{"user_id":"209","department":[{"_id":"48"}],"publication":"23rd IEEE NORCHIP Conference","page":"70-73","year":"2005","_id":"12998","doi":"10.1109/norchp.2005.1596991","status":"public","date_created":"2019-08-28T10:19:55Z","author":[{"first_name":"Muhammad","last_name":"Ali","full_name":"Ali, Muhammad"},{"first_name":"Michael","last_name":"Welzl","full_name":"Welzl, Michael"},{"id":"209","full_name":"Hellebrand, Sybille","orcid":"0000-0002-3717-3939","first_name":"Sybille","last_name":"Hellebrand"}],"citation":{"chicago":"Ali, Muhammad, Michael Welzl, and Sybille Hellebrand. “A Dynamic Routing Mechanism for Network on Chip.” In 23rd IEEE NORCHIP Conference, 70–73. Oulu, Finland: IEEE, 2005. https://doi.org/10.1109/norchp.2005.1596991.","bibtex":"@inproceedings{Ali_Welzl_Hellebrand_2005, place={Oulu, Finland}, title={A Dynamic Routing Mechanism for Network on Chip}, DOI={10.1109/norchp.2005.1596991}, booktitle={23rd IEEE NORCHIP Conference}, publisher={IEEE}, author={Ali, Muhammad and Welzl, Michael and Hellebrand, Sybille}, year={2005}, pages={70–73} }","short":"M. Ali, M. Welzl, S. Hellebrand, in: 23rd IEEE NORCHIP Conference, IEEE, Oulu, Finland, 2005, pp. 70–73.","apa":"Ali, M., Welzl, M., & Hellebrand, S. (2005). A Dynamic Routing Mechanism for Network on Chip. 23rd IEEE NORCHIP Conference, 70–73. https://doi.org/10.1109/norchp.2005.1596991","ama":"Ali M, Welzl M, Hellebrand S. A Dynamic Routing Mechanism for Network on Chip. In: 23rd IEEE NORCHIP Conference. IEEE; 2005:70-73. doi:10.1109/norchp.2005.1596991","mla":"Ali, Muhammad, et al. “A Dynamic Routing Mechanism for Network on Chip.” 23rd IEEE NORCHIP Conference, IEEE, 2005, pp. 70–73, doi:10.1109/norchp.2005.1596991.","ieee":"M. Ali, M. Welzl, and S. Hellebrand, “A Dynamic Routing Mechanism for Network on Chip,” in 23rd IEEE NORCHIP Conference, 2005, pp. 70–73, doi: 10.1109/norchp.2005.1596991."},"title":"A Dynamic Routing Mechanism for Network on Chip","date_updated":"2022-05-11T16:39:14Z","type":"conference","place":"Oulu, Finland","language":[{"iso":"eng"}],"publisher":"IEEE"}