conference paper published Tobias Gaukstern author Roman Dumitrescu author 16190 Christoph Jürgenhake author Jürgen Gausemeier author 676 department 2013 eng Gaukstern, Tobias, et al. <i>A Method for the Design of Three-Dimensional Injection Molded Circuit Boards like (MID)</i>. 2013. @inproceedings{Gaukstern_Dumitrescu_Jürgenhake_Gausemeier_2013, title={A method for the design of three-dimensional injection molded circuit boards like (MID)}, author={Gaukstern, Tobias and Dumitrescu, Roman and Jürgenhake, Christoph and Gausemeier, Jürgen}, year={2013} } T. Gaukstern, R. Dumitrescu, C. Jürgenhake, J. Gausemeier, in: 2013. Gaukstern, T., Dumitrescu, R., Jürgenhake, C., &#38; Gausemeier, J. (2013). <i>A method for the design of three-dimensional injection molded circuit boards like (MID)</i>. T. Gaukstern, R. Dumitrescu, C. Jürgenhake, and J. Gausemeier, “A method for the design of three-dimensional injection molded circuit boards like (MID),” 2013. Gaukstern, Tobias, Roman Dumitrescu, Christoph Jürgenhake, and Jürgen Gausemeier. “A Method for the Design of Three-Dimensional Injection Molded Circuit Boards like (MID),” 2013. Gaukstern T, Dumitrescu R, Jürgenhake C, Gausemeier J. A method for the design of three-dimensional injection molded circuit boards like (MID). In: ; 2013. 285432021-12-10T04:34:13Z2026-02-24T15:07:08Z