{"publication":"ADVANCED ENGINEERING MATERIALS","date_updated":"2022-01-06T06:54:41Z","type":"journal_article","language":[{"iso":"eng"}],"department":[{"_id":"35"},{"_id":"302"},{"_id":"321"}],"publication_identifier":{"issn":["1438-1656"],"eissn":["1527-2648"]},"title":"Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation","_id":"20942","volume":18,"citation":{"apa":"Hoppe, C., Ebbert, C., Voigt, M., Schmidt, H. C., Rodman, D., Homberg, W., … Grundmeier, G. (2016). Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>, <i>18</i>(6), 1066–1074. <a href=\"https://doi.org/10.1002/adem.201500501\">https://doi.org/10.1002/adem.201500501</a>","ieee":"C. Hoppe <i>et al.</i>, “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation,” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 6, pp. 1066–1074, 2016.","ama":"Hoppe C, Ebbert C, Voigt M, et al. Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. <i>ADVANCED ENGINEERING MATERIALS</i>. 2016;18(6):1066-1074. doi:<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>","mla":"Hoppe, Christian, et al. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i>, vol. 18, no. 6, 2016, pp. 1066–74, doi:<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>.","short":"C. Hoppe, C. Ebbert, M. Voigt, H.C. Schmidt, D. Rodman, W. Homberg, H.J. Maier, G. Grundmeier, ADVANCED ENGINEERING MATERIALS 18 (2016) 1066–1074.","chicago":"Hoppe, Christian, Christoph Ebbert, Markus Voigt, Hans Christian Schmidt, Dmytro Rodman, Werner Homberg, Hans Juergen Maier, and Guido Grundmeier. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” <i>ADVANCED ENGINEERING MATERIALS</i> 18, no. 6 (2016): 1066–74. <a href=\"https://doi.org/10.1002/adem.201500501\">https://doi.org/10.1002/adem.201500501</a>.","bibtex":"@article{Hoppe_Ebbert_Voigt_Schmidt_Rodman_Homberg_Maier_Grundmeier_2016, title={Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation}, volume={18}, DOI={<a href=\"https://doi.org/10.1002/adem.201500501\">10.1002/adem.201500501</a>}, number={6}, journal={ADVANCED ENGINEERING MATERIALS}, author={Hoppe, Christian and Ebbert, Christoph and Voigt, Markus and Schmidt, Hans Christian and Rodman, Dmytro and Homberg, Werner and Maier, Hans Juergen and Grundmeier, Guido}, year={2016}, pages={1066–1074} }"},"external_id":{"isi":["000378684200023"]},"user_id":"7266","intvolume":"        18","status":"public","year":"2016","author":[{"full_name":"Hoppe, Christian","last_name":"Hoppe","id":"27401","first_name":"Christian"},{"last_name":"Ebbert","id":"7266","full_name":"Ebbert, Christoph","first_name":"Christoph"},{"first_name":"Markus","last_name":"Voigt","full_name":"Voigt, Markus"},{"first_name":"Hans Christian","full_name":"Schmidt, Hans Christian","last_name":"Schmidt"},{"first_name":"Dmytro","full_name":"Rodman, Dmytro","last_name":"Rodman"},{"last_name":"Homberg","full_name":"Homberg, Werner","first_name":"Werner"},{"full_name":"Maier, Hans Juergen","last_name":"Maier","first_name":"Hans Juergen"},{"first_name":"Guido","last_name":"Grundmeier","id":"194","full_name":"Grundmeier, Guido"}],"doi":"10.1002/adem.201500501","page":"1066-1074","isi":"1","issue":"6","publication_status":"published","date_created":"2021-01-13T10:12:47Z","quality_controlled":"1","abstract":[{"lang":"eng","text":"Interface modification based on ultra-thin mercapto-propyl(trimethoxy) silane (MPTMS) films is shown to promote joining of copper and aluminum by plastic deformation followed by a heat treatment. The surface morphology and the surface chemistry of the metal substrates were analyzed by means of FE-SEM, XPS, and FT-IRRAS. The spectroscopic data show that the MPTMS film is crosslinked via Si-O-Si bonds and that stable Cu-S and Si-O-Al interfacial bonds are formed. The shear-force tests of the joints led to force displacement curves that are characteristic for a covalently bonded interface. Complementary cross sectional SEM and EDS analysis of the joint proved that a defect-free interface was formed without any measureable interdiffusion of metals across the interface or cracking of an oxide films."}]}