{"conference":{"location":"Ulm","name":"14th German Microwave Conference (GeMiC)"},"citation":{"short":"T. Mager, C. Jürgenhake, R. Dumitrescu, in: 2022 14th German Microwave Conference (GeMiC), IEEE, 2022, pp. 224–227.","chicago":"Mager, Thomas, Christoph Jürgenhake, and Roman Dumitrescu. “Efficient Method for Determining Substrate Parameters of Additive Manufactured Spatial Circuit Carriers.” In <i>2022 14th German Microwave Conference (GeMiC)</i>, 224–27. IEEE, 2022.","bibtex":"@inproceedings{Mager_Jürgenhake_Dumitrescu_2022, title={Efficient method for determining substrate parameters of additive manufactured spatial circuit carriers}, booktitle={2022 14th German Microwave Conference (GeMiC)}, publisher={IEEE}, author={Mager, Thomas and Jürgenhake, Christoph and Dumitrescu, Roman}, year={2022}, pages={224–227} }","ieee":"T. Mager, C. Jürgenhake, and R. Dumitrescu, “Efficient method for determining substrate parameters of additive manufactured spatial circuit carriers,” in <i>2022 14th German Microwave Conference (GeMiC)</i>, Ulm, 2022, pp. 224–227.","mla":"Mager, Thomas, et al. “Efficient Method for Determining Substrate Parameters of Additive Manufactured Spatial Circuit Carriers.” <i>2022 14th German Microwave Conference (GeMiC)</i>, IEEE, 2022, pp. 224–27.","ama":"Mager T, Jürgenhake C, Dumitrescu R. Efficient method for determining substrate parameters of additive manufactured spatial circuit carriers. In: <i>2022 14th German Microwave Conference (GeMiC)</i>. IEEE; 2022:224-227.","apa":"Mager, T., Jürgenhake, C., &#38; Dumitrescu, R. (2022). Efficient method for determining substrate parameters of additive manufactured spatial circuit carriers. <i>2022 14th German Microwave Conference (GeMiC)</i>, 224–227."},"author":[{"last_name":"Mager","first_name":"Thomas","full_name":"Mager, Thomas"},{"full_name":"Jürgenhake, Christoph","last_name":"Jürgenhake","first_name":"Christoph"},{"last_name":"Dumitrescu","first_name":"Roman","full_name":"Dumitrescu, Roman","id":"16190"}],"title":"Efficient method for determining substrate parameters of additive manufactured spatial circuit carriers","type":"conference","date_updated":"2022-10-13T11:23:59Z","publisher":"IEEE","language":[{"iso":"eng"}],"user_id":"15782","publication_status":"published","department":[{"_id":"563"}],"publication":"2022 14th German Microwave Conference (GeMiC)","year":"2022","page":"224-227","_id":"33712","status":"public","date_created":"2022-10-13T11:23:52Z"}