Experimental investigation of the influence of different bond tool grooves on the bond quality for ultrasonic thick wire bonding

O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: 2021.

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Conference Abstract | English
Publishing Year
Conference
International Workshop on Piezoelectric Materials and Applications in Actuators
Conference Date
2021-10-26 – 2021-10-29
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Hagedorn OEC, Broll M, Kirsch O, Hemsel T, Sextro W. Experimental investigation of the influence of different bond tool grooves on the bond quality for ultrasonic thick wire bonding. In: ; 2021.
Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., & Sextro, W. (2021). Experimental investigation of the influence of different bond tool grooves on the bond quality for ultrasonic thick wire bonding. International Workshop on Piezoelectric Materials and Applications in Actuators.
@inproceedings{Hagedorn_Broll_Kirsch_Hemsel_Sextro_2021, title={Experimental investigation of the influence of different bond tool grooves on the bond quality for ultrasonic thick wire bonding}, author={Hagedorn, Oliver Ernst Caspar and Broll, Marian and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2021} }
Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” 2021.
O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental investigation of the influence of different bond tool grooves on the bond quality for ultrasonic thick wire bonding,” presented at the International Workshop on Piezoelectric Materials and Applications in Actuators, 2021.
Hagedorn, Oliver Ernst Caspar, et al. Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. 2021.

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