{"citation":{"short":"F. Dahms, W. Homberg, in: Forming the Future, Springer, Cham, 2021, pp. 2249–2259.","chicago":"Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” In Forming the Future, 2249–59. Springer, Cham, 2021. https://doi.org/10.1007/978-3-030-75381-8_189.","ama":"Dahms F, Homberg W. Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In: Forming the Future. Springer, Cham; 2021:2249-2259. doi:10.1007/978-3-030-75381-8_189","mla":"Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” Forming the Future, Springer, Cham, 2021, pp. 2249–59, doi:10.1007/978-3-030-75381-8_189.","apa":"Dahms, F., & Homberg, W. (2021). Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In Forming the Future (pp. 2249–2259). Springer, Cham. https://doi.org/10.1007/978-3-030-75381-8_189","bibtex":"@inbook{Dahms_Homberg_2021, title={Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method}, DOI={10.1007/978-3-030-75381-8_189}, booktitle={Forming the Future}, publisher={Springer, Cham}, author={Dahms, Frederik and Homberg, Werner}, year={2021}, pages={2249–2259} }","ieee":"F. Dahms and W. Homberg, “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method,” in Forming the Future, Springer, Cham, 2021, pp. 2249–2259."},"author":[{"last_name":"Dahms","full_name":"Dahms, Frederik","first_name":"Frederik","id":"64977"},{"id":"233","first_name":"Werner","last_name":"Homberg","full_name":"Homberg, Werner"}],"year":"2021","publication_identifier":{"issn":["2367-1181","2367-1696"]},"doi":"10.1007/978-3-030-75381-8_189","language":[{"iso":"eng"}],"_id":"22766","publication_status":"published","type":"book_chapter","publisher":"Springer, Cham","quality_controlled":"1","publication":"Forming the Future","date_updated":"2023-04-27T10:30:18Z","department":[{"_id":"156"}],"title":"Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method","page":"2249-2259","user_id":"64977","conference":{"location":"Ohio, USA, VIRTUAL EVENT","start_date":"2021-07-25","name":"The 13th International Conference on the Technology of Plasticity","end_date":"2021-07-30"},"date_created":"2021-07-16T14:55:05Z","status":"public"}