Heat flow, transport and fluctuations in etched semiconductor quantum wire structures
C. Riha, O. Chiatti, S.S. Buchholz, D. Reuter, A.D. Wieck, S.F. Fischer, Physica Status Solidi (A) 213 (2016) 571–581.
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Journal Article
| Published
| English
Author
Riha, Christian;
Chiatti, Olivio;
Buchholz, Sven S.;
Reuter, DirkLibreCat;
Wieck, Andreas D.;
Fischer, Saskia F.
Publishing Year
Journal Title
physica status solidi (a)
Volume
213
Issue
3
Page
571-581
ISSN
LibreCat-ID
Cite this
Riha C, Chiatti O, Buchholz SS, Reuter D, Wieck AD, Fischer SF. Heat flow, transport and fluctuations in etched semiconductor quantum wire structures. physica status solidi (a). 2016;213(3):571-581. doi:10.1002/pssa.201532551
Riha, C., Chiatti, O., Buchholz, S. S., Reuter, D., Wieck, A. D., & Fischer, S. F. (2016). Heat flow, transport and fluctuations in etched semiconductor quantum wire structures. Physica Status Solidi (A), 213(3), 571–581. https://doi.org/10.1002/pssa.201532551
@article{Riha_Chiatti_Buchholz_Reuter_Wieck_Fischer_2016, title={Heat flow, transport and fluctuations in etched semiconductor quantum wire structures}, volume={213}, DOI={10.1002/pssa.201532551}, number={3}, journal={physica status solidi (a)}, publisher={Wiley}, author={Riha, Christian and Chiatti, Olivio and Buchholz, Sven S. and Reuter, Dirk and Wieck, Andreas D. and Fischer, Saskia F.}, year={2016}, pages={571–581} }
Riha, Christian, Olivio Chiatti, Sven S. Buchholz, Dirk Reuter, Andreas D. Wieck, and Saskia F. Fischer. “Heat Flow, Transport and Fluctuations in Etched Semiconductor Quantum Wire Structures.” Physica Status Solidi (A) 213, no. 3 (2016): 571–81. https://doi.org/10.1002/pssa.201532551.
C. Riha, O. Chiatti, S. S. Buchholz, D. Reuter, A. D. Wieck, and S. F. Fischer, “Heat flow, transport and fluctuations in etched semiconductor quantum wire structures,” physica status solidi (a), vol. 213, no. 3, pp. 571–581, 2016.
Riha, Christian, et al. “Heat Flow, Transport and Fluctuations in Etched Semiconductor Quantum Wire Structures.” Physica Status Solidi (A), vol. 213, no. 3, Wiley, 2016, pp. 571–81, doi:10.1002/pssa.201532551.
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