{"publication_status":"published","type":"conference","department":[{"_id":"151"}],"title":"Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization","publication":"2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","date_updated":"2023-09-21T14:16:41Z","date_created":"2020-08-07T09:49:17Z","status":"public","user_id":"210","citation":{"ama":"Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>. ; 2020. doi:<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>","chicago":"Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>, 2020. <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">https://doi.org/10.1109/eurosime48426.2020.9152679</a>.","short":"R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020.","bibtex":"@inproceedings{Schemmel_Krieger_Hemsel_Sextro_2020, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, DOI={<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>}, booktitle={2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2020} }","apa":"Schemmel, R., Krieger, V., Hemsel, T., &#38; Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>. <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">https://doi.org/10.1109/eurosime48426.2020.9152679</a>","mla":"Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” <i>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</i>, 2020, doi:<a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>.","ieee":"R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: <a href=\"https://doi.org/10.1109/eurosime48426.2020.9152679\">10.1109/eurosime48426.2020.9152679</a>."},"author":[{"id":"28647","full_name":"Schemmel, Reinhard","last_name":"Schemmel","first_name":"Reinhard"},{"full_name":"Krieger, Viktor","last_name":"Krieger","first_name":"Viktor"},{"full_name":"Hemsel, Tobias","last_name":"Hemsel","first_name":"Tobias","id":"210"},{"first_name":"Walter","last_name":"Sextro","full_name":"Sextro, Walter","id":"21220"}],"year":"2020","doi":"10.1109/eurosime48426.2020.9152679","language":[{"iso":"eng"}],"publication_identifier":{"isbn":["9781728160498"]},"_id":"17706"}