{"citation":{"apa":"Wang, R., Sun, Y., Kaynak, M., & Scheytt, J. C. (2012). Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren.","ama":"Wang R, Sun Y, Kaynak M, Scheytt JC. Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren. Published online 2012.","chicago":"Wang, Ruoyu, Yaoming Sun, Mehmet Kaynak, and J. Christoph Scheytt. “Chip-Antenne, Elektronisches Bauelement Und Herstellungsverfahren,” 2012.","mla":"Wang, Ruoyu, et al. Chip-Antenne, Elektronisches Bauelement Und Herstellungsverfahren. 2012.","bibtex":"@article{Wang_Sun_Kaynak_Scheytt_2012, title={Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren}, author={Wang, Ruoyu and Sun, Yaoming and Kaynak, Mehmet and Scheytt, J. Christoph}, year={2012} }","short":"R. Wang, Y. Sun, M. Kaynak, J.C. Scheytt, (2012).","ieee":"R. Wang, Y. Sun, M. Kaynak, and J. C. Scheytt, “Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren.” 2012."},"type":"patent","year":"2012","publication_date":"03.07.2014 ","date_updated":"2023-01-31T14:16:12Z","_id":"24400","ipc":"PCT/EP2013/077951 ","status":"public","date_created":"2021-09-14T12:53:08Z","author":[{"last_name":"Wang","first_name":"Ruoyu","full_name":"Wang, Ruoyu"},{"first_name":"Yaoming","full_name":"Sun, Yaoming","last_name":"Sun"},{"last_name":"Kaynak","full_name":"Kaynak, Mehmet","first_name":"Mehmet"},{"orcid":"https://orcid.org/0000-0002-5950-6618","full_name":"Scheytt, J. Christoph","first_name":"J. Christoph","id":"37144","last_name":"Scheytt"}],"department":[{"_id":"58"}],"related_material":{"link":[{"relation":"confirmation","url":"https://patentscope.wipo.int/search/de/detail.jsf?docId=WO2014102260"}]},"user_id":"15931","title":"Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren","abstract":[{"text":"Chipantenne (102), umfassend mindestens einen Strahler (114,116), der sich parallel zu einer Hauptoberfläche eines die Chipantenne tragenden Halbleitersubstrats (104) erstreckt, wobei der Strahler auf einer inselartigen Trägerzone (122,124) des Halbleitersubstrats angeordnet ist, die von mindestens einem vollständig mit einem Gas gefüllten Graben (126,128) umgeben ist, welcher das Halbleitersubstrat in dessen gesamter Tiefenerstreckung durchdringt und durch mindestens einen Haltesteg (130,132,134,136) überbrückt ist, welcher eine tragende Verbindung zwischen der Trägerzone und dem übrigen Halbleitersubstrat bildet.","lang":"ger"},{"text":"The invention relates to a chip antenna (102) comprising at least one emitter (114, 116) which extends parallel to a main surface of a semiconductor substrate (104) supporting the chip antenna. The emitter is arranged on an island-like support zone (122, 124) of the semiconductor substrate, said support zone being surrounded by at least one trench (126, 128) which is completely filled with a gas. The trench passes through the entire depth of the semiconductor substrate and is bridged by at least one retaining web (130, 132, 134, 136) which forms a supporting connection between the support zone and the rest of the semiconductor substrate.","lang":"eng"}],"ipn":"WO/2014/102260","application_date":"23.12.2013"}