---
res:
  bibo_abstract:
  - Ultrasonic wire bonding is a solid-state joining process, used in the electronics
    industry to form electrical connections, e.g. to connect electrical terminals
    within semiconductor modules. Many process parameters affect the bond strength,
    such like the bond normal force, ultrasonic power, wire material and bonding frequency.
    Today, process design, development, and optimization is most likely based on the
    knowledge of process engineers and is mainly performed by experimental testing.
    In this contribution, a newly developed simulation tool is presented, to reduce
    time and costs and efficiently determine optimized process parameter. Based on
    a co-simulation of MATLAB and ANSYS, the different physical phenomena of the wire
    bonding process are considered using finite element simulation for the complex
    plastic deformation of the wire and reduced order models for the transient dynamics
    of the transducer, wire, substrate and bond formation. The model parameters such
    as the coefficients of friction between bond tool and wire and between wire and
    substrate were determined for aluminium and copper wire in experiments with a
    test rig specially developed for the requirements of heavy wire bonding. To reduce
    simulation time, for the finite element simulation a restart analysis and high
    performance computing is utilized. Detailed analysis of the bond formation showed,
    that the normal pressure distribution in the contact between wire and substrate
    has high impact on bond formation and distribution of welded areas in the contact
    area.@eng
  bibo_authorlist:
  - foaf_Person:
      foaf_givenName: Reinhard
      foaf_name: Schemmel, Reinhard
      foaf_surname: Schemmel
      foaf_workInfoHomepage: http://www.librecat.org/personId=28647
  - foaf_Person:
      foaf_givenName: Viktor
      foaf_name: Krieger, Viktor
      foaf_surname: Krieger
  - foaf_Person:
      foaf_givenName: Tobias
      foaf_name: Hemsel, Tobias
      foaf_surname: Hemsel
      foaf_workInfoHomepage: http://www.librecat.org/personId=210
  - foaf_Person:
      foaf_givenName: Walter
      foaf_name: Sextro, Walter
      foaf_surname: Sextro
      foaf_workInfoHomepage: http://www.librecat.org/personId=21220
  bibo_doi: https://doi.org/10.1016/j.microrel.2021.114077
  bibo_volume: 119
  dct_date: 2021^xs_gYear
  dct_isPartOf:
  - http://id.crossref.org/issn/0026-2714
  dct_language: eng
  dct_subject:
  - Ultrasonic heavy wire bonding
  - Co-simulation
  - ANSYS
  - MATLAB
  - Process optimization
  - Friction coefficient
  - Copper-copper
  - Aluminium-copper
  dct_title: Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process
    optimization@
...