{"doi":"10.1109/ssi56489.2022.9901416","publication_status":"published","keyword":["Simulation Environment","Inductive Localization","Coil Parameters","Inductive Applications","Near-Field"],"date_created":"2022-10-04T11:26:11Z","project":[{"_id":"52","name":"PC2: Computing Resources Provided by the Paderborn Center for Parallel Computing"}],"abstract":[{"lang":"eng","text":"In this work, methods will be evaluated to numerically calculate the passive electrical parameters of planar coils. These parameters can then be used to optimize inductive applications such as wireless power transmission. The focus here will be on inductive localization, which uses high-frequency magnetic fields and the resulting induced voltage to provide localization through the coupling parameter mutual inductance. To achieve localization with high accuracy and best possible operation (resonance, signal strength, etc.), the coil parameters need to be well known. For this reason, some numerical methods for the calculation of these quantities are presented and validated. In addition, the physical effects are thereby considered in more detail, allowing the localization procedure to be better optimized compared to simulative black-box methods. The goal should be a dedicated simulation platform for planar coils to be able to develop training data for neural networks and to test and optimize localization algorithms."}],"date_updated":"2022-10-04T11:35:11Z","type":"conference","conference":{"name":"2022 Smart Systems Integration (SSI)","location":"Grenoble, France","start_date":"2022-04-27","end_date":"2022-04-28"},"publication":"2022 Smart Systems Integration (SSI)","language":[{"iso":"eng"}],"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/9901416"}],"_id":"33508","title":"Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings","publication_identifier":{"eisbn":["978-1-6654-8849-5"]},"department":[{"_id":"59"},{"_id":"485"}],"user_id":"38240","citation":{"ama":"Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. In: <i>2022 Smart Systems Integration (SSI)</i>. IEEE; 2022. doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>","bibtex":"@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, place={Grenoble, France}, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }","mla":"Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” <i>2022 Smart Systems Integration (SSI)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>.","ieee":"S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings,” presented at the 2022 Smart Systems Integration (SSI), Grenoble, France, 2022, doi: <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>.","chicago":"Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” In <i>2022 Smart Systems Integration (SSI)</i>. Grenoble, France: IEEE, 2022. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">https://doi.org/10.1109/ssi56489.2022.9901416</a>.","short":"S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, Grenoble, France, 2022.","apa":"Lange, S., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. <i>2022 Smart Systems Integration (SSI)</i>. 2022 Smart Systems Integration (SSI), Grenoble, France. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">https://doi.org/10.1109/ssi56489.2022.9901416</a>"},"status":"public","year":"2022","place":"Grenoble, France","author":[{"last_name":"Lange","id":"38240","full_name":"Lange, Sven","first_name":"Sven"},{"full_name":"Hedayat, Christian","last_name":"Hedayat","first_name":"Christian"},{"full_name":"Kuhn, Harald","last_name":"Kuhn","first_name":"Harald"},{"first_name":"Ulrich","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann"}],"publisher":"IEEE"}