---
_id: '22766'
author:
- first_name: Frederik
  full_name: Dahms, Frederik
  id: '64977'
  last_name: Dahms
- first_name: Werner
  full_name: Homberg, Werner
  id: '233'
  last_name: Homberg
citation:
  ama: 'Dahms F, Homberg W. Investigations and Improvements in 3D-DIC Optical Residual
    Stress Analysis—A New Temperature Compensation Method. In: <i>Forming the Future</i>.
    Springer, Cham; 2021:2249-2259. doi:<a href="https://doi.org/10.1007/978-3-030-75381-8_189">10.1007/978-3-030-75381-8_189</a>'
  apa: Dahms, F., &#38; Homberg, W. (2021). Investigations and Improvements in 3D-DIC
    Optical Residual Stress Analysis—A New Temperature Compensation Method. In <i>Forming
    the Future</i> (pp. 2249–2259). Springer, Cham. <a href="https://doi.org/10.1007/978-3-030-75381-8_189">https://doi.org/10.1007/978-3-030-75381-8_189</a>
  bibtex: '@inbook{Dahms_Homberg_2021, title={Investigations and Improvements in 3D-DIC
    Optical Residual Stress Analysis—A New Temperature Compensation Method}, DOI={<a
    href="https://doi.org/10.1007/978-3-030-75381-8_189">10.1007/978-3-030-75381-8_189</a>},
    booktitle={Forming the Future}, publisher={Springer, Cham}, author={Dahms, Frederik
    and Homberg, Werner}, year={2021}, pages={2249–2259} }'
  chicago: Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in
    3D-DIC Optical Residual Stress Analysis—A New Temperature Compensation Method.”
    In <i>Forming the Future</i>, 2249–59. Springer, Cham, 2021. <a href="https://doi.org/10.1007/978-3-030-75381-8_189">https://doi.org/10.1007/978-3-030-75381-8_189</a>.
  ieee: F. Dahms and W. Homberg, “Investigations and Improvements in 3D-DIC Optical
    Residual Stress Analysis—A New Temperature Compensation Method,” in <i>Forming
    the Future</i>, Springer, Cham, 2021, pp. 2249–2259.
  mla: Dahms, Frederik, and Werner Homberg. “Investigations and Improvements in 3D-DIC
    Optical Residual Stress Analysis—A New Temperature Compensation Method.” <i>Forming
    the Future</i>, Springer, Cham, 2021, pp. 2249–59, doi:<a href="https://doi.org/10.1007/978-3-030-75381-8_189">10.1007/978-3-030-75381-8_189</a>.
  short: 'F. Dahms, W. Homberg, in: Forming the Future, Springer, Cham, 2021, pp.
    2249–2259.'
conference:
  end_date: 2021-07-30
  location: Ohio, USA, VIRTUAL EVENT
  name: The 13th International Conference   on the Technology of Plasticity
  start_date: 2021-07-25
date_created: 2021-07-16T14:55:05Z
date_updated: 2023-04-27T10:30:18Z
department:
- _id: '156'
doi: 10.1007/978-3-030-75381-8_189
language:
- iso: eng
page: 2249-2259
publication: Forming the Future
publication_identifier:
  issn:
  - 2367-1181
  - 2367-1696
publication_status: published
publisher: Springer, Cham
quality_controlled: '1'
status: public
title: Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis—A
  New Temperature Compensation Method
type: book_chapter
user_id: '64977'
year: '2021'
...