---
_id: '17355'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a process to form electrical connections in electronics
well established industry. Typically, a clamping tool is pressed on the wire and
forced to vibrate at relative high frequency 40 to 100 kHz. The ultrasonic vibration
is transmitted through the wire into the interface between wire and substrate.
Due to frictional processes, contamination like oxide layers are removed from
the contact zone, the surface roughness is reduced, and with increasing bond duration
an metallic connection of wire and substrate is established. It is known that
the amount of ultrasonic energy over time directly influences the strength and
reliability of the bond connection, but the determination of optimum bond parameters
is still a challenging experimental task. For this, in the past different model
approaches have been presented, to calculate the bond quality by simulation. Measuring
the friction between wire and substrate to validate these models is a challenging
task at ultrasonic bonding frequency. Therefore a versatile test rig for bonding
experiments at frequencies lower than 1 kHz is setup to get detailed insight into
the different phases of the connection process. It includes a piezoelectric force
sensor for the measurement of the three-dimensional process forces, an electrodynamic
shaker for the vibration excitation and a conventional tension-compression testing
machine to apply the bond normal force. Using this test rig, it is possible to
observe the different phases of bond formation in detail, validate and enhance
existing models and finally optimize bond parameters for different processes.
author:
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Claus
full_name: Scheidemann, Claus
id: '38259'
last_name: Scheidemann
- first_name: Tobias
full_name: Hemsel, Tobias
id: '210'
last_name: Hemsel
- first_name: 'Olaf '
full_name: 'Kirsch, Olaf '
last_name: Kirsch
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
citation:
ama: 'Schemmel R, Scheidemann C, Hemsel T, Kirsch O, Sextro W. Experimental analysis
and modelling of bond formation in ultrasonic heavy wire bonding. In: CIPS
2020; 11th International Conference on Integrated Power Electronics Systems.
; 2020:1-6.'
apa: Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020).
Experimental analysis and modelling of bond formation in ultrasonic heavy wire
bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics
Systems, 1–6.
bibtex: '@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental
analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS
2020; 11th International Conference on Integrated Power Electronics Systems},
author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch,
Olaf and Sextro, Walter}, year={2020}, pages={1–6} }'
chicago: Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf Kirsch, and
Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic
Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated
Power Electronics Systems, 1–6, 2020.
ieee: R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental
analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in
CIPS 2020; 11th International Conference on Integrated Power Electronics Systems,
2020, pp. 1–6.
mla: Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation
in Ultrasonic Heavy Wire Bonding.” CIPS 2020; 11th International Conference
on Integrated Power Electronics Systems, 2020, pp. 1–6.
short: 'R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020;
11th International Conference on Integrated Power Electronics Systems, 2020, pp.
1–6.'
date_created: 2020-07-06T07:41:21Z
date_updated: 2023-09-21T14:27:32Z
department:
- _id: '151'
language:
- iso: eng
page: 1-6
publication: CIPS 2020; 11th International Conference on Integrated Power Electronics
Systems
quality_controlled: '1'
status: public
title: Experimental analysis and modelling of bond formation in ultrasonic heavy wire
bonding
type: conference
user_id: '210'
year: '2020'
...