book chapter published yes Frederik Dahms author 64977 Werner Homberg author 233 156 department The 13th International Conference on the Technology of Plasticity Springer, Cham2021Ohio, USA, VIRTUAL EVENT eng 2367-1181 2367-169610.1007/978-3-030-75381-8_189 2249-2259 Dahms, F., &#38; Homberg, W. (2021). Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In <i>Forming the Future</i> (pp. 2249–2259). Springer, Cham. <a href="https://doi.org/10.1007/978-3-030-75381-8_189">https://doi.org/10.1007/978-3-030-75381-8_189</a> F. Dahms, W. Homberg, in: Forming the Future, Springer, Cham, 2021, pp. 2249–2259. Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” <i>Forming the Future</i>, Springer, Cham, 2021, pp. 2249–59, doi:<a href="https://doi.org/10.1007/978-3-030-75381-8_189">10.1007/978-3-030-75381-8_189</a>. @inbook{Dahms_Homberg_2021, title={Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method}, DOI={<a href="https://doi.org/10.1007/978-3-030-75381-8_189">10.1007/978-3-030-75381-8_189</a>}, booktitle={Forming the Future}, publisher={Springer, Cham}, author={Dahms, Frederik and Homberg, Werner}, year={2021}, pages={2249–2259} } Dahms F, Homberg W. Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method. In: <i>Forming the Future</i>. Springer, Cham; 2021:2249-2259. doi:<a href="https://doi.org/10.1007/978-3-030-75381-8_189">10.1007/978-3-030-75381-8_189</a> F. Dahms and W. Homberg, “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method,” in <i>Forming the Future</i>, Springer, Cham, 2021, pp. 2249–2259. Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.” In <i>Forming the Future</i>, 2249–59. Springer, Cham, 2021. <a href="https://doi.org/10.1007/978-3-030-75381-8_189">https://doi.org/10.1007/978-3-030-75381-8_189</a>. 227662021-07-16T14:55:05Z2023-04-27T10:30:18Z