@inproceedings{26833, author = {{Hemmelgarn, Florian and Ehlert, Patrick and Mager, Thomas and Jürgenhake, Christoph and Dumitrescu, Roman}}, booktitle = {{14th International Congress Molded Interconnect Devices (MID)}}, location = {{Amberg}}, title = {{{Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications}}}, year = {{2021}}, }