--- _id: '29351' abstract: - lang: eng text: Safety-critical systems have to follow extremely high dependability requirements as specified in the standards for automotive, air, and space applications. The required high fault coverage at runtime is usually obtained by a combination of concurrent error detection or correction and periodic tests within rather short time intervals. The concurrent scheme ensures the integrity of computed results while the periodic test has to identify potential aging problems and to prevent any fault accumulation which may invalidate the concurrent error detection mechanism. Such periodic built-in self-test (BIST) schemes are already commercialized for memories and for random logic. The paper at hand extends this approach to interconnect structures. A BIST scheme is presented which targets interconnect defects before they will actually affect the system functionality at nominal speed. A BIST schedule is developed which significantly reduces aging caused by electromigration during the lifetime application of the periodic test. article_type: original author: - first_name: Somayeh full_name: Sadeghi-Kohan, Somayeh id: '78614' last_name: Sadeghi-Kohan - first_name: Sybille full_name: Hellebrand, Sybille id: '209' last_name: Hellebrand orcid: 0000-0002-3717-3939 - first_name: Hans-Joachim full_name: Wunderlich, Hans-Joachim last_name: Wunderlich citation: ama: Sadeghi-Kohan S, Hellebrand S, Wunderlich H-J. Stress-Aware Periodic Test of Interconnects. Journal of Electronic Testing. Published online 2022. doi:10.1007/s10836-021-05979-5 apa: Sadeghi-Kohan, S., Hellebrand, S., & Wunderlich, H.-J. (2022). Stress-Aware Periodic Test of Interconnects. Journal of Electronic Testing. https://doi.org/10.1007/s10836-021-05979-5 bibtex: '@article{Sadeghi-Kohan_Hellebrand_Wunderlich_2022, title={Stress-Aware Periodic Test of Interconnects}, DOI={10.1007/s10836-021-05979-5}, journal={Journal of Electronic Testing}, publisher={Springer Science and Business Media LLC}, author={Sadeghi-Kohan, Somayeh and Hellebrand, Sybille and Wunderlich, Hans-Joachim}, year={2022} }' chicago: Sadeghi-Kohan, Somayeh, Sybille Hellebrand, and Hans-Joachim Wunderlich. “Stress-Aware Periodic Test of Interconnects.” Journal of Electronic Testing, 2022. https://doi.org/10.1007/s10836-021-05979-5. ieee: 'S. Sadeghi-Kohan, S. Hellebrand, and H.-J. Wunderlich, “Stress-Aware Periodic Test of Interconnects,” Journal of Electronic Testing, 2022, doi: 10.1007/s10836-021-05979-5.' mla: Sadeghi-Kohan, Somayeh, et al. “Stress-Aware Periodic Test of Interconnects.” Journal of Electronic Testing, Springer Science and Business Media LLC, 2022, doi:10.1007/s10836-021-05979-5. short: S. Sadeghi-Kohan, S. Hellebrand, H.-J. Wunderlich, Journal of Electronic Testing (2022). date_created: 2022-01-14T11:16:34Z date_updated: 2022-05-11T16:10:01Z department: - _id: '48' doi: 10.1007/s10836-021-05979-5 keyword: - Electrical and Electronic Engineering language: - iso: eng publication: Journal of Electronic Testing publication_identifier: issn: - 0923-8174 - 1573-0727 publication_status: published publisher: Springer Science and Business Media LLC status: public title: Stress-Aware Periodic Test of Interconnects type: journal_article user_id: '209' year: '2022' ...