---
_id: '24349'
abstract:
- lang: eng
  text: This paper presents the packaging technology and the integrated antenna design
    for a miniaturized 122-GHz radar sensor. The package layout and the assembly process
    are shortly explained. Measurements of the antenna including the flip chip interconnect
    are presented that have been achieved by replacing the IC with a dummy chip that
    only contains a through-line. Afterwards, radiation pattern measurements are shown
    that were recorded using the radar sensor as transmitter. Finally, details of
    the fully integrated radar sensor are given, together with results of the first
    Doppler measurements.
author:
- first_name: Stefan
  full_name: Beer, Stefan
  last_name: Beer
- first_name: Mekdes Gebresilassie
  full_name: Girma, Mekdes Gebresilassie
  last_name: Girma
- first_name: Yaoming
  full_name: Sun, Yaoming
  last_name: Sun
- first_name: Wolfgang
  full_name: Winkler, Wolfgang
  last_name: Winkler
- first_name: Wojciech
  full_name: Debski, Wojciech
  last_name: Debski
- first_name: Jaska
  full_name: Paaso, Jaska
  last_name: Paaso
- first_name: Gerhard
  full_name: Kunkel, Gerhard
  last_name: Kunkel
- first_name: Christoph
  full_name: Scheytt, Christoph
  id: '37144'
  last_name: Scheytt
- first_name: Jürgen
  full_name: Hasch, Jürgen
  last_name: Hasch
- first_name: Thomas
  full_name: Zwick, Thomas
  last_name: Zwick
citation:
  ama: 'Beer S, Girma MG, Sun Y, et al. Flip-Chip Package with Integrated Antenna
    on a Polyimide Substrate for a 122-GHz Bistatic Radar IC. In: <i>7th EUROPEAN
    CONFERENCE ON ANTENNAS AND PROPAGATION</i>. ; 2013.'
  apa: Beer, S., Girma, M. G., Sun, Y., Winkler, W., Debski, W., Paaso, J., Kunkel,
    G., Scheytt, C., Hasch, J., &#38; Zwick, T. (2013). Flip-Chip Package with Integrated
    Antenna on a Polyimide Substrate for a 122-GHz Bistatic Radar IC. <i>7th EUROPEAN
    CONFERENCE ON ANTENNAS AND PROPAGATION</i>.
  bibtex: '@inproceedings{Beer_Girma_Sun_Winkler_Debski_Paaso_Kunkel_Scheytt_Hasch_Zwick_2013,
    place={Gothenburg, Sweden}, title={Flip-Chip Package with Integrated Antenna on
    a Polyimide Substrate for a 122-GHz Bistatic Radar IC}, booktitle={7th EUROPEAN
    CONFERENCE ON ANTENNAS AND PROPAGATION}, author={Beer, Stefan and Girma, Mekdes
    Gebresilassie and Sun, Yaoming and Winkler, Wolfgang and Debski, Wojciech and
    Paaso, Jaska and Kunkel, Gerhard and Scheytt, Christoph and Hasch, Jürgen and
    Zwick, Thomas}, year={2013} }'
  chicago: Beer, Stefan, Mekdes Gebresilassie Girma, Yaoming Sun, Wolfgang Winkler,
    Wojciech Debski, Jaska Paaso, Gerhard Kunkel, Christoph Scheytt, Jürgen Hasch,
    and Thomas Zwick. “Flip-Chip Package with Integrated Antenna on a Polyimide Substrate
    for a 122-GHz Bistatic Radar IC.” In <i>7th EUROPEAN CONFERENCE ON ANTENNAS AND
    PROPAGATION</i>. Gothenburg, Sweden, 2013.
  ieee: S. Beer <i>et al.</i>, “Flip-Chip Package with Integrated Antenna on a Polyimide
    Substrate for a 122-GHz Bistatic Radar IC,” 2013.
  mla: Beer, Stefan, et al. “Flip-Chip Package with Integrated Antenna on a Polyimide
    Substrate for a 122-GHz Bistatic Radar IC.” <i>7th EUROPEAN CONFERENCE ON ANTENNAS
    AND PROPAGATION</i>, 2013.
  short: 'S. Beer, M.G. Girma, Y. Sun, W. Winkler, W. Debski, J. Paaso, G. Kunkel,
    C. Scheytt, J. Hasch, T. Zwick, in: 7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION,
    Gothenburg, Sweden, 2013.'
date_created: 2021-09-14T09:22:26Z
date_updated: 2022-01-18T10:23:24Z
department:
- _id: '58'
language:
- iso: eng
place: Gothenburg, Sweden
publication: 7th EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION
publication_identifier:
  eisbn:
  - 978-88-907018-3-2
related_material:
  link:
  - relation: confirmation
    url: https://ieeexplore.ieee.org/document/6546229
status: public
title: Flip-Chip Package with Integrated Antenna on a Polyimide Substrate for a 122-GHz
  Bistatic Radar IC
type: conference
user_id: '15931'
year: '2013'
...