Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC Beer, Stefan Girma, Mekdes Gebresilassie Sun, Yaoming Winkler, Wolfgang Debski, Wojciech Paaso, Jaska Kunkel, Gerhard Scheytt, Christoph Hasch, Jürgen Zwick, Thomas This paper presents the packaging technology and the integrated antenna design for a miniaturized 122-GHz radar sensor. The package layout and the assembly process are shortly explained. Measurements of the antenna including the flip chip interconnect are presented that have been achieved by replacing the IC with a dummy chip that only contains a through-line. Afterwards, radiation pattern measurements are shown that were recorded using the radar sensor as transmitter. Finally, details of the fully integrated radar sensor are given, together with results of the first Doppler measurements. 2013 info:eu-repo/semantics/conferenceObject doc-type:conferenceObject text http://purl.org/coar/resource_type/c_5794 https://ris.uni-paderborn.de/record/24349 Beer S, Girma MG, Sun Y, et al. Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC. In: <i>7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION</i>. ; 2013. eng info:eu-repo/semantics/closedAccess