{"publication_identifier":{"isbn":["9781538604724"]},"author":[{"full_name":"Kampmann, Matthias","first_name":"Matthias","last_name":"Kampmann","id":"10935"},{"orcid":"0000-0002-3717-3939","last_name":"Hellebrand","first_name":"Sybille","full_name":"Hellebrand, Sybille","id":"209"}],"year":"2017","title":"Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test","status":"public","date_updated":"2022-05-11T17:14:51Z","publication_status":"published","_id":"10576","language":[{"iso":"eng"}],"publisher":"IEEE","doi":"10.1109/ddecs.2017.7934564","user_id":"209","citation":{"mla":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17), IEEE, 2017, doi:10.1109/ddecs.2017.7934564.","bibtex":"@inproceedings{Kampmann_Hellebrand_2017, title={Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test}, DOI={10.1109/ddecs.2017.7934564}, booktitle={20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17)}, publisher={IEEE}, author={Kampmann, Matthias and Hellebrand, Sybille}, year={2017} }","ama":"Kampmann M, Hellebrand S. Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. In: 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). IEEE; 2017. doi:10.1109/ddecs.2017.7934564","ieee":"M. Kampmann and S. Hellebrand, “Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test,” 2017, doi: 10.1109/ddecs.2017.7934564.","apa":"Kampmann, M., & Hellebrand, S. (2017). Design-for-FAST: Supporting X-tolerant compaction during Faster-than-at-Speed Test. 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). https://doi.org/10.1109/ddecs.2017.7934564","chicago":"Kampmann, Matthias, and Sybille Hellebrand. “Design-for-FAST: Supporting X-Tolerant Compaction during Faster-than-at-Speed Test.” In 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17). IEEE, 2017. https://doi.org/10.1109/ddecs.2017.7934564.","short":"M. Kampmann, S. Hellebrand, in: 20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS’17), IEEE, 2017."},"publication":"20th IEEE International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS'17)","date_created":"2019-07-05T08:23:56Z","department":[{"_id":"48"}],"type":"conference"}