{"article_number":"1700552","doi":"10.1002/adem.201700552","publication":"Advanced Engineering Materials","date_updated":"2022-01-06T06:52:47Z","type":"journal_article","language":[{"iso":"eng"}],"publication_status":"published","publication_identifier":{"issn":["1438-1656"]},"title":"Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review","_id":"16252","keyword":["FDM","Review","UAV"],"citation":{"bibtex":"@article{Klippstein_Diaz De Cerio Sanchez_Hassanin_Zweiri_Seneviratne_2017, title={Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review}, DOI={<a href=\"https://doi.org/10.1002/adem.201700552\">10.1002/adem.201700552</a>}, number={1700552}, journal={Advanced Engineering Materials}, author={Klippstein, Sven Helge and Diaz De Cerio Sanchez, Alejandro and Hassanin, Hany and Zweiri, Yahya and Seneviratne, Lakmal}, year={2017} }","short":"S.H. Klippstein, A. Diaz De Cerio Sanchez, H. Hassanin, Y. Zweiri, L. Seneviratne, Advanced Engineering Materials (2017).","chicago":"Klippstein, Sven Helge, Alejandro Diaz De Cerio Sanchez, Hany Hassanin, Yahya Zweiri, and Lakmal Seneviratne. “Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review.” <i>Advanced Engineering Materials</i>, 2017. <a href=\"https://doi.org/10.1002/adem.201700552\">https://doi.org/10.1002/adem.201700552</a>.","ieee":"S. H. Klippstein, A. Diaz De Cerio Sanchez, H. Hassanin, Y. Zweiri, and L. Seneviratne, “Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review,” <i>Advanced Engineering Materials</i>, Art. no. 1700552, 2017, doi: <a href=\"https://doi.org/10.1002/adem.201700552\">10.1002/adem.201700552</a>.","mla":"Klippstein, Sven Helge, et al. “Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review.” <i>Advanced Engineering Materials</i>, 1700552, 2017, doi:<a href=\"https://doi.org/10.1002/adem.201700552\">10.1002/adem.201700552</a>.","ama":"Klippstein SH, Diaz De Cerio Sanchez A, Hassanin H, Zweiri Y, Seneviratne L. Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review. <i>Advanced Engineering Materials</i>. Published online 2017. doi:<a href=\"https://doi.org/10.1002/adem.201700552\">10.1002/adem.201700552</a>","apa":"Klippstein, S. H., Diaz De Cerio Sanchez, A., Hassanin, H., Zweiri, Y., &#38; Seneviratne, L. (2017). Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review. <i>Advanced Engineering Materials</i>, Article 1700552. <a href=\"https://doi.org/10.1002/adem.201700552\">https://doi.org/10.1002/adem.201700552</a>"},"user_id":"71545","date_created":"2020-03-06T12:00:07Z","status":"public","year":"2017","quality_controlled":"1","extern":"1","author":[{"full_name":"Klippstein, Sven Helge","id":"71545","last_name":"Klippstein","first_name":"Sven Helge"},{"last_name":"Diaz De Cerio Sanchez","full_name":"Diaz De Cerio Sanchez, Alejandro","first_name":"Alejandro"},{"last_name":"Hassanin","full_name":"Hassanin, Hany","first_name":"Hany"},{"full_name":"Zweiri, Yahya","last_name":"Zweiri","first_name":"Yahya"},{"first_name":"Lakmal","last_name":"Seneviratne","full_name":"Seneviratne, Lakmal"}],"abstract":[{"lang":"eng","text":"Additive Manufacturing (AM) is a game changing production technology for aerospace applications. Fused deposition modeling is one of the most widely used AM technologies and recently has gained much attention in the advancement of many products. This paper introduces an extensive review of fused deposition modeling and its application in the development of high performance unmanned aerial vehicles. The process methodology, materials, post processing, and properties of its products are discussed in details. Successful examples of using this technology for making functional, lightweight, and high endurance unmanned aerial vehicles are also highlighted. In addition, major opportunities, limitations, and outlook of fused deposition modeling are also explored. The paper shows that the emerge of fused deposition modeling as a robust technique for unmanned aerial vehicles represents a good opportunity to produce compact, strong, lightweight structures, and functional parts with embedded electronic."}]}