{"related_material":{"link":[{"relation":"confirmation","url":"https://ieeexplore.ieee.org/document/9531711/authors#authors"}]},"department":[{"_id":"58"}],"doi":"10.1109/MWSCAS47672.2021.9531711","publisher":"IEEE","publication":"2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)","date_created":"2022-01-11T08:08:33Z","language":[{"iso":"eng"}],"publication_identifier":{"eisbn":["978-1-6654-2461-5"]},"abstract":[{"lang":"eng","text":"The circuit design and measurement results of a mixed-signal receiver baseband circuit for a wireless high data rate communication system are presented. The circuit design of the two most important system blocks of the sliced receiver baseband architecture, namely the broadband, programmable code-generator circuit, and the integrate and dump correlator circuit are explained. Using parallel sequence spread spectrum (PSSS) with PAM-4 modulated data, a net data rate of 2.22 Gbps is demonstrated with a single receiver baseband slice circuit working with a chip rate of 20 Gcps. A total of 15 slices are required to recover all 15 parallelly transmitted symbols resulting in the net data rate of 33.33 Gbps. This is the first reported implementation of a mixed-signal PSSS baseband circuit."}],"citation":{"bibtex":"@inproceedings{Javed_Scheytt_2021, place={ Lansing, MI, USA}, title={Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology}, DOI={<a href=\"https://doi.org/10.1109/MWSCAS47672.2021.9531711\">10.1109/MWSCAS47672.2021.9531711</a>}, booktitle={2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)}, publisher={IEEE}, author={Javed, Abdul Rehman and Scheytt, J. Christoph}, year={2021} }","mla":"Javed, Abdul Rehman, and J. Christoph Scheytt. “Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 Nm SiGe BiCMOS Technology.” <i>2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/MWSCAS47672.2021.9531711\">10.1109/MWSCAS47672.2021.9531711</a>.","chicago":"Javed, Abdul Rehman, and J. Christoph Scheytt. “Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 Nm SiGe BiCMOS Technology.” In <i>2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)</i>.  Lansing, MI, USA: IEEE, 2021. <a href=\"https://doi.org/10.1109/MWSCAS47672.2021.9531711\">https://doi.org/10.1109/MWSCAS47672.2021.9531711</a>.","short":"A.R. Javed, J.C. Scheytt, in: 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS), IEEE,  Lansing, MI, USA, 2021.","ieee":"A. R. Javed and J. C. Scheytt, “Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology,” 2021, doi: <a href=\"https://doi.org/10.1109/MWSCAS47672.2021.9531711\">10.1109/MWSCAS47672.2021.9531711</a>.","apa":"Javed, A. R., &#38; Scheytt, J. C. (2021). Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology. <i>2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)</i>. <a href=\"https://doi.org/10.1109/MWSCAS47672.2021.9531711\">https://doi.org/10.1109/MWSCAS47672.2021.9531711</a>","ama":"Javed AR, Scheytt JC. Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology. In: <i>2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/MWSCAS47672.2021.9531711\">10.1109/MWSCAS47672.2021.9531711</a>"},"year":"2021","place":" Lansing, MI, USA","_id":"29217","type":"conference","user_id":"15931","title":"Mixed-Signal Receiver Baseband Slice for High-Data-Rate Communication Using 130 nm SiGe BiCMOS Technology","date_updated":"2022-01-11T08:10:29Z","status":"public","author":[{"full_name":"Javed, Abdul Rehman","last_name":"Javed","first_name":"Abdul Rehman"},{"full_name":"Scheytt, J. Christoph","id":"37144","first_name":"J. Christoph","last_name":"Scheytt"}]}