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<titleInfo><title>SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study</title></titleInfo>





<name type="personal">
  <namePart type="given">Liang</namePart>
  <namePart type="family">Wu</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">30401</identifier></name>
<name type="personal">
  <namePart type="given">Saed</namePart>
  <namePart type="family">Abughannam</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">37628</identifier></name>
<name type="personal">
  <namePart type="given">Wolfgang</namePart>
  <namePart type="family">Müller</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">16243</identifier></name>
<name type="personal">
  <namePart type="given">Christoph</namePart>
  <namePart type="family">Scheytt</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">37144</identifier></name>
<name type="personal">
  <namePart type="given">Wolfgang</namePart>
  <namePart type="family">Ecker</namePart>
  <role><roleTerm type="text">author</roleTerm> </role></name>







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  <identifier type="local">58</identifier>
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<abstract lang="eng">This paper presents the design flow of using 
sampling technique for fault injection on sche-
matic level. The parameters used in the docu-
ment to calculate the likelihood could be modi-
fied by using more realistic data from the fab. 
With the help of the fault simulator, the whole 
design flow of the fault effect simulation can be 
realized automatically.</abstract>

<originInfo><dateIssued encoding="w3cdtf">2017</dateIssued>
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<language><languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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<relatedItem type="host"><titleInfo><title>2nd Workshop on Resiliency in Embedded Electronic Systems (REES)</title></titleInfo>
<part><extent unit="pages">68</extent>
</part>
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  <location>
  
     <url>https://past.date-conference.com/date17/conference/workshop-w05</url>
  
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<bibliographicCitation>
<mla>Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” &lt;i&gt;2nd Workshop on Resiliency in Embedded Electronic Systems (REES)&lt;/i&gt;, 2017, p. 68.</mla>
<ama>Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. In: &lt;i&gt;2nd Workshop on Resiliency in Embedded Electronic Systems (REES)&lt;/i&gt;. ; 2017:68.</ama>
<bibtex>@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne, Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }</bibtex>
<apa>Wu, L., Abughannam, S., Müller, W., Scheytt, C., &amp;#38; Ecker, W. (2017). SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. &lt;i&gt;2nd Workshop on Resiliency in Embedded Electronic Systems (REES)&lt;/i&gt;, 68.</apa>
<ieee>L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study,” in &lt;i&gt;2nd Workshop on Resiliency in Embedded Electronic Systems (REES)&lt;/i&gt;, 2017, p. 68.</ieee>
<chicago>Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” In &lt;i&gt;2nd Workshop on Resiliency in Embedded Electronic Systems (REES)&lt;/i&gt;, 68. Lausanne, Switzerland, 2017.</chicago>
<short>L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017, p. 68.</short>
</bibliographicCitation>
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