---
_id: '34104'
abstract:
- lang: eng
  text: 'ue to the constantly growing energy demand of power electronics and the need
    to reduce the size of electronic components like power modules for e-mobility,
    new challenges arise for ultrasonic wire bonding: the electrical connection must
    endure higher thermal and mechanical stress while the connecting partners become
    more sensitive or require more energy to get bonded. Past investigations have
    shown already that multi-dimensional ultrasonic bonding and welding yield the
    same or even better bond quality while reducing the load on the components. This
    contribution is intended to show whether multidi-mensional thick wire bonding
    is a promising concept to over-come the new challenges. The focus is on experimental
    investi-gations of different bond tool trajectories in ultrasonic wire bonding
    of aluminum and copper wire on DCB''s and chips. The bond quality is analyzed
    by shear tests, microsections and, in the case of aluminum bonding, by a new machine
    learning method for an objective automated evaluation of the sheared area.'
author:
- first_name: Claus
  full_name: Scheidemann, Claus
  id: '38259'
  last_name: Scheidemann
- first_name: Olaf
  full_name: Kirsch, Olaf
  last_name: Kirsch
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of
    Multidimensional Ultrasonic Heavy Wire Bonding. In: <i>2022 IEEE 9th Electronics
    System-Integration Technology Conference (ESTC)</i>. IEEE; 2022. doi:<a href="https://doi.org/10.1109/estc55720.2022.9939478">10.1109/estc55720.2022.9939478</a>'
  apa: Scheidemann, C., Kirsch, O., Hemsel, T., &#38; Sextro, W. (2022). Experimental
    Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. <i>2022 IEEE
    9th Electronics System-Integration Technology Conference (ESTC)</i>. <a href="https://doi.org/10.1109/estc55720.2022.9939478">https://doi.org/10.1109/estc55720.2022.9939478</a>
  bibtex: '@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental
    Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={<a href="https://doi.org/10.1109/estc55720.2022.9939478">10.1109/estc55720.2022.9939478</a>},
    booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference
    (ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel,
    Tobias and Sextro, Walter}, year={2022} }'
  chicago: Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental
    Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In <i>2022 IEEE
    9th Electronics System-Integration Technology Conference (ESTC)</i>. IEEE, 2022.
    <a href="https://doi.org/10.1109/estc55720.2022.9939478">https://doi.org/10.1109/estc55720.2022.9939478</a>.
  ieee: 'C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation
    of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: <a href="https://doi.org/10.1109/estc55720.2022.9939478">10.1109/estc55720.2022.9939478</a>.'
  mla: Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional
    Ultrasonic Heavy Wire Bonding.” <i>2022 IEEE 9th Electronics System-Integration
    Technology Conference (ESTC)</i>, IEEE, 2022, doi:<a href="https://doi.org/10.1109/estc55720.2022.9939478">10.1109/estc55720.2022.9939478</a>.
  short: 'C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics
    System-Integration Technology Conference (ESTC), IEEE, 2022.'
date_created: 2022-11-17T15:17:39Z
date_updated: 2023-09-22T12:24:18Z
department:
- _id: '151'
doi: 10.1109/estc55720.2022.9939478
language:
- iso: eng
publication: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
publication_status: published
publisher: IEEE
quality_controlled: '1'
status: public
title: Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
type: conference
user_id: '38259'
year: '2022'
...
---
_id: '15412'
abstract:
- lang: eng
  text: <jats:p> Ultrasonic joining is a common industrial process. To build electrical
    connections in the electronics industry, uni-axial and torsional ultrasonic vibration
    have been used to join different types of workpieces for decades. Many influencing
    factors like ultrasonic power, bond normal force, bond duration and frequency
    are known to have a high impact on bond quality and reliability. Multi-dimensional
    bonding has been investigated in the past to increase ultrasonic power and consequently
    bond strength. This contribution is focused on the comparison of circular, multi-frequency
    planar and uniaxial vibration trajectories used for ultrasonic bonding of copper
    pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic
    microscopy and interface cross-sections. </jats:p>
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Collin
  full_name: Dymel, Collin
  last_name: Dymel
- first_name: Tobias
  full_name: Hemsel, Tobias
  last_name: Hemsel
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  last_name: Sextro
citation:
  ama: 'Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration
    trajectories on quality and failure modes in ultrasonic bonding. In: <i>International
    Symposium on Microelectronics</i>. ; 2019:509-514. doi:<a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>'
  apa: Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M.,
    &#38; Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on
    quality and failure modes in ultrasonic bonding. <i>International Symposium on
    Microelectronics</i>, 509–514. <a href="https://doi.org/10.4071/2380-4505-2019.1.000509">https://doi.org/10.4071/2380-4505-2019.1.000509</a>
  bibtex: '@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019,
    title={Impact of multi-dimensional vibration trajectories on quality and failure
    modes in ultrasonic bonding}, DOI={<a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>},
    booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard
    and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias
    and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={509–514} }'
  chicago: Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias
    Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration
    Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In <i>International
    Symposium on Microelectronics</i>, 509–14, 2019. <a href="https://doi.org/10.4071/2380-4505-2019.1.000509">https://doi.org/10.4071/2380-4505-2019.1.000509</a>.
  ieee: 'R. Schemmel <i>et al.</i>, “Impact of multi-dimensional vibration trajectories
    on quality and failure modes in ultrasonic bonding,” in <i>International Symposium
    on Microelectronics</i>, Boston, 2019, pp. 509–514, doi: <a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>.'
  mla: Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories
    on Quality and Failure Modes in Ultrasonic Bonding.” <i>International Symposium
    on Microelectronics</i>, 2019, pp. 509–14, doi:<a href="https://doi.org/10.4071/2380-4505-2019.1.000509">10.4071/2380-4505-2019.1.000509</a>.
  short: 'R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann,
    W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.'
conference:
  location: Boston
  name: International Symposium on Microelectronics
date_created: 2019-12-24T21:41:04Z
date_updated: 2023-09-21T14:28:50Z
ddc:
- '620'
department:
- _id: '151'
doi: 10.4071/2380-4505-2019.1.000509
file:
- access_level: closed
  content_type: application/pdf
  creator: schemmel
  date_created: 2019-12-24T21:43:59Z
  date_updated: 2019-12-24T21:43:59Z
  file_id: '15413'
  file_name: 2380-4505-2019.1.000509.pdf
  file_size: 1010930
  relation: main_file
  success: 1
file_date_updated: 2019-12-24T21:43:59Z
has_accepted_license: '1'
language:
- iso: eng
page: 509-514
publication: International Symposium on Microelectronics
publication_identifier:
  issn:
  - 2380-4505
publication_status: published
quality_controlled: '1'
status: public
title: Impact of multi-dimensional vibration trajectories on quality and failure modes
  in ultrasonic bonding
type: conference
user_id: '210'
year: '2019'
...
---
_id: '10334'
abstract:
- lang: eng
  text: Ultrasonic joining is a common industrial process. In the electronics industry
    it is used to form electrical connections, including those of dissimilar materials.
    Multiple influencing factors in ultrasonic joining are known and extensively investigated;
    process parameters like ultrasonic power, bond force, and bonding frequency of
    the ultrasonic vibration are known to have a high impact on a reliable joining
    process and need to be adapted for each new application with different geometry
    or materials. This contribution is focused on increasing ultrasonic power transmitted
    to the interface and keeping mechanical stresses during ultrasonic bonding low
    by using a multi-dimensional ultrasonic transducer concept. Bonding results for
    a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional
    bonding are discussed.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Tobias
  full_name: Hemsel, Tobias
  id: '210'
  last_name: Hemsel
- first_name: Collin
  full_name: Dymel, Collin
  id: '66833'
  last_name: Dymel
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
citation:
  ama: 'Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex
    multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors
    and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>'
  apa: 'Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro,
    W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic
    bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662.
    <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>'
  bibtex: '@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using
    complex multi-dimensional vibration trajectories in ultrasonic bonding and welding},
    volume={295}, DOI={<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>},
    journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel,
    Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro,
    Walter}, year={2019}, pages={653–662} }'
  chicago: 'Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael
    Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295
    (2019): 653–62. <a href="https://doi.org/10.1016/j.sna.2019.04.025">https://doi.org/10.1016/j.sna.2019.04.025</a>.'
  ieee: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro,
    “Using complex multi-dimensional vibration trajectories in ultrasonic bonding
    and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662,
    2019, doi: <a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  mla: 'Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories
    in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>,
    vol. 295, 2019, pp. 653–62, doi:<a href="https://doi.org/10.1016/j.sna.2019.04.025">10.1016/j.sna.2019.04.025</a>.'
  short: 'R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro,
    Sensors and Actuators A: Physical 295 (2019) 653–662.'
date_created: 2019-07-01T07:32:07Z
date_updated: 2023-09-21T14:12:15Z
department:
- _id: '151'
doi: 10.1016/j.sna.2019.04.025
intvolume: '       295'
keyword:
- Ultrasonic bonding
- Ultrasonic welding
- Multi-dimensional bonding
- Complex vibration
- Multi-frequent
- Two-dimensional friction model
language:
- iso: eng
page: 653 - 662
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: 'Sensors and Actuators A: Physical'
publication_identifier:
  issn:
  - 0924-4247
quality_controlled: '1'
status: public
title: Using complex multi-dimensional vibration trajectories in ultrasonic bonding
  and welding
type: journal_article
user_id: '210'
volume: 295
year: '2019'
...
---
_id: '9973'
abstract:
- lang: eng
  text: In power electronics, copper connector pins are e.g. used to connect control
    boards with power modules. The new chip generation based on SiC and GaN technology
    increase the power density of semiconductor modules significantly with junction
    temperatures reaching 200°C. To enable reliable operation at such high temperature,
    the soldering of these connector pins should be substituted by a multi-dimensional
    copper-copper bonding technology. A copper pin welded directly on DBC substrate
    also simplifies the assembly. With this aim, a proper bond tool and a suitable
    connector pin geometry are designed. This paper presents a two-dimensional trajectory
    approach for ultrasonic bonding of copper pieces, e.g. connector pins, with the
    intention to minimize mechanical stresses exposed to the substrate. This is achieved
    using a multi-dimensional vibration system with multiple transducers known from
    flip chip bonding. Applying a planar relative motion between the bonding piece
    and the substrate increases the induced frictional power compared to one-dimensional
    excitation. The core of this work is the development of a new tool design which
    enables a reliable and effective transmission of the multidimensional vibration
    into the contact area between nail-shaped bonding piece and substrate. For this
    purpose, different bonding tool as well as bonding piece designs are discussed.
    A proper bonding tool design is selected based on the simulated alternatives.
    This tool is examined in bonding experiments and the results are presented. In
    addition, different grades of hardness for bonding piece and substrate are examined
    as well as different bonding parameters. Optical inspection of the bonded area
    shows the emergence of initial micro welds in form of a ring which is growing
    in direction of the interface boundaries with increasing bonding duration.
author:
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper
    Bonding – New Challenges for Tool Design. <i>IMAPSource</i>. 2017;Vol. 2017, No.
    1.
  apa: Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann,
    M., &#38; Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New
    Challenges for Tool Design. <i>IMAPSource</i>, <i>Vol. 2017</i>, <i>No. 1</i>.
  bibtex: '@article{Eichwald_Althoff_Schemmel_Sextro_Unger_Brökelmann_Hunstig_2017,
    title={Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design},
    volume={Vol. 2017, No. 1}, journal={IMAPSource}, author={Eichwald, Paul and Althoff,
    Simon and Schemmel, Reinhard and Sextro, Walter and Unger, Andreas and Brökelmann,
    Michael and Hunstig, Matthias}, year={2017} }'
  chicago: Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas
    Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic
    Copper Bonding – New Challenges for Tool Design.” <i>IMAPSource</i> Vol. 2017,
    No. 1 (2017).
  ieee: P. Eichwald <i>et al.</i>, “Multi-dimensional Ultrasonic Copper Bonding –
    New Challenges for Tool Design,” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.
  mla: Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges
    for Tool Design.” <i>IMAPSource</i>, vol. Vol. 2017, No. 1, 2017.
  short: P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann,
    M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
date_created: 2019-05-27T09:32:42Z
date_updated: 2020-05-07T05:33:54Z
department:
- _id: '151'
keyword:
- International Symposium on Microelectronics
language:
- iso: eng
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: IMAPSource
quality_controlled: '1'
status: public
title: Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
type: journal_article
user_id: '210'
volume: Vol. 2017, No. 1
year: '2017'
...
---
_id: '9895'
abstract:
- lang: eng
  text: Power semiconductor modules are used to control and switch high electrical
    currents and voltages. Within the power module package wire bonding is used as
    an interconnection technology. In recent years, aluminum wire has been used preferably,
    but an ever-growing market of powerful and efficient power modules requires a
    material with better mechanical and electrical properties. For this reason, a
    technology change from aluminum to copper is indispensable. However, the copper
    wire bonding process reacts more sensitive to parameter changes. This makes manufacturing
    reliable copper bond connections a challenging task. The aim of the BMBF funded
    project Itsowl-InCuB is the development of self-optimizing techniques to enable
    the reliable production of copper bond connections under varying conditions. A
    model of the process is essential to achieve this aim. This model needs to include
    the dynamic elasto-plastic deformation, the ultrasonic softening effect and the
    proceeding adhesion between wire and substrate. This paper focusses on the pre-deformation
    process. In the touchdown phase, the wire is pressed into the V-groove of the
    tool and a small initial contact area between wire and substrate arise. The local
    characteristics of the material change abruptly because of the cold forming. Consequently,
    the pre-deformation has a strong effect on the joining process. In [1], a pre-cleaning
    effect during the touchdown process of aluminum wires by cracking of oxide layers
    was presented. These interactions of the process parameters are still largely
    unknown for copper. In a first step, this paper validates the importance of modeling
    the pre-deformation by showing its impact on the wire deformation characteristic
    experimentally. Creating cross-section views of pre-deformed copper wires has
    shown a low deformation degree compared to aluminum. By using a digital microscope
    and a scanning confocal microscope an analysis about the contact areas and penetration
    depths after touchdown has been made. Additionally, it has to be taken into account
    that the dynamical touchdown force depends on the touchdown speed and the touchdown
    force set in the bonding machine. In order to measure the overshoot in the force
    signals, a strain gauge sensor has been used. Subsequently, the affecting factors
    have been interpreted independently Furthermore, the material properties of copper
    wire have been investigated with tensile tests and hardness measurements. In a
    second step, the paper presents finite element models of the touchdown process
    for source and destination bonds. These models take the measured overshoot in
    the touchdown forces into account. A multi-linear, isotropic material model has
    been selected to map the material properties of the copper. A validation of the
    model with the experimental determined contact areas, normal pressures and penetration
    depths reveals the high model quality. Thus, the simulation is able to calculate
    and visualize the three dimensional pre-deformation with an integrated material
    parameter of the wire if the touchdown parameters of the bonding machine are known.
    Based on the calculated deformation degrees of wire and substrate, it is probably
    possible to investigate the effect of the pre-deformation on the pre-cleaning
    phase in the copper wire bonding.
author:
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
citation:
  ama: 'Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation
    Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: <i>Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)</i>. San Diego, CA, US;
    2014:289-294.'
  apa: Unger, A., Sextro, W., Althoff, S., Eichwald, P., Meyer, T., Eacock, F., &#38;
    Brökelmann, M. (2014). Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds. In <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i> (pp. 289–294). San Diego, CA, US.
  bibtex: '@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014,
    place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study
    of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas
    and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and
    Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }'
  chicago: Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer,
    Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation
    Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In <i>Proceedings of the
    47th International Symposium on Microelectronics (IMAPS)</i>, 289–94. San Diego,
    CA, US, 2014.
  ieee: A. Unger <i>et al.</i>, “Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds,” in <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i>, 2014, pp. 289–294.
  mla: Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed
    Heavy Copper Wire Wedge Bonds.” <i>Proceedings of the 47th International Symposium
    on Microelectronics (IMAPS)</i>, 2014, pp. 289–94.
  short: 'A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann,
    in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS),
    San Diego, CA, US, 2014, pp. 289–294.'
date_created: 2019-05-20T13:35:09Z
date_updated: 2020-05-07T05:33:47Z
department:
- _id: '151'
keyword:
- pre-deformation
- copper wire bonding
- finite element model
language:
- iso: eng
page: 289-294
place: San Diego, CA, US
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics (IMAPS)
status: public
title: Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire
  Wedge Bonds
type: conference
user_id: '210'
year: '2014'
...