---
_id: '53663'
abstract:
- lang: eng
text: 'Noctua 2 is a supercomputer operated at the Paderborn Center for Parallel
Computing (PC2) at Paderborn University in Germany. Noctua 2 was inaugurated in
2022 and is an Atos BullSequana XH2000 system. It consists mainly of three node
types: 1) CPU Compute nodes with AMD EPYC processors in different main memory
configurations, 2) GPU nodes with NVIDIA A100 GPUs, and 3) FPGA nodes with Xilinx
Alveo U280 and Intel Stratix 10 FPGA cards. While CPUs and GPUs are known off-the-shelf
components in HPC systems, the operation of a large number of FPGA cards from
different vendors and a dedicated FPGA-to-FPGA network are unique characteristics
of Noctua 2. This paper describes in detail the overall setup of Noctua 2 and
gives insights into the operation of the cluster from a hardware, software and
facility perspective.'
article_type: original
author:
- first_name: Carsten
full_name: Bauer, Carsten
id: '90082'
last_name: Bauer
- first_name: Tobias
full_name: Kenter, Tobias
id: '3145'
last_name: Kenter
- first_name: Michael
full_name: Lass, Michael
id: '24135'
last_name: Lass
orcid: 0000-0002-5708-7632
- first_name: Lukas
full_name: Mazur, Lukas
id: '90492'
last_name: Mazur
orcid: ' 0000-0001-6304-7082'
- first_name: Marius
full_name: Meyer, Marius
id: '40778'
last_name: Meyer
- first_name: Holger
full_name: Nitsche, Holger
id: '15272'
last_name: Nitsche
- first_name: Heinrich
full_name: Riebler, Heinrich
id: '8961'
last_name: Riebler
- first_name: Robert
full_name: Schade, Robert
id: '75963'
last_name: Schade
orcid: 0000-0002-6268-5397
- first_name: Michael
full_name: Schwarz, Michael
id: '5312'
last_name: Schwarz
- first_name: Nils
full_name: Winnwa, Nils
id: '61189'
last_name: Winnwa
- first_name: Alex
full_name: Wiens, Alex
id: '23522'
last_name: Wiens
orcid: 0000-0003-1764-9773
- first_name: Xin
full_name: Wu, Xin
id: '77439'
last_name: Wu
- first_name: Christian
full_name: Plessl, Christian
id: '16153'
last_name: Plessl
orcid: 0000-0001-5728-9982
- first_name: Jens
full_name: Simon, Jens
id: '15273'
last_name: Simon
citation:
ama: Bauer C, Kenter T, Lass M, et al. Noctua 2 Supercomputer. Journal of large-scale
research facilities. 2024;9. doi:10.17815/jlsrf-8-187
apa: Bauer, C., Kenter, T., Lass, M., Mazur, L., Meyer, M., Nitsche, H., Riebler,
H., Schade, R., Schwarz, M., Winnwa, N., Wiens, A., Wu, X., Plessl, C., &
Simon, J. (2024). Noctua 2 Supercomputer. Journal of Large-Scale Research Facilities,
9. https://doi.org/10.17815/jlsrf-8-187
bibtex: '@article{Bauer_Kenter_Lass_Mazur_Meyer_Nitsche_Riebler_Schade_Schwarz_Winnwa_et
al._2024, title={Noctua 2 Supercomputer}, volume={9}, DOI={10.17815/jlsrf-8-187 }, journal={Journal of large-scale research facilities},
author={Bauer, Carsten and Kenter, Tobias and Lass, Michael and Mazur, Lukas and
Meyer, Marius and Nitsche, Holger and Riebler, Heinrich and Schade, Robert and
Schwarz, Michael and Winnwa, Nils and et al.}, year={2024} }'
chicago: Bauer, Carsten, Tobias Kenter, Michael Lass, Lukas Mazur, Marius Meyer,
Holger Nitsche, Heinrich Riebler, et al. “Noctua 2 Supercomputer.” Journal
of Large-Scale Research Facilities 9 (2024). https://doi.org/10.17815/jlsrf-8-187 .
ieee: 'C. Bauer et al., “Noctua 2 Supercomputer,” Journal of large-scale
research facilities, vol. 9, 2024, doi: 10.17815/jlsrf-8-187 .'
mla: Bauer, Carsten, et al. “Noctua 2 Supercomputer.” Journal of Large-Scale
Research Facilities, vol. 9, 2024, doi:10.17815/jlsrf-8-187 .
short: C. Bauer, T. Kenter, M. Lass, L. Mazur, M. Meyer, H. Nitsche, H. Riebler,
R. Schade, M. Schwarz, N. Winnwa, A. Wiens, X. Wu, C. Plessl, J. Simon, Journal
of Large-Scale Research Facilities 9 (2024).
date_created: 2024-04-26T07:39:41Z
date_updated: 2024-04-26T08:44:30Z
ddc:
- '004'
department:
- _id: '27'
- _id: '518'
doi: '10.17815/jlsrf-8-187 '
file:
- access_level: open_access
content_type: application/pdf
creator: deffel
date_created: 2024-04-26T07:30:20Z
date_updated: 2024-04-26T08:35:17Z
file_id: '53664'
file_name: Noctua2_Supercomputer.pdf
file_size: 3825480
relation: main_file
file_date_updated: 2024-04-26T08:35:17Z
has_accepted_license: '1'
intvolume: ' 9'
keyword:
- Noctua 2
- Supercomputer
- FPGA
- PC2
- Paderborn Center for Parallel Computing
language:
- iso: eng
oa: '1'
project:
- _id: '52'
name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
publication: Journal of large-scale research facilities
publication_status: published
status: public
title: Noctua 2 Supercomputer
type: journal_article
user_id: '8961'
volume: 9
year: '2024'
...
---
_id: '56606'
abstract:
- lang: eng
text: AbstractMost FPGA boards in the HPC domain
are well-suited for parallel scaling because of the direct integration of versatile
and high-throughput network ports. However, the utilization of their network capabilities is
often challenging and error-prone because the whole network stack and communication
patterns have to be implemented and managed on the FPGAs. Also, this approach
conceptually involves a trade-off between the performance potential of improved
communication and the impact of resource consumption for communication infrastructure,
since the utilized resources on the FPGAs could otherwise be used for computations.
In this work, we investigate this trade-off, firstly, by using synthetic benchmarks
to evaluate the different configuration options of the communication framework
ACCL and their impact on communication latency and throughput. Finally, we use
our findings to implement a shallow water simulation whose scalability heavily
depends on low-latency communication. With a suitable configuration of ACCL, good
scaling behavior can be shown to all 48 FPGAs installed in the system. Overall,
the results show that the availability of inter-FPGA communication frameworks
as well as the configurability of framework and network stack are crucial to achieve
the best application performance with low latency communication.
author:
- first_name: Marius
full_name: Meyer, Marius
last_name: Meyer
- first_name: Tobias
full_name: Kenter, Tobias
last_name: Kenter
- first_name: Lucian
full_name: Petrica, Lucian
last_name: Petrica
- first_name: Kenneth
full_name: O’Brien, Kenneth
last_name: O’Brien
- first_name: Michaela
full_name: Blott, Michaela
last_name: Blott
- first_name: Christian
full_name: Plessl, Christian
last_name: Plessl
citation:
ama: 'Meyer M, Kenter T, Petrica L, O’Brien K, Blott M, Plessl C. Optimizing Communication
for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL. In: Lecture
Notes in Computer Science. Springer Nature Switzerland; 2024. doi:10.1007/978-3-031-69766-1_9'
apa: Meyer, M., Kenter, T., Petrica, L., O’Brien, K., Blott, M., & Plessl, C.
(2024). Optimizing Communication for Latency Sensitive HPC Applications on up
to 48 FPGAs Using ACCL. In Lecture Notes in Computer Science. Springer
Nature Switzerland. https://doi.org/10.1007/978-3-031-69766-1_9
bibtex: '@inbook{Meyer_Kenter_Petrica_O’Brien_Blott_Plessl_2024, place={Cham}, title={Optimizing
Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL},
DOI={10.1007/978-3-031-69766-1_9},
booktitle={Lecture Notes in Computer Science}, publisher={Springer Nature Switzerland},
author={Meyer, Marius and Kenter, Tobias and Petrica, Lucian and O’Brien, Kenneth
and Blott, Michaela and Plessl, Christian}, year={2024} }'
chicago: 'Meyer, Marius, Tobias Kenter, Lucian Petrica, Kenneth O’Brien, Michaela
Blott, and Christian Plessl. “Optimizing Communication for Latency Sensitive HPC
Applications on up to 48 FPGAs Using ACCL.” In Lecture Notes in Computer Science.
Cham: Springer Nature Switzerland, 2024. https://doi.org/10.1007/978-3-031-69766-1_9.'
ieee: 'M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, and C. Plessl, “Optimizing
Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL,”
in Lecture Notes in Computer Science, Cham: Springer Nature Switzerland,
2024.'
mla: Meyer, Marius, et al. “Optimizing Communication for Latency Sensitive HPC Applications
on up to 48 FPGAs Using ACCL.” Lecture Notes in Computer Science, Springer
Nature Switzerland, 2024, doi:10.1007/978-3-031-69766-1_9.
short: 'M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, C. Plessl, in: Lecture
Notes in Computer Science, Springer Nature Switzerland, Cham, 2024.'
date_created: 2024-10-14T07:51:51Z
date_updated: 2024-10-14T07:55:50Z
department:
- _id: '27'
- _id: '518'
doi: 10.1007/978-3-031-69766-1_9
language:
- iso: eng
main_file_link:
- open_access: '1'
oa: '1'
place: Cham
publication: Lecture Notes in Computer Science
publication_identifier:
isbn:
- '9783031697654'
- '9783031697661'
issn:
- 0302-9743
- 1611-3349
publication_status: published
publisher: Springer Nature Switzerland
quality_controlled: '1'
status: public
title: Optimizing Communication for Latency Sensitive HPC Applications on up to 48
FPGAs Using ACCL
type: book_chapter
user_id: '3145'
year: '2024'
...
---
_id: '56607'
author:
- first_name: Abdul Rehman
full_name: Tareen, Abdul Rehman
id: '76938'
last_name: Tareen
- first_name: Marius
full_name: Meyer, Marius
id: '40778'
last_name: Meyer
- first_name: Christian
full_name: Plessl, Christian
id: '16153'
last_name: Plessl
orcid: 0000-0001-5728-9982
- first_name: Tobias
full_name: Kenter, Tobias
id: '3145'
last_name: Kenter
citation:
ama: 'Tareen AR, Meyer M, Plessl C, Kenter T. HiHiSpMV: Sparse Matrix Vector Multiplication
with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory. In: 2024
IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing
Machines (FCCM). Vol 35. IEEE; 2024. doi:10.1109/fccm60383.2024.00014'
apa: 'Tareen, A. R., Meyer, M., Plessl, C., & Kenter, T. (2024). HiHiSpMV: Sparse
Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High
Bandwidth Memory. 2024 IEEE 32nd Annual International Symposium on Field-Programmable
Custom Computing Machines (FCCM), 35. https://doi.org/10.1109/fccm60383.2024.00014'
bibtex: '@inproceedings{Tareen_Meyer_Plessl_Kenter_2024, title={HiHiSpMV: Sparse
Matrix Vector Multiplication with Hierarchical Row Reductions on FPGAs with High
Bandwidth Memory}, volume={35}, DOI={10.1109/fccm60383.2024.00014},
booktitle={2024 IEEE 32nd Annual International Symposium on Field-Programmable
Custom Computing Machines (FCCM)}, publisher={IEEE}, author={Tareen, Abdul Rehman
and Meyer, Marius and Plessl, Christian and Kenter, Tobias}, year={2024} }'
chicago: 'Tareen, Abdul Rehman, Marius Meyer, Christian Plessl, and Tobias Kenter.
“HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions
on FPGAs with High Bandwidth Memory.” In 2024 IEEE 32nd Annual International
Symposium on Field-Programmable Custom Computing Machines (FCCM), Vol. 35.
IEEE, 2024. https://doi.org/10.1109/fccm60383.2024.00014.'
ieee: 'A. R. Tareen, M. Meyer, C. Plessl, and T. Kenter, “HiHiSpMV: Sparse Matrix
Vector Multiplication with Hierarchical Row Reductions on FPGAs with High Bandwidth
Memory,” in 2024 IEEE 32nd Annual International Symposium on Field-Programmable
Custom Computing Machines (FCCM), 2024, vol. 35, doi: 10.1109/fccm60383.2024.00014.'
mla: 'Tareen, Abdul Rehman, et al. “HiHiSpMV: Sparse Matrix Vector Multiplication
with Hierarchical Row Reductions on FPGAs with High Bandwidth Memory.” 2024
IEEE 32nd Annual International Symposium on Field-Programmable Custom Computing
Machines (FCCM), vol. 35, IEEE, 2024, doi:10.1109/fccm60383.2024.00014.'
short: 'A.R. Tareen, M. Meyer, C. Plessl, T. Kenter, in: 2024 IEEE 32nd Annual International
Symposium on Field-Programmable Custom Computing Machines (FCCM), IEEE, 2024.'
date_created: 2024-10-14T07:59:08Z
date_updated: 2024-10-14T12:27:55Z
department:
- _id: '27'
- _id: '518'
doi: 10.1109/fccm60383.2024.00014
intvolume: ' 35'
language:
- iso: eng
publication: 2024 IEEE 32nd Annual International Symposium on Field-Programmable Custom
Computing Machines (FCCM)
publication_status: published
publisher: IEEE
quality_controlled: '1'
status: public
title: 'HiHiSpMV: Sparse Matrix Vector Multiplication with Hierarchical Row Reductions
on FPGAs with High Bandwidth Memory'
type: conference
user_id: '3145'
volume: 35
year: '2024'
...
---
_id: '62067'
abstract:
- lang: eng
text: Most FPGA boards in the HPC domain are well-suited for parallel scaling because
of the direct integration of versatile and high-throughput network ports. However,
the utilization of their network capabilities is often challenging and error-prone
because the whole network stack and communication patterns have to be implemented
and managed on the FPGAs. Also, this approach conceptually involves a trade-off
between the performance potential of improved communication and the impact of
resource consumption for communication infrastructure, since the utilized resources
on the FPGAs could otherwise be used for computations. In this work, we investigate
this trade-off, firstly, by using synthetic benchmarks to evaluate the different
configuration options of the communication framework ACCL and their impact on
communication latency and throughput. Finally, we use our findings to implement
a shallow water simulation whose scalability heavily depends on low-latency communication.
With a suitable configuration of ACCL, good scaling behavior can be shown to all
48 FPGAs installed in the system. Overall, the results show that the availability
of inter-FPGA communication frameworks as well as the configurability of framework and
network stack are crucial to achieve the best application performance with low
latency communication.
author:
- first_name: Marius
full_name: Meyer, Marius
id: '40778'
last_name: Meyer
- first_name: Tobias
full_name: Kenter, Tobias
id: '3145'
last_name: Kenter
- first_name: Lucian
full_name: Petrica, Lucian
last_name: Petrica
- first_name: Kenneth
full_name: O’Brien, Kenneth
last_name: O’Brien
- first_name: Michaela
full_name: Blott, Michaela
last_name: Blott
- first_name: Christian
full_name: Plessl, Christian
id: '16153'
last_name: Plessl
orcid: 0000-0001-5728-9982
citation:
ama: 'Meyer M, Kenter T, Petrica L, O’Brien K, Blott M, Plessl C. Optimizing Communication
for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL. In: Lecture
Notes in Computer Science. Springer Nature Switzerland; 2024. doi:10.1007/978-3-031-69766-1_9'
apa: Meyer, M., Kenter, T., Petrica, L., O’Brien, K., Blott, M., & Plessl, C.
(2024). Optimizing Communication for Latency Sensitive HPC Applications on up
to 48 FPGAs Using ACCL. In Lecture Notes in Computer Science. Springer
Nature Switzerland. https://doi.org/10.1007/978-3-031-69766-1_9
bibtex: '@inbook{Meyer_Kenter_Petrica_O’Brien_Blott_Plessl_2024, place={Cham}, title={Optimizing
Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL},
DOI={10.1007/978-3-031-69766-1_9},
booktitle={Lecture Notes in Computer Science}, publisher={Springer Nature Switzerland},
author={Meyer, Marius and Kenter, Tobias and Petrica, Lucian and O’Brien, Kenneth
and Blott, Michaela and Plessl, Christian}, year={2024} }'
chicago: 'Meyer, Marius, Tobias Kenter, Lucian Petrica, Kenneth O’Brien, Michaela
Blott, and Christian Plessl. “Optimizing Communication for Latency Sensitive HPC
Applications on up to 48 FPGAs Using ACCL.” In Lecture Notes in Computer Science.
Cham: Springer Nature Switzerland, 2024. https://doi.org/10.1007/978-3-031-69766-1_9.'
ieee: 'M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, and C. Plessl, “Optimizing
Communication for Latency Sensitive HPC Applications on up to 48 FPGAs Using ACCL,”
in Lecture Notes in Computer Science, Cham: Springer Nature Switzerland,
2024.'
mla: Meyer, Marius, et al. “Optimizing Communication for Latency Sensitive HPC Applications
on up to 48 FPGAs Using ACCL.” Lecture Notes in Computer Science, Springer
Nature Switzerland, 2024, doi:10.1007/978-3-031-69766-1_9.
short: 'M. Meyer, T. Kenter, L. Petrica, K. O’Brien, M. Blott, C. Plessl, in: Lecture
Notes in Computer Science, Springer Nature Switzerland, Cham, 2024.'
date_created: 2025-11-04T09:50:24Z
date_updated: 2025-11-04T09:51:22Z
department:
- _id: '27'
- _id: '518'
doi: 10.1007/978-3-031-69766-1_9
language:
- iso: eng
main_file_link:
- open_access: '1'
oa: '1'
place: Cham
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: Lecture Notes in Computer Science
publication_identifier:
isbn:
- '9783031697654'
- '9783031697661'
issn:
- 0302-9743
- 1611-3349
publication_status: published
publisher: Springer Nature Switzerland
quality_controlled: '1'
status: public
title: Optimizing Communication for Latency Sensitive HPC Applications on up to 48
FPGAs Using ACCL
type: book_chapter
user_id: '3145'
year: '2024'
...
---
_id: '45893'
author:
- first_name: Tim
full_name: Hansmeier, Tim
id: '49992'
last_name: Hansmeier
orcid: 0000-0003-1377-3339
- first_name: Tobias
full_name: Kenter, Tobias
id: '3145'
last_name: Kenter
- first_name: Marius
full_name: Meyer, Marius
id: '40778'
last_name: Meyer
- first_name: Heinrich
full_name: Riebler, Heinrich
id: '8961'
last_name: Riebler
- first_name: Marco
full_name: Platzner, Marco
id: '398'
last_name: Platzner
- first_name: Christian
full_name: Plessl, Christian
id: '16153'
last_name: Plessl
orcid: 0000-0001-5728-9982
citation:
ama: 'Hansmeier T, Kenter T, Meyer M, Riebler H, Platzner M, Plessl C. Compute Centers
I: Heterogeneous Execution Environments. In: Haake C-J, Meyer auf der Heide F,
Platzner M, Wachsmuth H, Wehrheim H, eds. On-The-Fly Computing -- Individualized
IT-Services in Dynamic Markets. Vol 412. Verlagsschriftenreihe des Heinz Nixdorf
Instituts. Heinz Nixdorf Institut, Universität Paderborn; 2023:165-182. doi:10.5281/zenodo.8068642'
apa: 'Hansmeier, T., Kenter, T., Meyer, M., Riebler, H., Platzner, M., & Plessl,
C. (2023). Compute Centers I: Heterogeneous Execution Environments. In C.-J. Haake,
F. Meyer auf der Heide, M. Platzner, H. Wachsmuth, & H. Wehrheim (Eds.), On-The-Fly
Computing -- Individualized IT-services in dynamic markets (Vol. 412, pp.
165–182). Heinz Nixdorf Institut, Universität Paderborn. https://doi.org/10.5281/zenodo.8068642'
bibtex: '@inbook{Hansmeier_Kenter_Meyer_Riebler_Platzner_Plessl_2023, place={Paderborn},
series={Verlagsschriftenreihe des Heinz Nixdorf Instituts}, title={Compute Centers
I: Heterogeneous Execution Environments}, volume={412}, DOI={10.5281/zenodo.8068642},
booktitle={On-The-Fly Computing -- Individualized IT-services in dynamic markets},
publisher={Heinz Nixdorf Institut, Universität Paderborn}, author={Hansmeier,
Tim and Kenter, Tobias and Meyer, Marius and Riebler, Heinrich and Platzner, Marco
and Plessl, Christian}, editor={Haake, Claus-Jochen and Meyer auf der Heide, Friedhelm
and Platzner, Marco and Wachsmuth, Henning and Wehrheim, Heike}, year={2023},
pages={165–182}, collection={Verlagsschriftenreihe des Heinz Nixdorf Instituts}
}'
chicago: 'Hansmeier, Tim, Tobias Kenter, Marius Meyer, Heinrich Riebler, Marco Platzner,
and Christian Plessl. “Compute Centers I: Heterogeneous Execution Environments.”
In On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets,
edited by Claus-Jochen Haake, Friedhelm Meyer auf der Heide, Marco Platzner, Henning
Wachsmuth, and Heike Wehrheim, 412:165–82. Verlagsschriftenreihe Des Heinz Nixdorf
Instituts. Paderborn: Heinz Nixdorf Institut, Universität Paderborn, 2023. https://doi.org/10.5281/zenodo.8068642.'
ieee: 'T. Hansmeier, T. Kenter, M. Meyer, H. Riebler, M. Platzner, and C. Plessl,
“Compute Centers I: Heterogeneous Execution Environments,” in On-The-Fly Computing
-- Individualized IT-services in dynamic markets, vol. 412, C.-J. Haake, F.
Meyer auf der Heide, M. Platzner, H. Wachsmuth, and H. Wehrheim, Eds. Paderborn:
Heinz Nixdorf Institut, Universität Paderborn, 2023, pp. 165–182.'
mla: 'Hansmeier, Tim, et al. “Compute Centers I: Heterogeneous Execution Environments.”
On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets,
edited by Claus-Jochen Haake et al., vol. 412, Heinz Nixdorf Institut, Universität
Paderborn, 2023, pp. 165–82, doi:10.5281/zenodo.8068642.'
short: 'T. Hansmeier, T. Kenter, M. Meyer, H. Riebler, M. Platzner, C. Plessl, in:
C.-J. Haake, F. Meyer auf der Heide, M. Platzner, H. Wachsmuth, H. Wehrheim (Eds.),
On-The-Fly Computing -- Individualized IT-Services in Dynamic Markets, Heinz Nixdorf
Institut, Universität Paderborn, Paderborn, 2023, pp. 165–182.'
date_created: 2023-07-07T08:15:45Z
date_updated: 2024-05-02T10:33:00Z
ddc:
- '004'
department:
- _id: '7'
- _id: '27'
- _id: '518'
- _id: '78'
doi: 10.5281/zenodo.8068642
editor:
- first_name: Claus-Jochen
full_name: Haake, Claus-Jochen
last_name: Haake
- first_name: Friedhelm
full_name: Meyer auf der Heide, Friedhelm
last_name: Meyer auf der Heide
- first_name: Marco
full_name: Platzner, Marco
last_name: Platzner
- first_name: Henning
full_name: Wachsmuth, Henning
last_name: Wachsmuth
- first_name: Heike
full_name: Wehrheim, Heike
last_name: Wehrheim
file:
- access_level: open_access
content_type: application/pdf
creator: florida
date_created: 2023-07-07T08:15:35Z
date_updated: 2023-07-07T11:17:33Z
file_id: '45894'
file_name: C2-Chapter-SFB-Buch-Final.pdf
file_size: 2288788
relation: main_file
file_date_updated: 2023-07-07T11:17:33Z
has_accepted_license: '1'
intvolume: ' 412'
language:
- iso: eng
oa: '1'
page: 165-182
place: Paderborn
project:
- _id: '1'
grant_number: '160364472'
name: 'SFB 901: SFB 901: On-The-Fly Computing - Individualisierte IT-Dienstleistungen
in dynamischen Märkten '
- _id: '4'
name: 'SFB 901 - C: SFB 901 - Project Area C'
- _id: '14'
grant_number: '160364472'
name: 'SFB 901 - C2: SFB 901 - On-The-Fly Compute Centers I: Heterogene Ausführungsumgebungen
(Subproject C2)'
publication: On-The-Fly Computing -- Individualized IT-services in dynamic markets
publisher: Heinz Nixdorf Institut, Universität Paderborn
series_title: Verlagsschriftenreihe des Heinz Nixdorf Instituts
status: public
title: 'Compute Centers I: Heterogeneous Execution Environments'
type: book_chapter
user_id: '398'
volume: 412
year: '2023'
...
---
_id: '38041'
abstract:
- lang: eng
text: "While FPGA accelerator boards and their respective high-level design
tools are maturing, there is still a lack of multi-FPGA applications, libraries,
and not least, benchmarks and reference implementations towards sustained HPC
usage of these devices. As in the early days of GPUs in HPC, for workloads that
can reasonably be decoupled into loosely coupled working sets, multi-accelerator
support can be achieved by using standard communication interfaces like MPI on
the host side. However, for performance and productivity, some applications can
profit from a tighter coupling of the accelerators. FPGAs offer unique opportunities
here when extending the dataflow characteristics to their communication interfaces.\r\n
\ In this work, we extend the HPCC FPGA benchmark suite by multi-FPGA
support and three missing benchmarks that particularly characterize or stress
inter-device communication: b_eff, PTRANS, and LINPACK. With all benchmarks implemented
for current boards with Intel and Xilinx FPGAs, we established a baseline for
multi-FPGA performance. Additionally, for the communication-centric benchmarks,
we explored the potential of direct FPGA-to-FPGA communication with a circuit-switched
inter-FPGA network that is currently only available for one of the boards. The
evaluation with parallel execution on up to 26 FPGA boards makes use of one of
the largest academic FPGA installations."
author:
- first_name: Marius
full_name: Meyer, Marius
id: '40778'
last_name: Meyer
- first_name: Tobias
full_name: Kenter, Tobias
id: '3145'
last_name: Kenter
- first_name: Christian
full_name: Plessl, Christian
id: '16153'
last_name: Plessl
orcid: 0000-0001-5728-9982
citation:
ama: Meyer M, Kenter T, Plessl C. Multi-FPGA Designs and Scaling of HPC Challenge
Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks. ACM Transactions
on Reconfigurable Technology and Systems. Published online 2023. doi:10.1145/3576200
apa: Meyer, M., Kenter, T., & Plessl, C. (2023). Multi-FPGA Designs and Scaling
of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks.
ACM Transactions on Reconfigurable Technology and Systems. https://doi.org/10.1145/3576200
bibtex: '@article{Meyer_Kenter_Plessl_2023, title={Multi-FPGA Designs and Scaling
of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks},
DOI={10.1145/3576200}, journal={ACM
Transactions on Reconfigurable Technology and Systems}, publisher={Association
for Computing Machinery (ACM)}, author={Meyer, Marius and Kenter, Tobias and Plessl,
Christian}, year={2023} }'
chicago: Meyer, Marius, Tobias Kenter, and Christian Plessl. “Multi-FPGA Designs
and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA
Networks.” ACM Transactions on Reconfigurable Technology and Systems, 2023.
https://doi.org/10.1145/3576200.
ieee: 'M. Meyer, T. Kenter, and C. Plessl, “Multi-FPGA Designs and Scaling of HPC
Challenge Benchmarks via MPI and Circuit-Switched Inter-FPGA Networks,” ACM
Transactions on Reconfigurable Technology and Systems, 2023, doi: 10.1145/3576200.'
mla: Meyer, Marius, et al. “Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks
via MPI and Circuit-Switched Inter-FPGA Networks.” ACM Transactions on Reconfigurable
Technology and Systems, Association for Computing Machinery (ACM), 2023, doi:10.1145/3576200.
short: M. Meyer, T. Kenter, C. Plessl, ACM Transactions on Reconfigurable Technology
and Systems (2023).
date_created: 2023-01-23T08:40:42Z
date_updated: 2023-07-28T08:02:05Z
department:
- _id: '27'
- _id: '518'
doi: 10.1145/3576200
keyword:
- General Computer Science
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://dl.acm.org/doi/10.1145/3576200
oa: '1'
project:
- _id: '52'
name: 'PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing'
- _id: '4'
name: 'SFB 901 - C: SFB 901 - Project Area C'
- _id: '1'
grant_number: '160364472'
name: 'SFB 901: SFB 901'
- _id: '14'
grant_number: '160364472'
name: 'SFB 901 - C2: SFB 901 - Subproject C2'
publication: ACM Transactions on Reconfigurable Technology and Systems
publication_identifier:
issn:
- 1936-7406
- 1936-7414
publication_status: published
publisher: Association for Computing Machinery (ACM)
quality_controlled: '1'
status: public
title: Multi-FPGA Designs and Scaling of HPC Challenge Benchmarks via MPI and Circuit-Switched
Inter-FPGA Networks
type: journal_article
user_id: '24135'
year: '2023'
...
---
_id: '27364'
author:
- first_name: Marius
full_name: Meyer, Marius
id: '40778'
last_name: Meyer
- first_name: Tobias
full_name: Kenter, Tobias
id: '3145'
last_name: Kenter
- first_name: Christian
full_name: Plessl, Christian
id: '16153'
last_name: Plessl
orcid: 0000-0001-5728-9982
citation:
ama: Meyer M, Kenter T, Plessl C. In-depth FPGA Accelerator Performance Evaluation
with Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and
Xilinx FPGAs using OpenCL. Journal of Parallel and Distributed Computing.
Published online 2022. doi:10.1016/j.jpdc.2021.10.007
apa: Meyer, M., Kenter, T., & Plessl, C. (2022). In-depth FPGA Accelerator Performance
Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite
for Intel and Xilinx FPGAs using OpenCL. Journal of Parallel and Distributed
Computing. https://doi.org/10.1016/j.jpdc.2021.10.007
bibtex: '@article{Meyer_Kenter_Plessl_2022, title={In-depth FPGA Accelerator Performance
Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite
for Intel and Xilinx FPGAs using OpenCL}, DOI={10.1016/j.jpdc.2021.10.007},
journal={Journal of Parallel and Distributed Computing}, author={Meyer, Marius
and Kenter, Tobias and Plessl, Christian}, year={2022} }'
chicago: Meyer, Marius, Tobias Kenter, and Christian Plessl. “In-Depth FPGA Accelerator
Performance Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark
Suite for Intel and Xilinx FPGAs Using OpenCL.” Journal of Parallel and Distributed
Computing, 2022. https://doi.org/10.1016/j.jpdc.2021.10.007.
ieee: 'M. Meyer, T. Kenter, and C. Plessl, “In-depth FPGA Accelerator Performance
Evaluation with Single Node Benchmarks from the HPC Challenge Benchmark Suite
for Intel and Xilinx FPGAs using OpenCL,” Journal of Parallel and Distributed
Computing, 2022, doi: 10.1016/j.jpdc.2021.10.007.'
mla: Meyer, Marius, et al. “In-Depth FPGA Accelerator Performance Evaluation with
Single Node Benchmarks from the HPC Challenge Benchmark Suite for Intel and Xilinx
FPGAs Using OpenCL.” Journal of Parallel and Distributed Computing, 2022,
doi:10.1016/j.jpdc.2021.10.007.
short: M. Meyer, T. Kenter, C. Plessl, Journal of Parallel and Distributed Computing
(2022).
date_created: 2021-11-10T14:36:27Z
date_updated: 2023-09-26T10:26:56Z
department:
- _id: '27'
- _id: '518'
doi: 10.1016/j.jpdc.2021.10.007
language:
- iso: eng
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: Journal of Parallel and Distributed Computing
publication_identifier:
issn:
- 0743-7315
publication_status: published
quality_controlled: '1'
status: public
title: In-depth FPGA Accelerator Performance Evaluation with Single Node Benchmarks
from the HPC Challenge Benchmark Suite for Intel and Xilinx FPGAs using OpenCL
type: journal_article
user_id: '15278'
year: '2022'
...
---
_id: '9980'
abstract:
- lang: eng
text: Die Erfindung betrifft ein Gerät mit wenigstens einem elastisch verformbaren
Bauteil als Strukturteil und/oder Lagerteil, auf das im Betriebsverlauf von wechselnden
Betriebszuständen abhängige, unterschiedliche Verformungskräfte einwirken, die
zu einem die Bauteilnutzungsdauer begrenzenden Bauteilverschleiß führen, und mit
einer Einrichtung zur Bestimmung der Bauteilnutzungsdauer und einer verschleißbedingten
Bauteil-Restnutzungsdauer. Erfindungsgemäß wird ein sich zeitversetzt wiederholender,
jeweils gleicher Betriebszustand vorbestimmt, dem eine jeweils gleiche, periodisch
wirkende Verformungskraft zugeordnet ist, durch die das elastisch verformbare
Bauteilmaterial periodisch verformt wird, wobei durch Walkarbeit ein Energieeintrag
mit einem messbaren Temperaturanstieg im Vergleich zu einer Umgebungstemperatur
erfolgt und wobei der jeweilige Temperaturanstieg als Kenngröße im Verlauf einer
Bauteilnutzungsdauer entsprechend einer abnehmenden Bauteilsteifigkeit größer
wird. Ein solcher vorbestimmter Betriebszustand wird jeweils von einer Messund
Auswerteeinheit erkannt und ein Messvorgang durch ein Startsignal selbsttätig
gestartet, wobei mit wenigstens einem bauteilzugeordneten Temperatursensor, der
aktuelle Temperaturanstieg im Vergleich zur Umgebungstemperatur als Kenngröße
für eine aktuelle Bauteilsteifigkeit gemessen und jeweils in einer Messkurve gespeichert
und verglichen wird.
application_date: 02.02.2017
application_number: 10 2017 000 926.0
author:
- first_name: Kai
full_name: Reinke, Kai
last_name: Reinke
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
citation:
ama: 'Reinke K, Bender A, Meyer T, Sextro W, Kimotho JK. Patent DE 10 2017 000 926
B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere einem
Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns einer
verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung
der Bauteil-Restnutzungsdauer. Published online 2022.'
apa: 'Reinke, K., Bender, A., Meyer, T., Sextro, W., & Kimotho, J. K. (2022).
Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren
Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung
des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren
zur Bestimmung der Bauteil-Restnutzungsdauer.'
bibtex: '@article{Reinke_Bender_Meyer_Sextro_Kimotho_2022, title={Patent DE 10 2017
000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil, insbesondere
einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung des Beginns
einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren zur Bestimmung
der Bauteil-Restnutzungsdauer.}, author={Reinke, Kai and Bender, Amelie and Meyer,
Tobias and Sextro, Walter and Kimotho, James Kuria}, year={2022} }'
chicago: 'Reinke, Kai, Amelie Bender, Tobias Meyer, Walter Sextro, and James Kuria
Kimotho. “Patent DE 10 2017 000 926 B4: Gerät Mit Wenigstens Einem Elastisch Verformbaren
Bauteil, Insbesondere Einem Gummi-Metall-Lager Und Mit Einer Einrichtung Zur Feststellung
Des Beginns Einer Verschleißbedingten Bauteil-Restnutzungsdauer, Sowie Verfahren
Zur Bestimmung Der Bauteil-Restnutzungsdauer.,” 2022.'
ieee: 'K. Reinke, A. Bender, T. Meyer, W. Sextro, and J. K. Kimotho, “Patent DE
10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren Bauteil,
insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung
des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren
zur Bestimmung der Bauteil-Restnutzungsdauer.” 2022.'
mla: 'Reinke, Kai, et al. Patent DE 10 2017 000 926 B4: Gerät Mit Wenigstens
Einem Elastisch Verformbaren Bauteil, Insbesondere Einem Gummi-Metall-Lager Und
Mit Einer Einrichtung Zur Feststellung Des Beginns Einer Verschleißbedingten Bauteil-Restnutzungsdauer,
Sowie Verfahren Zur Bestimmung Der Bauteil-Restnutzungsdauer. 2022.'
short: K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2022).
date_created: 2019-05-27T09:44:22Z
date_updated: 2023-09-28T09:48:38Z
ddc:
- '620'
department:
- _id: '151'
file:
- access_level: closed
content_type: application/pdf
creator: ekubi
date_created: 2022-09-07T05:04:49Z
date_updated: 2022-09-07T05:04:49Z
file_id: '33276'
file_name: DE102017000926B4_1.pdf
file_size: 244882
relation: main_file
success: 1
file_date_updated: 2022-09-07T05:04:49Z
has_accepted_license: '1'
ipc: G01M 7/00 (2006.01)
ipn: 'DE: 10 2017 000 926 B4 '
page: '1'
publication_date: 31.03.2022
status: public
title: 'Patent DE 10 2017 000 926 B4: Gerät mit wenigstens einem elastisch verformbaren
Bauteil, insbesondere einem Gummi-Metall-Lager und mit einer Einrichtung zur Feststellung
des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer, sowie Verfahren
zur Bestimmung der Bauteil-Restnutzungsdauer.'
type: patent
user_id: '210'
year: '2022'
...
---
_id: '21632'
abstract:
- lang: eng
text: FPGAs have found increasing adoption in data center applications since a new
generation of high-level tools have become available which noticeably reduce development
time for FPGA accelerators and still provide high-quality results. There is, however,
no high-level benchmark suite available, which specifically enables a comparison
of FPGA architectures, programming tools, and libraries for HPC applications.
To fill this gap, we have developed an OpenCL-based open-source implementation
of the HPCC benchmark suite for Xilinx and Intel FPGAs. This benchmark can serve
to analyze the current capabilities of FPGA devices, cards, and development tool
flows, track progress over time, and point out specific difficulties for FPGA
acceleration in the HPC domain. Additionally, the benchmark documents proven performance
optimization patterns. We will continue optimizing and porting the benchmark for
new generations of FPGAs and design tools and encourage active participation to
create a valuable tool for the community. To fill this gap, we have developed
an OpenCL-based open-source implementation of the HPCC benchmark suite for Xilinx
and Intel FPGAs. This benchmark can serve to analyze the current capabilities
of FPGA devices, cards, and development tool flows, track progress over time,
and point out specific difficulties for FPGA acceleration in the HPC domain. Additionally,
the benchmark documents proven performance optimization patterns. We will continue
optimizing and porting the benchmark for new generations of FPGAs and design tools
and encourage active participation to create a valuable tool for the community.
author:
- first_name: Marius
full_name: Meyer, Marius
id: '40778'
last_name: Meyer
- first_name: Tobias
full_name: Kenter, Tobias
id: '3145'
last_name: Kenter
- first_name: Christian
full_name: Plessl, Christian
id: '16153'
last_name: Plessl
orcid: 0000-0001-5728-9982
citation:
ama: 'Meyer M, Kenter T, Plessl C. Evaluating FPGA Accelerator Performance with
a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark
Suite. In: 2020 IEEE/ACM International Workshop on Heterogeneous High-Performance
Reconfigurable Computing (H2RC). ; 2020. doi:10.1109/h2rc51942.2020.00007'
apa: Meyer, M., Kenter, T., & Plessl, C. (2020). Evaluating FPGA Accelerator
Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the
HPCChallenge Benchmark Suite. 2020 IEEE/ACM International Workshop on Heterogeneous
High-Performance Reconfigurable Computing (H2RC). https://doi.org/10.1109/h2rc51942.2020.00007
bibtex: '@inproceedings{Meyer_Kenter_Plessl_2020, title={Evaluating FPGA Accelerator
Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the
HPCChallenge Benchmark Suite}, DOI={10.1109/h2rc51942.2020.00007},
booktitle={2020 IEEE/ACM International Workshop on Heterogeneous High-performance
Reconfigurable Computing (H2RC)}, author={Meyer, Marius and Kenter, Tobias and
Plessl, Christian}, year={2020} }'
chicago: Meyer, Marius, Tobias Kenter, and Christian Plessl. “Evaluating FPGA Accelerator
Performance with a Parameterized OpenCL Adaptation of Selected Benchmarks of the
HPCChallenge Benchmark Suite.” In 2020 IEEE/ACM International Workshop on Heterogeneous
High-Performance Reconfigurable Computing (H2RC), 2020. https://doi.org/10.1109/h2rc51942.2020.00007.
ieee: 'M. Meyer, T. Kenter, and C. Plessl, “Evaluating FPGA Accelerator Performance
with a Parameterized OpenCL Adaptation of Selected Benchmarks of the HPCChallenge
Benchmark Suite,” 2020, doi: 10.1109/h2rc51942.2020.00007.'
mla: Meyer, Marius, et al. “Evaluating FPGA Accelerator Performance with a Parameterized
OpenCL Adaptation of Selected Benchmarks of the HPCChallenge Benchmark Suite.”
2020 IEEE/ACM International Workshop on Heterogeneous High-Performance Reconfigurable
Computing (H2RC), 2020, doi:10.1109/h2rc51942.2020.00007.
short: 'M. Meyer, T. Kenter, C. Plessl, in: 2020 IEEE/ACM International Workshop
on Heterogeneous High-Performance Reconfigurable Computing (H2RC), 2020.'
date_created: 2021-04-16T10:17:22Z
date_updated: 2023-09-26T11:42:53Z
department:
- _id: '27'
- _id: '518'
doi: 10.1109/h2rc51942.2020.00007
keyword:
- FPGA
- OpenCL
- High Level Synthesis
- HPC benchmarking
language:
- iso: eng
main_file_link:
- url: https://ieeexplore.ieee.org/document/9306963
project:
- _id: '52'
name: Computing Resources Provided by the Paderborn Center for Parallel Computing
publication: 2020 IEEE/ACM International Workshop on Heterogeneous High-performance
Reconfigurable Computing (H2RC)
publication_identifier:
isbn:
- '9781665415927'
publication_status: published
quality_controlled: '1'
related_material:
link:
- description: Official repository of the benchmark suite on GitHub
relation: supplementary_material
url: https://github.com/pc2/HPCC_FPGA
status: public
title: Evaluating FPGA Accelerator Performance with a Parameterized OpenCL Adaptation
of Selected Benchmarks of the HPCChallenge Benchmark Suite
type: conference
user_id: '15278'
year: '2020'
...
---
_id: '9981'
abstract:
- lang: ger
text: Die Erfindung betrifft ein Gerät mit wenigstens einem elastisch verformbaren
Bauteil als Strukturteil und/oder Lagerteil, auf das im Betriebsverlauf von wechselnden
Betriebszuständen abhängige, unterschiedliche Verformungskräfte einwirken, die
zu einem die Bauteilnutzungsdauer begrenzenden Bauteilverschleiß führen, und mit
einer Einrichtung zur Bestimmung der Bauteilnutzungsdauer und einer verschleißbedingten
Bauteil-Restnutzungsdauer. Erfindungsgemäß wird ein sich zeitversetzt wiederholender,
jeweils gleicher Betriebszustand vorbestimmt, dem eine jeweils gleiche Verformungskraft
zugeordnet ist, durch die das elastisch verformbare Bauteilmaterial verformt wird.
Ein solcher vorbestimmter Betriebszustand wird jeweils von einer Mess- und Auswerteeinheit
erkannt und ein Messvorgang durch ein Startsignal selbsttätig gestartet, wobei
mit wenigstens einem bauteilzugeordneten Beschleunigungssensor, die aktuelle Beschleunigung
der Verformung oder daraus abgeleitete Kennwerte als Kenngröße für eine aktuelle
Bauteilsteifigkeit gemessen und jeweils in einer Messkurve gespeichert und verglichen
wird.
application_date: 01.02.2018
application_number: '18154730.8'
author:
- first_name: Kai
full_name: Reinke, Kai
last_name: Reinke
- first_name: Amelie
full_name: Bender, Amelie
id: '54290'
last_name: Bender
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
citation:
ama: 'Reinke K, Bender A, Meyer T, Sextro W, Kimotho JK. Patent EP 3 358 332 B1:
Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer
eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines
Geräts. Published online 2020.'
apa: 'Reinke, K., Bender, A., Meyer, T., Sextro, W., & Kimotho, J. K. (2020).
Patent EP 3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten
Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil
und/oder Lagerteil eines Geräts.'
bibtex: '@article{Reinke_Bender_Meyer_Sextro_Kimotho_2020, title={Patent EP 3 358
332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer
eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines
Geräts.}, author={Reinke, Kai and Bender, Amelie and Meyer, Tobias and Sextro,
Walter and Kimotho, James Kuria}, year={2020} }'
chicago: 'Reinke, Kai, Amelie Bender, Tobias Meyer, Walter Sextro, and James Kuria
Kimotho. “Patent EP 3 358 332 B1: Verfahren Zur Bestimmung Des Beginns Einer Verschleißbedingten
Bauteil-Restnutzungsdauer Eines Elastisch Verformbaren Bauteils, Als Strukturteil
Und/Oder Lagerteil Eines Geräts.,” 2020.'
ieee: 'K. Reinke, A. Bender, T. Meyer, W. Sextro, and J. K. Kimotho, “Patent EP
3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten Bauteil-Restnutzungsdauer
eines elastisch verformbaren Bauteils, als Strukturteil und/oder Lagerteil eines
Geräts.” 2020.'
mla: 'Reinke, Kai, et al. Patent EP 3 358 332 B1: Verfahren Zur Bestimmung Des
Beginns Einer Verschleißbedingten Bauteil-Restnutzungsdauer Eines Elastisch Verformbaren
Bauteils, Als Strukturteil Und/Oder Lagerteil Eines Geräts. 2020.'
short: K. Reinke, A. Bender, T. Meyer, W. Sextro, J.K. Kimotho, (2020).
date_created: 2019-05-27T09:46:54Z
date_updated: 2023-09-28T09:49:19Z
ddc:
- '620'
department:
- _id: '151'
file:
- access_level: closed
content_type: application/pdf
creator: ekubi
date_created: 2022-09-07T05:17:34Z
date_updated: 2022-09-07T05:17:34Z
file_id: '33277'
file_name: EP000003358332B1_1.pdf
file_size: 115020
relation: main_file
success: 1
file_date_updated: 2022-09-07T05:17:34Z
has_accepted_license: '1'
ipc: G01M 13/00
ipn: EP 3 358 332 B1
page: '1'
publication_date: 15.07.2020
status: public
title: 'Patent EP 3 358 332 B1: Verfahren zur Bestimmung des Beginns einer verschleißbedingten
Bauteil-Restnutzungsdauer eines elastisch verformbaren Bauteils, als Strukturteil
und/oder Lagerteil eines Geräts.'
type: patent
user_id: '210'
year: '2020'
...
---
_id: '9995'
abstract:
- lang: ger
text: Selbstoptimierung bietet die Möglichkeit der autonomen Anpassung des Systemverhaltens
an veränderliche Ziele. Dabei ist vor allem der Aspekt Zuverlässigkeit von maßgeblicher
Bedeutung, da über einen an die aktuelle Systemzuverlässigkeit angepassten Betriebspunkt
die Leistungsfähigkeit verbessert wird, während das Ausfallverhalten besser vorhersehbar
wird. Zur Anpassung des Systemverhaltens an die aktuelle Zuverlässigkeit mittels
Selbstoptimierung müssen die ersten beiden Schritte des Selbstoptimierungsprozesses
unterstützt werden. Für die Analyse der Ist-Situation ist eine Erkennung des aktuellen
Degradationszustands mittels Condition Monitoring notwendig. Zur Auswahl geeigneter
Verfahren werden bestehende Ansätze hinsichtlich ihrer Eignung klassifiziert.
Der zweite Schritt, die Bestimmung der Systemziele, wird durch eine strukturierte
Methode zum Finden verlässlichkeitsrelevanter Zielfunktionen ergänzt. Dabei werden
kritische Komponenten identifiziert, Optimierungsparameter festgelegt und die
Verlässlichkeit in Abhängigkeit des Systemverhaltens quantifiziert. Entwickler
selbstoptimierender Systeme werden somit durch geeignete Mittel bei der Implementierung
beider Schritte unterstützt. Abschließend wird der praktische Einsatz der vorgestellten
Methoden anhand zweier Beispiele gezeigt.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Meyer T, Kaul T, Kimotho JK, Sextro W. Steigerung Der Intelligenz Mechatronischer
Systeme. Vol Steigerung der Verlässlichkeit technischer Systeme. Springer
Nature Switzerland AG. Part of Springer Nature.; 2018:193-213.
apa: Meyer, T., Kaul, T., Kimotho, J. K., & Sextro, W. (2018). Steigerung
der Intelligenz mechatronischer Systeme (Vol. Steigerung der Verlässlichkeit
technischer Systeme, pp. 193–213). Springer Nature Switzerland AG. Part of Springer
Nature.
bibtex: '@book{Meyer_Kaul_Kimotho_Sextro_2018, title={Steigerung der Intelligenz
mechatronischer Systeme}, volume={Steigerung der Verlässlichkeit technischer Systeme},
publisher={Springer Nature Switzerland AG. Part of Springer Nature.}, author={Meyer,
Tobias and Kaul, Thorben and Kimotho, James Kuria and Sextro, Walter}, year={2018},
pages={193–213} }'
chicago: Meyer, Tobias, Thorben Kaul, James Kuria Kimotho, and Walter Sextro. Steigerung
Der Intelligenz Mechatronischer Systeme. Vol. Steigerung der Verlässlichkeit
technischer Systeme. Springer Nature Switzerland AG. Part of Springer Nature.,
2018.
ieee: T. Meyer, T. Kaul, J. K. Kimotho, and W. Sextro, Steigerung der Intelligenz
mechatronischer Systeme, vol. Steigerung der Verlässlichkeit technischer Systeme.
Springer Nature Switzerland AG. Part of Springer Nature., 2018, pp. 193–213.
mla: Meyer, Tobias, et al. Steigerung Der Intelligenz Mechatronischer Systeme.
Vol. Steigerung der Verlässlichkeit technischer Systeme, Springer Nature Switzerland
AG. Part of Springer Nature., 2018, pp. 193–213.
short: T. Meyer, T. Kaul, J.K. Kimotho, W. Sextro, Steigerung Der Intelligenz Mechatronischer
Systeme, Springer Nature Switzerland AG. Part of Springer Nature., 2018.
date_created: 2019-05-27T10:22:20Z
date_updated: 2019-05-27T10:23:51Z
department:
- _id: '151'
language:
- iso: eng
page: 193-213
publisher: Springer Nature Switzerland AG. Part of Springer Nature.
status: public
title: Steigerung der Intelligenz mechatronischer Systeme
type: book
user_id: '55222'
volume: Steigerung der Verlässlichkeit technischer Systeme
year: '2018'
...
---
_id: '9999'
abstract:
- lang: eng
text: Ultrasonic wire bonding is an indispensable process in the industrial manufacturing
of semiconductor devices. Copper wire is increasingly replacing the well-established
aluminium wire because of its superior electrical, thermal and mechanical properties.
Copper wire processes differ significantly from aluminium processes and are more
sensitive to disturbances, which reduces the range of parameter values suitable
for a stable process. Disturbances can be compensated by an adaption of process
parameters, but finding suitable parameters manually is difficult and time-consuming.
This paper presents a physical model of the ultrasonic wire bonding process including
the friction contact between tool and wire. This model yields novel insights into
the process. A prototype of a multi-objective optimizing bonding machine (MOBM)
is presented. It uses multi-objective optimization, based on the complete process
model, to automatically select the best operating point as a compromise of concurrent
objectives.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production
of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and
Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572'
apa: Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018).
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium
on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.).
https://doi.org/10.4071/2380-4505-2018.1.000572
bibtex: '@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572},
booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias
and Brökelmann, Michael and Sextro, Walter}, year={2018} }'
chicago: Unger, Andreas, Matthias Hunstig, Tobias Meyer, Michael Brökelmann, and
Walter Sextro. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization
– Insights, Opportunities and Challenges.” In In Proceedings of IMAPS 2018
– 51st Symposium on Microelectronics, Pasadena, CA, 2018, Vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018. https://doi.org/10.4071/2380-4505-2018.1.000572.
ieee: A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent
Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities
and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics,
Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
mla: Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective
Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS
2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018,
No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
short: 'A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings
of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.'
date_created: 2019-05-27T10:27:45Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
doi: 10.4071/2380-4505-2018.1.000572
keyword:
- wire bonding
- multi-objective optimization
- process model
- copper wire
- self-optimization
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena,
CA, 2018
quality_controlled: '1'
status: public
title: Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights,
Opportunities and Challenges
type: conference
user_id: '210'
volume: Vol. 2018, No. 1, pp. 000572-000577.
year: '2018'
...
---
_id: '9994'
abstract:
- lang: eng
text: Reliability-adaptive systems allow an adaptation of system behavior based
on current system reliability. They can extend their lifetime at the cost of lowered
performance or vice versa. This can be used to adapt failure behavior according
to a maintenance plan, thus increasing availability while using up system capability
fully. To facilitate setup, a control algorithm independent of a degradation model
is desired. A closed loop control technique for reliability based on a health
index, a measure for system degradation, is introduced. It uses self-optimization
as means to implement behavior adaptation. This is based on selecting the priorities
of objectives that the system pursues. Possible working points are computed beforehand
using model-based multiobjective optimization techniques. The controller selects
the priorities of objectives and this way balances reliability and performance.
As exemplary application, an automatically actuated single plate dry clutch is
introduced. The entire reliability control is setup and lifetime experiments are
conducted. Results show that the variance of time to failure is reduced greatly,
making the failure behavior more predictable. At the same time, the desired usable
lifetime can be extended at the cost of system performance to allow for changed
maintenance intervals. Together, these possibilities allow for greater system
usage and better planning of maintenance.
author:
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
citation:
ama: Meyer T. Optimization-Based Reliability Control of Mechatronic Systems.
Shaker; 2018.
apa: Meyer, T. (2018). Optimization-based reliability control of mechatronic
systems. Shaker.
bibtex: '@book{Meyer_2018, title={Optimization-based reliability control of mechatronic
systems}, publisher={Shaker}, author={Meyer, Tobias}, year={2018} }'
chicago: Meyer, Tobias. Optimization-Based Reliability Control of Mechatronic
Systems. Shaker, 2018.
ieee: T. Meyer, Optimization-based reliability control of mechatronic systems.
Shaker, 2018.
mla: Meyer, Tobias. Optimization-Based Reliability Control of Mechatronic Systems.
Shaker, 2018.
short: T. Meyer, Optimization-Based Reliability Control of Mechatronic Systems,
Shaker, 2018.
date_created: 2019-05-27T10:21:17Z
date_updated: 2023-09-15T12:26:09Z
department:
- _id: '151'
keyword:
- dependability
- reliability
- behavior adaptation
- self-optimization
- multiobjective optimization
- optimal control
- automotive drivetrain
- clutch system
- reliability-adaptive system
language:
- iso: eng
publisher: Shaker
status: public
title: Optimization-based reliability control of mechatronic systems
type: dissertation
user_id: '210'
year: '2018'
...
---
_id: '56249'
author:
- first_name: Yael
full_name: Fleischmann, Yael
last_name: Fleischmann
- first_name: Leander
full_name: Kempen, Leander
last_name: Kempen
- first_name: Tobias
full_name: Mai, Tobias
last_name: Mai
- first_name: Rolf
full_name: Biehler, Rolf
id: '16274'
last_name: Biehler
citation:
ama: 'Fleischmann Y, Kempen L, Mai T, Biehler R. Die online Lernmaterialien von
studiVEMINT: Einsatzszenarien im Blended Learning Format in mathematischen Vorkursen.
In: Klinger M, Schüler-Meyer A, Wessel L, eds. Hanse-Kolloquium Zur Hochschuldidaktik
Der Mathematik. WTM-Verlag; 2018:101–116.'
apa: 'Fleischmann, Y., Kempen, L., Mai, T., & Biehler, R. (2018). Die online
Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning Format in
mathematischen Vorkursen. In M. Klinger, A. Schüler-Meyer, & L. Wessel (Eds.),
Hanse-Kolloquium zur Hochschuldidaktik der Mathematik (pp. 101–116). WTM-Verlag.'
bibtex: '@inproceedings{Fleischmann_Kempen_Mai_Biehler_2018, place={Münster}, title={Die
online Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning Format
in mathematischen Vorkursen}, booktitle={Hanse-Kolloquium zur Hochschuldidaktik
der Mathematik}, publisher={WTM-Verlag}, author={Fleischmann, Yael and Kempen,
Leander and Mai, Tobias and Biehler, Rolf}, editor={Klinger, M. and Schüler-Meyer,
A. and Wessel, L.}, year={2018}, pages={101–116} }'
chicago: 'Fleischmann, Yael, Leander Kempen, Tobias Mai, and Rolf Biehler. “Die
Online Lernmaterialien von StudiVEMINT: Einsatzszenarien Im Blended Learning Format
in Mathematischen Vorkursen.” In Hanse-Kolloquium Zur Hochschuldidaktik Der
Mathematik, edited by M. Klinger, A. Schüler-Meyer, and L. Wessel, 101–116.
Münster: WTM-Verlag, 2018.'
ieee: 'Y. Fleischmann, L. Kempen, T. Mai, and R. Biehler, “Die online Lernmaterialien
von studiVEMINT: Einsatzszenarien im Blended Learning Format in mathematischen
Vorkursen,” in Hanse-Kolloquium zur Hochschuldidaktik der Mathematik, 2018,
pp. 101–116.'
mla: 'Fleischmann, Yael, et al. “Die Online Lernmaterialien von StudiVEMINT: Einsatzszenarien
Im Blended Learning Format in Mathematischen Vorkursen.” Hanse-Kolloquium Zur
Hochschuldidaktik Der Mathematik, edited by M. Klinger et al., WTM-Verlag,
2018, pp. 101–116.'
short: 'Y. Fleischmann, L. Kempen, T. Mai, R. Biehler, in: M. Klinger, A. Schüler-Meyer,
L. Wessel (Eds.), Hanse-Kolloquium Zur Hochschuldidaktik Der Mathematik, WTM-Verlag,
Münster, 2018, pp. 101–116.'
date_created: 2024-09-25T08:20:25Z
date_updated: 2024-09-25T08:28:10Z
department:
- _id: '363'
editor:
- first_name: M.
full_name: Klinger, M.
last_name: Klinger
- first_name: A.
full_name: Schüler-Meyer, A.
last_name: Schüler-Meyer
- first_name: L.
full_name: Wessel, L.
last_name: Wessel
language:
- iso: eng
main_file_link:
- url: https://www.researchgate.net/profile/Rolf-Biehler/publication/348551970_Die_Online-Lernmaterialien_von_studiVEMINT_Einsatzszenarien_im_Blended_Learning_Format_in_mathematischen_Vorkursen/links/602286d5a6fdcc37a813a04b/Die-Online-Lernmaterialien-von-studiVEMINT-Einsatzszenarien-im-Blended-Learning-Format-in-mathematischen-Vorkursen.pdf
page: 101–116
place: Münster
publication: Hanse-Kolloquium zur Hochschuldidaktik der Mathematik
publisher: WTM-Verlag
status: public
title: 'Die online Lernmaterialien von studiVEMINT: Einsatzszenarien im Blended Learning
Format in mathematischen Vorkursen'
type: conference
user_id: '37888'
year: '2018'
...
---
_id: '9976'
abstract:
- lang: eng
text: State-of-the-art mechatronic systems offer inherent intelligence that enables
them to autonomously adapt their behavior to current environmental conditions
and to their own system state. This autonomous behavior adaptation is made possible
by software in combination with complex sensor and actuator systems and by sophisticated
information processing, all of which make these systems increasingly complex.
This increasing complexity makes the design process a challenging task and brings
new complex possibilities for operation and maintenance. However, with the risk
of increased system complexity also comes the chance to adapt system behavior
based on current reliability, which in turn increases reliability. The development
of such an adaption strategy requires appropriate methods to evaluate reliability
based on currently selected system behavior. A common approach to implement such
adaptivity is to base system behavior on different working points that are obtained
using multiobjective optimization. During operation, selection among these allows
a changed operating strategy. To allow for multiobjective optimization, an accurate
system model including system reliability is required. This model is repeatedly
evaluated by the optimization algorithm. At present, modeling of system reliability
and synchronization of the models of behavior and reliability is a laborious manual
task and thus very error-prone. Since system behavior is crucial for system reliability,
an integrated model is introduced that integrates system behavior and system reliability.
The proposed approach is used to formulate reliability-related objective functions
for a clutch test rig that are used to compute feasible working points using multiobjective
optimization.
author:
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: Kaul T, Meyer T, Sextro W. Formulation of reliability-related objective functions
for design of intelligent mechatronic systems. SAGE Journals. 2017;Vol.
231(4):390-399. doi:10.1177/1748006X17709376
apa: Kaul, T., Meyer, T., & Sextro, W. (2017). Formulation of reliability-related
objective functions for design of intelligent mechatronic systems. SAGE Journals,
Vol. 231(4), 390–399. https://doi.org/10.1177/1748006X17709376
bibtex: '@article{Kaul_Meyer_Sextro_2017, title={Formulation of reliability-related
objective functions for design of intelligent mechatronic systems}, volume={Vol.
231(4)}, DOI={10.1177/1748006X17709376},
journal={SAGE Journals}, author={Kaul, Thorben and Meyer, Tobias and Sextro, Walter},
year={2017}, pages={390–399} }'
chicago: 'Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Formulation of Reliability-Related
Objective Functions for Design of Intelligent Mechatronic Systems.” SAGE Journals
Vol. 231(4) (2017): 390–99. https://doi.org/10.1177/1748006X17709376.'
ieee: T. Kaul, T. Meyer, and W. Sextro, “Formulation of reliability-related objective
functions for design of intelligent mechatronic systems,” SAGE Journals,
vol. Vol. 231(4), pp. 390–399, 2017.
mla: Kaul, Thorben, et al. “Formulation of Reliability-Related Objective Functions
for Design of Intelligent Mechatronic Systems.” SAGE Journals, vol. Vol.
231(4), 2017, pp. 390–99, doi:10.1177/1748006X17709376.
short: T. Kaul, T. Meyer, W. Sextro, SAGE Journals Vol. 231(4) (2017) 390–399.
date_created: 2019-05-27T09:37:46Z
date_updated: 2019-09-16T10:20:49Z
department:
- _id: '151'
doi: 10.1177/1748006X17709376
keyword:
- Integrated model
- reliability
- system behavior
- Bayesian network
- multiobjective optimization
language:
- iso: eng
page: 390 - 399
publication: SAGE Journals
quality_controlled: '1'
status: public
title: Formulation of reliability-related objective functions for design of intelligent
mechatronic systems
type: journal_article
user_id: '55222'
volume: Vol. 231(4)
year: '2017'
...
---
_id: '9985'
abstract:
- lang: ger
text: Intelligente technische Systeme sind durch einen erhöhten Funktionsumfang
charakterisiert, der diese dazu befähigt, autonom auf wechselnde Umgebungsbedingungen,
Anforderungen und inhärente Systemzustände zu reagieren. Dies kann mit den Methoden
der Selbstoptimie-rung erreicht werden. Hier werden mit Verfahren der Mehrzieloptimierung
mögliche Betriebs-punkte des Systems bestimmt zwischen denen das System im Betrieb
autonom auswählt und somit eine Verhaltensadaption erwirkt. Zur Berechnung der
Betriebspunkte ist es notwendig ein Modell des Systemverhaltens aufzustellen und
das Verhalten hinsichtlich verschiedener, meist konfliktärer, Ziele zu quantifizieren.
Bei der Modellierung des Systemverhaltens und der Formulierung der Ziele stellt
die Absiche-rung der Verlässlichkeit auf Grund der zunehmenden Systemkomplexität
eine große Heraus-forderung dar, der im Entwicklungsprozess begegnet werden muss.
Die Implementierung von Selbstoptimierung bietet darüber hinaus in Kombination
mit einer Zustandsüberwachung im Betrieb die Möglichkeit einer zuverlässigkeitsbasierten
Verhaltensanpassung, deren Potential zu einer Steigerung der Verlässlichkeit genutzt
werden kann. In dieser Arbeit werden die Entwicklung intelligenter technischer
Systeme und die damit ver-bundenen notwendigen Entwicklungsschritte zur Absicherung
der Verlässlichkeit anhand von selbstoptimierenden Systemen betrachtet. Dazu gehören
die Formulierung verlässlichkeitsre-levanter Ziele und die Implementierung einer
Zustandsüberwachung als Basis für eine zuver-lässigkeitsbasierte Verhaltensanpassung.
Es werden auf Grundlage einer Beschreibung der Entwicklungsschritte, Potentiale
zur Steigerung der Verlässlichkeit sowie Chancen und zukünf-tige Herausforderungen
herausgestellt und diskutiert.
author:
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: James Kuria
full_name: Kimotho, James Kuria
last_name: Kimotho
citation:
ama: 'Sextro W, Meyer T, Kaul T, Kimotho JK. Entwicklung verlässlicher, intelligenter
Systeme. In: VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017)
- Entwicklung Und Betrieb Zuverlässiger Produkte. Leonberg; 2017:17–30.'
apa: Sextro, W., Meyer, T., Kaul, T., & Kimotho, J. K. (2017). Entwicklung verlässlicher,
intelligenter Systeme. In VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit
(TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte. (pp. 17–30).
Leonberg.
bibtex: '@inproceedings{Sextro_Meyer_Kaul_Kimotho_2017, place={Leonberg}, title={Entwicklung
verlässlicher, intelligenter Systeme}, booktitle={VDI-Berichte 2307–28. Tagung
Technische Zuverlässigkeit (TTZ 2017) - Entwicklung und Betrieb zuverlässiger
Produkte.}, author={Sextro, Walter and Meyer, Tobias and Kaul, Thorben and Kimotho,
James Kuria}, year={2017}, pages={17–30} }'
chicago: Sextro, Walter, Tobias Meyer, Thorben Kaul, and James Kuria Kimotho. “Entwicklung
Verlässlicher, Intelligenter Systeme.” In VDI-Berichte 2307–28. Tagung Technische
Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger Produkte.,
17–30. Leonberg, 2017.
ieee: W. Sextro, T. Meyer, T. Kaul, and J. K. Kimotho, “Entwicklung verlässlicher,
intelligenter Systeme,” in VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit
(TTZ 2017) - Entwicklung und Betrieb zuverlässiger Produkte., 2017, pp. 17–30.
mla: Sextro, Walter, et al. “Entwicklung Verlässlicher, Intelligenter Systeme.”
VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) - Entwicklung
Und Betrieb Zuverlässiger Produkte., 2017, pp. 17–30.
short: 'W. Sextro, T. Meyer, T. Kaul, J.K. Kimotho, in: VDI-Berichte 2307–28. Tagung
Technische Zuverlässigkeit (TTZ 2017) - Entwicklung Und Betrieb Zuverlässiger
Produkte., Leonberg, 2017, pp. 17–30.'
date_created: 2019-05-27T09:52:37Z
date_updated: 2019-09-30T09:03:57Z
department:
- _id: '151'
keyword:
- intelligente Systeme
language:
- iso: eng
page: 17–30
place: Leonberg
publication: VDI-Berichte 2307–28. Tagung Technische Zuverlässigkeit (TTZ 2017) -
Entwicklung und Betrieb zuverlässiger Produkte.
quality_controlled: '1'
status: public
title: Entwicklung verlässlicher, intelligenter Systeme
type: conference
user_id: '55222'
year: '2017'
...
---
_id: '9955'
abstract:
- lang: eng
text: Wire bonding has been an established packaging technology for decades. When
introducing copper as wire material for high power applications, adaptations to
the bonding process and to machines became necessary. Here, challenges occur due
to the stiffer wire material and changing oxide layers on the contact partners.
To achieve sufficient process stability, a clean bond area is required, which
can only be achieved with high shear stresses in the contact partners surfaces.
These necessitate high normal forces to plastically deform the wire and substrate.
To achieve such high stresses in the contact area, the bonding tool needs to be
able to transmit the needed tangential forces to the top side of the wire. The
wire itself performs a shear movement and transmits the force into the contact
area to clean the contaminant and oxide layers and to level the desired bond surfaces.
The main function of the tool is to transmit these forces. If the bond tool can
only transmit low forces in the direction of excitation, the parameter space for
a stable bond process is severely restricted. Here, a modeling approach to estimate
how well different tool shapes meet the demand of transmitting high tangential
forces is presented. The model depends on wire deformation and thus on the ultrasonic
softening effect.
author:
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
citation:
ama: 'Althoff S, Meyer T, Unger A, Sextro W, Eacock F. Shape-Dependent Transmittable
Tangential Force of Wire Bond Tools. In: IEEE 66th Electronic Components and
Technology Conference. ; 2016:2103-2110. doi:10.1109/ECTC.2016.234'
apa: Althoff, S., Meyer, T., Unger, A., Sextro, W., & Eacock, F. (2016). Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools. In IEEE 66th Electronic
Components and Technology Conference (pp. 2103–2110). https://doi.org/10.1109/ECTC.2016.234
bibtex: '@inproceedings{Althoff_Meyer_Unger_Sextro_Eacock_2016, title={Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools}, DOI={10.1109/ECTC.2016.234},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Althoff,
Simon and Meyer, Tobias and Unger, Andreas and Sextro, Walter and Eacock, Florian},
year={2016}, pages={2103–2110} }'
chicago: Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian
Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In
IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016.
https://doi.org/10.1109/ECTC.2016.234.
ieee: S. Althoff, T. Meyer, A. Unger, W. Sextro, and F. Eacock, “Shape-Dependent
Transmittable Tangential Force of Wire Bond Tools,” in IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.
mla: Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire
Bond Tools.” IEEE 66th Electronic Components and Technology Conference,
2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
short: 'S. Althoff, T. Meyer, A. Unger, W. Sextro, F. Eacock, in: IEEE 66th Electronic
Components and Technology Conference, 2016, pp. 2103–2110.'
date_created: 2019-05-27T08:47:52Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.234
keyword:
- finite element simulation
- wire bonding
- tool geometry
language:
- iso: eng
page: 2103-2110
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Shape-Dependent Transmittable Tangential Force of Wire Bond Tools
type: conference
user_id: '210'
year: '2016'
...
---
_id: '9957'
abstract:
- lang: eng
text: Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter
und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL –
Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden
Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen
herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit,
sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte
Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der
Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in
Form einer modifizierten Bondmaschine. Intelligent production of heavy copper
wire bonds It is the aim of this innovation-project to develop a self-optimization
system for ultrasonic copper wire bonding. It is part of the leading edge cluster
“it’s OWL”. The bonding machine will be able to react autonomously to changing
boundary conditions to ensure constant and reliable bonding results. For this,
the hole bonding process is modeled in great detail and newest self-optimization
techniques are utilized. A prototype-system incorporated in a serial machine is
used for evaluation.
author:
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Florian
full_name: Biermann, Florian
last_name: Biermann
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen.
wt-online. 2016;7/8:512-519.
apa: Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M.,
… Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. Wt-Online,
7/8, 512–519.
bibtex: '@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016,
title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online},
author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff,
Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth,
Karsten}, year={2016}, pages={512–519} }'
chicago: 'Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter
Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen
Intelligent Herstellen.” Wt-Online 7/8 (2016): 512–19.'
ieee: M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,”
wt-online, vol. 7/8, pp. 512–519, 2016.
mla: Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.”
Wt-Online, vol. 7/8, 2016, pp. 512–19.
short: M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F.
Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.
date_created: 2019-05-27T08:53:18Z
date_updated: 2020-05-07T05:33:52Z
department:
- _id: '151'
language:
- iso: eng
page: 512-519
popular_science: '1'
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: wt-online
status: public
title: Kupferbondverbindungen intelligent herstellen
type: journal_article
user_id: '210'
volume: 7/8
year: '2016'
...
---
_id: '9961'
abstract:
- lang: eng
text: Redundancy is a common approach to improve system reliability, availability
and safety in technical systems. It is achieved by adding functionally equivalent
elements that enable the system to remain operational even though one or more
of those elements fail. This paper begins with an overview on the various terminologies
and methods for redundancy concepts that can be modeled sufficiently using established
reliability analysis methods. However, these approaches yield very complex system
models, which limits their applicability. In current research, Bayesian Networks
(BNs), especially Dynamic Bayesian Networks (DBNs) have been successfully used
for reliability analysis because of their benefits in modeling complex systems
and in representing multi-state variables. However, these approaches lack appropriate
methods to model all commonly used redundancy concepts. To overcome this limitation,
three different modeling approaches based on BNs and DBNs are described in this
paper. Addressing those approaches, the benefits and limitations of BNs and DBNs
for modeling reliability of redundant technical systems are discussed and evaluated.
author:
- first_name: Thorben
full_name: Kaul, Thorben
id: '14802'
last_name: Kaul
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Kaul T, Meyer T, Sextro W. Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks. In: Proceedings of the Third European Conference of
the Prognostics and Health Management Society 2016. ; 2016.'
apa: Kaul, T., Meyer, T., & Sextro, W. (2016). Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks. In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016.
bibtex: '@inproceedings{Kaul_Meyer_Sextro_2016, title={Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks}, booktitle={Proceedings of the Third
European Conference of the Prognostics and Health Management Society 2016}, author={Kaul,
Thorben and Meyer, Tobias and Sextro, Walter}, year={2016} }'
chicago: Kaul, Thorben, Tobias Meyer, and Walter Sextro. “Modeling of Complex Redundancy
in Technical Systems with Bayesian Networks.” In Proceedings of the Third European
Conference of the Prognostics and Health Management Society 2016, 2016.
ieee: T. Kaul, T. Meyer, and W. Sextro, “Modeling of Complex Redundancy in Technical
Systems with Bayesian Networks,” in Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.
mla: Kaul, Thorben, et al. “Modeling of Complex Redundancy in Technical Systems
with Bayesian Networks.” Proceedings of the Third European Conference of the
Prognostics and Health Management Society 2016, 2016.
short: 'T. Kaul, T. Meyer, W. Sextro, in: Proceedings of the Third European Conference
of the Prognostics and Health Management Society 2016, 2016.'
date_created: 2019-05-27T09:10:07Z
date_updated: 2019-09-30T08:05:55Z
department:
- _id: '151'
language:
- iso: eng
publication: Proceedings of the Third European Conference of the Prognostics and Health
Management Society 2016
quality_controlled: '1'
status: public
title: Modeling of Complex Redundancy in Technical Systems with Bayesian Networks
type: conference
user_id: '55222'
year: '2016'
...
---
_id: '9966'
abstract:
- lang: eng
text: Usage of copper wire bonds allows to push power boundaries imposed by aluminum
wire bonds. Copper allows higher electrical, thermal and mechanical loads than
aluminum, which currently is the most commonly used material in heavy wire bonding.
This is the main driving factor for increased usage of copper in high power applications
such as wind turbines, locomotives or electric vehicles. At the same time, usage
of copper also increases tool wear and reduces the range of parameter values for
a stable process, making the process more challenging. To overcome these drawbacks,
parameter adaptation at runtime using self-optimization is desired. A self-optimizing
system is based on system objectives that evaluate and quantify system performance.
System parameters can be changed at runtime such that pre-selected objective values
are reached. For adaptation of bond process parameters, model-based self-optimization
is employed. Since it is based on a model of the system, the bond process was
modeled. In addition to static model parameters such as wire and substrate material
properties and vibration characteristics of transducer and tool, variable model
inputs are process parameters. Main simulation result is bonded area in the wiresubstrate
contact. This model is then used to find valid and optimal working points before
operation. The working point is composed of normal force and ultrasonic voltage
trajectories, which are usually determined experimentally. Instead, multiobjective
optimalization is used to compute trajectories that simultaneously optimize bond
quality, process duration, tool wear and probability of tool-substrate contacts.
The values of these objectives are computed using the process model. At runtime,
selection among pre-determined optimal working points is sufficient to prioritize
individual objectives. This way, the computationally expensive process of numerically
solving a multiobjective optimal control problem and the demanding high speed
bonding process are separated. To evaluate to what extent the pre-defined goals
of self-optimization are met, an offthe- shelf heavy wire bonding machine was
modified to allow for parameter adaptation and for transmitting of measurement
data at runtime. This data is received by an external computer system and evaluated
to select a new working point. Then, new process parameters are sent to the modified
bonding machine for use for subsequent bonds. With these components, a full self-optimizing
system has been implemented.
author:
- first_name: Tobias
full_name: Meyer , Tobias
last_name: 'Meyer '
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper
Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components
and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215'
apa: Meyer , T., Unger, A., Althoff, S., Sextro, W., Brökelmann, M., Hunstig, M.,
& Guth, K. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation. In IEEE 66th Electronic Components and Technology
Conference (pp. 622–628). https://doi.org/10.1109/ECTC.2016.215
bibtex: '@inproceedings{Meyer _Unger_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
title={Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter
Adaptation}, DOI={10.1109/ECTC.2016.215},
booktitle={IEEE 66th Electronic Components and Technology Conference}, author={Meyer
, Tobias and Unger, Andreas and Althoff, Simon and Sextro, Walter and Brökelmann,
Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={622–628}
}'
chicago: Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann,
Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire
Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components
and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
ieee: T. Meyer et al., “Reliable Manufacturing of Heavy Copper Wire Bonds
Using Online Parameter Adaptation,” in IEEE 66th Electronic Components and
Technology Conference, 2016, pp. 622–628.
mla: Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using
Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology
Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
short: 'T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K.
Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp.
622–628.'
date_created: 2019-05-27T09:17:26Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
doi: 10.1109/ECTC.2016.215
keyword:
- Self-optimization
- adaptive system
- bond process
- copper wire
language:
- iso: eng
page: 622-628
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE 66th Electronic Components and Technology Conference
quality_controlled: '1'
status: public
title: Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
type: conference
user_id: '210'
year: '2016'
...