{"department":[{"_id":"676"}],"author":[{"last_name":"Gaukstern","full_name":"Gaukstern, Tobias","first_name":"Tobias"},{"first_name":"Roman","last_name":"Dumitrescu","full_name":"Dumitrescu, Roman","id":"16190"},{"first_name":"Christoph ","last_name":"Jürgenhake","full_name":"Jürgenhake, Christoph "},{"full_name":"Gausemeier, Jürgen","last_name":"Gausemeier","first_name":"Jürgen"}],"user_id":"14972","date_created":"2021-12-10T04:34:13Z","_id":"28543","date_updated":"2026-02-24T15:07:08Z","language":[{"iso":"eng"}],"title":"A method for the design of three-dimensional injection molded circuit boards like (MID)","type":"conference","publication_status":"published","status":"public","citation":{"apa":"Gaukstern, T., Dumitrescu, R., Jürgenhake, C., & Gausemeier, J. (2013). A method for the design of three-dimensional injection molded circuit boards like (MID).","short":"T. Gaukstern, R. Dumitrescu, C. Jürgenhake, J. Gausemeier, in: 2013.","bibtex":"@inproceedings{Gaukstern_Dumitrescu_Jürgenhake_Gausemeier_2013, title={A method for the design of three-dimensional injection molded circuit boards like (MID)}, author={Gaukstern, Tobias and Dumitrescu, Roman and Jürgenhake, Christoph and Gausemeier, Jürgen}, year={2013} }","mla":"Gaukstern, Tobias, et al. A Method for the Design of Three-Dimensional Injection Molded Circuit Boards like (MID). 2013.","ieee":"T. Gaukstern, R. Dumitrescu, C. Jürgenhake, and J. Gausemeier, “A method for the design of three-dimensional injection molded circuit boards like (MID),” 2013.","chicago":"Gaukstern, Tobias, Roman Dumitrescu, Christoph Jürgenhake, and Jürgen Gausemeier. “A Method for the Design of Three-Dimensional Injection Molded Circuit Boards like (MID),” 2013.","ama":"Gaukstern T, Dumitrescu R, Jürgenhake C, Gausemeier J. A method for the design of three-dimensional injection molded circuit boards like (MID). In: ; 2013."},"year":"2013"}