TY - CONF AU - Schemmel, Reinhard AU - Krieger, Viktor AU - Hemsel, Tobias AU - Sextro, Walter ID - 17706 SN - 9781728160498 T2 - 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) TI - Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization ER -