{"status":"public","author":[{"last_name":"Wu","full_name":"Wu, Liang","first_name":"Liang","id":"30401"},{"full_name":"Abughannam, Saed","last_name":"Abughannam","first_name":"Saed","id":"37628"},{"first_name":"Wolfgang","id":"16243","full_name":"Müller, Wolfgang","last_name":"Müller"},{"id":"37144","first_name":"Christoph","full_name":"Scheytt, Christoph","last_name":"Scheytt"},{"full_name":"Ecker, Wolfgang","last_name":"Ecker","first_name":"Wolfgang"}],"date_updated":"2022-01-06T06:56:13Z","_id":"24223","language":[{"iso":"eng"}],"year":"2017","page":"68","type":"conference","related_material":{"link":[{"url":"https://past.date-conference.com/date17/conference/workshop-w05","relation":"confirmation"}]},"publication":"2nd Workshop on Resiliency in Embedded Electronic Systems (REES)","title":"SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study","date_created":"2021-09-13T08:20:39Z","department":[{"_id":"58"}],"place":"Lausanne, Switzerland","citation":{"mla":"Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68.","short":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017, p. 68.","apa":"Wu, L., Abughannam, S., Müller, W., Scheytt, C., &#38; Ecker, W. (2017). SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68.","chicago":"Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68. Lausanne, Switzerland, 2017.","ama":"Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. In: <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>. ; 2017:68.","ieee":"L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study,” in <i>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68.","bibtex":"@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne, Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }"},"user_id":"15931","abstract":[{"text":"This paper presents the design flow of using \r\nsampling technique for fault injection on sche-\r\nmatic level. The parameters used in the docu-\r\nment to calculate the likelihood could be modi-\r\nfied by using more realistic data from the fab. \r\nWith the help of the fault simulator, the whole \r\ndesign flow of the fault effect simulation can be \r\nrealized automatically.","lang":"eng"}]}