---
_id: '29351'
abstract:
- lang: eng
text: Safety-critical systems have to follow extremely high dependability requirements
as specified in the standards for automotive, air, and space applications. The
required high fault coverage at runtime is usually obtained by a combination of
concurrent error detection or correction and periodic tests within rather short
time intervals. The concurrent scheme ensures the integrity of computed results
while the periodic test has to identify potential aging problems and to prevent
any fault accumulation which may invalidate the concurrent error detection mechanism.
Such periodic built-in self-test (BIST) schemes are already commercialized for
memories and for random logic. The paper at hand extends this approach to interconnect
structures. A BIST scheme is presented which targets interconnect defects before
they will actually affect the system functionality at nominal speed. A BIST schedule
is developed which significantly reduces aging caused by electromigration during
the lifetime application of the periodic test.
article_type: original
author:
- first_name: Somayeh
full_name: Sadeghi-Kohan, Somayeh
id: '78614'
last_name: Sadeghi-Kohan
- first_name: Sybille
full_name: Hellebrand, Sybille
id: '209'
last_name: Hellebrand
orcid: 0000-0002-3717-3939
- first_name: Hans-Joachim
full_name: Wunderlich, Hans-Joachim
last_name: Wunderlich
citation:
ama: Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Stress-Aware Periodic Test of
Interconnects. Journal of Electronic Testing. Published online 2022. doi:10.1007/s10836-021-05979-5
apa: Sadeghi-Kohan, S., Hellebrand, S., & Wunderlich, H.-J. (2022). Stress-Aware
Periodic Test of Interconnects. Journal of Electronic Testing. https://doi.org/10.1007/s10836-021-05979-5
bibtex: '@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, title={Stress-Aware
Periodic Test of Interconnects}, DOI={10.1007/s10836-021-05979-5},
journal={Journal of Electronic Testing}, publisher={Springer Science and Business
Media LLC}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich,
Hans-Joachim}, year={2022} }'
chicago: Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich.
“Stress-Aware Periodic Test of Interconnects.” Journal of Electronic Testing,
2022. https://doi.org/10.1007/s10836-021-05979-5.
ieee: 'S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Stress-Aware Periodic
Test of Interconnects,” Journal of Electronic Testing, 2022, doi: 10.1007/s10836-021-05979-5.'
mla: Sadeghi-Kohan, Somayeh, et al. “Stress-Aware Periodic Test of Interconnects.”
Journal of Electronic Testing, Springer Science and Business Media LLC,
2022, doi:10.1007/s10836-021-05979-5.
short: S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, Journal of Electronic
Testing (2022).
date_created: 2022-01-14T11:16:34Z
date_updated: 2022-05-11T16:10:01Z
department:
- _id: '48'
doi: 10.1007/s10836-021-05979-5
keyword:
- Electrical and Electronic Engineering
language:
- iso: eng
publication: Journal of Electronic Testing
publication_identifier:
issn:
- 0923-8174
- 1573-0727
publication_status: published
publisher: Springer Science and Business Media LLC
status: public
title: Stress-Aware Periodic Test of Interconnects
type: journal_article
user_id: '209'
year: '2022'
...