{"_id":"10576","doi":"10.1109/ddecs.2017.7934564","date_created":"2019-07-05T08:23:56Z","publication":"20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS'17)","type":"conference","title":"Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test","department":[{"_id":"48"}],"author":[{"last_name":"Kampmann","full_name":"Kampmann, Matthias","id":"10935","first_name":"Matthias"},{"full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","last_name":"Hellebrand","first_name":"Sybille","id":"209"}],"user_id":"209","publication_status":"published","publisher":"IEEE","date_updated":"2022-05-11T17:14:51Z","year":"2017","citation":{"short":"M. Kampmann, S. Hellebrand, in: 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17), IEEE, 2017.","apa":"Kampmann, M., & Hellebrand, S. (2017). Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). https://doi.org/10.1109/ddecs.2017.7934564","ama":"Kampmann M, Hellebrand S. Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. In: 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). IEEE; 2017. doi:10.1109/ddecs.2017.7934564","ieee":"M. Kampmann and S. Hellebrand, “Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test,” 2017, doi: 10.1109/ddecs.2017.7934564.","bibtex":"@inproceedings{Kampmann_Hellebrand_2017, title={Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test}, DOI={10.1109/ddecs.2017.7934564}, booktitle={20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17)}, publisher={IEEE}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2017} }","mla":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17), IEEE, 2017, doi:10.1109/ddecs.2017.7934564.","chicago":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” In 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). IEEE, 2017. https://doi.org/10.1109/ddecs.2017.7934564."},"publication_identifier":{"isbn":["9781538604724"]},"language":[{"iso":"eng"}],"status":"public"}