{"date_created":"2021-07-16T14:55:05Z","status":"public","doi":"10.1007/978-3-030-75381-8_189","_id":"22766","year":"2021","page":"2249-2259","publication":"Forming the Future","quality_controlled":"1","publication_status":"published","department":[{"_id":"156"}],"user_id":"64977","publication_identifier":{"issn":["2367-1181","2367-1696"]},"publisher":"Springer, Cham","language":[{"iso":"eng"}],"type":"book_chapter","date_updated":"2023-04-27T10:30:18Z","title":"Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method","citation":{"short":"F. Dahms, W. Homberg, in: Forming the Future, Springer, Cham, 2021, pp. 2249–2259.","bibtex":"@inbook{Dahms_Homberg_2021, title={Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method}, DOI={<a href=\"https://doi.org/10.1007/978-3-030-75381-8_189\">10.1007/978-3-030-75381-8_189</a>}, booktitle={Forming the Future}, publisher={Springer, Cham}, author={Dahms, Frederik and Homberg, Werner}, year={2021}, pages={2249–2259} }","chicago":"Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” In <i>Forming the Future</i>, 2249–59. Springer, Cham, 2021. <a href=\"https://doi.org/10.1007/978-3-030-75381-8_189\">https://doi.org/10.1007/978-3-030-75381-8_189</a>.","ama":"Dahms F, Homberg W. Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In: <i>Forming the Future</i>. Springer, Cham; 2021:2249-2259. doi:<a href=\"https://doi.org/10.1007/978-3-030-75381-8_189\">10.1007/978-3-030-75381-8_189</a>","ieee":"F. Dahms and W. Homberg, “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method,” in <i>Forming the Future</i>, Springer, Cham, 2021, pp. 2249–2259.","mla":"Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” <i>Forming the Future</i>, Springer, Cham, 2021, pp. 2249–59, doi:<a href=\"https://doi.org/10.1007/978-3-030-75381-8_189\">10.1007/978-3-030-75381-8_189</a>.","apa":"Dahms, F., &#38; Homberg, W. (2021). Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In <i>Forming the Future</i> (pp. 2249–2259). Springer, Cham. <a href=\"https://doi.org/10.1007/978-3-030-75381-8_189\">https://doi.org/10.1007/978-3-030-75381-8_189</a>"},"author":[{"id":"64977","first_name":"Frederik","last_name":"Dahms","full_name":"Dahms, Frederik"},{"full_name":"Homberg, Werner","last_name":"Homberg","first_name":"Werner","id":"233"}],"conference":{"start_date":"2021-07-25","end_date":"2021-07-30","location":"Ohio, USA, VIRTUAL EVENT","name":"The 13th International Conference   on the Technology of Plasticity"}}