{"language":[{"iso":"eng"}],"type":"journal_article","date_updated":"2023-09-21T14:12:15Z","publication":"Sensors and Actuators A: Physical","author":[{"first_name":"Reinhard","full_name":"Schemmel, Reinhard","last_name":"Schemmel","id":"28647"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"first_name":"Collin","last_name":"Dymel","id":"66833","full_name":"Dymel, Collin"},{"first_name":"Matthias","last_name":"Hunstig","full_name":"Hunstig, Matthias"},{"full_name":"Brökelmann, Michael","last_name":"Brökelmann","first_name":"Michael"},{"id":"21220","last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"}],"year":"2019","status":"public","intvolume":"       295","user_id":"210","citation":{"mla":"Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i>, vol. 295, 2019, pp. 653–62, doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","bibtex":"@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }","ama":"Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>. 2019;295:653-662. doi:<a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>","ieee":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” <i>Sensors and Actuators A: Physical</i>, vol. 295, pp. 653–662, 2019, doi: <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">10.1016/j.sna.2019.04.025</a>.","chicago":"Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” <i>Sensors and Actuators A: Physical</i> 295 (2019): 653–62. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>.","short":"R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, W. Sextro, Sensors and Actuators A: Physical 295 (2019) 653–662.","apa":"Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., &#38; Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. <i>Sensors and Actuators A: Physical</i>, <i>295</i>, 653–662. <a href=\"https://doi.org/10.1016/j.sna.2019.04.025\">https://doi.org/10.1016/j.sna.2019.04.025</a>"},"volume":295,"_id":"10334","title":"Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding","publication_identifier":{"issn":["0924-4247"]},"department":[{"_id":"151"}],"page":"653 - 662","doi":"10.1016/j.sna.2019.04.025","abstract":[{"text":"Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.","lang":"eng"}],"quality_controlled":"1","project":[{"name":"Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen","_id":"93","grant_number":"MP-1-1-015"}],"date_created":"2019-07-01T07:32:07Z","keyword":["Ultrasonic bonding","Ultrasonic welding","Multi-dimensional bonding","Complex vibration","Multi-frequent","Two-dimensional friction model"]}