{"date_created":"2021-12-10T04:34:13Z","type":"conference","department":[{"_id":"676"}],"citation":{"mla":"Gaukstern, Tobias, et al. <i>A Method for the Design of Three-Dimensional Injection Molded Circuit Boards like (MID)</i>. 2013.","ama":"Gaukstern T, Dumitrescu R, Jürgenhake C, Gausemeier J. A method for the design of three-dimensional injection molded circuit boards like (MID). In: ; 2013.","bibtex":"@inproceedings{Gaukstern_Dumitrescu_Jürgenhake_Gausemeier_2013, title={A method for the design of three-dimensional injection molded circuit boards like (MID)}, author={Gaukstern, Tobias and Dumitrescu, Roman and Jürgenhake, Christoph  and Gausemeier, Jürgen}, year={2013} }","apa":"Gaukstern, T., Dumitrescu, R., Jürgenhake, C., &#38; Gausemeier, J. (2013). <i>A method for the design of three-dimensional injection molded circuit boards like (MID)</i>.","ieee":"T. Gaukstern, R. Dumitrescu, C. Jürgenhake, and J. Gausemeier, “A method for the design of three-dimensional injection molded circuit boards like (MID),” 2013.","short":"T. Gaukstern, R. Dumitrescu, C. Jürgenhake, J. Gausemeier, in: 2013.","chicago":"Gaukstern, Tobias, Roman Dumitrescu, Christoph  Jürgenhake, and Jürgen Gausemeier. “A Method for the Design of Three-Dimensional Injection Molded Circuit Boards like (MID),” 2013."},"_id":"28543","language":[{"iso":"eng"}],"user_id":"14972","year":"2013","status":"public","title":"A method for the design of three-dimensional injection molded circuit boards like (MID)","author":[{"first_name":"Tobias","last_name":"Gaukstern","full_name":"Gaukstern, Tobias"},{"full_name":"Dumitrescu, Roman","first_name":"Roman","last_name":"Dumitrescu","id":"16190"},{"first_name":"Christoph ","last_name":"Jürgenhake","full_name":"Jürgenhake, Christoph "},{"last_name":"Gausemeier","first_name":"Jürgen","full_name":"Gausemeier, Jürgen"}],"date_updated":"2026-02-24T15:07:08Z","publication_status":"published"}