang: eng
text: Piezoelektrische Trägheitsmotoren nutzen die Trägheit einer bewegten Masse,
um diese über einen ununterbrochenen Reibkontakt schrittweise zu bewegen. Wegen
ihres einfachen Aufbaus und ihrer guten Miniaturisierbarkeit werden diese Motoren
zunehmend in Konsumgütern eingesetzt. Die Geschwindigkeit ist eine wichtige Motorkenngröße,
eine allgemeingültige Analyse des Motorprinzips existiert jedoch bisher nicht.Nach
einer Definition von Trägheitsmotoren werden anhand eines Modells eines translatorischen
piezoelektrischen Trägheitsmotors verschiedene idealisierte Anregungssignale hergeleitet.
Eine Analyse des Motorverhaltens zeigt, dass der verbreitete Betrieb von Trägheitsmotoren
mit Haft- und Gleitphasen für das Erreichen hoher Geschwindigkeiten ungeeignet
ist. Aus den idealisierten Signalen für den schnellen dauergleitenden Betrieb
werden frequenzbeschränkte Signale für den Betrieb mit realen Aktoren abgeleitet.
Das Verhalten bei Anregung mit diesen Signalen wird bezüglich Geschwindigkeit,
Effizienz, Haltbarkeit und Kraft verglichen. Zudem wird ein Verfahren beschrieben,
mit dem die Bewegung hochfrequent angeregter Trägheitsmotoren periodenweise berechnet
und wichtige Motorkenngrößen direkt berechnet werden können. Zur Validierung der
theoretischen Ergebnisse wird ein Versuchsmotor aufgebaut und mit unterschiedlichen
Signalen angeregt, es zeigt sich eine gute Übereinstimmung zwischen Messung und
Modell. Die Ergebnisse dieser Arbeit geben wertvolle Einblicke in die Funktion
schneller Trägheitsmotoren und sind nützlich für ihre weitere Entwicklung und
die Erweiterung ihres Einsatzbereichs.
author:
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
citation:
ama: Hunstig M. Konzeption, Ansteuerung Und Eigenschaften Schneller Piezoelektrischer
Trägheitsmotoren. Shaker; 2014.
apa: Hunstig, M. (2014). Konzeption, Ansteuerung und Eigenschaften schneller
piezoelektrischer Trägheitsmotoren. Shaker.
bibtex: '@book{Hunstig_2014, title={Konzeption, Ansteuerung und Eigenschaften schneller
piezoelektrischer Trägheitsmotoren}, publisher={Shaker}, author={Hunstig, Matthias},
year={2014} }'
chicago: Hunstig, Matthias. Konzeption, Ansteuerung Und Eigenschaften Schneller
Piezoelektrischer Trägheitsmotoren. Shaker, 2014.
ieee: M. Hunstig, Konzeption, Ansteuerung und Eigenschaften schneller piezoelektrischer
Trägheitsmotoren. Shaker, 2014.
mla: Hunstig, Matthias. Konzeption, Ansteuerung Und Eigenschaften Schneller Piezoelektrischer
Trägheitsmotoren. Shaker, 2014.
short: M. Hunstig, Konzeption, Ansteuerung Und Eigenschaften Schneller Piezoelektrischer
Trägheitsmotoren, Shaker, 2014.
date_created: 2019-05-20T13:02:32Z
date_updated: 2023-09-15T12:29:21Z
department:
- _id: '151'
keyword:
- Tr{\
language:
- iso: eng
publisher: Shaker
status: public
title: Konzeption, Ansteuerung und Eigenschaften schneller piezoelektrischer Trägheitsmotoren
type: dissertation
user_id: '210'
year: '2014'
...
---
_id: '9794'
abstract:
- lang: eng
text: 'A piezoelectric cantilever beam with a tip mass at its free end is a common
energy harvester configuration. This article introduces a new principle of designing
such a harvester that increases the generated power without changing the resonance
frequency of the harvester: the attraction force between two permanent magnets
is used to add stiffness to the system. This magnetic stiffening counters the
effect of the tip mass on the efficient operation frequency. Five set-ups incorporating
piezoelectric bimorph cantilevers of the same type in different mechanical configurations
are compared theoretically and experimentally to investigate the feasibility of
this principle: theoretical and experimental results show that magnetically stiffened
harvesters have important advantages over conventional set-ups with and without
tip mass. They generate more power while only slightly increasing the deflection
in the piezoelectric harvester and they can be tuned across a wide range of excitation
frequencies.'
author:
- first_name: Waleed
full_name: Al-Ashtari, Waleed
last_name: Al-Ashtari
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Al-Ashtari W, Hunstig M, Hemsel T, Sextro W. Increasing the power of piezoelectric
energy harvesters by magnetic stiffening. Journal of Intelligent Material Systems
and Structures. 2013;24(11):1332-1342. doi:10.1177/1045389X13483021
apa: Al-Ashtari, W., Hunstig, M., Hemsel, T., & Sextro, W. (2013). Increasing
the power of piezoelectric energy harvesters by magnetic stiffening. Journal
of Intelligent Material Systems and Structures, 24(11), 1332–1342.
https://doi.org/10.1177/1045389X13483021
bibtex: '@article{Al-Ashtari_Hunstig_Hemsel_Sextro_2013, title={Increasing the power
of piezoelectric energy harvesters by magnetic stiffening}, volume={24}, DOI={10.1177/1045389X13483021},
number={11}, journal={Journal of Intelligent Material Systems and Structures},
author={Al-Ashtari, Waleed and Hunstig, Matthias and Hemsel, Tobias and Sextro,
Walter}, year={2013}, pages={1332–1342} }'
chicago: 'Al-Ashtari, Waleed, Matthias Hunstig, Tobias Hemsel, and Walter Sextro.
“Increasing the Power of Piezoelectric Energy Harvesters by Magnetic Stiffening.”
Journal of Intelligent Material Systems and Structures 24, no. 11 (2013):
1332–42. https://doi.org/10.1177/1045389X13483021.'
ieee: W. Al-Ashtari, M. Hunstig, T. Hemsel, and W. Sextro, “Increasing the power
of piezoelectric energy harvesters by magnetic stiffening,” Journal of Intelligent
Material Systems and Structures, vol. 24, no. 11, pp. 1332–1342, 2013.
mla: Al-Ashtari, Waleed, et al. “Increasing the Power of Piezoelectric Energy Harvesters
by Magnetic Stiffening.” Journal of Intelligent Material Systems and Structures,
vol. 24, no. 11, 2013, pp. 1332–42, doi:10.1177/1045389X13483021.
short: W. Al-Ashtari, M. Hunstig, T. Hemsel, W. Sextro, Journal of Intelligent Material
Systems and Structures 24 (2013) 1332–1342.
date_created: 2019-05-13T13:51:00Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.1177/1045389X13483021
intvolume: ' 24'
issue: '11'
language:
- iso: eng
page: 1332-1342
publication: Journal of Intelligent Material Systems and Structures
status: public
title: Increasing the power of piezoelectric energy harvesters by magnetic stiffening
type: journal_article
user_id: '55222'
volume: 24
year: '2013'
...
---
_id: '9795'
abstract:
- lang: eng
text: Power and bandwidth of piezoelectric harvesters can be increased by using
multiple piezoelectric elements in one harvester. In this contribution, a novel
energy harvesting cantilever array with magnetic tuning including three piezoelectric
bimorphs is investigated theoretically and experimentally, with a good agreement
between model and experiment. Other than harvester designs proposed before, this
array is easy to manufacture and insensitive to manufacturing tolerances because
its optimum operation frequency can be re-adjusted after fabrication. Using the
superposition principle, the Butterworth-Van Dyke model and a mechanical lumped
parameters model, the generated voltage and current are determined analytically.
Formulas for calculating the power generated by array harvesters with an arbitrary
number of piezoelectric elements connected in series or in parallel are derived.
It is shown that optimum harvester design must take both the connected load and
the operating frequency into account. Strategies for connecting multiple bimorphs
to increase the maximum generated power and/or enhance the bandwidth compared
to a single bimorph harvester are investigated. For bandwidth enhancement it is
essential that individual rectifiers are used for the bimorphs. An example with
three bimorphs shows that, depending on the chosen tuning strategy, the power
is increased by about 340\% or the bandwidth is increased by about 500\%, compared
to one single bimorph.
author:
- first_name: Waleed
full_name: Al-Ashtari, Waleed
last_name: Al-Ashtari
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Al-Ashtari W, Hunstig M, Hemsel T, Sextro W. Enhanced energy harvesting using
multiple piezoelectric elements: Theory and experiments. Sensors and Actuators
A: Physical. 2013;200:138-146. doi:10.1016/j.sna.2013.01.008'
apa: 'Al-Ashtari, W., Hunstig, M., Hemsel, T., & Sextro, W. (2013). Enhanced
energy harvesting using multiple piezoelectric elements: Theory and experiments.
Sensors and Actuators A: Physical, 200, 138–146. https://doi.org/10.1016/j.sna.2013.01.008'
bibtex: '@article{Al-Ashtari_Hunstig_Hemsel_Sextro_2013, title={Enhanced energy
harvesting using multiple piezoelectric elements: Theory and experiments}, volume={200},
DOI={10.1016/j.sna.2013.01.008},
journal={Sensors and Actuators A: Physical}, author={Al-Ashtari, Waleed and Hunstig,
Matthias and Hemsel, Tobias and Sextro, Walter}, year={2013}, pages={138–146}
}'
chicago: 'Al-Ashtari, Waleed, Matthias Hunstig, Tobias Hemsel, and Walter Sextro.
“Enhanced Energy Harvesting Using Multiple Piezoelectric Elements: Theory and
Experiments.” Sensors and Actuators A: Physical 200 (2013): 138–46. https://doi.org/10.1016/j.sna.2013.01.008.'
ieee: 'W. Al-Ashtari, M. Hunstig, T. Hemsel, and W. Sextro, “Enhanced energy harvesting
using multiple piezoelectric elements: Theory and experiments,” Sensors and
Actuators A: Physical, vol. 200, pp. 138–146, 2013.'
mla: 'Al-Ashtari, Waleed, et al. “Enhanced Energy Harvesting Using Multiple Piezoelectric
Elements: Theory and Experiments.” Sensors and Actuators A: Physical, vol.
200, 2013, pp. 138–46, doi:10.1016/j.sna.2013.01.008.'
short: 'W. Al-Ashtari, M. Hunstig, T. Hemsel, W. Sextro, Sensors and Actuators A:
Physical 200 (2013) 138–146.'
date_created: 2019-05-13T13:51:59Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
doi: 10.1016/j.sna.2013.01.008
intvolume: ' 200'
keyword:
- Energy harvesting
- Cantilever array
- Bandwidth
- Power increase
language:
- iso: eng
page: 138 - 146
publication: 'Sensors and Actuators A: Physical'
status: public
title: 'Enhanced energy harvesting using multiple piezoelectric elements: Theory and
experiments'
type: journal_article
user_id: '55222'
volume: 200
year: '2013'
...
---
_id: '9796'
abstract:
- lang: eng
text: 'A basic autonomous system powered by a piezoelectric harvester contains three
components apart from the harvester: a fullwave rectifier, a reservoir capacitor
and an electronic device performing the primary task of the system. In this contribution,
a model describing the operation of such a system is derived. It is found that
in steady-state operation, the piezoelectric harvester experiences two alternating
load conditions due to the rectification process. These alternating load conditions
can have a significant effect on the operation of the harvester and must be considered
in the design of autonomous systems. The results also show that such an autonomous
system works efficiently if it is connected to a high impedance load and excited
by a frequency matching the anti-resonance frequency of the piezoelectric harvester.'
author:
- first_name: Waleed
full_name: Al-Ashtari, Waleed
last_name: Al-Ashtari
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Al-Ashtari W, Hunstig M, Hemsel T, Sextro W. Characteristics of Piezoelectric
Energy Harvesters in Autonomous Systems. In: Proceedings of 10th International
Workshop on Piezoelectric Materials and Applications and 8th Energy Harvesting
Workshop, Hannover, Germany, 14.-17.7.2013. Berichte aus dem IDS. Hannover,
Germany; 2013:159-161.'
apa: Al-Ashtari, W., Hunstig, M., Hemsel, T., & Sextro, W. (2013). Characteristics
of Piezoelectric Energy Harvesters in Autonomous Systems. In Proceedings of
10th International Workshop on Piezoelectric Materials and Applications and 8th
Energy Harvesting Workshop, Hannover, Germany, 14.-17.7.2013 (pp. 159–161).
Hannover, Germany.
bibtex: '@inproceedings{Al-Ashtari_Hunstig_Hemsel_Sextro_2013, place={Hannover,
Germany}, series={Berichte aus dem IDS}, title={Characteristics of Piezoelectric
Energy Harvesters in Autonomous Systems}, number={05/2013}, booktitle={Proceedings
of 10th International Workshop on Piezoelectric Materials and Applications and
8th Energy Harvesting Workshop, Hannover, Germany, 14.-17.7.2013}, author={Al-Ashtari,
Waleed and Hunstig, Matthias and Hemsel, Tobias and Sextro, Walter}, year={2013},
pages={159–161}, collection={Berichte aus dem IDS} }'
chicago: Al-Ashtari, Waleed, Matthias Hunstig, Tobias Hemsel, and Walter Sextro.
“Characteristics of Piezoelectric Energy Harvesters in Autonomous Systems.” In
Proceedings of 10th International Workshop on Piezoelectric Materials and Applications
and 8th Energy Harvesting Workshop, Hannover, Germany, 14.-17.7.2013, 159–61.
Berichte Aus Dem IDS. Hannover, Germany, 2013.
ieee: W. Al-Ashtari, M. Hunstig, T. Hemsel, and W. Sextro, “Characteristics of Piezoelectric
Energy Harvesters in Autonomous Systems,” in Proceedings of 10th International
Workshop on Piezoelectric Materials and Applications and 8th Energy Harvesting
Workshop, Hannover, Germany, 14.-17.7.2013, 2013, no. 05/2013, pp. 159–161.
mla: Al-Ashtari, Waleed, et al. “Characteristics of Piezoelectric Energy Harvesters
in Autonomous Systems.” Proceedings of 10th International Workshop on Piezoelectric
Materials and Applications and 8th Energy Harvesting Workshop, Hannover, Germany,
14.-17.7.2013, no. 05/2013, 2013, pp. 159–61.
short: 'W. Al-Ashtari, M. Hunstig, T. Hemsel, W. Sextro, in: Proceedings of 10th
International Workshop on Piezoelectric Materials and Applications and 8th Energy
Harvesting Workshop, Hannover, Germany, 14.-17.7.2013, Hannover, Germany, 2013,
pp. 159–161.'
date_created: 2019-05-13T13:53:25Z
date_updated: 2022-01-06T07:04:20Z
department:
- _id: '151'
issue: 05/2013
keyword:
- Energy harvesting
- harvester modeling
- load dependence
- generated voltage
language:
- iso: eng
page: 159-161
place: Hannover, Germany
publication: Proceedings of 10th International Workshop on Piezoelectric Materials
and Applications and 8th Energy Harvesting Workshop, Hannover, Germany, 14.-17.7.2013
quality_controlled: '1'
series_title: Berichte aus dem IDS
status: public
title: Characteristics of Piezoelectric Energy Harvesters in Autonomous Systems
type: conference
user_id: '55222'
year: '2013'
...
---
_id: '9801'
author:
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Waleed
full_name: Al-Ashtari, Waleed
last_name: Al-Ashtari
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Hunstig M, Al-Ashtari W, Hemsel T, Sextro W. Leistungs- und Bandbreitensteigerung
von Energy-Harvesting-Generatoren für Energieautarke Systeme. In: Gausemeier J,
Dumitrescu R, Rammig F, Schäfer W, Trächtler A, eds. 9. Paderborner Workshop
Entwurf Mechatronischer Systeme. HNI-Verlagsschriftenreihe. Paderborn: Heinz
Nixdorf Institut, Universität Paderborn; 2013:359-372.'
apa: 'Hunstig, M., Al-Ashtari, W., Hemsel, T., & Sextro, W. (2013). Leistungs-
und Bandbreitensteigerung von Energy-Harvesting-Generatoren für Energieautarke
Systeme. In J. Gausemeier, R. Dumitrescu, F. Rammig, W. Schäfer, & A. Trächtler
(Eds.), 9. Paderborner Workshop Entwurf mechatronischer Systeme (pp. 359–372).
Paderborn: Heinz Nixdorf Institut, Universität Paderborn.'
bibtex: '@inproceedings{Hunstig_Al-Ashtari_Hemsel_Sextro_2013, place={Paderborn},
series={HNI-Verlagsschriftenreihe}, title={Leistungs- und Bandbreitensteigerung
von Energy-Harvesting-Generatoren für Energieautarke Systeme}, booktitle={9. Paderborner
Workshop Entwurf mechatronischer Systeme}, publisher={Heinz Nixdorf Institut,
Universität Paderborn}, author={Hunstig, Matthias and Al-Ashtari, Waleed and Hemsel,
Tobias and Sextro, Walter}, editor={Gausemeier, Jürgen and Dumitrescu, Roman and Rammig,
Franz and Schäfer, Wilhelm and Trächtler, AnsgarEditors}, year={2013}, pages={359–372},
collection={HNI-Verlagsschriftenreihe} }'
chicago: 'Hunstig, Matthias, Waleed Al-Ashtari, Tobias Hemsel, and Walter Sextro.
“Leistungs- Und Bandbreitensteigerung von Energy-Harvesting-Generatoren Für Energieautarke
Systeme.” In 9. Paderborner Workshop Entwurf Mechatronischer Systeme, edited
by Jürgen Gausemeier, Roman Dumitrescu, Franz Rammig, Wilhelm Schäfer, and Ansgar
Trächtler, 359–72. HNI-Verlagsschriftenreihe. Paderborn: Heinz Nixdorf Institut,
Universität Paderborn, 2013.'
ieee: M. Hunstig, W. Al-Ashtari, T. Hemsel, and W. Sextro, “Leistungs- und Bandbreitensteigerung
von Energy-Harvesting-Generatoren für Energieautarke Systeme,” in 9. Paderborner
Workshop Entwurf mechatronischer Systeme, 2013, pp. 359–372.
mla: Hunstig, Matthias, et al. “Leistungs- Und Bandbreitensteigerung von Energy-Harvesting-Generatoren
Für Energieautarke Systeme.” 9. Paderborner Workshop Entwurf Mechatronischer
Systeme, edited by Jürgen Gausemeier et al., Heinz Nixdorf Institut, Universität
Paderborn, 2013, pp. 359–72.
short: 'M. Hunstig, W. Al-Ashtari, T. Hemsel, W. Sextro, in: J. Gausemeier, R. Dumitrescu,
F. Rammig, W. Schäfer, A. Trächtler (Eds.), 9. Paderborner Workshop Entwurf Mechatronischer
Systeme, Heinz Nixdorf Institut, Universität Paderborn, Paderborn, 2013, pp. 359–372.'
date_created: 2019-05-13T14:02:10Z
date_updated: 2022-01-06T07:04:21Z
department:
- _id: '151'
editor:
- first_name: Jürgen
full_name: Gausemeier, Jürgen
last_name: Gausemeier
- first_name: Roman
full_name: Dumitrescu, Roman
last_name: Dumitrescu
- first_name: Franz
full_name: ' Rammig, Franz'
last_name: ' Rammig'
- first_name: Wilhelm
full_name: Schäfer, Wilhelm
last_name: Schäfer
- first_name: Ansgar
full_name: Trächtler, Ansgar
last_name: Trächtler
language:
- iso: eng
page: 359-372
place: Paderborn
publication: 9. Paderborner Workshop Entwurf mechatronischer Systeme
publisher: Heinz Nixdorf Institut, Universität Paderborn
series_title: HNI-Verlagsschriftenreihe
status: public
title: Leistungs- und Bandbreitensteigerung von Energy-Harvesting-Generatoren für
Energieautarke Systeme
type: conference
user_id: '55222'
year: '2013'
...