{"doi":"10.1109/ats.2018.00028","publication":"27th IEEE Asian Test Symposium (ATS'18)","type":"conference","date_updated":"2022-05-11T17:11:53Z","language":[{"iso":"eng"}],"publication_status":"published","publication_identifier":{"isbn":["9781538694664"]},"department":[{"_id":"48"}],"_id":"10575","title":"Extending Aging Monitors for Early Life and Wear-Out Failure Prevention","citation":{"ieee":"C. Liu, E. Schneider, M. Kampmann, S. Hellebrand, and H.-J. Wunderlich, “Extending Aging Monitors for Early Life and Wear-Out Failure Prevention,” 2018, doi: <a href=\"https://doi.org/10.1109/ats.2018.00028\">10.1109/ats.2018.00028</a>.","ama":"Liu C, Schneider E, Kampmann M, Hellebrand S, Wunderlich H-J. Extending Aging Monitors for Early Life and Wear-Out Failure Prevention. In: <i>27th IEEE Asian Test Symposium (ATS’18)</i>. ; 2018. doi:<a href=\"https://doi.org/10.1109/ats.2018.00028\">10.1109/ats.2018.00028</a>","mla":"Liu, Chang, et al. “Extending Aging Monitors for Early Life and Wear-Out Failure Prevention.” <i>27th IEEE Asian Test Symposium (ATS’18)</i>, 2018, doi:<a href=\"https://doi.org/10.1109/ats.2018.00028\">10.1109/ats.2018.00028</a>.","apa":"Liu, C., Schneider, E., Kampmann, M., Hellebrand, S., &#38; Wunderlich, H.-J. (2018). Extending Aging Monitors for Early Life and Wear-Out Failure Prevention. <i>27th IEEE Asian Test Symposium (ATS’18)</i>. <a href=\"https://doi.org/10.1109/ats.2018.00028\">https://doi.org/10.1109/ats.2018.00028</a>","bibtex":"@inproceedings{Liu_Schneider_Kampmann_Hellebrand_Wunderlich_2018, title={Extending Aging Monitors for Early Life and Wear-Out Failure Prevention}, DOI={<a href=\"https://doi.org/10.1109/ats.2018.00028\">10.1109/ats.2018.00028</a>}, booktitle={27th IEEE Asian Test Symposium (ATS’18)}, author={Liu, Chang and Schneider, Eric and Kampmann, Matthias and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2018} }","chicago":"Liu, Chang, Eric Schneider, Matthias Kampmann, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Extending Aging Monitors for Early Life and Wear-Out Failure Prevention.” In <i>27th IEEE Asian Test Symposium (ATS’18)</i>, 2018. <a href=\"https://doi.org/10.1109/ats.2018.00028\">https://doi.org/10.1109/ats.2018.00028</a>.","short":"C. Liu, E. Schneider, M. Kampmann, S. Hellebrand, H.-J. Wunderlich, in: 27th IEEE Asian Test Symposium (ATS’18), 2018."},"user_id":"209","date_created":"2019-07-05T08:14:58Z","status":"public","year":"2018","author":[{"last_name":"Liu","full_name":"Liu, Chang","first_name":"Chang"},{"last_name":"Schneider","full_name":"Schneider, Eric","first_name":"Eric"},{"first_name":"Matthias","last_name":"Kampmann","id":"10935","full_name":"Kampmann, Matthias"},{"first_name":"Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","id":"209","full_name":"Hellebrand, Sybille"},{"full_name":"Wunderlich, Hans-Joachim","last_name":"Wunderlich","first_name":"Hans-Joachim"}]}