---
_id: '24223'
abstract:
- lang: eng
  text: "This paper presents the design flow of using \r\nsampling technique for fault
    injection on sche-\r\nmatic level. The parameters used in the docu-\r\nment to
    calculate the likelihood could be modi-\r\nfied by using more realistic data from
    the fab. \r\nWith the help of the fault simulator, the whole \r\ndesign flow of
    the fault effect simulation can be \r\nrealized automatically."
author:
- first_name: Liang
  full_name: Wu, Liang
  id: '30401'
  last_name: Wu
- first_name: Saed
  full_name: Abughannam, Saed
  id: '37628'
  last_name: Abughannam
- first_name: Wolfgang
  full_name: Müller, Wolfgang
  id: '16243'
  last_name: Müller
- first_name: Christoph
  full_name: Scheytt, Christoph
  id: '37144'
  last_name: Scheytt
- first_name: Wolfgang
  full_name: Ecker, Wolfgang
  last_name: Ecker
citation:
  ama: 'Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection
    with Likelihood Weighted Random Sampling - A Case Study. In: <i>2nd Workshop on
    Resiliency in Embedded Electronic Systems (REES)</i>. ; 2017:68.'
  apa: Wu, L., Abughannam, S., Müller, W., Scheytt, C., &#38; Ecker, W. (2017). SPICE-Level
    Fault Injection with Likelihood Weighted Random Sampling - A Case Study. <i>2nd
    Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 68.
  bibtex: '@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne,
    Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random
    Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic
    Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and
    Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }'
  chicago: Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang
    Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling -
    A Case Study.” In <i>2nd Workshop on Resiliency in Embedded Electronic Systems
    (REES)</i>, 68. Lausanne, Switzerland, 2017.
  ieee: L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault
    Injection with Likelihood Weighted Random Sampling - A Case Study,” in <i>2nd
    Workshop on Resiliency in Embedded Electronic Systems (REES)</i>, 2017, p. 68.
  mla: Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random
    Sampling - A Case Study.” <i>2nd Workshop on Resiliency in Embedded Electronic
    Systems (REES)</i>, 2017, p. 68.
  short: 'L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop
    on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017,
    p. 68.'
date_created: 2021-09-13T08:20:39Z
date_updated: 2022-01-06T06:56:13Z
department:
- _id: '58'
language:
- iso: eng
page: '68'
place: Lausanne, Switzerland
publication: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES)
related_material:
  link:
  - relation: confirmation
    url: https://past.date-conference.com/date17/conference/workshop-w05
status: public
title: SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case
  Study
type: conference
user_id: '15931'
year: '2017'
...