{"type":"conference","user_id":"210","date_created":"2020-08-07T09:49:17Z","publication_status":"published","language":[{"iso":"eng"}],"status":"public","department":[{"_id":"151"}],"author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"first_name":"Viktor","full_name":"Krieger, Viktor","last_name":"Krieger"},{"id":"210","first_name":"Tobias","last_name":"Hemsel","full_name":"Hemsel, Tobias"},{"last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter","id":"21220"}],"year":"2020","publication":"2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","citation":{"apa":"Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020. https://doi.org/10.1109/eurosime48426.2020.9152679.","bibtex":"@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={10.1109/eurosime48426.2020.9152679}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }","ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020."},"publication_identifier":{"isbn":["9781728160498"]},"date_updated":"2023-09-21T14:16:41Z","_id":"17706","doi":"10.1109/eurosime48426.2020.9152679"}