Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen

Project Period: 2016-04-01 – 2019-03-31
Acronym
HoLeiB
Coordinator
Michael Brökelmann
Principal Investigator
Walter Sextro
Member
Simon Althoff, Michael Brökelmann, Collin Dymel, Florian Eacock, Paul Eichwald, Tobias Hemsel, Matthias Hunstig, Reinhard Schemmel, Frank Schulte, Karsten Guth, Andreas Unger
Department(s)
Lehrstuhl für Dynamik und Mechatronik (LDM)
Grant Number
Funding Organisation
EFRE.NRW
Cooperator
Hesse Mechatronics GmbH
Infineon Technologies AG

5 Publications

2018 | Conference Paper | LibreCat-ID: 9993
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, M. Hunstig, in: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
 
2019 | Journal Article | LibreCat-ID: 10334
Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.
LibreCat | DOI
 
2017 | Journal Article | LibreCat-ID: 9973
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
LibreCat
 
2018 | Conference Paper | LibreCat-ID: 9992
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process
C. Dymel, P. Eichwald, R. Schemmel, T. Hemsel, M. Brökelmann, M. Hunstig, W. Sextro, in: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
 
2018 | Conference Paper | LibreCat-ID: 9997
Effects of different working frequencies on the joint formation in copper wire bonding
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, in: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.
LibreCat