{"publication_status":"published","language":[{"iso":"eng"}],"type":"conference","date_updated":"2022-05-11T17:06:38Z","publication":"38th IEEE VLSI Test Symposium (VTS)","doi":"10.1109/vts48691.2020.9107591","publisher":"IEEE","author":[{"first_name":"Somayeh","id":"78614","last_name":"Sadeghi-Kohan","full_name":"Sadeghi-Kohan, Somayeh"},{"first_name":"Sybille","orcid":"0000-0002-3717-3939","full_name":"Hellebrand, Sybille","last_name":"Hellebrand","id":"209"}],"status":"public","year":"2020","place":"Virtual Conference - Originally San Diego, CA, USA","user_id":"209","citation":{"mla":"Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. “Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects.” <i>38th IEEE VLSI Test Symposium (VTS)</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/vts48691.2020.9107591\">10.1109/vts48691.2020.9107591</a>.","ama":"Sadeghi-Kohan S, Hellebrand S. Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects. In: <i>38th IEEE VLSI Test Symposium (VTS)</i>. IEEE; 2020. doi:<a href=\"https://doi.org/10.1109/vts48691.2020.9107591\">10.1109/vts48691.2020.9107591</a>","ieee":"S. Sadeghi-Kohan and S. Hellebrand, “Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects,” 2020, doi: <a href=\"https://doi.org/10.1109/vts48691.2020.9107591\">10.1109/vts48691.2020.9107591</a>.","apa":"Sadeghi-Kohan, S., &#38; Hellebrand, S. (2020). Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects. <i>38th IEEE VLSI Test Symposium (VTS)</i>. <a href=\"https://doi.org/10.1109/vts48691.2020.9107591\">https://doi.org/10.1109/vts48691.2020.9107591</a>","bibtex":"@inproceedings{Sadeghi-Kohan_Hellebrand_2020, place={Virtual Conference - Originally San Diego, CA, USA}, title={Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects}, DOI={<a href=\"https://doi.org/10.1109/vts48691.2020.9107591\">10.1109/vts48691.2020.9107591</a>}, booktitle={38th IEEE VLSI Test Symposium (VTS)}, publisher={IEEE}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille}, year={2020} }","chicago":"Sadeghi-Kohan, Somayeh, and Sybille Hellebrand. “Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects.” In <i>38th IEEE VLSI Test Symposium (VTS)</i>. Virtual Conference - Originally San Diego, CA, USA: IEEE, 2020. <a href=\"https://doi.org/10.1109/vts48691.2020.9107591\">https://doi.org/10.1109/vts48691.2020.9107591</a>.","short":"S. Sadeghi-Kohan, S. Hellebrand, in: 38th IEEE VLSI Test Symposium (VTS), IEEE, Virtual Conference - Originally San Diego, CA, USA, 2020."},"date_created":"2022-01-10T08:38:34Z","title":"Dynamic Multi-Frequency Test Method for Hidden Interconnect Defects","_id":"29200","department":[{"_id":"48"}]}