{"page":"227-228","title":"Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes","date_updated":"2022-01-06T06:54:03Z","year":"2015","language":[{"iso":"eng"}],"publication_identifier":{"issn":["0916-4812","2187-4816"]},"_id":"19381","type":"journal_article","doi":"10.11618/adhesion.51.227","user_id":"537","author":[{"id":"537","last_name":"Teutenberg","first_name":"Dominik","full_name":"Teutenberg, Dominik"},{"last_name":"Meschut","orcid":"0000-0002-2763-1246","id":"32056","first_name":"Gerson","full_name":"Meschut, Gerson"},{"first_name":"O","full_name":"Hahn, O","last_name":"Hahn"},{"last_name":"Schlimmer","full_name":"Schlimmer, M","first_name":"M"},{"last_name":"Kuehlmeyer","first_name":"P","full_name":"Kuehlmeyer, P"},{"full_name":"Matzenmiller, A","first_name":"A","last_name":"Matzenmiller"}],"publication":"Journal of The Adhesion Society of Japan","publication_status":"published","citation":{"bibtex":"@article{Teutenberg_Meschut_Hahn_Schlimmer_Kuehlmeyer_Matzenmiller_2015, title={Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes}, DOI={<a href=\"https://doi.org/10.11618/adhesion.51.227\">10.11618/adhesion.51.227</a>}, journal={Journal of The Adhesion Society of Japan}, author={Teutenberg, Dominik and Meschut, Gerson and Hahn, O and Schlimmer, M and Kuehlmeyer, P and Matzenmiller, A}, year={2015}, pages={227–228} }","short":"D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, A. Matzenmiller, Journal of The Adhesion Society of Japan (2015) 227–228.","ieee":"D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, and A. Matzenmiller, “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes,” <i>Journal of The Adhesion Society of Japan</i>, pp. 227–228, 2015.","mla":"Teutenberg, Dominik, et al. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” <i>Journal of The Adhesion Society of Japan</i>, 2015, pp. 227–28, doi:<a href=\"https://doi.org/10.11618/adhesion.51.227\">10.11618/adhesion.51.227</a>.","chicago":"Teutenberg, Dominik, Gerson Meschut, O Hahn, M Schlimmer, P Kuehlmeyer, and A Matzenmiller. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” <i>Journal of The Adhesion Society of Japan</i>, 2015, 227–28. <a href=\"https://doi.org/10.11618/adhesion.51.227\">https://doi.org/10.11618/adhesion.51.227</a>.","ama":"Teutenberg D, Meschut G, Hahn O, Schlimmer M, Kuehlmeyer P, Matzenmiller A. Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. <i>Journal of The Adhesion Society of Japan</i>. 2015:227-228. doi:<a href=\"https://doi.org/10.11618/adhesion.51.227\">10.11618/adhesion.51.227</a>","apa":"Teutenberg, D., Meschut, G., Hahn, O., Schlimmer, M., Kuehlmeyer, P., &#38; Matzenmiller, A. (2015). Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. <i>Journal of The Adhesion Society of Japan</i>, 227–228. <a href=\"https://doi.org/10.11618/adhesion.51.227\">https://doi.org/10.11618/adhesion.51.227</a>"},"date_created":"2020-09-14T12:28:04Z","status":"public"}