{"date_updated":"2022-01-06T06:55:28Z","year":"2018","type":"conference","page":"687-697","date_created":"2021-05-14T07:46:13Z","language":[{"iso":"eng"}],"user_id":"29240","_id":"22183","intvolume":"        29","main_file_link":[{"open_access":"1","url":"http://utw10945.utweb.utexas.edu/sites/default/files/2018/056%20TopologyOptimizedHeatTransferUsingtheExample.pdf"}],"status":"public","citation":{"ama":"Menge D, Delfs P, Töws M, Schmid H-J. Topology Optimized Heat Transfer Using the Example of an Electronic Housing. In: <i>29th Annual International Solid Freeform Fabrication Symposium</i>. Vol 29. ; 2018:687-697.","bibtex":"@inproceedings{Menge_Delfs_Töws_Schmid_2018, title={Topology Optimized Heat Transfer Using the Example of an Electronic Housing}, volume={29}, booktitle={29th Annual International Solid Freeform Fabrication Symposium}, author={Menge, Dennis and Delfs, Patrick and Töws, Marcel and Schmid, Hans-Joachim}, year={2018}, pages={687–697} }","chicago":"Menge, Dennis, Patrick Delfs, Marcel Töws, and Hans-Joachim Schmid. “Topology Optimized Heat Transfer Using the Example of an Electronic Housing.” In <i>29th Annual International Solid Freeform Fabrication Symposium</i>, 29:687–97, 2018.","ieee":"D. Menge, P. Delfs, M. Töws, and H.-J. Schmid, “Topology Optimized Heat Transfer Using the Example of an Electronic Housing,” in <i>29th Annual International Solid Freeform Fabrication Symposium</i>, 2018, vol. 29, pp. 687–697.","apa":"Menge, D., Delfs, P., Töws, M., &#38; Schmid, H.-J. (2018). Topology Optimized Heat Transfer Using the Example of an Electronic Housing. <i>29th Annual International Solid Freeform Fabrication Symposium</i>, <i>29</i>, 687–697.","short":"D. Menge, P. Delfs, M. Töws, H.-J. Schmid, in: 29th Annual International Solid Freeform Fabrication Symposium, 2018, pp. 687–697.","mla":"Menge, Dennis, et al. “Topology Optimized Heat Transfer Using the Example of an Electronic Housing.” <i>29th Annual International Solid Freeform Fabrication Symposium</i>, vol. 29, 2018, pp. 687–97."},"author":[{"first_name":"Dennis","id":"29240","full_name":"Menge, Dennis","last_name":"Menge"},{"full_name":"Delfs, Patrick","last_name":"Delfs","first_name":"Patrick"},{"full_name":"Töws, Marcel","last_name":"Töws","first_name":"Marcel"},{"first_name":"Hans-Joachim","full_name":"Schmid, Hans-Joachim","id":"464","last_name":"Schmid"}],"volume":29,"title":"Topology Optimized Heat Transfer Using the Example of an Electronic Housing","publication":"29th Annual International Solid Freeform Fabrication Symposium","abstract":[{"lang":"eng","text":"Function integration is a key issue for an efficient and economic usage of Additive Manufacturing. An efficient heat transfer by topology optimized structures is a rarely considered approach which will be outlined with an exemplary electronic housing which has been newly designed. A commercial projector unit, whose electrical components in total produce 38 W, shall be integrated in the closed housing and passively cooled by natural convection. Topology optimized structures shall be generated in the inner part of the housing to transfer the heat homogenously from the projector components to the housing wall while simultaneously minimizing the mass. At the outside of the housing walls, lattice and rib structures are applied to increase the effective surface for heat transfer by natural convection and radiation. Furthermore, the housing geometry is optimized regarding a minimization of support structures to reduce the post-processing effort. Finally, the housing shall be built of AlSi10Mg by SLM."}],"department":[{"_id":"150"},{"_id":"624"},{"_id":"219"}],"oa":"1"}