[{"title":"SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study","status":"public","year":"2017","author":[{"id":"30401","last_name":"Wu","first_name":"Liang","full_name":"Wu, Liang"},{"full_name":"Abughannam, Saed","first_name":"Saed","last_name":"Abughannam","id":"37628"},{"last_name":"Müller","first_name":"Wolfgang","full_name":"Müller, Wolfgang","id":"16243"},{"id":"37144","full_name":"Scheytt, Christoph","first_name":"Christoph","last_name":"Scheytt"},{"last_name":"Ecker","first_name":"Wolfgang","full_name":"Ecker, Wolfgang"}],"date_updated":"2022-01-06T06:56:13Z","page":"68","language":[{"iso":"eng"}],"_id":"24223","user_id":"15931","publication":"2nd Workshop on Resiliency in Embedded Electronic Systems (REES)","citation":{"ama":"Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. In: <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>. ; 2017:68.","bibtex":"@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne, Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }","mla":"Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68.","short":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017, p. 68.","chicago":"Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68. Lausanne, Switzerland, 2017.","apa":"Wu, L., Abughannam, S., Müller, W., Scheytt, C., &#38; Ecker, W. (2017). SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68.","ieee":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study,” in <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68."},"related_material":{"link":[{"relation":"confirmation","url":"https://past.date-conference.com/date17/conference/workshop-w05"}]},"abstract":[{"lang":"eng","text":"This paper presents the design flow of using \r\nsampling technique for fault injection on sche-\r\nmatic level. The parameters used in the docu-\r\nment to calculate the likelihood could be modi-\r\nfied by using more realistic data from the fab. \r\nWith the help of the fault simulator, the whole \r\ndesign flow of the fault effect simulation can be \r\nrealized automatically."}],"place":"Lausanne, Switzerland","date_created":"2021-09-13T08:20:39Z","type":"conference","department":[{"_id":"58"}]}]