{"language":[{"iso":"eng"}],"_id":"26833","year":"2021","conference":{"name":"International Congress Molded Interconnect Devices (MID)","end_date":"2021-02-10","start_date":"2021-02-9","location":"Amberg"},"publication_status":"published","date_updated":"2022-01-06T06:57:29Z","status":"public","author":[{"first_name":"Florian","full_name":"Hemmelgarn, Florian","last_name":"Hemmelgarn"},{"full_name":"Ehlert, Patrick","last_name":"Ehlert","first_name":"Patrick"},{"first_name":"Thomas","full_name":"Mager, Thomas","last_name":"Mager"},{"first_name":"Christoph","full_name":"Jürgenhake, Christoph","last_name":"Jürgenhake"},{"full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","id":"16190","first_name":"Roman"}],"publication":"14th International Congress Molded Interconnect Devices (MID)","date_created":"2021-10-25T12:27:28Z","title":"Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications","type":"conference","citation":{"mla":"Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” <i>14th International Congress Molded Interconnect Devices (MID)</i>, 2021.","ieee":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jürgenhake, and R. Dumitrescu, “Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications,” presented at the International Congress Molded Interconnect Devices (MID), Amberg, 2021.","apa":"Hemmelgarn, F., Ehlert, P., Mager, T., Jürgenhake, C., &#38; Dumitrescu, R. (2021). Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. <i>14th International Congress Molded Interconnect Devices (MID)</i>. International Congress Molded Interconnect Devices (MID), Amberg.","short":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jürgenhake, R. Dumitrescu, in: 14th International Congress Molded Interconnect Devices (MID), 2021.","ama":"Hemmelgarn F, Ehlert P, Mager T, Jürgenhake C, Dumitrescu R. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. In: <i>14th International Congress Molded Interconnect Devices (MID)</i>. ; 2021.","chicago":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jürgenhake, and Roman Dumitrescu. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” In <i>14th International Congress Molded Interconnect Devices (MID)</i>, 2021.","bibtex":"@inproceedings{Hemmelgarn_Ehlert_Mager_Jürgenhake_Dumitrescu_2021, title={Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications}, booktitle={14th International Congress Molded Interconnect Devices (MID)}, author={Hemmelgarn, Florian and Ehlert, Patrick and Mager, Thomas and Jürgenhake, Christoph and Dumitrescu, Roman}, year={2021} }"},"user_id":"15782","department":[{"_id":"563"}]}