{"department":[{"_id":"48"}],"citation":{"short":"M. Kampmann, S. Hellebrand, in: 20th IEEE International Symposium on Design &#38; Diagnostics of Electronic Circuits &#38; Systems (DDECS’17), IEEE, 2017.","bibtex":"@inproceedings{Kampmann_Hellebrand_2017, title={Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test}, DOI={<a href=\"https://doi.org/10.1109/ddecs.2017.7934564\">10.1109/ddecs.2017.7934564</a>}, booktitle={20th IEEE International Symposium on Design &#38; Diagnostics of Electronic Circuits &#38; Systems (DDECS’17)}, publisher={IEEE}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2017} }","ieee":"M. Kampmann and S. Hellebrand, “Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test,” 2017, doi: <a href=\"https://doi.org/10.1109/ddecs.2017.7934564\">10.1109/ddecs.2017.7934564</a>.","ama":"Kampmann M, Hellebrand S. Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. In: <i>20th IEEE International Symposium on Design &#38; Diagnostics of Electronic Circuits &#38; Systems (DDECS’17)</i>. IEEE; 2017. doi:<a href=\"https://doi.org/10.1109/ddecs.2017.7934564\">10.1109/ddecs.2017.7934564</a>","mla":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” <i>20th IEEE International Symposium on Design &#38; Diagnostics of Electronic Circuits &#38; Systems (DDECS’17)</i>, IEEE, 2017, doi:<a href=\"https://doi.org/10.1109/ddecs.2017.7934564\">10.1109/ddecs.2017.7934564</a>.","chicago":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” In <i>20th IEEE International Symposium on Design &#38; Diagnostics of Electronic Circuits &#38; Systems (DDECS’17)</i>. IEEE, 2017. <a href=\"https://doi.org/10.1109/ddecs.2017.7934564\">https://doi.org/10.1109/ddecs.2017.7934564</a>.","apa":"Kampmann, M., &#38; Hellebrand, S. (2017). Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. <i>20th IEEE International Symposium on Design &#38; Diagnostics of Electronic Circuits &#38; Systems (DDECS’17)</i>. <a href=\"https://doi.org/10.1109/ddecs.2017.7934564\">https://doi.org/10.1109/ddecs.2017.7934564</a>"},"type":"conference","publisher":"IEEE","publication_identifier":{"isbn":["9781538604724"]},"user_id":"209","year":"2017","author":[{"id":"10935","first_name":"Matthias","full_name":"Kampmann, Matthias","last_name":"Kampmann"},{"last_name":"Hellebrand","full_name":"Hellebrand, Sybille","first_name":"Sybille","id":"209","orcid":"0000-0002-3717-3939"}],"status":"public","_id":"10576","publication_status":"published","doi":"10.1109/ddecs.2017.7934564","date_created":"2019-07-05T08:23:56Z","publication":"20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS'17)","title":"Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test","date_updated":"2022-05-11T17:14:51Z","language":[{"iso":"eng"}]}